Efficient heat dissipation type light emitting diode module

Abstract

The utility model provides an efficient heat dissipation type light-emitting diode module, which belongs to the technical field of LEDs and comprises a module body, a first heat dissipation structure and a second heat dissipation structure. The first heat dissipation structure comprises a liquid cooling cavity, a heat exchange plate and a first shell, cooling liquid is arranged in the liquid cooling cavity, the heat exchange plate is arranged at the top of the liquid cooling cavity and connected with the liquid cooling cavity, the first shell surrounds the periphery of the liquid cooling cavity, a heat dissipation channel is formed between the inner wall of the first shell and the outer wall of the liquid cooling cavity, and the module body is arranged on the heat exchange plate. The second heat dissipation structure is arranged on the first shell and used for driving gas in the heat dissipation channel to flow. According to the efficient heat dissipation type light-emitting diode module, efficient heat dissipation can be conducted on the module body, so that the module body can keep a proper working temperature, the service life of the light-emitting diode module is prolonged, and the light-emitting diode module keeps high working stability.

Description

Technical Field

[0001] The utility model relates to the technical field of LEDs, in particular to a high-efficiency heat dissipation type light emitting diode module. Background Art

[0002] Light Emitting Diode (LED) is a semiconductor device that can convert electrical energy into light energy. It uses the principle of carrier injection and recombination in the semiconductor PN junction to generate visible light or other wavelengths of light. The diode has many advantages such as high efficiency and energy saving, long life, environmental protection, and fast response. The light emitting diode module is a functional unit that integrates components such as diode chips, first shells, printed circuit boards, control circuits, and metal pins in one module. The light emitting diode module has a wide range of applications in various fields such as lighting, display technology, decoration, and entertainment. With the rapid development of electronic technology and the continuous improvement of the performance of electronic equipment, the heat generated by the light emitting diode module during operation has also increased significantly. The accumulation of this heat will not only reduce the performance and life of the diode, but may also affect the stability of the entire mechanism and device. Traditional heat dissipation structures often cannot effectively export and dissipate the heat generated by the diode to the external environment in a timely manner, resulting in heat accumulation inside the module, which in turn causes performance degradation or even thermal damage.

[0003] Therefore, it is necessary to improve the existing light emitting diode module to overcome the defects of the prior art. Utility Model Content

[0004] In order to overcome the problems existing in the related art, the purpose of the utility model is to provide a high-efficiency heat-dissipating light-emitting diode module, which can efficiently dissipate heat from the module body so that the module body can maintain a suitable operating temperature, help to extend the service life of the light-emitting diode module, and enable the light-emitting diode module to maintain a high working stability.

[0005] A high-efficiency heat dissipation light emitting diode module, characterized by comprising:

[0006] Module body;

[0007] A first heat dissipation structure, the first heat dissipation structure comprises a liquid cooling chamber, a heat exchange plate and a first shell, the liquid cooling chamber is provided with a coolant, the heat exchange plate is provided at the top of the liquid cooling chamber and connected to the liquid cooling chamber, the first shell is provided around the periphery of the liquid cooling chamber, and a heat dissipation channel is formed between the inner wall of the first shell and the outer wall of the liquid cooling chamber; the module body is provided on the heat exchange plate;

[0008] The second heat dissipation structure is arranged on the first shell, the second heat dissipation structure has a first air inlet and a first air outlet, the first air inlet is connected to the heat dissipation channel, and the second heat dissipation structure drives the gas flow in the heat dissipation channel.

[0009] In a preferred technical solution of the utility model, a second air outlet and a plurality of second air inlets are arranged on the first shell, and the first air inlet is connected to the second air outlet.

[0010] In a preferred technical solution of the utility model, the second heat dissipation structure includes a second housing and a negative pressure fan, the second housing is arranged on the first housing, and the second housing is provided with the first air inlet and the first air outlet;

[0011] The negative pressure fan is arranged in the second housing.

[0012] In a preferred technical solution of the utility model, the cross-section of the liquid cooling cavity is circular or polygonal, and the outer wall of the liquid cooling cavity is provided with a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged on the liquid cooling cavity along the circumference of the liquid cooling cavity.

[0013] In a preferred technical solution of the present utility model, a plurality of third air inlets are arranged on a side of the first shell facing away from the heat exchange plate.

[0014] In a preferred technical solution of the utility model, a slot is provided on the surface of the heat exchange plate, the module body is arranged in the slot, and thermal conductive silicone grease is arranged at the bottom of the slot.

[0015] In a preferred technical solution of the utility model, the module body includes a substrate, a light-emitting diode group and a lens, the substrate is arranged on the heat exchange plate, the light-emitting diode group is arranged on the substrate, and the lens cover is arranged on the light-emitting diode group.

[0016] In a preferred technical solution of the utility model, a display screen is also provided on the machine body, and the display screen is electrically connected to the metering device.

[0017] The beneficial effects of the utility model are:

[0018] The utility model provides an efficient heat dissipation type light emitting diode module, which includes a module body, a first heat dissipation structure and a second heat dissipation structure. The first heat dissipation structure includes a liquid cooling chamber, a heat exchange plate and a first shell. Cooling liquid is arranged in the liquid cooling chamber. The heat exchange plate is arranged at the top of the liquid cooling chamber and connected to the liquid cooling chamber. The first shell is arranged around the periphery of the liquid cooling chamber. A heat dissipation channel is formed between the inner wall of the first shell and the outer wall of the liquid cooling chamber. The module body is arranged on the heat exchange plate. The second heat dissipation structure is arranged on the first shell and is used to drive the gas flow in the heat dissipation channel. The light emitting diode module can efficiently dissipate the heat of the module body through the coolant in the liquid cooling chamber and the heat exchange plate, and the module can achieve efficient heat dissipation. The heat exchange plate exchanges heat with the module body and transfers heat to the coolant, so that the coolant effectively absorbs the heat generated by the module body, thereby ensuring that the module body maintains a suitable temperature during operation and preventing performance degradation or damage caused by overheating. The heat dissipation channel formed between the first shell and the liquid cooling cavity, and the second heat dissipation structure drive the gas flow in the heat dissipation channel to dissipate heat from the cooling cavity, so that the heat of the coolant is quickly dissipated to the outside, thereby ensuring efficient heat dissipation of the module body, reducing failures of the module body caused by high temperature, and improving the reliability of the module body. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a three-dimensional diagram of a high-efficiency heat dissipation type light-emitting diode module provided in an embodiment of the utility model;

[0020] Figure 2 It is a bottom view of the high-efficiency heat dissipation type light-emitting diode module provided in the embodiment of the utility model;

[0021] Figure 3 It is a schematic diagram of a module body provided in an embodiment of the utility model being arranged on a heat dissipation plate;

[0022] Figure 4 It is a schematic diagram of the airflow in the first heat dissipation structure provided in an embodiment of the utility model.

[0023] Reference numerals:

[0024] 1. Module body; 11. Base plate; 12. Lens; 13. Light-emitting diode group; 2. First heat dissipation structure; 21. First shell; 211. Second air inlet; 212. Third air inlet; 213. Second air outlet; 22. Heat exchange plate; 221. Card slot; 222. Thermal grease; 23. Liquid cooling chamber; 3. Second heat dissipation structure; 31. Second shell; 311. First air inlet; 312. First air outlet; 32. Negative pressure fan; DETAILED DESCRIPTION

[0025] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present invention more thorough and complete, and to fully convey the scope of the present invention to those skilled in the art.

[0026] The terms used in the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The singular forms "a", "the" and "the" used in the present invention and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0027] It should be understood that although the terms "first", "second", "third", etc. may be used to describe various information in the present invention, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. Example

[0028] like Figure 1-Figure 4 As shown, this embodiment provides a high-efficiency heat dissipation light emitting diode module, including:

[0029] Module body 1; Specifically, the module body 1 includes a substrate 11, a light emitting diode group 13 and a lens 12, wherein the substrate 11 is disposed on the heat exchange plate 22, the light emitting diode group 13 is disposed on the substrate 11, and the lens 12 is disposed on the light emitting diode group 13. The substrate 11 is a circuit board, the light emitting diode group 13 includes a plurality of light emitting diodes, the light emitting diodes are electrically connected to the circuit board, and the lens 12 is used to protect the light emitting diode group 13.

[0030] The high-efficiency heat dissipation type light-emitting diode module also includes a first heat dissipation structure 2 and a second heat dissipation structure 3. The first heat dissipation structure 2 includes a liquid cooling chamber 23, a heat exchange plate 22 and a first shell 21. The liquid cooling chamber 23 is provided with cooling liquid. The heat exchange plate 22 is arranged at the top of the liquid cooling chamber 23 and connected to the liquid cooling chamber 23. The first shell 21 is arranged around the periphery of the liquid cooling chamber 23. A heat dissipation channel is formed between the inner wall of the first shell 21 and the outer wall of the liquid cooling chamber 23. The module body 1 is arranged on the heat exchange plate 22. The liquid cooling chamber 23 stores cooling liquid, and the cooling liquid can efficiently exchange heat with the heat exchange plate 22, so that the heat exchange plate 22 can dissipate heat from the module body 1.

[0031] The second heat dissipation structure 3 is arranged on the first housing 21, and the second heat dissipation structure 3 has a first air inlet 311 and a first air outlet 312. The first air inlet 311 is connected to the heat dissipation channel, and the second heat dissipation structure 3 drives the gas flow in the heat dissipation channel. During the operation of the second heat dissipation structure 3, negative pressure is generated, so that the air in the heat dissipation channel enters the second heat dissipation structure 3 from the first air inlet 311 and flows out from the first air outlet 312, so that the air can exchange heat with the liquid cooling cavity 23 in the heat dissipation channel, and cool the coolant in the liquid cooling cavity 23.

[0032] The above-mentioned efficient heat dissipation type light-emitting diode module comprises a module body 1, a first heat dissipation structure 2 and a second heat dissipation structure 3. The first heat dissipation structure 2 comprises a liquid cooling chamber 23, a heat exchange plate 22 and a first shell 21. The liquid cooling chamber 23 is provided with a coolant. The heat exchange plate 22 is arranged at the top of the liquid cooling chamber 23 and connected to the liquid cooling chamber 23. The first shell 21 is arranged around the periphery of the liquid cooling chamber 23. A heat dissipation channel is formed between the inner wall of the first shell 21 and the outer wall of the liquid cooling chamber 23. The module body 1 is arranged on the heat exchange plate 22. The second heat dissipation structure 3 is arranged on the first shell 21, and is used to drive the gas flow in the heat dissipation channel. The light-emitting diode module can efficiently dissipate the heat of the module body 1 through the coolant in the liquid cooling chamber 23 and the heat exchange plate 22, and the module can achieve efficient heat dissipation. The heat exchange plate 22 exchanges heat with the module body 1 and transfers the heat to the coolant, so that the coolant effectively absorbs the heat generated by the module body 1, thereby ensuring that the module body 1 maintains a suitable temperature during operation and preventing performance degradation or damage caused by overheating. The heat dissipation channel formed between the first shell 21 and the liquid cooling cavity 23, and the second heat dissipation structure 3 drive the gas flow in the heat dissipation channel to dissipate heat from the cooling cavity, so that the heat of the coolant is quickly dissipated to the outside, thereby ensuring efficient heat dissipation of the module body 1, reducing failures of the module body 1 due to high temperature, and improving the reliability of the operation of the module body 1.

[0033] Furthermore, a second air outlet 213 and a plurality of second air inlets 211 are disposed on the first housing 21 , and the first air inlet 311 is in communication with the second air outlet 213 .

[0034] Furthermore, the second heat dissipation structure 3 includes a second housing 31 and a negative pressure fan 32, the second housing 31 is disposed on the first housing 21, and the second housing 31 is provided with the first air inlet 311 and the first air outlet 312;

[0035] The negative pressure fan 32 is disposed in the second housing 31 .

[0036] During operation, the negative pressure fan 32 is started to draw air in the heat dissipation channel through the second air outlet 213, so that negative pressure is formed in the heat dissipation channel, and the outside air enters the heat dissipation channel through the plurality of second air inlets 211, thereby achieving the purpose of promoting the flow of air in the heat dissipation channel and improving the heat exchange efficiency between the air and the liquid cooling chamber 23. Through the connection between the first air inlet 311 and the second air outlet 213, a circulating airflow path is formed, thereby accelerating the flow of gas in the heat dissipation channel and the discharge of heat.

[0037] In a more preferred embodiment, a blower may also be provided at the second air inlet 211 to accelerate the flow of air.

[0038] Furthermore, the cross section of the liquid cooling cavity 23 is circular or polygonal, and a plurality of heat dissipation fins are disposed on the outer wall of the liquid cooling cavity 23 . The plurality of heat dissipation fins are arranged on the liquid cooling cavity 23 along the circumference of the liquid cooling cavity 23 .

[0039] By adding heat dissipation fins, the heat dissipation area of ​​the liquid cooling cavity 23 is greatly increased. These fins can more effectively conduct the heat in the liquid cooling cavity 23 to the external environment, thereby improving the heat dissipation performance of the entire module. The heat dissipation fins are arranged along the circumference of the liquid cooling cavity 23 to ensure uniform distribution and rapid conduction of heat. This design reduces the possibility of heat accumulation and prevents local overheating of the liquid cooling cavity 23, thereby extending the service life of the diode module.

[0040] Furthermore, a plurality of third air inlets 212 are provided on a side of the first housing 21 away from the heat exchange plate 22 .

[0041] By providing multiple third air inlets 212, more ways for external cold air to enter the heat dissipation channel are added. This design not only promotes air circulation in the heat dissipation channel, but also allows more cold air to directly contact the heat dissipation fins and the heat dissipation channel, thereby more effectively absorbing and taking away the heat of the coolant in the liquid cooling cavity 23. In actual applications, the third air inlet 212 can be provided at the bottom of the first housing 21.

[0042] Furthermore, a slot 221 is provided on the surface of the heat exchange plate 22, the module body 1 is provided in the slot 221, and a thermal grease 222 is provided at the bottom of the slot 221. By providing the slot 221 on the surface of the heat exchange plate 22 and accurately placing the module body 1 in the slot 221, this design not only provides a stable support for the module, but also ensures a close contact between the module and the heat exchange plate 22. The thermal grease 222 at the bottom of the slot 221 further enhances the heat conduction effect, which can fill the tiny gap between the module and the heat exchange plate 22, increase the effective contact area, and thus effectively reduce the thermal resistance, so that the heat generated by the module can be dissipated more quickly through the heat exchange plate 22.

[0043] The embodiments of the present invention have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. An efficient heat dissipation light emitting diode module, characterized in that: include: Module body; A first heat dissipation structure, the first heat dissipation structure comprising a liquid cooling chamber, a heat exchange plate and a first shell, wherein a coolant is arranged in the liquid cooling chamber, the heat exchange plate is arranged on the top of the liquid cooling chamber and connected to the liquid cooling chamber, the first shell is arranged around the periphery of the liquid cooling chamber, and a heat dissipation channel is formed between an inner wall of the first shell and an outer wall of the liquid cooling chamber; The module body is arranged on the heat exchange plate; The second heat dissipation structure is arranged on the first shell, the second heat dissipation structure has a first air inlet and a first air outlet, the first air inlet is connected to the heat dissipation channel, and the second heat dissipation structure drives the gas flow in the heat dissipation channel.

2. The high-efficiency heat dissipation light emitting diode module according to claim 1, characterized in that: The first shell is provided with a second air outlet and a plurality of second air inlets, and the first air inlet is connected with the second air outlet.

3. The high-efficiency heat dissipation light emitting diode module according to claim 1, characterized in that: The second heat dissipation structure includes a second housing and a negative pressure fan, the second housing is arranged on the first housing, and the first air inlet and the first air outlet are arranged on the second housing; The negative pressure fan is arranged in the second housing.

4. The high-efficiency heat dissipation light emitting diode module according to any one of claims 1 to 3, characterized in that: The cross section of the liquid cooling cavity is circular or polygonal, and a plurality of heat dissipation fins are arranged on the outer wall of the liquid cooling cavity. The plurality of heat dissipation fins are arranged on the liquid cooling cavity along the circumference of the liquid cooling cavity.

5. The high-efficiency heat dissipation light emitting diode module according to claim 2, characterized in that: A plurality of third air inlets are arranged on a side of the first shell facing away from the heat exchange plate.

6. The high-efficiency heat dissipation light emitting diode module according to claim 1, characterized in that: A slot is provided on the surface of the heat exchange plate, the module body is arranged in the slot, and thermal conductive silicone grease is arranged at the bottom of the slot.

7. The high-efficiency heat dissipation light emitting diode module according to claim 1, characterized in that: The module body comprises a substrate, a light emitting diode group and a lens. The substrate is arranged on the heat exchange plate, the light emitting diode group is arranged on the substrate, and the lens cover is arranged on the light emitting diode group.

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