Touch display screen

Abstract

The utility model discloses a touch display screen, the touch display screen comprises a touch frame, an elastic wave sensor, an elastic wave acquisition board and a mainboard, the elastic wave acquisition board is provided with a main control module and a signal processing module, and the touch frame comprises a touch control circuit board; the elastic wave sensor is connected to the main control module so as to transmit an elastic wave signal; the touch control circuit board is connected to the signal processing module so as to transmit the touch signal; the main control module is connected to the signal processing module to transmit a high-speed interface signal, and the high-speed interface signal is obtained by converting an elastic wave signal; the signal processing module is connected to the mainboard so as to transmit USB signals, and the USB signals are obtained by converting touch signals and high-speed interface signals. According to the touch display screen, the main control module for processing the elastic wave signals is arranged on the elastic wave acquisition board and is separated from the touch control circuit board, so that wiring is facilitated, mutual interference of signals between lines is avoided, the reliability of transmitted signals is improved, and the reliability of the touch display screen is improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a touch display screen. Background Art

[0002] At present, screen touch technology is widely used in large-screen display terminals for various conferences and education to enhance the interactive experience. The touch technology of most products generally includes capacitive touch screens and infrared touch screens. Compared with capacitive touch screens, infrared touch screens using infrared technology can greatly reduce costs and manufacturing process difficulties, so they are widely used.

[0003] Infrared touch screens usually collect vibration signals generated by the touch panel, namely elastic wave signals, through elastic wave sensors, and transmit the collected elastic wave signals to the microcontroller unit (MCU) on the infrared touch circuit board through USB2.0 differential signal lines, and the MCU forwards the elastic wave signals to the mainboard.

[0004] However, since the MCU used to process elastic wave signals in the related technology is located on the infrared touch circuit board, the infrared touch circuit board is limited by the border width of the infrared touch screen and is usually made relatively narrow. Therefore, it is difficult to route the various USB2.0 differential signal lines in the infrared touch circuit board, which can easily lead to signal abnormalities due to impedance mismatch. Utility Model Content

[0005] In view of the above problems, the present application provides a touch display screen and a display device to solve the above technical problems.

[0006] In a first aspect, the present application provides a touch display screen, which includes: a touch frame, an elastic wave sensor, an elastic wave collection board and a main board, wherein a main control module and a signal processing module are arranged on the elastic wave collection board, and the touch frame includes a touch circuit board;

[0007] An elastic wave sensor is electrically connected to the main control module to transmit the collected elastic wave signal to the main control module;

[0008] A touch circuit board, electrically connected to the signal processing module, so as to transmit the collected touch signal to the signal processing module;

[0009] A main control module is electrically connected to the signal processing module to transmit a high-speed interface signal to the signal processing module, wherein the high-speed interface signal is obtained by converting the elastic wave signal;

[0010] The signal processing module is electrically connected to the mainboard to transmit the USB signal to the mainboard. The USB signal is obtained by converting the touch signal and the high-speed interface signal.

[0011] In a possible implementation of the present application, an operational amplifier circuit is also provided on the elastic wave acquisition board, and the operational amplifier circuit is respectively connected to the elastic wave sensor and the main control module to convert the elastic wave signal into a single-ended signal and transmit it to the main control module.

[0012] In a possible implementation of the present application, the main control module is configured with a USB OTG interface, and the main control module is electrically connected to the signal processing module via the USB OTG interface to output a high-speed interface signal obtained by converting a single-ended signal to the signal processing module.

[0013] In a possible implementation of the present application, the high-speed interface signal is a ULPI interface signal, and the rate of the ULPI interface signal is 480 Mbps.

[0014] In a possible implementation of the present application, the signal processing module includes a conversion unit and a multi-port forwarding unit;

[0015] The input end of the conversion unit is electrically connected to the main control module to access the high-speed interface signal, and the output end of the conversion unit is electrically connected to the first input end of the multi-port forwarding unit to output a high-speed USB differential signal;

[0016] The second input end of the multi-port forwarding unit is connected to the output end of the touch circuit board to receive the touch signal, and the output end of the multi-port forwarding unit is electrically connected to the mainboard to output the USB signal.

[0017] In a possible implementation of the present application, the high-speed USB differential signal is a USB 2.0 signal with a rate of 480 Mbps.

[0018] In a possible implementation of the present application, the conversion unit includes a USB conversion chip, and the USB conversion chip is used to convert the high-speed interface signal into a high-speed USB differential signal.

[0019] In a possible implementation of the present application, the multi-port forwarding unit includes a USB2.0 HUB, a first input end of the USB2.0 HUB is connected to the conversion unit to access the high-speed USB differential signal, a second input end of the USB2.0 HUB is connected to the touch circuit board to access the touch signal, and an output end of the USB2.0 HUB is connected to the motherboard to output the USB signal.

[0020] In a possible implementation of the present application, there are multiple elastic wave sensors, and the multiple elastic wave sensors are respectively connected to the main control module through corresponding differential harnesses to transmit elastic wave signals.

[0021] In a possible implementation of the present application, the touch display screen also includes a frame, a touch panel and a display module. The touch panel is connected to the frame, the display module is connected to the frame, the elastic wave sensor is arranged on the side of the touch panel close to the display module, the touch frame is located on the periphery of the touch panel and is arranged in the frame, the display module includes a back panel, and the elastic wave collection board and the main board are arranged on the back panel.

[0022] From the above content, it can be concluded that the present application has the following beneficial effects:

[0023] In the present application, the elastic wave sensor is directly electrically connected to the main control module on the elastic wave acquisition board, and the collected elastic wave signal is transmitted to the main control module. The main control module is then electrically connected to the signal processing module, and the high-speed interface signal converted from the elastic wave signal is transmitted to the signal processing module. At the same time, the touch circuit board on the touch frame is electrically connected to the signal processing module, and the collected touch signal is transmitted to the signal processing module. The signal processing module transmits the USB signal converted from the touch signal and the high-speed interface signal to the main board, so that the main board can implement corresponding display control according to the USB signal. Compared with the MCU for processing the elastic wave signal in the related art, which is located on the infrared touch circuit board of the infrared touch frame, resulting in wiring difficulties and signal abnormalities, the main control module for processing the elastic wave signal in the present application is arranged on the elastic wave acquisition board, separated from the touch circuit board on the touch frame, and the wiring no longer needs to be routed on the touch circuit board, making the wiring easier and more convenient, avoiding mutual interference between the signals between the lines, and improving the reliability of the transmitted signal, thereby improving the reliability of the touch display screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 is a structural schematic diagram of a touch display screen provided in an embodiment of the present application;

[0026] Figure 2 is another structural schematic diagram of a touch display screen provided in an embodiment of the present application;

[0027] Figure 3 is another structural schematic diagram of a touch display screen provided in an embodiment of the present application;

[0028] Figure 4 is a circuit principle schematic diagram of an operational amplifier circuit provided in an embodiment of the present application;

[0029] Figure 5 It is a circuit principle diagram of a main control module provided in an embodiment of the present application;

[0030] Figure 6 is a structural diagram of a signal processing module provided in an embodiment of the present application;

[0031] Figure 7 is a schematic diagram of a circuit principle of a conversion unit provided in an embodiment of the present application;

[0032] Figure 8 It is a circuit principle diagram of a multi-port forwarding unit provided in an embodiment of the present application. DETAILED DESCRIPTION

[0033] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0034] In order to enable those skilled in the art to better understand the solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application.

[0035] In the embodiments of the present application, it should be noted that, in this article, relational terms such as first and second, etc. are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.

[0036] Moreover, the terms "comprises", "comprising" or any other variation thereof are intended to cover non-exclusive inclusion, so that an article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such article or device. In the absence of more restrictions, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the article or device comprising the element.

[0037] In the description of the embodiments of the present application, words such as "example" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "example" or "for example" in the embodiments of the present application is not to be interpreted as being more preferred or having more advantages than another embodiment or design. The use of words such as "example" or "for example" is intended to present relative concepts in a clear manner.

[0038] In addition, the "plurality" in the embodiments of the present application refers to two or more than two. In view of this, in the embodiments of the present application, "plurality" can also be understood as "at least two". "At least one" can be understood as one or more, for example, one, two or more. For example, including at least one means including one, two or more, and there is no limit on which ones are included. For example, including at least one of A, B and C, then A, B, C, A and B, A and C, B and C, or A, B and C can be included.

[0039] It should be noted that in the embodiments of the present application, "connection" can be understood as electrical connection, and the connection between two electrical components can be a direct or indirect connection between the two electrical components. For example, the connection between A and B can be either a direct connection between A and B or an indirect connection between A and B through one or more other electrical components.

[0040] Before introducing the touch display screen of the present application, the relevant background information of the embodiments of the present application is first introduced.

[0041] An infrared touch screen generally includes an infrared touch frame, a touch panel and a display module. The infrared touch frame includes an infrared touch circuit board arranged on the periphery of the touch panel for sending and receiving infrared signals. Usually, an elastic wave sensor is also arranged on the back of the touch panel to collect the elastic wave signal generated when the user touches and taps the touch panel.

[0042] In the related art, the MCU for processing elastic wave signals is usually arranged on the infrared touch circuit board of the infrared touch frame, and the USB2.0 differential signal line between the elastic wave sensor and the MCU for processing the elastic wave signal is partially wired on the infrared touch circuit board, plus two USB2.0 signals of the native touch signal of the infrared touch circuit board. Therefore, there are more wirings on the infrared touch circuit board.

[0043] Since differential signal lines need to be of equal length, equal distance and equal width to avoid vias or branches, and the infrared touch circuit board is limited by the border width of the infrared touch screen and is usually made narrower, it is difficult to route the various USB2.0 differential signal lines in the infrared touch circuit board, which can easily lead to signal anomalies due to impedance mismatch.

[0044] Based on this, an embodiment of the present application provides a touch display screen, which separates the main control module for processing elastic wave signals from the touch circuit board of the touch frame by setting the main control module for processing elastic wave signals on a separate elastic wave acquisition board. As a result, the USB2.0 differential signal line used to transmit the elastic wave signal no longer needs to be placed on the touch circuit board, making wiring easier and more convenient, avoiding mutual interference between signals between lines, and improving the reliability of the transmitted signal, thereby improving the reliability of the touch display screen.

[0045] The touch display screen provided by this application is introduced in detail below.

[0046] An embodiment of the present application provides a touch display screen, which may be an electronic device such as an interactive tablet, a large conference screen, etc.

[0047] See also Figure 1 , Figure 1 1 is a structural diagram of a touch display screen provided in an embodiment of the present application. The touch display screen may include a touch frame 100, an elastic wave sensor 200, an elastic wave collection board 300 and a main board 400, wherein the elastic wave collection board 300 is provided with a main control module 310 and a signal processing module 320, and the touch frame 100 includes a touch circuit board 110.

[0048] The elastic wave sensor 200 can be electrically connected to the main control module 310 to transmit the collected elastic wave signal to the main control module 310; the touch circuit board 110 can be electrically connected to the signal processing module 320 to transmit the collected touch signal to the signal processing module 320; the main control module 310 can be electrically connected to the signal processing module 320 to transmit the high-speed interface signal to the signal processing module 320, and the high-speed interface signal is converted from the elastic wave signal; the signal processing module 320 can be electrically connected to the mainboard 400 to transmit the USB signal to the mainboard 400, and the USB signal is converted from the touch signal and the high-speed interface signal.

[0049] In the embodiment of the present application, the elastic wave collecting plate 300 and the main board 400 can be detachably arranged on the back plate of the touch display screen. It can be understood that the back plate here is arranged on the back of the touch display screen.

[0050] The touch frame 100 may be located within the frame of the touch display screen. The touch frame 100 includes a touch circuit board 110 . The touch circuit board 110 may be used to determine whether a touch operation currently occurs based on the reception and transmission of infrared signals, and then generate a corresponding touch signal to be sent to the signal processing module 320 .

[0051] The main board 400 can be a control main board of a touch display screen. A main chip 410 can be provided on the main board 400. The main chip 410 can be used to receive a USB signal from the signal processing module 320. The USB signal is obtained based on the touch signal and the high-speed interface signal. The touch signal can be used to characterize the position of the current touch operation. Since the high-speed interface signal is converted from the elastic wave signal, the high-speed interface signal can be used to characterize the material or properties of the object currently tapping the touch panel.

[0052] After receiving the USB signal, the main chip 410 can determine the material or property of the object currently hitting the touch panel according to the USB signal, thereby realizing the corresponding function and performing touch display.

[0053] The elastic wave collection board 300 is separated from the touch circuit board 110 on the touch frame 100 , and a main control module 310 and a signal processing module 320 are provided on the elastic wave collection board 300 . The elastic wave sensor 200 is electrically connected to the main control module 310 , so as to transmit the collected elastic wave signal to the main control module 310 .

[0054] In the embodiment of the present application, the elastic wave sensor 200 can adopt any existing pressure sensor, including but not limited to piezoelectric sensors, acoustic sensors, vibration sensors, etc. The elastic wave signal collected by the elastic wave sensor 200 is the differential pressure data signal collected by the pressure sensor.

[0055] It should be noted that although Figure 1 Only one elastic wave sensor is shown in the figure, but in other application scenarios, two or more elastic wave sensors can be set on the back of the touch panel of the touch display screen, and each of the elastic wave sensors can be connected to the main control module 310 via a USB2.0 differential signal line to transmit the elastic wave signals collected by each sensor to the main control module 310.

[0056] After receiving the elastic wave signal, the main control module 310 may convert the elastic wave signal into a high-speed interface signal and transmit it to the signal processing module 320 .

[0057] The touch circuit board 110 on the touch frame 100 can realize the touch function, which can be an infrared touch circuit board, which is not only stable and has a long service life, but also has no special requirements for the touch body, is not affected by current, voltage, static electricity, etc., and has strong adaptability. The touch signal collected by the touch circuit board 110 can be a USB2.0 differential signal, which can be connected to the signal processing module 320 through the USB2.0 differential signal line, so as to transmit the collected touch signal to the signal processing module 320.

[0058] The signal processing module 320 can convert the received high-speed interface signal and touch signal into a USB2.0 signal and transmit it to the main chip 410 on the mainboard 400, so that the main chip 410 can perform display control based on the USB2.0 signal.

[0059] In the embodiment of the present application, the elastic wave sensor 200 is directly electrically connected to the main control module 310 on the elastic wave acquisition board 300, and the collected elastic wave signal is transmitted to the main control module 310. The main control module 310 is then electrically connected to the signal processing module 320, and the high-speed interface signal converted from the elastic wave signal is transmitted to the signal processing module 320. At the same time, the touch circuit board 110 is electrically connected to the signal processing module 320, and the collected touch signal is transmitted to the signal processing module 320. The signal processing module 320 transmits the USB signal obtained by converting the touch signal and the high-speed interface signal to the main control module 310 on the main board 400. Chip 410 enables the main chip 410 to implement corresponding display control according to the USB signal. Compared with the related art in which the MCU for processing elastic wave signals is located on the touch circuit board of the touch frame, which leads to wiring difficulties and signal abnormalities, the main control module 310 for processing elastic wave signals in the embodiment of the present application is arranged on the elastic wave acquisition board 300, which is separated from the touch circuit board 110 on the touch frame 100. The wiring does not need to be routed on the touch circuit board 110, making the wiring easier and more convenient, avoiding mutual interference of signals between lines, improving the reliability of the transmitted signal, and thus improving the reliability of the touch display screen.

[0060] Next, continue to Figure 1 Each unit module shown and the specific implementation methods that may be used in practical applications are explained in detail.

[0061] like Figure 2 As shown, in some embodiments of the present application, an operational amplifier circuit 330 may also be provided on the elastic wave acquisition board 300. The operational amplifier circuit 330 may be connected to the elastic wave sensor 200 and the main control module 310 respectively to convert the elastic wave signal into a single-ended signal and transmit it to the main control module 310.

[0062] In the embodiment of the present application, the operational amplifier circuit 330 can receive the elastic wave signal output by the elastic wave sensor 200 , perform operational amplification processing on the elastic wave signal, and generate a corresponding single-ended signal to output to the main control module 310 .

[0063] It can be understood that the number of operational amplifier circuits 330 can correspond to the number of elastic wave sensors 200, that is, the elastic wave collection board 300 is provided with a corresponding number of operational amplifier circuits 330 for the number of elastic wave sensors 200 provided on the touch display screen. Each operational amplifier circuit 330 is used to process the elastic wave signal of the elastic wave sensor 200 connected thereto, and convert it into a corresponding single-ended signal to output to the main control module 310.

[0064] For example, if five elastic wave sensors are disposed on the back of the touch panel of the touch display screen, five corresponding operational amplifier circuits are also disposed.

[0065] Figure 3 Five elastic wave sensors are arranged on the back of the touch panel of the touch display screen shown, among which the elastic wave sensor 1 and the elastic wave sensor 2 are located at the upper part of the back of the touch panel of the touch display screen, and are connected to the elastic wave collection board 300 through the fourth connection terminal CN4. The fourth connection terminal CN4 transmits the elastic wave signal collected by the elastic wave sensor 1 to the operational amplifier circuit 1 for processing, and the operational amplifier circuit 1 outputs the corresponding single-ended signal to the main control module 310; similarly, the fourth connection terminal CN4 transmits the elastic wave signal collected by the elastic wave sensor 2 to the operational amplifier circuit 2 for processing, and the operational amplifier circuit 2 outputs the corresponding single-ended signal to the main control module 310.

[0066] The elastic wave sensor 3, the elastic wave sensor 4 and the elastic wave sensor 5 are located at the lower part of the back side of the touch panel of the touch display screen, and are connected to the elastic wave collection board 300 through the third connection terminal CN3. The third connection terminal CN3 transmits the elastic wave signal collected by the elastic wave sensor 3 to the operational amplifier circuit 3 for processing, and the operational amplifier circuit 3 outputs the corresponding single-ended signal to the main control module 310; the third connection terminal CN3 transmits the elastic wave signal collected by the elastic wave sensor 4 to the operational amplifier circuit 4 for processing, and the operational amplifier circuit 4 outputs the corresponding single-ended signal to the main control module 310; the third connection terminal CN3 transmits the elastic wave signal collected by the elastic wave sensor 5 to the operational amplifier circuit 5 for processing, and the operational amplifier circuit 5 outputs the corresponding single-ended signal to the main control module 310, that is, in this embodiment, there are 5 single-ended signals input to the main control module 310 for processing.

[0067] Take operational amplifier circuit 1 as an example for explanation. Figure 4The operational amplifier circuit in the embodiment of the present application may include a first-stage differential operational amplifier unit and a second-stage single-ended operational amplifier unit, wherein the first-stage differential operational amplifier unit includes a first operational amplifier UM4A and a second operational amplifier UM4B, and the second-stage single-ended operational amplifier unit includes a sixth operational amplifier UM8A. Specifically, the positive end of the elastic wave sensor 1 is connected to the first pin of the fourth terminal CN4, which is used to output the first signal TXB_SS_D1+ in the differential elastic wave signal, and the negative end of the elastic wave sensor 1 is connected to the second pin of the fourth terminal CN4, which is used to output the second signal TXB_SS_D1- in the differential elastic wave signal.

[0068] The first signal TXB_SS_D1+ is input into the inverting input terminal of the first operational amplifier UM4A. The non-inverting input terminal of the first operational amplifier UM4A is connected to the reference voltage signal VREF_1V65. The reference voltage signal VREF_1V65 is subtracted from the first signal TXB_SS_D1+ to obtain the first output signal TXB_D1+ which is input into the inverting output terminal of the sixth operational amplifier UM8A.

[0069] The second signal TXB_SS_D1- is input into the inverting input terminal of the second operational amplifier UM4B. The non-inverting input terminal of the second operational amplifier UM4B is also connected to the reference voltage signal VREF_1V65. The reference voltage signal VREF_1V65 is subtracted from the second signal TXB_SS_D1- to obtain the second output signal TXB_D1- which is input into the non-inverting output terminal of the sixth operational amplifier UM8A.

[0070] The second output signal TXB_D1 − is subtracted from the first output signal TXB_D1 + to obtain a single-ended signal TXB_ID1 corresponding to the elastic wave sensor 1 , which is output to the main control module 310 .

[0071] It can be understood that the structures of the operational amplifier circuits in the embodiments of the present application are the same. The specific circuit structures of the operational amplifier circuit 2, the operational amplifier circuit 3, the operational amplifier circuit 4 and the operational amplifier circuit 5 can refer to Figure 4 , I will not go into details here.

[0072] Please continue reading Figure 2 In some embodiments of the present application, the main control module 310 can be configured with a USB OTG interface 311, and the main control module 310 can be electrically connected to the signal processing module 320 through the USB OTG interface 311 to output the high-speed interface signal obtained by converting the single-ended signal to the signal processing module 320.

[0073] In the embodiment of the present application, the main control module 310 may be a microcontroller unit (MCU), and the main control module 310 may be configured with an OTG (On-The-Go) function, so that the main control module 310 may be configured with a USB OTG interface 311 .

[0074] After receiving the single-ended signal, the main control module 310 may process the single-ended signal using a Fast Fourier Transform (FFT) algorithm, and convert the processed signal into a high-speed interface signal for output via OTG.

[0075] In some embodiments of the present application, the high-speed interface signal may be a ULPI interface signal, and the rate of the ULPI interface signal is 480 Mbps.

[0076] Among them, ULPI is the abbreviation of UTMI+Low Pin Interface. UTMI (USB2.0 TransceiverMacrocell Interface) is a protocol used for communication between the USB controller and the USB external signal interface chip PHY. The USB external signal interface chip PHY can convert the digital signal of the USB controller into an analog signal on the cable for transmission.

[0077] Specifically, Figure 5 As shown, the main control module 310 is a chip U1, and pins 23, 24, 14, 15 and 16 of the chip U1 correspond to the single-ended signals of elastic wave sensors 1 to 5 respectively. After being processed by the FFT algorithm, each single-ended signal is converted into an 8-channel ULPI interface signal (USB_HS_ULPI_D0 to USB_HS_ULPI_D7) through OTG for output, wherein the output pins corresponding to the 8-channel ULPI interface signal (USB_HS_ULPI_D0 to USB_HS_ULPI_D7) are pins 17, 26, 27, 29, 30, 33, 34 and 57 of the chip U1.

[0078] In this embodiment, the rate of each ULPI interface signal is 60Mbps, so the rate of 8 ULPI interface signals is 480Mbps. Compared with the full-speed 12Mbps USB2.0 signal obtained by MCU conversion in the related art, the transmission rate is faster, the effect is more obvious when a large amount of data is transmitted, and the user experience is improved.

[0079] like Figure 6 As shown, in some embodiments of the present application, the signal processing module 320 may include a conversion unit 3201 and a multi-port forwarding unit 3202 .

[0080] The input end of the conversion unit 3201 is electrically connected to the main control module 310 to access the high-speed interface signal, and the output end of the conversion unit 3201 is electrically connected to the first input end of the multi-port forwarding unit 3202 to output a high-speed USB differential signal; the second input end of the multi-port forwarding unit 3202 is connected to the output end of the touch circuit board 110 to access the touch signal, and the output end of the multi-port forwarding unit 3202 is electrically connected to the mainboard 400 to output the USB signal.

[0081] In the embodiment of the present application, the conversion unit 3201 may be a USB external signal interface chip PHY, so that the high-speed interface signal from the main control module 310 may be converted into a high-speed USB differential signal and output to the multi-port forwarding unit 3202 .

[0082] The multi-port forwarding unit 3202 can have two inputs, one of which is a high-speed USB differential signal from the conversion unit 3201, and the other is a touch signal from the touch circuit board 110. Therefore, the first input end of the multi-port forwarding unit 3202 is connected to the conversion unit 3201 to access the high-speed USB differential signal, and the second input end is connected to the touch circuit board 110 to access the touch signal. It can be understood that the touch signal can be a USB2.0 differential signal.

[0083] In some embodiments of the present application, the high-speed USB differential signal may be a USB 2.0 signal with a rate of 480 Mbps.

[0084] The input end of the conversion unit 3201 is connected to the high-speed interface signal, and the output end outputs the high-speed USB differential signal. According to the description in the above embodiment, it can be known that the high-speed interface signal is a ULPI interface signal with a rate of 480Mbps. In the embodiment of the present application, the conversion unit 3201 is used for signal conversion without affecting the transmission rate of the signal. Therefore, the high-speed USB differential signal can be a USB2.0 signal with a rate of 480Mbps.

[0085] like Figure 7 As shown, in some embodiments of the present application, the conversion unit 3201 may include a USB conversion chip UY1, which can be used to convert a high-speed interface signal into a high-speed USB differential signal.

[0086] In an embodiment of the present application, pins 17 to 24 of the USB conversion chip UY1 are connected to the MCU to access the high-speed interface signal, namely, 8 ULPI interface signals (USB_HS_ULPI_D0 to USB_HS_ULPI_D7), and then the 8 ULPI interface signals (USB_HS_ULPI_D0 to USB_HS_ULPI_D7) are converted into high-speed 480Mbps USB2.0 differential signals (USB_HS_DP and USB_HS_DM) and output to the multi-port forwarding unit 3202 through pins 7 and 8.

[0087] See also Figure 8 In some embodiments of the present application, the multi-port forwarding unit 3202 may include a USB2.0 HUB chip UU1, a first input end of the USB2.0 HUB chip UU1 is connected to the conversion unit 3201 to access the high-speed USB differential signal (USB_HS_DM and USB_HS_DP), a second input end of the USB2.0 HUB chip UU1 is connected to the touch circuit board 110 to access the touch signal (TOUCH_DM and TOUCH_DP), and an output end of the USB2.0 HUB is connected to the main chip 410 on the motherboard 400 to output the USB signal (MB_USBHUB_DM and MB_USBHUB_DP).

[0088] In the embodiment of the present application, the downstream port of the USB2.0 HUB chip UU1 is connected to the USB conversion chip UY1 and the touch circuit board 110, and the upstream port is connected to the main chip 410. Specifically, the 9th and 10th pins of the USB2.0 HUB chip UU1 are connected to the USB conversion chip UY1 to access the high-speed USB differential signal (USB_HS_DM and USB_HS_DP), the 11th and 12th pins of the USB2.0 HUB chip UU1 are connected to the touch circuit board 110 to access the differential touch signal (TOUCH_DM and TOUCH_DP), and the 14th and 15th pins of the USB2.0 HUB chip UU1 are connected to the main chip 410 to output the USB signal.

[0089] It can be understood that the USB signals are USB2.0 differential signals MB_USBHUB_DM and MB_USBHUB_DP.

[0090] In some embodiments of the present application, there are multiple elastic wave sensors 200, and the multiple elastic wave sensors 200 are respectively connected to the main control module 310 through corresponding differential harnesses to transmit elastic wave signals.

[0091] In the embodiment of the present application, each elastic wave sensor 200 can be connected to the main control module 310 through a corresponding differential wire harness, that is, a differential signal line, and transmits the collected elastic wave signal to the main control module 310 for processing.

[0092] Compared with the elastic wave sensor in the related art that is connected to the touch circuit board on the touch frame through a flexible printed circuit (FPC) cable, the elastic wave sensor 200 in the embodiment of the present application is connected to the main control module 310 through a differential wiring harness, and does not need to be routed in the touch circuit board 110 of the touch frame 100. The wiring is convenient, the disassembly is easy, and the cost is reduced. At the same time, the elastic wave collection board 300 can be universal and compatible with any model of touch circuit board 110 without customization, which further reduces the cost and expands the scope of application.

[0093] In some embodiments of the present application, the touch display screen may further include a frame, a touch panel and a display module, wherein the touch panel is connected to the frame, the display module is connected to the frame, the elastic wave sensor is arranged on a side of the touch panel close to the display module, the touch frame is located on the periphery of the touch panel and is arranged in the frame, wherein the display module includes a back panel, and the elastic wave collection board and the main board are arranged on the back panel.

[0094] The touch panel 500 can be made of transparent glass, transparent plastic, etc.

[0095] In the embodiment of the present application, the elastic wave collecting plate 300 and the main board 400 can be detachably arranged on the back plate to facilitate assembly and disassembly and maintenance.

[0096] The above are only preferred embodiments of the present application, and are not intended to limit the present application in any form. Although the present application has been disclosed as above with preferred embodiments, it is not intended to limit the present application. Any technical personnel in the field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present application. However, any brief modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A touch display screen, characterized in that: include: A touch frame, an elastic wave sensor, an elastic wave collection board and a main board, wherein the elastic wave collection board is provided with a main control module and a signal processing module, and the touch frame includes a touch circuit board; The elastic wave sensor is electrically connected to the main control module to transmit the collected elastic wave signal to the main control module; The touch circuit board is electrically connected to the signal processing module to transmit the collected touch signal to the signal processing module; The main control module is electrically connected to the signal processing module to transmit a high-speed interface signal to the signal processing module, wherein the high-speed interface signal is converted from the elastic wave signal; The signal processing module is electrically connected to the mainboard to transmit a USB signal to the mainboard, wherein the USB signal is obtained by converting the touch signal and the high-speed interface signal.

2. The touch display screen according to claim 1, characterized in that: The elastic wave acquisition board is also provided with an operational amplifier circuit, which is connected to the elastic wave sensor and the main control module respectively to convert the elastic wave signal into a single-ended signal and transmit it to the main control module.

3. The touch display screen according to claim 2, characterized in that: The main control module is configured with a USB OTG interface, and the main control module is electrically connected to the signal processing module through the USB OTG interface to output the high-speed interface signal obtained by converting the single-ended signal to the signal processing module.

4. The touch display screen according to claim 1, characterized in that: The high-speed interface signal is a ULPI interface signal, and the rate of the ULPI interface signal is 480 Mbps.

5. The touch display screen according to claim 1, characterized in that: The signal processing module includes a conversion unit and a multi-port forwarding unit; The input end of the conversion unit is electrically connected to the main control module to access the high-speed interface signal, and the output end of the conversion unit is electrically connected to the first input end of the multi-port forwarding unit to output a high-speed USB differential signal; The second input end of the multi-port forwarding unit is connected to the output end of the touch circuit board to receive the touch signal, and the output end of the multi-port forwarding unit is electrically connected to the mainboard to output the USB signal.

6. The touch display screen according to claim 5, characterized in that: The high-speed USB differential signal is a USB 2.0 signal with a rate of 480 Mbps.

7. The touch display screen according to claim 5, characterized in that: The conversion unit includes a USB conversion chip, and the USB conversion chip is used to convert the high-speed interface signal into the high-speed USB differential signal.

8. The touch display screen according to claim 5, characterized in that: The multi-port forwarding unit includes a USB2.0 HUB, a first input end of the USB2.0 HUB is connected to the conversion unit to access the high-speed USB differential signal, a second input end of the USB2.0 HUB is connected to the touch circuit board to access the touch signal, and an output end of the USB2.0 HUB is connected to the mainboard to output the USB signal.

9. The touch display screen according to any one of claims 1 to 8, characterized in that: There are multiple elastic wave sensors, and the multiple elastic wave sensors are respectively connected to the main control module through corresponding differential wiring harnesses to transmit the elastic wave signals.

10. The touch display screen according to any one of claims 1 to 8, characterized in that: The touch display screen also includes a frame, a touch panel and a display module, the touch panel is connected to the frame, the display module is connected to the frame, the elastic wave sensor is arranged on a side of the touch panel close to the display module, the touch frame is located at the periphery of the touch panel and is arranged in the frame, the display module includes a back panel, and the elastic wave collection board and the main board are arranged on the back panel.

Images