Tray for inspection in semiconductor chip packaging process

Abstract

The utility model discloses a tray for inspection in the packaging process of a semiconductor chip, relates to the field of semiconductor chips, and solves the problems that a metal lead frame is poor in limiting effect and is easy to deform and damage due to external pressure in the conventional side plate contact-type limiting, and adopts the following scheme: the tray comprises a tray plate; a sliding groove distributed in an L shape is formed in the top face of the tray plate, and a positioning tooth holder located on the outer side of the sliding groove is further assembled on the top of the tray plate; a first corner frame assembly and a second corner frame assembly which are distributed diagonally are fixedly mounted at the top of the tray plate; according to the tray for inspection in the packaging process of the semiconductor chip, through arrangement of the first corner frame assembly and the second corner frame assembly above the tray plate, metal lead frames on the inner sides of the tray plate can be limited from two inclined corners, meanwhile, in the inward extrusion process, a bearing frame is synchronously extruded inwards, and the inspection efficiency is improved. And the sponge body frame in the inner side ring is in contact with the metal lead frame, so that a protection effect is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chips, in particular to a tray for semiconductor chip packaging process inspection. Background Art

[0002] Semiconductor chips refer to semiconductor devices that can achieve certain functions by etching and wiring on semiconductor sheets. They are not just silicon chips, but also commonly include semiconductor materials such as gallium arsenide and germanium.

[0003] After searching, the application with patent number CN202221849069.8 discloses a tray structure for semiconductor chip packaging process inspection, including a bottom plate, a first side plate, a second side plate and a third side plate, an eccentric block rotating in a vertical plane is arranged at one end of the bottom plate away from the second side plate, the center of gravity of the eccentric block deviates from its rotation center, and the first side plate or the second side plate is slidably mounted on the bottom plate, and the third side plate is slidably mounted on the bottom plate; different metal lead frames are adapted by moving the first, second and third side plates, and when the bottom plate is moved, the eccentric block automatically rotates under the action of gravity, and the eccentric block cooperates with the third side plate to further limit the purpose of moving the metal lead frame;

[0004] The tray in the above application document is provided with three groups of side plates and a group of eccentric blocks to limit the metal lead frame, but the positions of the three groups of side plates need to be moved and the eccentric blocks need to be adjusted at the same time. This process is not only relatively cumbersome, but also requires strict control of the positions of the three groups of side plates during adjustment. Once the side pressure is too large, the metal lead frame may be easily deformed and damaged. If the side pressure is too small, the metal lead frame may shake on its inner side during movement, and collision with the side plates may also cause deformation and damage to the metal lead frame.

[0005] Therefore, we propose a tray for semiconductor chip packaging process inspection. Utility Model Content

[0006] In view of the deficiencies of the prior art, the utility model provides a tray for semiconductor chip packaging process inspection, which solves the problem that the existing side plate contact limiter has poor limiting effect on the metal lead frame and is easily damaged by external pressure deformation.

[0007] To achieve the above objectives, the utility model is implemented through the following technical solutions: a tray for semiconductor chip packaging process inspection, including a tray plate and a metal lead frame with a semiconductor chip placed on the top surface thereof;

[0008] The top surface of the tray plate is provided with an L-shaped sliding groove, and the top of the tray plate is also equipped with a positioning gear seat located outside the sliding groove;

[0009] A first corner frame assembly and a second corner frame assembly which are diagonally distributed are fixedly mounted on the top of the pallet plate;

[0010] The main bodies of the first corner frame assembly and the second corner frame assembly are both L-shaped first corner frame strips and second corner frame strips, the end of the first corner frame strip is provided with a card slot, and the end of the second corner frame strip is fixedly installed with a card strip adapted to the specifications;

[0011] A first tooth plate and a second tooth plate are fixedly mounted on the outer walls of the first corner frame bar and the second corner frame bar, respectively, and a first slide block and a second slide block matching the specifications of the slide groove are fixedly mounted on the bottom of the first corner frame bar and the second corner frame bar;

[0012] A receiving frame located inside the first corner frame assembly and the second corner frame assembly is fixedly mounted on the top side of the tray plate.

[0013] Preferably, the receiving frame is composed of an outer rectangular soft rubber strip frame and an inner sponge frame, and a metal lead frame is placed on the inner side of the receiving frame, wherein the rectangular rubber strip frame is arranged to be deformed with the oblique movement of the first corner frame assembly and the second corner frame assembly, and at the same time, the sponge frame on its inner side moves inward and contacts with the outer side of the metal lead frame to provide soft protection therefor; even if the metal lead frame shakes or the outer side is deformed due to force, the automatic deformation of the sponge frame can be used to offset the outer pressure, thereby avoiding the deformation of the metal lead frame due to force, thereby ensuring the protective effect of the metal lead frame.

[0014] Preferably, the main body of the positioning gear seat is a gear meshing with the first tooth plate and the second tooth plate, the inner side of the gear is assembled on the tray plate through a positioning bolt, and a handwheel is fixedly installed on the top side of the gear, wherein the setting of the positioning gear seat is convenient for manual rotation thereof, synchronously driving the first corner frame assembly and the second corner frame assembly to move horizontally or vertically, thereby achieving corresponding limiting of the metal lead frame therebetween.

[0015] Preferably, a triangular cover is fixedly mounted on the top of the first corner frame assembly and the second corner frame assembly, and the cover is arranged to protect the metal lead frame from the top side after the first corner frame assembly and the second corner frame assembly are moved to corresponding positions.

[0016] Preferably, the slide groove is a T-shaped straight groove, and the first slider and the second slider are both T-shaped blocks that match the shape of the slide groove.

[0017] The utility model provides a tray for semiconductor chip packaging process inspection, which has the following beneficial effects:

[0018] 1. The inspection tray for semiconductor chip packaging process can limit the metal lead frame inside from two oblique corners through the arrangement of the first corner frame assembly and the second corner frame assembly above the tray plate. At the same time, during the inward extrusion process, the receiving frame will be extruded inward synchronously so that the sponge frame in the inner circle contacts with the metal lead frame, thereby ensuring the limiting effect and protecting it from deformation, thus solving the problem that the existing side plate contact limiting has poor limiting effect on the metal lead frame and is easily damaged by deformation due to the external pressure.

[0019] 2. The inspection tray for the semiconductor chip packaging process can drive the first corner frame assembly and the second corner frame assembly to move toward each other in an oblique direction by rotating two sets of positioning gear seats, and squeeze the receiving frame on the inner side so that it is sleeved on the outer side of the metal lead frame, thereby achieving the effect of limiting it. The operation is simple and the effect is good, which solves the problem that the above application documents require three sets of side plates to drive the limit and also require manual rotation of the eccentric block for adjustment, which is cumbersome. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the utility model;

[0021] Figure 2 This is a schematic diagram of the structure of the tray seat of the utility model;

[0022] Figure 3 This is a schematic structural diagram of the first corner frame assembly of the utility model;

[0023] Figure 4 It is a structural schematic diagram of the second corner frame assembly of the utility model.

[0024] In the figure: 1. tray plate; 2. first corner frame assembly; 21. first corner frame strip; 22. first tooth plate; 23. first slider; 24. slot; 3. second corner frame assembly; 31. second corner frame strip; 32. second tooth plate; 33. second slider; 34. slot; 4. receiving frame; 5. slide groove; 6. positioning gear seat. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] Embodiment 1:

[0027] A tray for semiconductor chip packaging process inspection, comprising a tray plate 1 and a metal lead frame with a semiconductor chip placed on the top surface thereof; a slide groove 5 distributed in an L shape is provided on the top surface of the tray plate 1, and a positioning tooth seat 6 located outside the slide groove 5 is also equipped on the top of the tray plate 1; a first corner frame assembly 2 and a second corner frame assembly 3 distributed diagonally are fixedly installed on the top of the tray plate 1; the main bodies of the first corner frame assembly 2 and the second corner frame assembly 3 are both L-shaped first corner frame strips 21 and second corner frame strips 31, a card slot 24 is provided at the end of the first corner frame strip 21, and a card strip 34 compatible with the 25 specification is fixedly installed at the end of the second corner frame strip 31; a first tooth plate 22 and a second tooth plate 32 are fixedly installed on the outer walls of the first corner frame strip 21 and the second corner frame strip 31, respectively, and the bottoms of the first corner frame strip 21 and the second corner frame strip 31 are fixedly installed with The first slider 23 and the second slider 33 are adapted to the specifications of the slide groove 5; the top side of the tray plate 1 is fixedly installed with a receiving frame 4 located inside the first corner frame component 2 and the second corner frame component 3; the receiving frame 4 is composed of an outer rectangular soft rubber strip frame and an inner sponge frame, and a metal lead frame is placed inside the receiving frame 4. The semiconductor chip packaging process inspection tray can limit the metal lead frame inside from two oblique corners through the arrangement of each component in the first corner frame component 2 and the second corner frame component 3 above the tray plate 1. At the same time, in the process of inward extrusion, the receiving frame 4 will be synchronously extruded inward, so that the sponge frame in the inner circle contacts with the metal lead frame, ensuring the limiting effect while protecting it from deformation, solving the problem that the existing side plate contact limiting has a poor limiting effect on the metal lead frame and is easily damaged by the outer pressure deformation;

[0028] Embodiment 2:

[0029] The main body of the positioning gear seat 6 is a gear meshing with the first tooth plate 22 and the second tooth plate 32. The inner side of the gear is assembled on the tray plate 1 by a positioning bolt, and a handwheel is fixedly installed on the top side of the gear. A triangular cover plate is fixedly installed on the top of the first corner frame assembly 2 and the second corner frame assembly 3. The slide 5 is a T-shaped straight groove, and the first slider 23 and the second slider 33 are both T-shaped blocks that match the shape of the slide 5. The tray for inspecting the semiconductor chip packaging process only needs to rotate two sets of positioning gear seats 6 to obliquely drive the first corner frame assembly 2 and the second corner frame assembly 3 to move toward each other, and squeeze the receiving frame 4 on the inner side so that it is sleeved on the outer side of the metal lead frame, thereby achieving the effect of limiting it. The operation is simple and the effect is good, which solves the problem that the above-mentioned application documents require three sets of side plates to drive the limit and also require manual rotation of the eccentric block for adjustment, which is cumbersome.

[0030] The working principle and use process of the utility model are as follows: when the device is needed to work, the two sets of positioning tooth seats 6 are rotated to move the first corner frame assembly 2 and the second corner frame assembly 3 outward, and then the metal lead frame is placed on the inner side of the receiving frame 4, and then the two sets of positioning tooth seats 6 are rotated in the opposite direction to drive the first corner frame assembly 2 and the second corner frame assembly 3 to move inward obliquely relative to each other, and the receiving frame 4 is simultaneously squeezed so that the sponge frame layer on its inner wall contacts the outer side of the metal lead frame, and it is limited in four directions. At the same time, the sponge frame layer on the inner side of the receiving frame 4 is arranged to squeeze and fill the gap between the first corner frame assembly 2 and the second corner frame assembly 3 and the metal lead frame to ensure the limiting effect. If there is pressure on the outer side of the metal lead frame due to movement or shaking, the sponge frame layer can offset the pressure as much as possible to ensure the protective effect of the metal lead frame.

[0031] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0032] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A tray for semiconductor chip packaging process inspection, comprising a tray plate (1) and a metal lead frame with a semiconductor chip placed on the top surface thereof; Features: The top surface of the tray plate (1) is provided with a slide groove (5) distributed in an L shape, and the top of the tray plate (1) is also equipped with a positioning tooth seat (6) located outside the slide groove (5); A first corner frame assembly (2) and a second corner frame assembly (3) which are diagonally distributed are fixedly mounted on the top of the pallet plate (1); The main bodies of the first corner frame assembly (2) and the second corner frame assembly (3) are both L-shaped first corner frame strips (21) and second corner frame strips (31), the end of the first corner frame strip (21) is provided with a clamping groove (24), and the end of the second corner frame strip (31) is fixedly installed with a clamping strip (34) matching the specifications of (25); A first tooth plate (22) and a second tooth plate (32) are fixedly mounted on the outer walls of the first corner frame strip (21) and the second corner frame strip (31), respectively, and a first slide block (23) and a second slide block (33) that are compatible with the specifications of the slide groove (5) are fixedly mounted on the bottoms of the first corner frame strip (21) and the second corner frame strip (31); A receiving frame (4) located inside the first corner frame assembly (2) and the second corner frame assembly (3) is fixedly mounted on the top side of the tray plate (1).

2. A tray for semiconductor chip packaging process inspection according to claim 1, characterized in that: The receiving frame (4) is composed of an outer rectangular soft rubber strip frame and an inner sponge frame, and a metal lead frame is placed inside the receiving frame (4).

3. A tray for semiconductor chip packaging process inspection according to claim 1, characterized in that: The main body of the positioning gear seat (6) is a gear meshing with the first gear plate (22) and the second gear plate (32); the inner side of the gear is assembled on the tray plate (1) through positioning bolts, and a hand wheel is fixedly installed on the top side of the gear.

4. A tray for semiconductor chip packaging process inspection according to claim 1, characterized in that: A triangular cover plate is fixedly mounted on the top of the first corner frame assembly (2) and the second corner frame assembly (3).

5. The semiconductor chip packaging process inspection tray according to claim 1, characterized in that: The slide groove (5) is a T-shaped straight groove, and the first slider (23) and the second slider (33) are both T-shaped blocks that match the shape of the slide groove (5).

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