Circuit board and battery

Abstract

The utility model discloses a circuit board and a battery. The circuit board comprises a wiring layer, a copper block and a conductive filling piece, the wiring layer is provided with a containing groove, the copper block and the conductive filling piece are both arranged in the containing groove, the conductive filling piece wraps at least part of the copper block, the copper block is provided with a through hole, the through hole is filled with the conductive filling piece, and the conductive filling piece is arranged in the containing groove. And the copper block is electrically connected with the inner wall of the accommodating groove through the conductive filling piece. According to the scheme, the problem that the copper block embedding process of the current circuit board cannot realize sufficient circuit connection can be solved.

Description

Technical Field

[0001] The present application belongs to the field of battery technology, and specifically relates to a circuit board and a battery. Background Art

[0002] Burying copper in a circuit board means filling the idle space in the non-wiring area on the circuit board with solid copper, allowing the current in the circuit board to flow more smoothly, thereby improving the conductivity of the circuit board; at the same time, after the circuit board is buried with copper, its mechanical strength will be enhanced; in addition, since copper has good thermal conductivity, burying copper can improve the heat dissipation capacity of the circuit board.

[0003] At present, in the copper embedding process, it is usually necessary to embed the copper block into the routing layer of the circuit board and then perform electrical connection by punching. As a result, the copper block does not have sufficient contact with the surrounding routing layer with the same network properties, which makes it impossible to fully reduce the resistance of the copper block, resulting in poor current carrying performance and heat dissipation performance of the circuit board. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a circuit board and a battery that can solve the problem that the current copper block embedding process of the circuit board cannot achieve sufficient circuit connection.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides a circuit board, comprising a routing layer, a copper block and a conductive filling piece, wherein the routing layer is provided with a receiving groove, the copper block and the conductive filling piece are both arranged in the receiving groove, the conductive filling piece wraps at least a portion of the copper block, the copper block is provided with a through hole, the through hole is filled with the conductive filling piece, and the copper block is electrically connected to the inner wall of the receiving groove through the conductive filling piece.

[0007] In a second aspect, an embodiment of the present application further provides a battery, comprising an electrically connected battery cell and a protection board, wherein the protection board comprises a connecting portion and the above-mentioned circuit board, the circuit board is electrically connected to the battery cell, and the connecting portion is used to electrically connect to an external structure.

[0008] In the embodiment of the present application, a receiving groove is opened on the wiring layer, and the copper block and the conductive filling piece are both arranged in the receiving groove, the conductive filling piece wraps at least part of the copper block, and the copper block is electrically connected to the inner wall of the receiving groove through the conductive filling piece, thereby increasing the connection area between the copper block and the wiring layer to improve the current carrying performance of the circuit board; and the through hole of the copper block is filled with a conductive filling piece, thereby further increasing the connection area between the copper block and the wiring layer to improve the current carrying performance of the circuit board; at the same time, the copper block in this scheme is directly placed in the receiving groove, and a conductive filling piece is arranged around the copper block, so that the copper block is fully electrically connected to the wiring layer, without the need to completely bury the copper block in the wiring layer and then make electrical connections above and below the copper block by punching holes, so the arrangement of the copper block can be applied to circuit boards with smaller thicknesses, at which time the copper content in the entire circuit board increases, which is beneficial to improving the heat dissipation performance of the circuit board. It can be seen from this that this scheme can solve the problem that the copper block embedding process of the current circuit board cannot achieve full connection of the circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 A schematic diagram of the structure of the routing layer disclosed in the embodiment of the present application;

[0010] Figure 2 A schematic diagram of the structure of the routing layer and copper block disclosed in the embodiment of the present application;

[0011] Figure 3 A schematic diagram of a portion of the structure of a circuit board disclosed in an embodiment of the present application;

[0012] Figures 4 to 5 Schematic diagram of the structure of the copper block disclosed in the embodiment of the present application at different viewing angles.

[0013] Description of reference numerals:

[0014] 100 - routing layer, 110 - receiving groove, 120 - first surface, 130 - first wiring layer, 140 - insulation layer, 150 - second wiring layer;

[0015] 200-copper block, 210-through hole;

[0016] 300-Conductive filler. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0018] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0019] The circuit board and battery provided in the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0020] like Figures 1 to 5 As shown, an embodiment of the present application provides a circuit board, which includes a routing layer 100, a copper block 200 and a conductive filler 300. Optionally, the routing layer 100 can be an inner layer of the circuit board or an outer layer of the circuit board, and the embodiment of the present application does not impose specific restrictions on this. The routing layer 100 is provided with a receiving groove 110, and the copper block 200 and the conductive filler 300 are both arranged in the receiving groove 110. The conductive filler 300 wraps at least a portion of the copper block 200. The copper block 200 is provided with a through hole 210, and the through hole 210 is filled with the conductive filler 300. The copper block 200 is electrically connected to the inner wall of the receiving groove 110 through the conductive filler 300.

[0021] In the embodiment of the present application, a receiving groove 110 is opened on the wiring layer 100, and the copper block 200 and the conductive filling member 300 are both arranged in the receiving groove 110. The conductive filling member 300 wraps at least a portion of the copper block 200, and the copper block 200 is electrically connected to the inner wall of the receiving groove 110 through the conductive filling member 300, thereby increasing the connection area between the copper block 200 and the wiring layer 100, so as to improve the current carrying performance of the circuit board; and the through hole 210 of the copper block 200 is filled with the conductive filling member 300, thereby further increasing the connection area between the copper block 200 and the wiring layer 100. At the same time, the copper block 200 in this solution is directly placed in the receiving groove 110, and a conductive filler 300 is arranged around the copper block 200 to make the copper block 200 fully electrically connected to the wiring layer 100, without the need to completely bury the copper block 200 in the wiring layer 100 and then make electrical connections by punching holes above and below the copper block 200. Therefore, the arrangement of the copper block 200 can be applied to circuit boards with smaller thicknesses. At this time, the copper content in the entire circuit board is increased, which is beneficial to improving the heat dissipation performance of the circuit board. It can be seen that this solution can solve the problem that the current copper block 200 embedding process of the circuit board cannot achieve full connection of the line.

[0022] In an optional embodiment, the conductive filler 300 is respectively arranged to fit the inner wall of the receiving groove 110 and the inner wall of the through hole 210, thereby increasing the contact area between the conductive filler 300 and the wiring layer 100 and the contact area between the conductive filler 300 and the copper block 200, so as to further improve the electrical connectivity between the copper block 200 and the wiring layer 100, thereby improving the current carrying performance of the entire circuit board. Of course, the conductive filler 300 and at least one of the inner wall of the receiving groove 110 and the inner wall of the through hole 210 can be point-connected or partially connected.

[0023] Optionally, the conductive filler 300 may be a conductive adhesive; or, in other embodiments, the conductive filler 300 may be a metal plating layer, that is, the conductive filler 300 may be formed by electroplating and filling, which has better conductivity and is conducive to further improving the current carrying performance of the circuit board. In addition, during the electroplating process, the through hole 210 opened on the copper block 200 can provide a space for the electroplating liquid to avoid the formation of islands on the surface of the copper block 200 and the local gathering of the electroplating liquid, thereby improving the uniformity of the metal plating layer.

[0024] Optionally, the conductive filler 300 may be a copper foil structure, which has good conductivity and heat dissipation properties, and is beneficial to improving the current carrying performance and heat dissipation performance of the circuit board.

[0025] In another optional embodiment, the depth of the receiving groove 110 is greater than the height of the copper block 200. The depth of the receiving groove 110 here specifically refers to the depth of the receiving groove 110 in the thickness direction of the circuit board; the height of the copper block 200 here specifically refers to the size of the copper block 200 in the thickness direction of the circuit board. In the process of setting the conductive filler 300 in this solution, the conductive filler 300 can fully wrap the copper block 200, thereby further improving the electrical connection performance between the copper block 200 and the wiring layer 100. Of course, the depth of the receiving groove 110 can also be equal to the height of the copper block 200.

[0026] In an embodiment where the conductive filler 300 is a metal plating layer, the depth of the receiving groove 110 is greater than the height of the copper block 200. At this time, during the electroplating filling process, the plating solution can be prevented from overflowing the receiving groove 110, thereby improving the efficiency and yield of the electroplating process.

[0027] In a further optional embodiment, the first surface 120 of the routing layer 100 is provided with a receiving groove 110. Optionally, the side of the conductive filler 300 that is away from the bottom of the receiving groove 110 can be lower than the first surface 120. At this time, there is a certain space in the upper part of the receiving groove 110, and this part of the space is filled with air. Since the thermal conductivity of air is relatively small, it will cause heat accumulation in the circuit board, and its heat dissipation performance is poor. Based on this, the side of the conductive filler 300 that is away from the bottom of the receiving groove 110 is flush with the first surface 120, and the thermal conductivity of the conductive filler 300 is relatively large compared to air, which is conducive to improving the heat dissipation performance of the circuit board; at the same time, the contact area between the conductive filler 300 and the routing layer 100 is larger, which is conducive to improving the current carrying performance of the circuit board.

[0028] In an optional embodiment, the number of through holes 210 may be one; or the number of through holes 210 is at least two, and adjacent through holes 210 are arranged at intervals. This solution can further increase the contact area between the conductive filler 300 and the copper block 200 and the wiring layer 100 by providing multiple through holes 210, thereby improving the current carrying performance of the circuit board.

[0029] In an embodiment where the conductive filler 300 is a metal plating, the number of through holes 210 is at least two, and adjacent through holes 210 are spaced apart. During the electroplating filling process, the multiple through holes 210 opened on the copper block 200 can provide more accommodation space for the electroplating liquid, thereby avoiding the formation of isolated islands on the top surface of the copper block 200 and the gathering of the electroplating liquid. Therefore, this solution is beneficial to further improve the uniformity of the metal plating.

[0030] Optionally, each through hole 210 can be opened at random; or, in other embodiments, the through holes 210 are arranged in an array, which not only facilitates the opening of each through hole 210, but also facilitates the arrangement of the conductive filler 300; in addition, the thickness of the connecting wall between adjacent through holes 210 is basically the same, and the current carrying performance and heat dissipation performance of the copper block 200 are relatively uniform.

[0031] Optionally, the through hole 210 can be a triangular hole, a rectangular hole, an irregular hole, etc.; or, in another embodiment, the through hole 210 is a circular hole. Since the curvature of the inner wall of the circular hole changes less, it is beneficial for the conductive filler 300 to fully contact the inner wall of the through hole 210, thereby increasing the contact area between the two, so as to further improve the current carrying performance of the circuit board.

[0032] In the embodiment where the conductive filler 300 is a metal plating layer, during the electroplating filling process, the electroplating solution can flow smoothly in the circular through hole 210, which is beneficial to improving the process efficiency of the electroplating filling.

[0033] If the width of the through hole 210 is too large, only a small number of through holes 210 can be opened when the size of the copper block 200 remains unchanged, and the current uniformity of the copper block 200 is poor; if the width of the through hole 210 is too small, it will greatly increase the difficulty of opening the hole, and at the same time increase the difficulty of setting the conductive filler 300; in view of this, optionally, the width of the through hole 210 is 0.05-0.1 mm, and more through holes 210 can be opened when the size of the copper block 200 remains unchanged to improve the current uniformity of the copper block 200; and the difficulty of opening the hole and setting the conductive filler 300 can be reduced. Of course, the width of the through hole 210 can also be flexibly adjusted according to actual needs, and the embodiment of the present application does not impose specific restrictions on this.

[0034] In an embodiment where the conductive filler 300 is a metal plating layer, if the aperture of the through hole 210 is too large, the plating solution is likely to gather in the through hole 210; if the aperture of the through hole 210 is too small, the plating solution is likely to gather on the top surface of the copper block 200. Therefore, optionally, the aperture of the through hole 210 is 0.05 to 0.1 mm, thereby preventing the plating solution from gathering in the through hole 210 or on the top surface of the copper block 200.

[0035] In another optional embodiment, the routing layer 100 includes a first wiring layer 130, an insulating layer 140 and a second wiring layer 150 stacked in sequence, and the receiving groove 110 is opened in two adjacent layers of the first wiring layer 130, the insulating layer 140 and the second wiring layer 150. In this case, only one of the first wiring layer 130 and the second wiring layer 150 is provided with the receiving groove 110, and the internal routing of the other can be flexibly arranged, thereby reducing the difficulty of its setting, and at the same time, the material of the conductive filler 300 can be saved to save costs.

[0036] Optionally, the network properties of the first wiring layer 130 and the second wiring layer 150 may be the same or similar to improve the current transmission performance between the first wiring layer 130 and the second wiring layer 150 .

[0037] Optionally, through holes are provided in the first wiring layer 130 and the insulating layer 140, and the first wiring layer 130, the insulating layer 140 and the second wiring layer 150 form a receiving groove 110. At this time, the inner wall of the through hole forms the side wall of the receiving groove 110, and the side of the second wiring layer 150 facing the insulating layer 140 forms the bottom of the receiving groove 110. The conductive filling member 300 is electrically connected to the first wiring layer 130, the second wiring layer 150 and the copper block 200 respectively to ensure that the first wiring layer 130 and the second wiring layer 150 are both fully electrically connected to the copper block 200, so that the current carrying performance of the routing layer 100 is better.

[0038] Optionally, the conductive filling member 300 includes a conductive sleeve, a conductive column and a covering top plate, the first end of the conductive sleeve and the first end of the conductive column are both connected to the covering top plate, the conductive sleeve is sleeved on the outer surface of the copper block 200, the conductive sleeve is located between the side wall of the accommodating groove 110 and the outer surface of the copper block 200, the second end of the conductive sleeve is in contact with the bottom of the accommodating groove 110, that is, the second end of the conductive sleeve is in contact with the second wiring layer 150; the conductive column is filled in the through hole 210, the second end of the conductive column is in contact with the bottom of the accommodating groove 110, that is, the second end of the conductive column is in contact with the second wiring layer 150, and the covering top plate is arranged on the side of the copper block 200 away from the bottom of the accommodating groove 110.

[0039] Based on the circuit board provided in the embodiment of the present application, the embodiment of the present application further provides a method for manufacturing the circuit board, which can be applied to the above-mentioned circuit board. The manufacturing method includes:

[0040] S100 , opening a receiving groove 110 on the first surface 120 of the wiring layer 100 .

[0041] The size and shape of the receiving groove 110 in this step can be set according to actual needs, and no specific limitation is made here.

[0042] S200 , opening a through hole 210 on the copper block 200 , and then placing the copper block 200 into the receiving groove 110 .

[0043] Optionally, the aperture of the through hole 210 can be 0.05 to 0.1 mm, and of course it can be flexibly adjusted according to actual needs, and there is no specific restriction on this here; optionally, the number of through holes 210 can be at least two, adjacent through holes 210 are arranged at intervals, and each through hole 210 is arranged in an array. Of course, the number and arrangement of the through holes 110 can be flexibly adjusted according to actual needs, and there is no specific restriction on this here.

[0044] S300, filling the space between the copper block 200 and the receiving groove 110 and the through hole 210 of the copper block 200 with liquid copper foil by electroplating, and forming a metal plating layer after the liquid copper foil reacts completely.

[0045] In this step, after the metal plating layer is formed, it wraps at least a portion of the surface of the copper block 200 , thereby filling the receiving groove 110 . At the same time, the metal plating layer is electrically connected to the wiring layer 100 and the copper block 200 to achieve current transmission in the wiring layer 100 .

[0046] Based on the circuit board provided in the embodiment of the present application, the embodiment of the present application also provides a battery, which includes an electrically connected battery cell and a protection board, and the protection board is used to protect the battery cell, and can specifically play the functions of overcharge protection, discharge protection, overcurrent protection and short circuit protection. The protection board includes a connecting part and a circuit board as described in any of the above embodiments, and components such as IC, resistors, capacitors, MOS tubes, etc. are arranged on the circuit board to construct a circuit with a protection function. The circuit board is electrically connected to the battery cell, and the connecting part is used to electrically connect to an external structure. For example, the connecting part can be a snap-on connector, and the external structure can be the motherboard of an electronic device.

[0047] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A circuit board, characterized in that: The invention comprises a wiring layer (100), a copper block (200) and a conductive filling piece (300), wherein the wiring layer (100) is provided with a receiving groove (110), the copper block (200) and the conductive filling piece (300) are both arranged in the receiving groove (110), the conductive filling piece (300) wraps at least a part of the copper block (200), the copper block (200) is provided with a through hole (210), the through hole (210) is filled with the conductive filling piece (300), and the copper block (200) is electrically connected to the inner wall of the receiving groove (110) through the conductive filling piece (300).

2. The circuit board according to claim 1, characterized in that: The conductive filling piece (300) is respectively disposed in close contact with the inner wall of the receiving groove (110) and the inner wall of the through hole (210).

3. The circuit board according to claim 2, characterized in that: The conductive filling piece (300) is a metal plating layer.

4. The circuit board according to claim 1, characterized in that: The depth of the containing groove (110) is greater than the height of the copper block (200).

5. The circuit board according to claim 4, characterized in that: The first surface (120) of the routing layer (100) is provided with the receiving groove (110), and a surface of the conductive filling member (300) facing away from the bottom of the receiving groove (110) is flush with the first surface (120).

6. The circuit board according to claim 1, characterized in that: The number of the through holes (210) is at least two, and adjacent through holes (210) are arranged at intervals.

7. The circuit board according to claim 6, characterized in that: The through holes (210) are arranged in an array.

8. The circuit board according to claim 1, characterized in that: The through hole (210) is a circular hole; The through hole (210) has a diameter of 0.05 to 0.1 mm.

9. The circuit board according to claim 1, characterized in that: The routing layer (100) comprises a first wiring layer (130), an insulating layer (140) and a second wiring layer (150) stacked in sequence, and the receiving groove (110) is opened in two adjacent layers among the first wiring layer (130), the insulating layer (140) and the second wiring layer (150).

10. A battery, characterized in that: It comprises an electrically connected battery cell and a protection board, wherein the protection board comprises a connection part and the circuit board according to any one of claims 1 to 9, the circuit board is electrically connected to the battery cell, and the connection part is used for electrically connecting to an external structure.

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