Semiconductor module assembling robot arm and assembling device

By setting the second actuator on the first actuator in the assembly of the mechanical arm of the semiconductor module and adopting a jaw and suction cup structure, the problems of large size, low reliability and low efficiency of the mechanical arm are solved, and a more compact structure and higher working reliability and efficiency are achieved.

CN222627827UActive Publication Date: 2025-03-18TOPSUN AUTOMATION TECH SHANGHAI
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Patent Information

Application Number
CN202420730877.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-10
Publication Date
2025-03-18
Estimated Expiration
2034-04-10

AI Technical Summary

Technical Problem

The existing semiconductor module assembly robotic arms are large in size, have low operating reliability and low operating efficiency.

Method used

By setting the second actuator on the first actuator and the layout and coordination between the two, the structural compactness is improved, the volume is controlled, and the transfer of the first positioning fixture and the second positioning fixture is achieved by using a jaw and a suction cup structure respectively, thereby improving the operation reliability and efficiency.

Benefits of technology

The volume control of the robot arm is realized, the operation reliability and efficiency are improved, and the operation control is simplified.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a semiconductor module assembling mechanical arm and an assembling device, and belongs to the technical field of semiconductors. In order to solve the problems that a semiconductor module assembling mechanical arm is large in size, low in operation reliability and low in operation efficiency, the semiconductor module assembling mechanical arm comprises a mechanical arm body, a first executing mechanism and a second executing mechanism, the first executing mechanism comprises a lifting driving part, a horizontal driving part and a clamping jaw assembly which are arranged along a straight line, and the second executing mechanism comprises a clamping jaw assembly which is arranged along a straight line; the clamping jaw assembly is used for taking the first positioning jig; the second executing mechanism comprises a connecting frame, a mounting frame and a plurality of suction cups, the two ends of the connecting frame are connected with the lifting driving part and the mounting frame respectively, a lifting space is formed in the middle of the mounting frame in a penetrating mode, the horizontal driving part is driven by the lifting driving part to ascend and descend through the lifting space, and the suction cups are arranged on the mounting frame and used for sucking the second positioning jig. The structure compactness is improved, the size is controlled, and the operation reliability and the operation efficiency are improved.
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Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a semiconductor module assembly robot and an assembly device. Background Art

[0002] In order to improve the integration of equipment and reduce the possibility of failure, modular design is increasingly used in the semiconductor field. Semiconductor modules usually include a mounting plate and a substrate disposed on the mounting plate, and the two are connected by a connecting piece, such as a single-sided direct cooling (SSDC) module. The SSDC module is a special power module design that aims to improve efficiency and reduce thermal resistance by directly dissipating heat on one side of the module. This design is usually used in high-power density applications such as electric vehicles, data centers, and renewable energy systems. The SSDC module includes a heat sink (i.e., a mounting plate) and a ceramic substrate (i.e., a substrate) disposed on the mounting plate, and a tin sheet (i.e., a connecting sheet) is disposed between the heat sink and the substrate to achieve welding so that the mounting plate and the substrate are reliably, evenly, and tightly fixed.

[0003] The semiconductor module assembly process requires the use of positioning jig components, and after assembly is completed, they are processed together with the positioning jig components to ensure that the connecting piece stably connects the mounting plate and the substrate. For example, the SSDC module and the positioning jig components need to be sent into a high-temperature environment together to achieve welding. Figure 1 As shown in the figure, generally the positioning jig assembly includes a first positioning jig, a second positioning jig and a third positioning jig.

[0004] Conventional semiconductor module assembly systems usually only complete one operation at each station, for example, two robotic arms at two stations complete the assembly of the first positioning fixture and the second positioning fixture, resulting in a large space occupied by the assembly system and low assembly efficiency. Currently, there are also robotic arms with dual end effectors that can pick up different workpieces through two end effectors, but they are usually large in size, have low operational reliability and low operational efficiency. Utility Model Content

[0005] The purpose of the present application is to solve the problems in the prior art that the semiconductor module assembly robot arm is large in size, has low operational reliability and low operational efficiency. Therefore, the present application provides a semiconductor module assembly robot arm and an assembly device, which improves the compactness of the structure, controls the volume, and improves operational reliability and operational efficiency by setting the second actuator on the first actuator and coordinating the layout of the two.

[0006] The present application provides a semiconductor module assembly robot arm, a first positioning fixture and a second positioning fixture for sequential assembly, wherein the first positioning fixture and the second positioning fixture are both in the shape of a rectangular frame, and the assembly robot arm includes a robot arm body and a first actuator and a second actuator disposed at the end of the robot arm body.

[0007] The first actuator includes a lifting drive member, a horizontal drive member and a clamping jaw assembly arranged in a straight line, the horizontal drive member is connected to the driving end of the lifting drive member, and the clamping jaw assembly is connected to the driving end of the horizontal drive member and is used to take the first positioning fixture;

[0008] The second actuator includes a connecting frame, a mounting frame and a plurality of suction cups, one end of the connecting frame is connected to the outer shell of the lifting drive member, and the other end is connected to one end of the mounting frame, the mounting frame is horizontally arranged and has a lifting space formed in the middle, the horizontal driving member is lifted and lowered through the lifting space under the drive of the lifting drive member, the plurality of suction cups are arranged on the mounting frame and are used to absorb the second positioning fixture.

[0009] By adopting the above technical scheme, the first actuator and the second actuator arranged at the end of the robot arm body are used to realize the transfer of the first positioning fixture and the second positioning fixture respectively, and the lifting drive member, the horizontal drive member and the clamping jaw assembly in the first actuator are arranged along a straight line, which can effectively control the lateral volume of the first actuator, thereby controlling the volume of the assembly robot arm; at the same time, the second actuator is directly connected to the lifting drive member housing of the first actuator to realize the connection with the assembly robot arm, reducing the intermediate connecting parts, thereby further controlling the volume of the assembly robot arm; and the first actuator adopts a clamping jaw structure and the second actuator adopts a suction cup structure to realize the transfer of the first positioning fixture and the second positioning fixture respectively, which is suitable for the structure of the first positioning fixture and the second positioning fixture, and improves the operation reliability; when the assembly robot arm is operating, only the first actuator needs to be lifted and lowered to realize the operation of the first actuator and avoid the operation of the second actuator, which simplifies the operation control, improves the operation reliability and improves the operation efficiency.

[0010] In some embodiments, the mounting frame is U-shaped, and the other end of the connecting frame is connected to the closed end of the mounting frame, the multiple suction cups are arranged on the two arms of the mounting frame, and the lifting space is formed between the two arms of the mounting frame; and the horizontal movement direction of the clamping jaw assembly is the same as the opening direction of the mounting frame.

[0011] By adopting the above technical solution, the flexibility of the transfer structure layout is improved and the volume of the assembly robot arm is controlled on the basis of ensuring the reliability of the transfer operation. That is, by arranging multiple suction cups around the circumference of the clamping jaw assembly, the clamping jaw assembly can be raised and lowered between the multiple suction cups, thereby improving the compactness of the first actuator and the second actuator, thereby controlling the volume of the assembly robot arm.

[0012] In some embodiments, the lifting drive member and the horizontal drive member are both pneumatic drives.

[0013] The above technical solution can control costs, ensure quick response and ensure operational efficiency.

[0014] In some embodiments, the clamping jaw assembly includes two clamping jaws arranged opposite to each other, and the two clamping jaws are driven by the horizontal driving member to move away from each other to clamp the first positioning fixture, and move toward each other to disengage from the first positioning fixture.

[0015] By adopting the above technical solution, on the basis of ensuring reliable clamping, the space required for the operation of the clamping jaw assembly is reduced, thereby making the integration of the first actuator and the second actuator more compact and reducing the volume of the assembly robot arm.

[0016] In some embodiments, the clamping jaw includes a clamping portion, the clamping portion is in a groove shape, and when the clamping jaw clamps the first positioning fixture, a portion of the first positioning fixture is embedded in the clamping portion.

[0017] By adopting the above technical solution, the operation reliability of the first actuator is further improved through the cooperation between the groove-shaped clamping portion of the clamping jaw and the first positioning fixture.

[0018] In some embodiments, the end of the robotic arm body is rotatably connected to a connecting rod, the connecting rod and the first actuator are arranged along the same straight line, and the end of the connecting rod away from the end of the robotic arm body is connected to the top of the lifting drive member of the first actuator.

[0019] By adopting the above technical solution, the connection between the robot arm body and the first actuator is achieved through a connecting rod. On the one hand, the volume of the assembled robot arm is controlled, and on the other hand, it is convenient to realize the horizontal rotation of the first actuator and the second actuator, thereby improving the positioning accuracy of the first actuator and the second actuator and the first positioning fixture and the second positioning fixture, thereby improving the operation reliability.

[0020] The embodiment of the present application further provides a semiconductor module assembly device, comprising any of the above-mentioned assembly robot arms, and further comprising a first loading mechanism, a second loading mechanism and a positioning mechanism.

[0021] The second feeding mechanism and the positioning mechanism are respectively arranged on two sides of the assembly robot arm, and the first feeding mechanism is arranged on the other side of the assembly robot arm;

[0022] The first loading mechanism is used to provide a first positioning jig to the assembly robot arm, the second loading mechanism is used to provide a second positioning jig to the assembly robot arm, and the positioning mechanism is used to receive the first positioning jig and the second positioning jig transmitted by the assembly robot arm, and determine the positions of the first positioning jig and the second positioning jig.

[0023] By adopting the above technical solution, the movement line of the assembly robot arm is optimized through the layout setting of the first feeding mechanism, the second feeding mechanism, the positioning mechanism and the assembly robot arm, the working efficiency is improved, the layout is compact, and the overall volume is reduced.

[0024] In some embodiments, the positioning mechanism includes a positioning platform and a correction component disposed on one side of the positioning platform.

[0025] The positioning platform includes a first positioning space and a second positioning space arranged side by side, the first positioning space matches the first positioning fixture, and the second positioning space matches the second positioning fixture;

[0026] The correction component includes a horizontal push rod, which is used to push the first positioning fixture located in the first positioning space to abut against the inner wall of the first positioning space, and to push the second positioning fixture located in the second positioning space to abut against the inner wall of the second positioning space.

[0027] By adopting the above technical solution, the first positioning space and the second positioning space of the positioning platform are used in conjunction with the horizontal push rod of the correction component to achieve position adjustment and positioning of the first positioning fixture and the second positioning fixture on the positioning platform, thereby improving the assembly yield rate.

[0028] Other features and corresponding beneficial effects of the present application are described in the latter part of the specification, and it should be understood that at least some of the beneficial effects become obvious from the records in the specification of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 An exploded diagram of the semiconductor module and the positioning fixture assembly after assembly;

[0030] Figure 2 It is a structural schematic diagram of the semiconductor module assembly device in this application;

[0031] Figure 3 A schematic diagram of the structure of the first actuator and the second actuator in the semiconductor module assembly robot arm of the present application;

[0032] Figure 4 A schematic structural diagram of the first actuator and the second actuator in the semiconductor module assembly robot arm of the present application from another angle;

[0033] Figure 5 It is a structural schematic diagram of a positioning mechanism in the semiconductor module assembly device of the present application.

[0034] Description of reference numerals: 1. substrate; 2. connecting piece; 3. mounting plate; 4. first positioning fixture; 5. second positioning fixture; 6. third positioning fixture;

[0035] 10. Assemble the robotic arm;

[0036] 100. Robotic arm body; 110. Connecting rod;

[0037] 200, first actuator; 210, lifting drive member; 220, horizontal drive member; 230, clamping claw; 231, clamping portion;

[0038] 300, second actuator; 310, connecting frame; 320, mounting frame; 330, suction cup;

[0039] 20. The first feeding mechanism;

[0040] 30. Second feeding mechanism;

[0041] 40. Positioning mechanism; 410. Positioning platform; 411. First positioning space; 412. Second positioning space; 413. First positioning side; 420. Correction assembly; 421. Horizontal push rod; 422. Second positioning side. DETAILED DESCRIPTION

[0042] The following specific embodiments illustrate the implementation of the present application, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Although the description of the present application will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this application are limited to the implementation. On the contrary, the purpose of introducing the application in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present application. In order to provide a deep understanding of the present application, the following description will include many specific details. The present application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present application, some specific details will be omitted in the description. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0043] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0044] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

[0045] In the description of the present application, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description created by the present application, unless otherwise specified, "multiple" means two or more.

[0046] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0047] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0048] Embodiment 1:

[0049] See also Figure 1 , Figure 1 This is an exploded diagram of the semiconductor module and positioning fixture components after assembly.

[0050] The semiconductor module includes a mounting plate 3 and a substrate 1 disposed on the mounting plate 3, and the mounting plate 3 and the substrate 1 are welded via a connecting piece 2 so that the mounting plate 3 and the substrate 1 are reliably and evenly tightly fixed. Generally speaking, three substrates 1 are provided and are regularly laid in the middle of the mounting plate 3.

[0051] A plurality of positioning jigs are required in the semiconductor module assembly process, and after the assembly is completed, the positioning jigs are processed together so that the connecting piece 2 can stably connect the mounting plate 3 and the substrate 1. In the assembly system of the present application, the positioning jig includes a first positioning jig 4, a second positioning jig 5 and a third positioning jig 6. The first positioning jig 4 and the second positioning jig 5 are in the shape of a rectangular frame, and in order to improve the accuracy, generally speaking, the number of the first positioning jigs 4 is consistent with the number of the substrates 1, and the second positioning jig 5 is provided with a limiting space matching the overlapping substrates 1 and the connecting piece 2, and the first positioning jig 4 can extend into the limiting space to achieve the limitation of the overlapping substrates 1 and the connecting piece 2 in the thickness direction.

[0052] In current semiconductor module assembly systems, multiple workstations are usually used to transfer and assemble various components in the semiconductor module and multiple positioning fixtures one by one, resulting in a large space occupied by the assembly system and low assembly efficiency.

[0053] See also Figure 2 , Figure 2 Schematic diagram of the structure of the semiconductor module assembly device in the present application, which includes a semiconductor module assembly robot arm 10.

[0054] The embodiment of the present application provides a semiconductor module assembly robot 10, which is used to sequentially assemble a first positioning jig 4 and a second positioning jig 5, wherein the first positioning jig 4 and the second positioning jig 5 are both in the shape of a rectangular frame.

[0055] The assembly robot 10 includes a robot body 100 and a first actuator 200 and a second actuator 300 arranged at the end of the robot body 100. A single robot can transfer the first positioning fixture 4 and the second positioning fixture 5 respectively, thereby reducing the space occupied by the device system and improving assembly efficiency.

[0056] In one embodiment, the robot body 100 includes a base, a first horizontal rotating arm disposed on the base, and a second horizontal rotating arm disposed at the end of the first horizontal rotating arm, and the first actuator 200 and the second actuator 300 are disposed at the end of the second horizontal rotating arm, so that the assembly robot 10 is suitable for semiconductor module assembly.

[0057] See also Figure 3 and Figure 4 , Figure 3It is a structural schematic diagram of the first actuator 200 and the second actuator 300 in the semiconductor module assembly robot 10 of the present application; Figure 4 It is a structural schematic diagram of the first actuator 200 and the second actuator 300 in the semiconductor module assembly robot 10 of the present application from another angle.

[0058] In one embodiment, the first actuator 200 includes a lifting drive 210, a horizontal drive 220, and a clamp 230 assembly arranged in a straight line. The horizontal drive 220 is connected to the driving end of the lifting drive 210, and the clamp 230 assembly is connected to the driving end of the horizontal drive 220 and is used to take the first positioning fixture 4. The lifting drive 210, the horizontal drive 220, and the clamp 230 assembly in the first actuator 200 are arranged in a straight line, which can effectively control the lateral volume of the first actuator 200, thereby controlling the volume of the assembly robot 10.

[0059] Furthermore, the first actuator 200 realizes the transfer of the first positioning fixture 4 through the clamping jaw 230 structure, which is suitable for the first positioning fixture 4 with a smaller surface area, thereby improving the reliability of the transfer operation of the first positioning fixture 4.

[0060] In one embodiment, the clamping jaw 230 assembly includes two clamping jaws 230 arranged opposite to each other. The two clamping jaws 230 move in opposite directions under the drive of the horizontal driving member 220 to clamp the first positioning fixture 4, that is, the distance between the two clamping jaws 230 is enlarged to respectively abut against the opposite sides of the inner frame of the first positioning fixture 4 to clamp the first positioning fixture 4; the two clamping jaws 230 move in opposite directions under the drive of the horizontal driving member 220 to disengage from the first positioning fixture 4, that is, the distance between the two clamping jaws 230 is reduced to move away from the inner frame side of the first positioning fixture 4 to disengage from the first positioning fixture 4, thereby reducing the space required for the operation of the clamping jaw 230 assembly on the basis of ensuring reliable clamping, thereby making the integration of the first actuator 200 and the second actuator 300 more compact and reducing the volume of the assembly robot 10.

[0061] In one embodiment, the clamping jaw 230 includes a clamping portion 231 , which is in a groove shape. When the clamping jaw 230 clamps the first positioning fixture 4 , part of the first positioning fixture 4 is embedded in the clamping portion 231 , thereby further improving the operating reliability of the first actuator 200 .

[0062] In one embodiment, both the lifting drive 210 and the horizontal drive 220 are pneumatic drives, which can control costs and ensure quick response and work efficiency.

[0063] In one embodiment, the second actuator 300 includes a connecting frame 310, a mounting frame 320, and a plurality of suction cups 330. One end of the connecting frame 310 is connected to the housing of the lifting drive member 210, and the other end is connected to one end of the mounting frame 320, that is, the second actuator 300 is directly connected to the housing of the lifting drive member 210 of the first actuator 200 to achieve connection with the assembly robot arm 10, reducing intermediate connecting parts, thereby further controlling the volume of the assembly robot arm 10.

[0064] In addition, the second actuator 300 realizes the transfer of the second positioning jig 5 through the suction cup 330 structure, which is suitable for the second positioning jig 5 with a large surface area and multiple limiting spaces in the middle, so that each position of the second positioning jig 5 can obtain a relatively uniform force, avoiding deformation of the second positioning jig 5 and improving the reliability of the transfer operation of the second positioning jig 5.

[0065] At the same time, when the assembly robot arm 10 is operating, only the first actuator 200 needs to be raised and lowered to realize the operation of the first actuator 200 and avoid the operation of the second actuator 300, which simplifies the operation control, improves the operation reliability and improves the operation efficiency.

[0066] In one embodiment, the mounting frame 320 is horizontally arranged and has a lifting space formed therein. The horizontal driving member 220 is lifted and lowered through the lifting space under the drive of the lifting driving member 210. A plurality of suction cups 330 are arranged on the mounting frame 320 and used to absorb the second positioning fixture 5.

[0067] In a specific embodiment, the mounting frame 320 is U-shaped, and the other end of the connecting frame 310 is connected to the closed end of the mounting frame 320, and a plurality of suction cups 330 are arranged on the two arms of the mounting frame 320, and a lifting space is formed between the two arms of the mounting frame 320; and the horizontal movement direction of the clamping jaw 230 assembly is the same as the opening direction of the mounting frame 320.

[0068] On the basis of ensuring the reliability of the transfer operation, the flexibility of the transfer structure layout is improved and the volume of the assembly robot 10 is controlled. That is, by arranging multiple suction cups 330 circumferentially around the clamp 230 assembly, the clamp 230 assembly can be lifted and lowered between the multiple suction cups 330, thereby improving the compactness of the first actuator 200 and the second actuator 300, thereby controlling the volume of the assembly robot 10.

[0069] Please see again Figure 1In one embodiment, the end of the robot body 100 is rotatably connected to a connecting rod 110, and the connecting rod 110 and the first actuator 200 are arranged along the same straight line, and the end of the connecting rod 110 away from the end of the robot body 100 is connected to the top of the lifting drive member 210 of the first actuator 200, so as to control the volume of the assembled robot arm 10 on the one hand, and facilitate the horizontal rotation of the first actuator 200 and the second actuator 300 on the other hand, thereby improving the positioning accuracy of the first actuator 200 and the second actuator 300 and the first positioning fixture 4 and the second positioning fixture 5, and improving the operation reliability.

[0070] Embodiment 2:

[0071] Please see again Figure 1 The embodiment of the present application also provides a semiconductor module assembly device, including the assembly robot 10 of embodiment 1, and also including a first loading mechanism 20, a second loading mechanism 30 and a positioning mechanism 40. The first loading mechanism 20 is used to provide a first positioning jig 4 to the assembly robot 10, the second loading mechanism 30 is used to provide a second positioning jig 5 to the assembly robot 10, and the positioning mechanism 40 is used to receive the first positioning jig 4 and the second positioning jig 5 transmitted by the assembly robot 10, and determine the positions of the first positioning jig 4 and the second positioning jig 5.

[0072] Since the first positioning jig 4 is usually fed through a loading tray, its overall volume is larger and the number within a single-sided area is smaller, while the second positioning jig 5 can be directly stacked, so that its overall volume is smaller and the number within a single-sided area is larger. Therefore, in order to ensure that the number of the first positioning jig 4 and the second positioning jig 5 matches during the assembly process, the volume of the first loading mechanism 20 is larger than the volume of the second loading mechanism 30.

[0073] In one embodiment, the second loading mechanism 30 and the positioning mechanism 40 are respectively arranged on both sides of the assembly robot arm 10, and the first loading mechanism 20 is arranged on the other side of the assembly robot arm 10, so that the layout of the device is compact, the overall volume is reduced, and the movement line of the assembly robot arm 10 is optimized, thereby improving the working efficiency.

[0074] Since there may be deviations in the positions of the multiple first positioning jigs 4 in the first loading mechanism 20, the assembly robot 10 may not be able to accurately put down the first positioning jig 4 for assembly when transferring it to other positions, resulting in a low yield rate. Similarly, the second positioning jig 5 also has the same problem. Therefore, it is preferred to reposition the first positioning jig 4 and the second positioning jig 5 during the transfer process.

[0075] See also Figure 5 , Figure 5 It is a structural schematic diagram of the positioning mechanism 40 in the semiconductor module assembly device of the present application.

[0076] In one embodiment, the positioning mechanism 40 includes a positioning platform 410 and a correction component 420 disposed on one side of the positioning platform 410 .

[0077] The positioning platform 410 includes a first positioning space 411 and a second positioning space 412 which are arranged side by side. The first positioning space 411 matches the first positioning fixture 4 , and the second positioning space 412 matches the second positioning fixture 5 .

[0078] The correction component 420 includes a horizontal push rod 421, which is used to push the first positioning fixture 4 located in the first positioning space 411 to abut against the inner wall of the first positioning space 411, and to push the second positioning fixture 5 located in the second positioning space 412 to abut against the inner wall of the second positioning space 412.

[0079] By using the above method, the position adjustment and positioning of the first positioning fixture 4 and the second positioning fixture 5 located on the positioning platform 410 can be achieved, thereby improving the assembly yield rate; and the first positioning fixture 4 and the second positioning fixture 5 share the positioning platform 410 and the correction component 420, which improves the utilization rate of the positioning mechanism 40 and controls the volume of the device.

[0080] In a specific embodiment, the first positioning space 411 and the second positioning space 412 each have two first positioning side surfaces 413 that intersect perpendicularly, and both first positioning side surfaces 413 of the first positioning space 411 and the second positioning space 412 are disposed away from the correction component 420 .

[0081] The end of the horizontal push rod 421 faces the positioning platform 410 , and the end of the horizontal push rod 421 has two positioning surface groups disposed opposite to each other, and the positioning surface group includes two second positioning side surfaces 422 that intersect vertically.

[0082] The corresponding two first positioning side surfaces 413 and the two second positioning side surfaces 422 are arranged along a diagonal line, so that the two second positioning side surfaces 422 cooperate with the two first positioning side surfaces 413 by moving the horizontal push rod 421 forward, thereby realizing the position adjustment and positioning of the first positioning fixture 4 and the second positioning fixture 5, so that the assembly yield rate is improved.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A semiconductor module assembly robot arm, used for sequentially assembling a first positioning fixture and a second positioning fixture, wherein the first positioning fixture and the second positioning fixture are both in the shape of a rectangular frame, characterized in that: The assembly robot arm comprises a robot arm body and a first actuator and a second actuator arranged at the end of the robot arm body; The first actuator includes a lifting drive member, a horizontal drive member and a clamping jaw assembly arranged in a straight line, the horizontal drive member is connected to the driving end of the lifting drive member, and the clamping jaw assembly is connected to the driving end of the horizontal drive member and is used to take the first positioning fixture; The second actuator includes a connecting frame, a mounting frame and a plurality of suction cups, one end of the connecting frame is connected to the outer shell of the lifting drive member, and the other end is connected to one end of the mounting frame, the mounting frame is horizontally arranged and has a lifting space formed in the middle, the horizontal driving member is lifted and lowered through the lifting space under the drive of the lifting drive member, the plurality of suction cups are arranged on the mounting frame and are used to absorb the second positioning fixture.

2. The semiconductor module assembly robot according to claim 1, characterized in that: The mounting frame is arranged in a U shape, and the other end of the connecting frame is connected to the closed end of the mounting frame, the plurality of suction cups are arranged on two arms of the mounting frame, and the lifting space is formed between the two arms of the mounting frame; Furthermore, the horizontal moving direction of the clamping jaw assembly is the same as the opening direction of the mounting frame.

3. The semiconductor module assembly robot according to claim 1, characterized in that: The lifting drive member and the horizontal drive member are both pneumatic drive members.

4. The semiconductor module assembly robot according to claim 1, characterized in that: The clamping jaw assembly includes two clamping jaws arranged opposite to each other. Driven by the horizontal driving member, the two clamping jaws move away from each other to clamp the second positioning fixture, and move toward each other to separate from the first positioning fixture.

5. The semiconductor module assembly robot according to claim 4, characterized in that: The clamping jaw comprises a clamping portion, the clamping portion is in a groove shape, and when the clamping jaw clamps the first positioning fixture, part of the first positioning fixture is embedded in the clamping portion.

6. The semiconductor module assembly robot according to claim 1, characterized in that: The end of the robot arm body is rotatably connected to a connecting rod, the connecting rod and the first actuator are arranged along the same straight line, and the end of the connecting rod away from the end of the robot arm body is connected to the top of the lifting drive member of the first actuator.

7. A semiconductor module assembly device, characterized in that: It comprises the assembly robot arm as described in any one of claims 1 to 6, and further comprises a first feeding mechanism, a second feeding mechanism and a positioning mechanism; The second feeding mechanism and the positioning mechanism are respectively arranged on two sides of the assembly robot arm, and the first feeding mechanism is arranged on the other side of the assembly robot arm; The first loading mechanism is used to provide a first positioning jig to the assembly robot arm, the second loading mechanism is used to provide a second positioning jig to the assembly robot arm, and the positioning mechanism is used to receive the first positioning jig and the second positioning jig transmitted by the assembly robot arm, and determine the positions of the first positioning jig and the second positioning jig.

8. The semiconductor module assembly device according to claim 7, wherein: The positioning mechanism includes a positioning platform and a correction component arranged on one side of the positioning platform; The positioning platform includes a first positioning space and a second positioning space arranged side by side, the first positioning space matches the first positioning fixture, and the second positioning space matches the second positioning fixture; The correction component includes a horizontal push rod, which is used to push the first positioning fixture located in the first positioning space to abut against the inner wall of the first positioning space, and to push the second positioning fixture located in the second positioning space to abut against the inner wall of the second positioning space.