Drive mechanism

Abstract

A driving mechanism is used for driving an optical element to move and comprises a fixed part, a movable part and a driving assembly. And the movable part is movably connected with the fixed part and is used for bearing the optical element. The driving assembly drives the movable part to move relative to the fixed part.

Description

Technical Field

[0001] The utility model relates to a driving mechanism, and more specifically, to a driving mechanism for driving an optical element to move. Background Art

[0002] With the development of technology, many electronic devices (such as smart phones or digital cameras) now have the function of taking photos or recording videos. These electronic devices are becoming more and more popular and are developing in the direction of convenient and thinner designs to provide users with more choices.

[0003] In existing mobile phone lenses, the dual-lens camera system uses two lens drive mechanisms, and their positions are usually quite close, so the magnets located in different lens drive mechanisms are often prone to magnetic interference, which will affect the focusing speed and accuracy of the lens.

[0004] In view of this, how to design an optical element driving mechanism that can avoid magnetic interference has become an important issue. Utility Model Content

[0005] The purpose of the present invention is to provide a driving mechanism to solve at least one of the above problems.

[0006] In view of the above-mentioned known problems, an embodiment of the present invention provides a driving mechanism for driving an optical element to move, wherein the optical element has an optical axis, and the driving mechanism includes a fixed portion, a movable portion, and a driving assembly. The movable portion is movably connected to the fixed portion, wherein the optical element is disposed on the movable portion, and the driving assembly is used to drive the movable portion to move relative to the fixed portion.

[0007] In one embodiment, the driving mechanism further includes a reinforcing sheet and a circuit component, and the fixing portion has a plastic shell and a base connected to each other, wherein the shell forms a groove, the reinforcing sheet is embedded in the shell and exposed on the inner side of the shell, the circuit component is fixed in the groove, and the reinforcing sheet faces the circuit component.

[0008] In one embodiment, the reinforcing sheet has low magnetic permeability.

[0009] In one embodiment, the reinforcing sheet is electrically independent from the circuit element.

[0010] In one embodiment, the reinforcing sheet is combined with the shell by insert molding.

[0011] In one embodiment, a portion of the shell extends into a through hole of the reinforcing sheet to form an embedded structure.

[0012] In one embodiment, the embedded structure protrudes from the through hole of the reinforcing sheet.

[0013] In one embodiment, the embedded structure forms a recess in the through hole of the reinforcing sheet.

[0014] In one embodiment, the shell has a side wall, and a protruding structure protrudes from the side wall toward the inner side of the shell, wherein the groove is located between the side wall and the protruding structure, and the reinforcing sheet faces the protruding structure.

[0015] In one embodiment, the reinforcing sheet is formed with an inclined surface, and the inclined surface is embedded in the side wall portion of the housing.

[0016] In one embodiment, the driving mechanism further includes a magnet disposed on the movable portion and a magnetic field sensing element disposed on the circuit component, wherein the magnetic field sensing element abuts against an edge of the protruding structure to sense a position change of the magnet.

[0017] In one embodiment, the driving mechanism further comprises a glue applied in the groove and between the circuit component and the reinforcing sheet to bond the circuit component and the housing.

[0018] In one embodiment, the protruding structure includes a first boss, a second boss and a third boss. The third boss connects the first boss and the second boss, and the third boss forms a recessed area between the first and second bosses that is recessed toward the outer side of the shell.

[0019] In one embodiment, the driving mechanism further includes a light-curing adhesive applied on the first boss to bond the circuit assembly and the housing.

[0020] In one embodiment, the glue is a thermal curing glue.

[0021] In one embodiment, the movable portion is formed with a protrusion, and when the movable portion is at a limit position, the third boss contacts the protrusion to limit the movable portion at the limit position.

[0022] In one embodiment, the base is formed with a retaining wall for contacting and limiting the movable part at a limit position.

[0023] In one embodiment, the retaining wall has a first section, a second section and a third section, the third section is located between the first and second sections, and the third section forms a recessed area between the first and second sections.

[0024] In one embodiment, the movable portion has a protrusion, and when the movable portion is at the limit position, the protrusion contacts the third section.

[0025] In one embodiment, the distance between the third section and the movable portion is different from the distance between the first section and the movable portion.

[0026] In one embodiment, the driving mechanism further includes an electronic component disposed on the circuit assembly and tilted relative to the optical axis.

[0027] In one embodiment, the driving assembly has a coil and a magnetic element, and the housing is formed with two limiting posts, wherein the coil is disposed on the movable portion, and the magnetic element is disposed between the limiting posts.

[0028] In one embodiment, the driving mechanism further includes an upper spring connecting the movable portion and the housing, and the upper spring surrounds the limiting column.

[0029] In one embodiment, the magnetic element and the upper spring sheet partially overlap in the direction of the optical axis.

[0030] In one embodiment, when viewed along a horizontal direction perpendicular to the optical axis, a portion of the circuit component does not overlap with the reinforcing sheet, wherein the horizontal direction is perpendicular to the optical axis.

[0031] In one embodiment, the reinforcing sheet has a main body and at least one protruding portion connected to the main body, and when viewed along the optical axis, a portion of the protruding portion does not overlap with the main body.

[0032] In one embodiment, the side wall portion, the reinforcing sheet, the circuit component, and the protruding structure are arranged in sequence along a horizontal direction, and the horizontal direction is perpendicular to the optical axis.

[0033] In one embodiment, the shell has a side wall portion, and a protruding structure protrudes from the side wall portion toward the inner side of the shell, wherein the groove is located between the side wall portion and the protruding structure, and the protruding structure and the retaining wall at least partially overlap in the direction of the optical axis.

[0034] In one embodiment, the side wall portion, the reinforcing sheet, the circuit component, and the blocking wall are arranged in sequence along a horizontal direction, and the horizontal direction is perpendicular to the optical axis. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 An exploded view of a driving mechanism according to an embodiment of the utility model is shown.

[0036] Figure 2 express Figure 1 Another exploded view of the drive mechanism in .

[0037] Figure 3 express Figure 1 A three-dimensional view of the drive mechanism after assembly.

[0038] Figure 4 Exploded view showing the shell and stiffener.

[0039] Figure 5 A three-dimensional diagram showing the combination of the housing, the reinforcing plate and the upper spring plate.

[0040] Figure 6 A perspective view showing a reinforcing sheet.

[0041] Figure 7 A three-dimensional diagram from another perspective showing the upper spring, shell and reinforcement plate after being combined.

[0042] Figure 8 A bottom view showing the upper spring, housing and reinforcement plate after they are combined.

[0043] Fig. 9 A three-dimensional diagram showing the upper spring sheet, magnetic element, shell and reinforcement sheet after being combined.

[0044] Fig.10 Indicates along Figure 3 Cross-sectional view along line segment A1-A2 in FIG.

[0045] Fig.11 Indicates along Figure 3 A cross-sectional view of line segment A3-A4 in FIG.

[0046] Fig.12 A schematic diagram showing that the carrier and the coil are arranged in the housing.

[0047] Fig.13 A partial three-dimensional enlarged view showing the magnetic field sensing element resting against the edge of the protruding structure.

[0048] Fig.14 A schematic diagram showing that a retaining wall is formed with a first section, a second section and a third section.

[0049] The reference numerals are as follows:

[0050] 100: Driving mechanism

[0051] 11: Limit column

[0052] 101: Embedding Structures

[0053] B: Base

[0054] B1: convex column

[0055] BP: Retaining Wall

[0056] BP1: The first section

[0057] BP2: The second section

[0058] BP3: The third section

[0059] BS: Lower reed

[0060] C: Coil

[0061] D: Arrow

[0062] E: Electronic components

[0063] F: Circuit components

[0064] FS: Upper reed

[0065] FS1: Opening

[0066] G1: Region

[0067] G2: Region

[0068] H: Shell

[0069] HM:Magnet

[0070] h: side wall

[0071] LH: Bearing

[0072] LH1: Bump

[0073] M: Magnetic components

[0074] O: Optical axis

[0075] P: Protruding structure

[0076] P1: First boss

[0077] P2: Second boss

[0078] P3: The third boss

[0079] PR:Glue tank

[0080] R: Groove

[0081] S: Strengthening tablets

[0082] S1: body

[0083] S2: Perforation

[0084] S3: protrusion

[0085] S11: Inclined surface DETAILED DESCRIPTION

[0086] The following describes the drive mechanism of the embodiment of the utility model. However, it is easy to understand that the embodiment of the utility model provides many suitable utility model concepts and can be implemented in a wide variety of specific backgrounds. The specific embodiments disclosed are only used to illustrate the use of the utility model in a specific way, and are not used to limit the scope of the utility model.

[0087] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the relevant technology and the present disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined herein.

[0088] The above and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only referenced to the directions of the attached drawings. Therefore, the directional terms used in the embodiments are used to illustrate and not to limit the present invention.

[0089] First, please refer to Figures 1 to 3 ,in Figure 1 FIG. 1 is an exploded view of a driving mechanism 100 according to an embodiment of the present invention. Figure 2 express Figure 1 Another exploded view of the drive mechanism 100, Figure 3 express Figure 1 FIG. 1 is a three-dimensional view of the drive mechanism 100 after assembly.

[0090] like Figure 1 , Figure 2 and Figure 3 As shown, the driving mechanism 100 of the present embodiment is, for example, a voice coil motor (VCM), which can be installed inside a mobile phone or other portable electronic device to drive an optical element (such as an optical lens) to move, thereby achieving functions such as auto focusing (AF) or optical image stabilization (OIS).

[0091] The aforementioned driving mechanism 100 mainly includes a hollow plastic housing H, a base B, a circuit component F, a carrier LH, an upper spring sheet FS, at least one lower spring sheet BS, at least one magnetic element M and at least one coil C. In this embodiment, the aforementioned housing H has a hollow structure and is combined with the base B, and the circuit component F is fixed to one side of the base B, wherein the housing H and the base B can together form a fixed part of the driving mechanism 100, and the boss B1 on the base B will extend into the interior of the housing H, and the boss B1 and the inner surface of the housing H can be bonded by glue during assembly.

[0092] In addition, the aforementioned carrier LH is movably accommodated in the housing H, and an optical element (not shown) can be fixed in the carrier LH, wherein the aforementioned carrier LH constitutes a movable part that can move relative to the aforementioned fixed part (housing H and base B).

[0093] Specifically, the aforementioned carrier LH is connected to the housing H and the base B through the upper and lower springs FS and BS, respectively, so that the carrier LH can be suspended in the driving mechanism 100 in a movable manner. Through the aforementioned mechanism configuration, external light can enter the driving mechanism 100 along the optical axis O (Z-axis direction) of the optical element, and the light will pass through the optical lens and reach an image sensing element (not shown) located below the base B, thereby generating a digital image.

[0094] It should be particularly noted that a coil C is provided on both sides of the aforementioned carrier LH, and a magnetic element M (such as a magnet) corresponding to the aforementioned coil C is provided on the inner side of the shell H, wherein the aforementioned coil C and the magnetic element M can constitute a driving component.

[0095] When a current signal is applied to the aforementioned coil C, the magnetic force generated between the coil C and the magnetic element M can drive the carrier LH and the optical element disposed therein to move relative to the base B and the shell H along the optical axis O direction (Z-axis direction), thereby achieving the function of auto focus (AF) or optical image stabilization (OIS).

[0096] Depend on Figure 1 As can be seen in FIG. 1 , a magnet HM is provided on one side of the carrier LH, and a magnetic field sensing element HS is provided on the circuit assembly F. Fig. 9 ) is used to sense the position change of the magnet HM. For example, the magnetic field sensing element HS may be a Hall effect sensor, a magnetoresistive sensor (MR sensor), or a fluxgate sensor, etc., which can be used to sense the position of the magnet HM, so as to know the relative position change between the carrier LH and the fixing part (shell H and base B).

[0097] Please also refer to Figure 3, Figure 4 and Figure 5 ,in Figure 4 Exploded view showing the shell H and the reinforcing plate S. Figure 5 A perspective view showing the housing H, the reinforcing sheet S, and the upper spring sheet FS after being combined.

[0098] like Figure 4 and Figure 5 As shown, the aforementioned shell H contains plastic material, wherein a plurality of long strip limiting posts 11 protruding toward the -Z axis direction are formed on the inner side of the shell H. The aforementioned magnetic element M can be positioned between adjacent limiting posts 11 during assembly, thereby preventing the magnetic element M from being displaced in the horizontal direction relative to the shell H, thereby ensuring that the driving mechanism 100 performs normal functions.

[0099] In this embodiment, the upper spring sheet FS is fixed to an inner side of the housing H, and the upper spring sheet FS surrounds the limit post 11; that is, the limit post 11 passes through the openings FS1 on both sides of the upper spring sheet FS (such as Figure 1 shown).

[0100] On the other hand, the shell H is formed with a plurality of side walls h parallel to the optical axis O, wherein a protruding structure P protrudes from a side wall portion h of the shell H toward the inner side of the shell H, and a groove R is formed between the protruding structure P and the side wall portion h for accommodating glue and the circuit component F.

[0101] It should be particularly noted that a reinforcing sheet S with low magnetic permeability and electrically independent from the circuit component F and any other circuits is embedded on the inner side of the aforementioned side wall portion h, wherein the reinforcing sheet S has a main body S1, at least one through hole S2 and at least one protrusion S3, the aforementioned through hole S2 is formed on the main body S1, and the aforementioned protrusion S3 extends downward from the aforementioned main body S1.

[0102] In this embodiment, the aforementioned reinforcing sheet S is made of metal, for example, and can be combined with the plastic housing H by insert molding. When the housing H and the reinforcing sheet S are combined, the body S1 of the reinforcing sheet S will be exposed on the inner side of the housing H and face the aforementioned protruding structure P. In addition, a portion of the housing H will be embedded in the through hole S2 of the reinforcing sheet S after molding to form an embedded structure 101 ( Figure 5 ), thereby increasing the bonding strength between the shell H and the reinforcing sheet S.

[0103] Specifically, the aforementioned embedded structure 101 can protrude the aforementioned through hole S2 toward the inner side of the reinforcing sheet S; however, the aforementioned embedded structure 101 may not protrude from the through hole S2 of the reinforcing sheet S, but instead form a recess in the through hole S2, thereby helping to increase the glue adhesion area between the shell H, the reinforcing sheet S and the circuit component F.

[0104] On the other hand, from Figure 5 It can be seen from the figure that the protrusion S3 of the reinforcing sheet S protrudes downward from the edge of the plastic housing H, so that glue (such as Figure 1 As shown in the direction of arrow D in the figure, the circuit assembly F, the housing H, the reinforcing sheet S and the base B are bonded together at the same time, thereby greatly improving the overall structural strength and reliability of the driving mechanism 100.

[0105] Next, please refer to Figure 6 ,in Figure 6 A perspective view showing a reinforcing sheet S is shown.

[0106] like Figure 6 As shown, the body S1 of the reinforcing sheet S is substantially rectangular, and a slope S11 is formed on both sides of the body S1 , wherein the slope S11 is embedded in the side wall h of the plastic housing H to enhance the bonding strength between the housing H and the reinforcing sheet S.

[0107] In addition, from Figure 6 It can be seen that the protrusion S3 is bent toward the -Y axis direction (horizontal direction) and protrudes from the body S1, so when observed along the optical axis O direction (Z axis direction), a part of the protrusion S3 will not overlap with the body S1.

[0108] Please also refer to Figure 7 , Figure 8 and Fig. 9 ,in Figure 7 Another perspective view showing the upper spring FS, the housing H and the reinforcing sheet S after being combined. Figure 8 The bottom view shows the upper spring FS, the housing H and the reinforcing sheet S after they are combined. Fig. 9 A three-dimensional diagram showing the upper spring piece FS, the magnetic element M, the housing H and the reinforcing sheet S after being combined.

[0109] from Figure 7 , Figure 8 and Fig. 9It can be seen that the upper spring sheet FS will surround the limit column 11 after assembly, and the upper spring sheet FS and the magnetic element at least partially overlap in the direction of the optical axis O. In addition, the groove R is between a side wall portion h of the housing H and the protruding structure P, wherein the protruding structure P includes a first boss P1, a second boss P2 and a third boss P3, the first boss P1 and the second boss P2 are located at two ends of the protruding structure P, and the third boss P3 is located between the first boss P1 and the second boss P2.

[0110] It should be understood that during assembly, glue (such as thermosetting glue) can be applied inside the groove R and between the circuit component F and the reinforcing sheet S, and then the circuit component F can be inserted into the aforementioned groove R to enable the circuit component F to be fixed in the aforementioned groove R.

[0111] like Fig. 9 As shown in the areas G1 and G2 in the figure, in order to enhance the connection strength between the circuit component F and the housing H, a UV glue or a UV-andthermo-curable adhesive may be applied to the first boss P1 and the second boss P2 during assembly, and the circuit component F and the housing H may be pre-bonded. Then, a thermal glue may be applied to other components that need to be fixed (such as the base B), and high-temperature baking may be performed together after the installation of other components is completed. In this way, the components inside the drive mechanism 100 may be firmly bonded to each other through stepwise curing.

[0112] In one embodiment, a light-curing adhesive or a dual-effect curing adhesive may also be applied on the third boss P3 to enhance the bonding strength between the circuit component F and the housing H.

[0113] In addition, from Fig. 9 It can also be seen that a magnetic field sensing element HS and a plurality of electronic components E (such as capacitors or inductors) are provided on the circuit assembly F, wherein two electronic components E at least partially overlap in the direction of the optical axis O (Z axis), and at least one of the aforementioned electronic components E is tilted relative to the optical axis O (Z axis). Through the aforementioned special configuration, the space inside the shell H can be effectively utilized to promote the miniaturization of the volume of the driving mechanism 100.

[0114] In addition, when the circuit component F is inserted into the groove R, the magnetic field sensing element HS on the circuit component F can be placed against the edge of the protruding structure P and adjacent to the glue groove PR on the protruding structure P. This not only improves the positioning accuracy between the circuit component F and the shell H, but also the aforementioned glue groove PR can help contain glue to ensure that the circuit component F and the shell H can be tightly adhered to each other.

[0115] Please also read Fig.10 and Fig.11 ,in Fig.10 Indicates along Figure 3 The cross-sectional view of the line segment A1-A2 in Fig.11 Indicates along Figure 3 A cross-sectional view of line segment A3-A4 in FIG.

[0116] from Figure 1 and Fig.10 It can be seen that a retaining wall BP is formed on one side of the base B, wherein when the driving mechanism 100 is hit by external force, the retaining wall BP and the protruding structure P located on the inner side of the shell H can contact and block the carrier LH to prevent the carrier LH from directly colliding with the circuit component F and causing damage to the circuit component F.

[0117] like Fig.10 As shown, the side wall portion h, the reinforcing sheet S, the circuit assembly F and the blocking wall BP are arranged in sequence along the horizontal direction (Y-axis direction), and the horizontal direction is perpendicular to the optical axis O.

[0118] In addition, the protruding structure P and the blocking wall BP at least partially overlap in the optical axis O direction.

[0119] In addition, from Fig.10 It can be seen that when viewed along the horizontal direction (Y-axis direction), a portion of the circuit component F protrudes downward from the reinforcing sheet S without overlapping the reinforcing sheet S.

[0120] It should be particularly noted that, by embedding a reinforcing sheet S on the inner side of the shell H, this embodiment can not only significantly improve the structural strength of the shell H, but also the aforementioned reinforcing sheet S can provide a shielding effect for the circuit component F and the magnetic field sensing element HS disposed on the circuit component F, so as to prevent the magnetic field sensing element HS from being affected by the magnetic elements outside the driving mechanism 100 and reducing its sensing accuracy.

[0121] On the other hand, from Fig.11 It can be seen that a coil C is provided on the opposite side of the carrier LH, and a magnetic element M (such as a magnet) corresponding to the aforementioned coil C is provided on the inner side of the shell H. When a current signal is applied to the aforementioned coil C, the magnetic force generated between the coil C and the magnetic element M can drive the carrier LH and the optical element disposed therein to move relative to the base B and the shell H along the optical axis O direction (Z-axis direction) to achieve the function of auto focus (AF) or optical image stabilization (OIS).

[0122] Please also refer to Fig.12 , 13 and Fig.14 ,in Fig.12A schematic diagram showing that the carrier LH and the coil C are arranged in the housing H, Fig.13 A partial three-dimensional enlarged view showing that the magnetic field sensing element HS is against the edge of the protruding structure P, Fig.14 A schematic diagram showing that the retaining wall BP is formed with a first section BP1, a second section BP2 and a third section BP3.

[0123] like Fig.12 , Fig.13 and Fig.14 As shown, two of the electronic components E on the circuit assembly F at least partially overlap in the direction of the optical axis O (Z axis), and at least one of the aforementioned electronic components E is inclined relative to the optical axis O (Z axis), thereby being able to effectively utilize the space inside the shell H to promote the miniaturization of the volume of the driving mechanism 100.

[0124] In addition, from Fig.13 and Fig.14 It can be seen that the magnetic field sensing element HS on the circuit component F will abut against one end face (edge) of the protruding structure P and be adjacent to the glue groove PR on the protruding structure P after assembly. This not only improves the positioning accuracy between the circuit component F and the shell H, but also the aforementioned glue groove PR can help contain glue to ensure that the circuit component F and the shell H can be tightly adhered to each other.

[0125] It should be noted that the retaining wall BP in this embodiment is formed with a first section BP1, a second section BP2 and a third section BP3 ( Fig.14 ), wherein the third section BP3 is located between the first and second sections BP1 and BP2, and the third section BP3 forms a recessed area between the first and second sections BP1 and BP2 that is recessed toward the outside of the base B. Correspondingly, the third boss P3 in the aforementioned protruding structure P forms a recessed area between the first and second bosses P1 and P2 that is recessed toward the outside of the housing H.

[0126] Specifically, when the driving mechanism 100 is hit by external force, the third boss P3 of the aforementioned protruding structure P and / or the third section BP3 of the retaining wall BP can contact and block the protrusion LH1 on the carrier LH, thereby limiting the carrier LH (movable part) to an extreme position in the horizontal direction (Y-axis direction), thereby preventing the carrier LH from directly hitting the circuit component F and causing damage to the circuit component F.

[0127] In addition, the first and second bosses P1, P2 of the aforementioned protruding structure P and / or the first and second sections BP1, BP2 of the retaining wall BP can also be used to contact and block the bump LH1 on the carrier LH, thereby further protecting the circuit component F to prevent the carrier LH from directly hitting the circuit component F and causing damage to the circuit component F.

[0128] In this embodiment, the distance between the third section BP3 and the carrier LH is greater than the distance between the third boss P3 and the carrier LH, and the distance between the third section BP3 and the carrier LH is different from the distance between the first and second sections BP1, BP2 and the carrier LH.

[0129] Although the embodiments and advantages of the utility model have been disclosed as above, it should be understood that those skilled in the art may make changes, substitutions and modifications without departing from the spirit and scope of the utility model. In addition, the scope of protection of the utility model is not limited to the processes, machines, manufactures, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any technician in the relevant technical field can understand the current or future developed processes, machines, manufactures, material compositions, devices, methods and steps from the disclosure of the utility model. As long as they can implement roughly the same functions or obtain roughly the same results in the embodiments described herein, they can be used according to the utility model. Therefore, the scope of protection of the utility model includes the above-mentioned processes, machines, manufactures, material compositions, devices, methods and steps. In addition, each claim constitutes an individual embodiment, and the scope of protection of the utility model also includes the combination of each claim and embodiment.

[0130] Although the present invention has been disclosed above in terms of preferred embodiments, it is not intended to limit the present invention. Those skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the attached claims.

Claims

1. A driving mechanism for driving an optical element to move, characterized in that: The optical element has an optical axis, and the driving mechanism comprises: A fixing part, comprising a plastic shell and a base connected to each other, wherein the shell is formed with a groove; a movable part movably connected to the fixed part, wherein the optical element is disposed on the movable part; a driving assembly for driving the movable portion to move relative to the fixed portion; a reinforcing sheet with low magnetic permeability, embedded in the shell and exposed on the inner side of the shell; and A circuit component is fixed in the groove, wherein the reinforcing sheet faces the circuit component.

2. The driving mechanism according to claim 1, characterized in that: When viewed along a horizontal direction perpendicular to the optical axis, a portion of the circuit component does not overlap with the reinforcing sheet.

3. The driving mechanism according to claim 1, characterized in that: The reinforcing sheet is electrically independent from the circuit component.

4. The driving mechanism according to claim 1, characterized in that: The reinforcing sheet has a main body and at least one protruding portion connected to the main body, and when viewed along the optical axis, a portion of the protruding portion does not overlap with the main body.

5. The driving mechanism according to claim 4, characterized in that: A portion of the shell extends into a through hole of the reinforcing sheet to form an embedded structure.

6. The driving mechanism according to claim 5, characterized in that: The embedded structure protrudes out of the through hole of the reinforcing sheet.

7. The driving mechanism according to claim 5, characterized in that: The embedded structure forms a recess in the through hole of the reinforcing sheet.

8. The driving mechanism according to claim 1, characterized in that: The shell has a side wall portion, and a protruding structure protrudes from the side wall portion toward the inner side of the shell, wherein the groove is located between the side wall portion and the protruding structure, and the reinforcing sheet faces the protruding structure.

9. The driving mechanism according to claim 8, characterized in that: The reinforcing sheet is formed with an inclined surface, and the inclined surface is embedded in the side wall portion of the shell.

10. The driving mechanism according to claim 8, characterized in that: The side wall portion, the reinforcing sheet, the circuit component and the protruding structure are arranged in sequence along a horizontal direction, and the horizontal direction is perpendicular to the optical axis.

11. The driving mechanism according to claim 8, characterized in that: The driving mechanism also includes glue, which is applied in the groove and between the circuit component and the reinforcing sheet to bond the circuit component and the housing.

12. The driving mechanism according to claim 11, characterized in that: The protruding structure includes a first boss, a second boss and a third boss. The third boss connects the first boss and the second boss, and the third boss forms a concave area between the first and second bosses that is concave toward the outer side of the shell.

13. The driving mechanism according to claim 12, characterized in that: The driving mechanism also includes a light curing adhesive applied on the first boss to bond the circuit assembly and the housing.

14. The driving mechanism according to claim 11, characterized in that: The glue is a heat curing glue.

15. The driving mechanism according to claim 12, characterized in that: The movable part is formed with a protrusion, and when the movable part is at a limit position, the third boss contacts the protrusion to limit the movable part at the limit position.

16. The driving mechanism according to claim 1, characterized in that: The base is formed with a retaining wall for contacting and limiting the movable part at a limit position.

17. The driving mechanism according to claim 16, characterized in that: The housing has a side wall portion, and a protruding structure protrudes from the side wall portion toward the inner side of the housing, wherein the groove is located between the side wall portion and the protruding structure, and the protruding structure and the blocking wall at least partially overlap in the optical axis direction.

18. The driving mechanism according to claim 17, characterized in that: The retaining wall has a first section, a second section and a third section. The third section is located between the first and second sections, and the third section forms a recessed area between the first and second sections.

19. The driving mechanism according to claim 18, characterized in that: The movable part has a protrusion, and when the movable part is at the limit position, the protrusion contacts the third section.

20. The driving mechanism according to claim 18, characterized in that: The distance between the third section and the movable portion is different from the distance between the first section and the movable portion.

21. The driving mechanism according to claim 16, characterized in that: The side wall portion, the reinforcing sheet, the circuit assembly and the blocking wall are arranged in sequence along a horizontal direction, and the horizontal direction is perpendicular to the optical axis.

22. The driving mechanism according to claim 1, characterized in that: The driving mechanism also includes an electronic element which is arranged on the circuit assembly and tilted relative to the optical axis.

23. The driving mechanism according to claim 22, characterized in that: The driving component has a coil and a magnetic element, and the shell is formed with two limiting posts, wherein the coil is arranged on the movable part, and the magnetic element is arranged between a plurality of the limiting posts.

24. The driving mechanism according to claim 23, characterized in that: The driving mechanism further comprises an upper spring sheet connected to the movable part and the housing, and the upper spring sheet surrounds the plurality of limit posts.

25. The driving mechanism according to claim 24, characterized in that: The magnetic element and the upper spring sheet partially overlap in the direction of the optical axis.

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