Flexible automatic silicon wafer gripper clamp

Abstract

The utility model discloses a flexible automatic silicon wafer gripper clamp, which belongs to the technical field of silicon wafer gripper clamps, and comprises a gripper part, the gripper part comprises at least two gripper bodies which are arranged oppositely, when the two gripper bodies move oppositely, a silicon wafer is gripped, and when the two gripper bodies move reversely, the silicon wafer is released; the driving part comprises a driver and a driving piece, and the driver drives the driving piece to enable the two gripper bodies to move in the opposite directions or in the opposite directions; and the connecting part is used for connecting the driving piece with the gripper body. The driver is controlled by a motor, the position degree of the gripper body can be effectively and accurately controlled, specific position data can be fed back in real time, the gripper body can stop at any position through parameterization adjustment so as to grab silicon wafers of different specifications and sizes, the compatibility is high, and the production takt is greatly shortened.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon wafer gripper clamps, and in particular relates to a flexible automatic silicon wafer gripper clamp. Background Art

[0002] Silicon crystal photovoltaic technology is the most widely used photovoltaic technology at present. Its cells use silicon as the main material and are made of single crystal silicon or polycrystalline silicon. Silicon crystal photovoltaics have the advantages of high efficiency, stability and reliability, but their production cost is high. The materials used in thin-film solar cells mainly include amorphous silicon, copper indium gallium selenide, organic materials, etc., which have the characteristics of light weight, low production cost and strong flexibility, but their efficiency is lower than that of silicon crystal photovoltaics. Polycrystalline silicon photovoltaics use microcrystalline crystals of high-purity silicon, which can be comparable to ordinary silicon crystal cells, but its manufacturing process is more advanced than silicon crystal photovoltaic technology, and silicon crystal rods are a commonly used silicon crystal.

[0003] Silicon wafers are formed after slicing the silicon crystal rods. After slicing and cleaning, the silicon wafers will be inspected by silicon wafer sorting machines for size, thickness, dirt, edge collapse, resistance measurement, hidden cracks, P / N, holes, etc., and then transported to the automated packaging area. During this process, grippers are needed to grab the silicon wafers.

[0004] The original silicon wafers were transported by pneumatic grippers and placed on the downstream conveyor line for plastic sealing. Since the grippers were driven by cylinders, their gripping size was relatively fixed, and could not meet the needs of rapid adjustment and compatibility for silicon wafers of different specifications and sizes. The gripper distance needed to be adjusted manually. When switching between silicon wafers of different specifications and sizes, the manual replacement cycle was long, which seriously affected the production rhythm. In addition, the manual adjustment accuracy was not high, and there was a problem of inaccurate positioning, which could easily crush the silicon wafers. Utility Model Content

[0005] The utility model overcomes the shortcomings of the prior art and provides a flexible automatic silicon wafer gripper clamp to solve the problems existing in the prior art.

[0006] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a flexible automatic silicon wafer gripper clamp, comprising

[0007] A gripper portion, the gripper portion comprising at least two gripper bodies disposed in opposite directions, wherein when the two gripper bodies move in opposite directions, the silicon wafer is gripped, and when the two gripper bodies move in opposite directions, the silicon wafer is released;

[0008] A driving part, the driving part includes a driver and a driving member, the driver drives the driving member to move the two gripper bodies toward each other or in opposite directions;

[0009] A connecting portion connects the driving member with the gripper body.

[0010] In a preferred embodiment of the utility model, the driver is a driving motor, and the driving member includes a main connecting rod and a secondary connecting rod. The main connecting rod is connected to the driver through a coupling, and the secondary connecting rod is connected to the connecting part. When the main connecting rod rotates under the drive of the driver, the secondary connecting rod continuously reciprocates.

[0011] In a preferred embodiment of the utility model, the connecting part includes a mounting plate, a guide rail arranged on the mounting plate and a slider moving along the length direction of the guide rail, the secondary connecting rod drives the slider to move along the length direction of the guide rail, and the gripper body is connected to the slider.

[0012] In a preferred embodiment of the utility model, the gripper body includes a mounting frame, a clamping plate and a support plate, the mounting frame is connected to the slider, the secondary connecting rod drives the mounting frame, the clamping plate is arranged on the mounting frame, and the clamping plate and the support plate are detachably connected to form an L-shaped structure.

[0013] In a preferred embodiment of the utility model, an adjustment plate and an adjustment block are provided on the sliding block to install the mounting frame.

[0014] In a preferred embodiment of the utility model, a limiting portion is provided on the mounting frame, and the limiting portion includes a stop plate and a limiting block, the stop plate is connected to the end of the secondary connecting rod to stop the end of the secondary connecting rod from rotating, and the limiting block is provided on the mounting frame to limit the gripper body.

[0015] In a preferred embodiment of the utility model, a fixing block is arranged on the mounting plate, and after the fixing block contacts the limiting block, the gripper body is limited.

[0016] In a preferred embodiment of the utility model, a plurality of sensors are arranged on one side of the mounting plate close to the silicon wafer to sense the silicon wafer.

[0017] The utility model solves the defects existing in the background technology, and has the following beneficial effects:

[0018] (1) The driver of the utility model adopts motor control, which can effectively and accurately control the position of the gripper body and feedback the specific position data in real time. Through parameter adjustment, the gripper body can be docked at any position to meet the needs of grabbing silicon wafers of different specifications and sizes. It has strong compatibility and greatly shortens the production cycle;

[0019] (2) The gripper clamp of the utility model adopts a connecting rod drive in conjunction with a linear slide rail mechanism to clamp the silicon wafer from four directions, ensuring smooth placement and regularization of the silicon wafer and centering of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The utility model is further described below in conjunction with the accompanying drawings and embodiments;

[0021] Figure 1 It is a schematic diagram of the overall structure of a preferred embodiment of the utility model;

[0022] Figure 2 This is a schematic diagram of the first partial structure of the preferred embodiment of the utility model;

[0023] Figure 3 This is a schematic diagram of the second partial structure of the preferred embodiment of the utility model;

[0024] Figure 4 This is a schematic diagram of the third partial structure of the preferred embodiment of the utility model;

[0025] In the figure: 10, gripper part; 11, gripper body; 111, mounting frame; 112, clamping plate; 113, support plate; 20, driving part; 21, driver; 22, driving member; 221, main connecting rod; 222, secondary connecting rod; 30, connecting part; 31, mounting plate; 32, guide rail; 33, slider; 331, adjustment plate; 332, adjustment block; 40, coupling; 50, limit part; 51, stop plate; 52, limit block; 60, fixing block; 70, sensor. DETAILED DESCRIPTION

[0026] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0027] This embodiment provides a flexible automated silicon wafer gripper fixture, which can meet the needs of gripping silicon wafers of different specifications and sizes, has strong compatibility, and greatly shortens the production cycle.

[0028] Combination Figures 1 to 4 As shown, the gripper clamp of this embodiment includes a gripper portion 10, a driving portion 20 and a connecting portion 30. The gripper portion 10 grips the silicon wafer, and the driving portion 20 can drive the gripper portion 10. The connecting portion 30 can connect the gripper portion 10 with the driving portion 20, so that the driving portion 20 can stably drive the gripper portion 10.

[0029] In this embodiment, the gripper portion 10 includes at least two gripper bodies 11 disposed opposite to each other. When the two gripper bodies 11 move toward each other, the silicon wafer is gripped. When the two gripper bodies 11 move in opposite directions, the silicon wafer is released. There are four gripper bodies 11 in this embodiment, which can grip the silicon wafer from four directions. The picking and placing are smooth, and the silicon wafer can be regularized and centered.

[0030] Specifically, the gripper body 11 includes a mounting frame 111, a clamping plate 112 and a support plate 113. The clamping plate 112 is arranged on the mounting frame 111. The clamping plate 112 and the support plate 113 are detachably connected to form an L-shaped structure. When grabbing the silicon wafer, the mounting frame 111 drives the clamping plate 112 to move, and the clamping plate 112 clamps the silicon wafer, while the support plate 113 can support and support the silicon wafer and lift the silicon wafer. Therefore, the gripper body 11 can simultaneously realize the bearing and clamping of the silicon wafer, and realize the regularity and centering of the silicon wafer during grabbing.

[0031] Combination Figure 1 and Figure 2 As shown, the driving part 20 includes a driver 21 and a driving member 22. The driver 21 drives the driving member 22 to move the gripper body 11 toward or in the opposite direction. The driver 21 of this embodiment is a driving motor. The driving member 22 includes a main connecting rod 221 and a secondary connecting rod 222. The main connecting rod 221 is connected to the driver 21 through a coupling 40, and the secondary connecting rod 222 is connected to the connecting part 30. When the main connecting rod 221 rotates under the drive of the driver 21, the secondary connecting rod 222 continuously reciprocates. When the driving motor drives the main connecting rod 221 to rotate, since the secondary connecting rod 222 is connected to the main connecting rod 221 through a connecting shaft, the main connecting rod 22 When rotating, the secondary connecting rod 222 will perform continuous reciprocating motion. Under the action of the connecting portion 30, the gripper body 11 is driven to make the gripper body 11 move toward or in the opposite direction to achieve the grasping or releasing of the silicon wafer. The driver 21 of this embodiment adopts motor control, which can effectively and accurately control the position of the gripper body 11 and feedback the specific position data in real time. Through parameter adjustment, the gripper body 11 can be docked at any position to meet the needs of grasping silicon wafers of different specifications and sizes. It has strong compatibility and greatly shortens the production cycle. In this embodiment, a servo motor is used as a driving motor, and its driving accuracy is higher.

[0032] In this embodiment, the connecting part 30 includes a mounting plate 31, a guide rail 32 arranged on the mounting plate 31, and a slider 33 moving along the length direction of the guide rail 32. The secondary connecting rod 222 drives the slider 33 to move along the length direction of the guide rail 32. The gripper body 11 is connected to the slider 33, and the mounting frame 111 is connected to the slider 33. The secondary connecting rod 222 drives the mounting frame 111. The mounting frame 111 of this embodiment is connected to the slider 33. When the secondary connecting rod 222 drives the mounting frame 111 to reciprocate, the slider 33 will reciprocate along the length direction of the guide rail 32, and the clamping plate 112 and the support plate 113 of the gripper body 11 are both arranged on the mounting frame 111, thereby realizing the taking and placing of silicon wafers. The existence of the guide rail 32 and the slider 33 can guide the movement of the gripper body 11 and improve the accuracy of taking and placing silicon wafers.

[0033] Furthermore, the slider 33 of this embodiment is provided with an adjustment plate 331 and an adjustment block 332 to install the mounting frame 111 . By changing the position of the mounting frame 111 on the slider 33 , silicon wafers of different specifications can be adapted.

[0034] In this embodiment, a limiting portion 50 is provided on the mounting frame 111, and the limiting portion 50 includes a stop plate 51 and a limit block 52. The stop plate 51 is connected to the end of the auxiliary connecting rod 222 to stop the end of the auxiliary connecting rod 222 to prevent the auxiliary connecting rod 222 from excessive movement, thereby controlling the movement stroke of the gripper body 11. The limit block 52 is provided on the mounting frame 111 to limit the gripper body 11. A fixing block 60 is provided on the mounting plate 31. After the fixing block 60 contacts the limit block 52, the gripper body 11 is limited to control the movement stroke of the gripper body 11.

[0035] In this embodiment, a plurality of sensors 70 are provided on one side of the mounting plate 31 close to the silicon wafer to sense the silicon wafer. The sensors 70 of this embodiment include a product in-position sensor 70, an original-position sensor 70 and a limit sensor 70. The product in-position sensor 70 monitors the position of the silicon wafer in real time, the original-position sensor 70 monitors the original position of the gripper body 11, and the limit sensor 70 monitors the farthest movement stroke of the gripper body 11.

[0036] In actual use, the gripper clamp of this embodiment is driven by a driving motor to drive the main connecting rod 221, and the main connecting rod 221 drives the secondary connecting rod 222 to move. During the movement, the secondary connecting rod 222 drives the gripper body 11 to move. The multiple groups of gripper bodies 11 move toward each other synchronously, and can synchronously grasp the silicon wafer. The clamping plate 112 of the gripper body 11 clamps the silicon wafer from multiple directions, and the supporting plate 113 of the gripper body 11 can carry the silicon wafer. The multiple groups of gripper bodies 11 can simultaneously realize the bearing and clamping of the silicon wafer. The gripper clamp of this embodiment can effectively and accurately control the position of the gripper body 11, and provide real-time feedback of specific position data. Through parameterized adjustment, the gripper body 11 can be docked at any position to meet the needs of grabbing silicon wafers of different specifications and sizes. It has strong compatibility and greatly shortens the production cycle. It adopts connecting rod drive and linear slide rail mechanism to clamp the silicon wafers from four directions, which ensures smooth picking and placing, and has the effect of regularizing and centering the silicon wafers.

[0037] Obviously, the above embodiments are merely examples for the purpose of clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the scope of protection of the invention of the utility model.

Claims

1. A flexible automated silicon wafer gripper fixture, characterized in that: include A gripper portion (10), the gripper portion (10) comprising at least two gripper bodies (11) disposed in opposite directions, wherein when the two gripper bodies (11) move in opposite directions, the silicon wafer is gripped, and when the two gripper bodies (11) move in opposite directions, the silicon wafer is released; A driving unit (20), the driving unit (20) comprising a driver (21) and a driving member (22), the driver (21) driving the driving member (22) to move the two gripper bodies (11) toward each other or in opposite directions; A connecting portion (30), wherein the connecting portion (30) connects the driving member (22) and the gripper body (11); The driver (21) is a driving motor, and the driving member (22) comprises a main connecting rod (221) and a secondary connecting rod (222). The main connecting rod (221) is connected to the driver (21) via a coupling (40), and the secondary connecting rod (222) is connected to the connecting portion (30). When the main connecting rod (221) rotates under the drive of the driver (21), the secondary connecting rod (222) continuously reciprocates.

2. A flexible automated silicon wafer gripper fixture according to claim 1, characterized in that: The connecting portion (30) comprises a mounting plate (31), a guide rail (32) arranged on the mounting plate (31), and a slider (33) moving along the length direction of the guide rail (32); the secondary connecting rod (222) drives the slider (33) to move along the length direction of the guide rail (32); and the gripper body (11) is connected to the slider (33).

3. A flexible automated silicon wafer gripper fixture according to claim 2, characterized in that: The gripper body (11) comprises a mounting frame (111), a clamping plate (112) and a supporting plate (113); the mounting frame (111) is connected to the slider (33); the secondary connecting rod (222) drives the mounting frame (111); the clamping plate (112) is arranged on the mounting frame (111); the clamping plate (112) and the supporting plate (113) are detachably connected to form an L-shaped structure.

4. A flexible automated silicon wafer gripper fixture according to claim 3, characterized in that: The sliding block (33) is provided with an adjustment plate (331) and an adjustment block (332) for installing the mounting frame (111).

5. The flexible automated silicon wafer gripper fixture according to claim 3, characterized in that: A limiting portion (50) is provided on the mounting frame (111), and the limiting portion (50) comprises a rotation-stopping plate (51) and a rotation-stopping block (52); the rotation-stopping plate (51) is connected to the end of the secondary connecting rod (222) to stop the end of the secondary connecting rod (222); and the rotation-stopping block (52) is provided on the mounting frame (111) to limit the gripper body (11).

6. The flexible automated silicon wafer gripper fixture according to claim 5, characterized in that: A fixing block (60) is provided on the mounting plate (31), and after the fixing block (60) contacts the limiting block (52), the gripper body (11) is limited.

7. The flexible automated silicon wafer gripper according to claim 2, characterized in that: A plurality of sensors (70) are arranged on one side of the mounting plate (31) close to the silicon wafer to sense the silicon wafer.

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