Rapid feeding device for bonding machine

Abstract

The utility model discloses a rapid feeding device for a bonding machine. The rapid feeding device comprises a lower tool and a detachable upper tool arranged on the lower tool. The lower tool comprises an annular support, three supporting protruding parts are evenly arranged on the inner annular face of the annular support, a positioning groove is formed between every two adjacent supporting protruding parts, the upper tool comprises three profiling protruding parts, every two adjacent profiling protruding parts are connected through an upper connecting arm, the profiling protruding parts are arranged in the corresponding positioning grooves, and the upper connecting arm is connected with the upper connecting arm. Wherein a positioning plane is arranged on the inner side surface of one profiling convex part, a supporting plate is arranged on the peripheral surface of the profiling convex part, and the supporting plate is erected on the surface of the annular support. The wafer stacking device is simple in operation, can accurately stack wafers, and improves the preparation quality.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor preparation, in particular to a fast feeding device for a bonding machine. Background Art

[0002] A wafer bonder is a device that tightly bonds two or more wafers together through chemical and physical effects to achieve a specific bonding strength. During the bonding process, a loading tooling device is required to ensure that the two wafers can be accurately stacked together.

[0003] Currently, when stacking multiple wafers, manual assistance is required. Due to manual placement, the relative position between the upper and lower wafers greatly tests the manual operation experience. Moreover, when the two wafers are overlapped, the two have a certain adsorption force, and operations such as rotation are likely to cause surface wear. Therefore, it is not recommended to adjust the two stacked wafers.

[0004] In the existing loading tooling, an extended tongue support plate is used to allow manual observation of the relative position between two wafers before stacking. Subsequently, the multiple tongue support plates are removed in sequence, and the upper wafer falls on the surface of the next wafer. Since they are removed in sequence, the wafers do not fall vertically, and alignment and filling problems will still occur during the stacking process, which greatly affects subsequent processing. Summary of the invention

[0005] The technical problem to be solved by the utility model is to provide a fast feeding device for a bonding machine, which is simple to operate, can accurately overlap wafers, and improve preparation quality.

[0006] In order to solve the above technical problems, the utility model provides a rapid loading device for a bonding machine, comprising a lower tooling and a detachable upper tooling arranged on the lower tooling; the lower tooling comprises an annular bracket, three supporting protrusions are evenly arranged on the inner ring surface of the annular bracket, and a positioning groove is formed between two adjacent supporting protrusions; the upper tooling comprises three contour protrusions, and two adjacent contour protrusions are connected by an upper connecting arm, and the contour protrusions are arranged in corresponding positioning grooves, wherein a positioning plane is arranged on the inner side surface of one of the contour protrusions, and a support plate is arranged on the outer peripheral surface of the contour protrusion, and the support plate is mounted on the surface of the annular bracket.

[0007] Furthermore, a lower pressure arm is provided on one side of the supporting protrusion, and a rubber wheel is provided on the lower pressure arm.

[0008] Furthermore, the lower pressure arm is arranged on the base, and a front straight swing arm and a rear L-shaped swing arm are axially connected on the base. The lower pressure arm is axially connected to one end of the front straight swing arm and the rear L-shaped swing arm respectively, and the other end of the L-shaped swing arm is connected to an action button through a connecting rod. The action button is axially connected to the base, and a tension spring is also arranged between the action button and the base.

[0009] Furthermore, the connecting rod includes an axle seat, a limiting screw is provided on the axle seat, a through hole is provided at the end of the L-shaped swing arm corresponding to the limiting screw, the limiting screw passes through the through hole and is connected to the axle seat, and a spring is provided on the limiting screw between the axle seat and the end of the L-shaped swing arm.

[0010] Furthermore, a U-shaped groove is provided at the end of the lower pressure arm, and the rubber wheel is arranged in the U-shaped groove.

[0011] Furthermore, the support plate is provided with a guide hole, and a guide column is provided on the annular bracket corresponding to the guide hole, and the guide hole and the guide column cooperate with each other to guide the upper tooling installation.

[0012] Furthermore, an operating groove is provided on the contoured protrusion on one side of the positioning plane.

[0013] Furthermore, the lower tooling is made of metal, and the upper tooling is made of plastic.

[0014] Beneficial effects of the utility model:

[0015] 1. The upper tooling that matches the lower tooling is used to position the wafer, so that multiple wafers can be effectively stacked in the same position. With the setting of the positioning plane, the stacking accuracy is high and the stacking is convenient. There is no need to adjust the placement position based on experience. The upper tooling can be detached and does not affect the flow of the lower tooling into the equipment for processing.

[0016] 2. The positioning groove can effectively position the contoured convex part, making the installation of the upper tooling simple.

[0017] 3. The setting of the lower pressure arm can press and fix the wafers after they are stacked, which has a good fixing effect and can ensure that the position of the wafers does not change during the circulation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 It is a structural schematic diagram of the lower tooling of the utility model;

[0020] Figure 3 It is a schematic diagram of the bottom structure of the upper tooling of the utility model;

[0021] Figure 4 It is a schematic diagram of the driving structure of the lower pressure arm of the utility model. DETAILED DESCRIPTION

[0022] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0023] Reference Figures 1 to 3 As shown, an embodiment of the rapid loading device for a bonding machine of the utility model comprises a lower tooling 1 and a detachable upper tooling 2 arranged on the lower tooling; the lower tooling comprises an annular bracket 3, three supporting protrusions 4 are evenly arranged on the inner ring surface of the annular bracket, and a positioning groove 5 is formed between two adjacent supporting protrusions; the upper tooling comprises three profiling protrusions 6, and two adjacent profiling protrusions are connected by an upper connecting arm 7, and the profiling protrusions are arranged in corresponding positioning grooves, and a positioning plane 8 is arranged on the inner side surface of one of the profiling protrusions, and a support plate 9 is arranged on the outer peripheral surface of the profiling protrusion, and the support plate is mounted on the surface of the annular bracket.

[0024] The above-mentioned lower tooling is used in circulation in the equipment, and the upper tooling is used in conjunction with the lower tooling when stacking wafers. During specific operations, the upper tooling is first placed on the lower tooling, and the three contoured protrusions respectively enter the corresponding three positioning grooves, and the three positioning grooves limit the upper tooling from moving and rotating in the horizontal direction. After being placed in place, the support plate is erected on the surface of the annular bracket to form an effect of fixed relative position, and then the first wafer is placed from the upper tooling, and the wafer enters the position formed along the inner side walls of the three contoured protrusions, and is erected on the surfaces of the three supporting protrusions. The positioning plane set on one of the contoured protrusions just fits a straight edge of the wafer, that is, the inner sides of the three contoured protrusions form the shape of the wafer, and the wafer placement position is unique and will not rotate; then the second wafer can be placed, and the first wafer and the second wafer can be stacked together in the same posture, without the need for manual adjustment and judgment, and also eliminating the need for the use of a tongue support plate.

[0025] Finally, the upper tooling is removed from bottom to top to achieve the effect of overlapping placement. During the removal process, since the profiling convex part contacts the periphery of the wafer, in order to avoid interference with the placed wafer, a lower pressure arm 10 is provided on one side of each supporting convex part, and a rubber wheel 11 is provided on the lower pressure arm. By pressing down the lower pressure arm, the wafer is pressed tightly on the supporting convex part, and the removal of the upper tooling does not affect the stacking position of the wafer. The rubber wheel is mainly used to contact the wafer, and it has elasticity to avoid crushing the wafer when pressing down. A U-shaped groove 20 is provided at the end of the lower pressure arm, and the rubber wheel is set in the U-shaped groove, so the pressure applied is stable and it is also easy to replace.

[0026] In order to further reduce the interference with the wafer when the upper tooling is removed, a guide hole 21 is also provided on the support plate, and a guide column 22 is provided on the annular bracket corresponding to the guide hole. The guide hole and the guide column cooperate to guide the installation of the upper tooling. The upper tooling can only move along the guide direction of the guide column, that is, the contoured protrusion cannot cause squeezing damage to the wafer in the horizontal direction, thereby improving the operating accuracy and making the operation more convenient when placing.

[0027] An operating groove 23 is also provided on the contoured convex portion on one side of the positioning plane. When the wafer is damaged due to operational errors during the placement process, there is no need to remove the upper tooling and then take out the wafer. Instead, the fingers can be inserted into the operating groove and the upper and lower surfaces of the wafer can be grasped to take out the wafer, thereby improving the convenience of operation.

[0028] The above-mentioned lower tooling is made of metal material, which flows into the equipment for bonding operation, and the upper tooling is made of plastic material, which can reduce the preparation cost and reduce the damage caused by friction between the wafer and the upper tooling.

[0029] Reference Figure 4 As shown, the present application also discloses a structure for conveniently pressing down the pressure arm, specifically: the pressure arm is arranged on the base 12, and the front swing arm 13 and the rear L-shaped swing arm 14 are axially arranged on the base, the pressure arm is axially connected to one end of the front swing arm and the rear L-shaped swing arm respectively, and the other end of the L-shaped swing arm is connected to the action button 15 through a connecting rod 171, and the action button is axially connected to the base, and a tension spring 16 is also arranged between the action button and the base. The pressure arm, the base, the front swing arm and the rear L-shaped swing arm cooperate to form a quadrilateral structure, and after being axially connected, the pressure arm can move forward and downward, as well as upward and backward (see the quadrilateral deformation structure for the principle, which is not described in detail for the prior art), that is, it can avoid the placement of the wafer, and after the placement is completed, it can move to the top of the wafer and press downward. The power for clamping is provided by a tension spring, which pulls the action button to rotate clockwise. During the upward swing of the action button, the connecting rod moves upward, and the connecting rod pushes the L-shaped swing arm to rotate clockwise. The L-shaped swing arm pushes the lower pressure arm to extend and clamp the wafer. When contact and clamping are required, the power is provided by a tension spring, which pulls the action button to rotate counterclockwise. During the downward swing of the action button, the connecting rod moves downward, and the connecting rod pulls the L-shaped swing arm to rotate counterclockwise. The L-shaped swing arm pulls the lower pressure arm back to contact and clamp the wafer.

[0030] Among them, the axial connection position between the action button and the base is located in the middle part of the tension spring. When the tension spring and the axial connection position are located in the same straight line, theoretically no rotation occurs. When they are not in the same straight line, the tension force of the deformation of the tension spring can drive the action button to rotate along the axial connection position until the rotation limit position is reached, that is, the action button can be pulled by the tension spring in two directions to form two action ranges.

[0031] During specific operation, a force is manually applied to the action button. When the action button rotates in the first action range, the tension spring is stretched, and the tension spring deforms and stores force. When the action button rotates to the second action range, the tension spring is reset and the action button is pulled to the limit position of the second action range, and vice versa.

[0032] In order to avoid excessive pressure when the lower pressure arm is pressed down, the connecting rod is improved. The connecting rod includes a shaft seat 17, a limit screw 18 is arranged on the shaft seat, and a through hole is arranged at the end of the L-shaped swing arm corresponding to the limit screw. The limit screw passes through the through hole and is connected to the shaft seat. A spring 19 is arranged on the limit screw between the shaft seat and the end of the L-shaped swing arm. When multiple wafers are stacked, different numbers have different thicknesses. During the process of pushing and applying pressure by the connecting rod, the spring can adaptively change the swing formation of the L-shaped swing arm, thereby meeting the compression of different thicknesses, and the force applied by the tension spring is offset, thereby ensuring that the wafer will not be damaged during compression.

[0033] Specifically, through the setting of the spring, the movement of the connecting rod will not change. When the wafer thickness increases, the swing of the L-shaped swing arm will decrease. At this time, the spring is adaptively compressed to form an elastic connection to reduce the pressure.

[0034] The above embodiments are only preferred embodiments for fully illustrating the present invention, and the protection scope of the present invention is not limited thereto. Any equivalent substitution or modification made by a person skilled in the art based on the present invention is within the protection scope of the present invention.

Claims

1. A fast feeding device for a bonding machine, characterized in that: It includes a lower tooling and a detachable upper tooling arranged on the lower tooling; the lower tooling includes an annular bracket, three supporting protrusions are evenly arranged on the inner ring surface of the annular bracket, and a positioning groove is formed between two adjacent supporting protrusions; the upper tooling includes three profiling protrusions, and two adjacent profiling protrusions are connected by an upper connecting arm. The profiling protrusions are arranged in corresponding positioning grooves, and a positioning plane is arranged on the inner side surface of one of the profiling protrusions. A support plate is arranged on the outer circumferential surface of the profiling protrusion, and the support plate is mounted on the surface of the annular bracket.

2. The fast feeding device for bonding machine according to claim 1, characterized in that: A lower pressing arm is arranged on one side of the supporting protrusion, and a rubber wheel is arranged on the lower pressing arm.

3. The fast feeding device for bonding machine according to claim 2, characterized in that: The lower pressure arm is arranged on the base, and a front straight swing arm and a rear L-shaped swing arm are axially connected on the base. The lower pressure arm is axially connected to one end of the front straight swing arm and the rear L-shaped swing arm respectively, and the other end of the L-shaped swing arm is connected to an action button through a connecting rod. The action button is axially connected to the base, and a tension spring is also arranged between the action button and the base.

4. The fast feeding device for bonding machine according to claim 3, characterized in that: The connecting rod includes an axle seat, a limiting screw is arranged on the axle seat, a through hole is arranged at the end of the L-shaped swing arm corresponding to the limiting screw, the limiting screw passes through the through hole and is connected to the axle seat, and a spring is arranged on the limiting screw between the axle seat and the end of the L-shaped swing arm.

5. The fast feeding device for bonding machine according to claim 2, characterized in that: The end of the lower pressure arm is provided with a U-shaped groove, and the rubber wheel is arranged in the U-shaped groove.

6. The fast feeding device for bonding machine according to claim 1, characterized in that: The support plate is provided with a guide hole, and a guide column is provided on the annular bracket corresponding to the guide hole. The guide hole and the guide column cooperate with each other to guide the upper tooling installation.

7. The fast feeding device for a bonding machine according to claim 1, characterized in that: An operating groove is arranged on the contoured convex portion on one side of the positioning plane.

8. The fast feeding device for bonding machine according to claim 1, characterized in that: The lower tooling is made of metal, and the upper tooling is made of plastic.

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