Low-cost foam rubber forming structure
By setting up a groove structure of the pressing layer and double-sided adhesive colloid in the foam glue molding structure, the problem of high bulging and customized production costs when attaching foam glue in the prior art is solved, and stronger adhesion and flatness are achieved, and production costs are reduced.
Patent Information
- Application Number
- CN202421097861.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-20
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-05-20
AI Technical Summary
In the prior art, the entire foam glue on the back of the display screen is prone to bulge when attached, resulting in weak fit and easy to fall. At the same time, custom production is required due to different sizes, resulting in an increase in cost.
A low-cost foam glue forming structure is adopted, including a pressing layer and a double-sided adhesive colloid. A number of first grooves are provided on one side of the pressing layer. A second groove corresponding to the pressing layer is formed on the double-sided adhesive colloid to avoid air bubbles on the glue surface and improve adhesion and flatness.
By setting up a groove structure, air bubbles in the rubber surface are avoided, the adhesion of foam glue and the flatness of the rubber surface and the product are improved, and there is no need to customize the foam glue of different sizes, reducing production costs.
Smart Images

Figure CN222631335U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of foam adhesive processing, in particular to a low-cost foam adhesive molding structure. Background Art
[0002] In the prior art, a whole surface of foam adhesive is usually attached to the back of the display screen to protect the display screen. The foam adhesive is made by directly processing the colloid into a grid shape, and grooves are also provided at the edge of the colloid. However, when the display screen and the foam adhesive are attached, there are closed bubbles between the two, causing bulging, resulting in weak adhesion between the display screen and the colloid, and easy to fall off.
[0003] Moreover, due to the size of foam glue, foam glue of different sizes needs to be customized during production, which increases the cost. Utility Model Content
[0004] The purpose of the utility model is to overcome the shortcomings of the prior art and provide a low-cost foam glue molding structure.
[0005] The purpose of this utility model is achieved through the following technical solutions:
[0006] A low-cost foam adhesive molding structure comprises: a glue pressing layer, one side of which is provided with a plurality of first grooves.
[0007] In one embodiment, the adhesive layer is a release film.
[0008] In one embodiment, the first groove is arranged at a non-edge portion of the adhesive layer.
[0009] In one embodiment, the first grooves are arranged in ten rows and ten columns to form a grid of grooves.
[0010] In one of the embodiments, it also includes foam glue, which includes a double-sided adhesive body and a buffer layer. One side of the double-sided adhesive body is bonded to the buffer layer, and the pressing layer is pressed with the other side of the double-sided adhesive body on the side where the first groove is provided, so that the double-sided adhesive body is pressed into shape to form a second groove.
[0011] In one embodiment, the adhesive layer is aligned with the double-sided adhesive body.
[0012] In one embodiment, the thickness of the buffer layer is greater than the thickness of the double-sided adhesive.
[0013] In one embodiment, a plurality of the double-sided adhesive bodies and the same number of the buffer layers as the double-sided adhesive bodies are arranged on the adhesive layer, and the buffer layers are bonded to the adhesive layer through the double-sided adhesive bodies.
[0014] In one embodiment, the intervals between the first grooves are the same.
[0015] In one embodiment, the buffer layer is one of PU foam, antistatic foam or conductive foam.
[0016] Compared with the prior art, the utility model has at least the following advantages:
[0017] 1. The low-cost foam adhesive molding structure of the utility model is provided with a pressure-bonding layer, and a plurality of first grooves are provided on one side of the pressure-bonding layer, and the pressure-bonding layer is pressed on the double-sided adhesive body on the foam adhesive. Since the double-sided adhesive body has a certain plasticity and the pressure-bonding layer squeezes the double-sided adhesive body, the first groove on the pressure-bonding layer is inverted in the double-sided adhesive body, so that a second groove corresponding to the pressure-bonding layer is formed on the double-sided adhesive body. When bonding with the product, air bubbles are avoided in the adhesive surface, so that the adhesion of the foam adhesive is stronger, and the flatness of the adhesive surface of the foam adhesive and the product can be improved.
[0018] 2. The glue layer directly presses the foam glue by using the first groove thereon, so that the double-sided adhesive in the foam glue forms a grid groove. The glue layer has a large area and strong versatility, and there is no need for customized production of double-sided adhesives of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.
[0020] Figure 1 It is a structural schematic diagram of a low-cost foam adhesive molding structure in an embodiment of the utility model in an unpressed state;
[0021] Figure 2 It is a structural schematic diagram of a low-cost foam adhesive molding structure in a pressed state in one embodiment of the utility model.
[0022] Reference numerals:
[0023] The adhesive layer 10 , the first groove 11 , the foam adhesive 20 , the double-sided adhesive 21 , the buffer layer 22 , and the second groove 23 . DETAILED DESCRIPTION
[0024] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.
[0025] This application proposes a low-cost foam glue molding structure, please refer to Figure 1 and Figure 2 , including: a glue layer 10, a plurality of first grooves 11 are arranged on one side of the glue layer 10, and the glue layer 10 is pressed onto the double-sided adhesive body 21 on the foam adhesive 20. Since the double-sided adhesive body 21 has a certain plasticity and the glue layer 10 squeezes the double-sided adhesive body 21, the first grooves 11 on the glue layer 10 are inverted in the double-sided adhesive body 21, so that the second grooves 23 corresponding to the glue layer 10 are formed on the double-sided adhesive body 21. When laminating with the product, air bubbles are avoided in the adhesive surface, so that the adhesion of the foam adhesive 20 is stronger, and the flatness of the adhesive surface of the foam adhesive 20 and the product can be improved. In addition, the glue layer 10 has a large area and strong versatility, and there is no need for customized production of double-sided adhesive bodies 21 of different sizes, which reduces the production cost.
[0026] The low-cost foam adhesive molding structure also includes foam adhesive 20. The foam adhesive 20 includes a double-sided adhesive body 21 and a buffer layer 22. Both sides of the double-sided adhesive body 21 are adhesive. One side of the double-sided adhesive body 21 is bonded to the buffer layer 22, and the adhesive layer 10 is pressed on the other side of the double-sided adhesive body 21 on the side where the first groove 11 is provided, so that the adhesive layer 10 and the double-sided adhesive body 21 are closely attached, so that the double-sided adhesive body 21 is formed under the pressing of the adhesive layer 10, and a second groove 23 corresponding to the first groove 11 on the adhesive layer 10 is formed on the adhesive surface of the double-sided adhesive body 21, and a bulge is formed between the two second grooves 23 of the double-sided adhesive body 21, and the bulge supports the surface of the product, so that the foam adhesive 20 is attached to the surface of the product. The second groove 23 can contain a certain amount of gas, so that when the double-sided adhesive body 21 is attached to the product, the adhesive surface is prevented from bulging due to gas, thereby improving the attachment effect of the foam adhesive 20.
[0027] Specifically, the staff places the adhesive layer 10 above or below the double-sided adhesive body 21 of the foam adhesive 20, and then applies pressure to the foam adhesive 20 through the adhesive layer 10, so that a second groove 23 corresponding to the adhesive layer 10 is formed on the double-sided adhesive body 21, and the second groove 23 is used to accommodate air, thereby improving the adhesion effect of the foam adhesive 20. Preferably, the spacing between the first grooves 11 is the same, so that the area of the second groove 23 to accommodate air is relatively uniform, further improving the flatness of the adhesive surface adhesion. Among them, the adhesive layer 10 is a release film, and the release film has a slight viscosity. When the release film is operated, it can prevent the adhesive thereon from moving or falling off. And the first groove 11 is set at the non-edge of the adhesive layer 10, so the height of the edges around the double-sided adhesive body 21 is relatively low. When the product is recycled, the edge of the colloid is not bonded to the product, making the colloid easier to tear off.
[0028] In some embodiments, the first groove 11 can be cylindrical and cubic in structure, so the second groove 23 is correspondingly cylindrical and cubic in structure, which allows the foam glue 20 to adhere better to the product. The second groove 23 can accommodate a certain amount of air to ensure the flatness of the attachment.
[0029] Furthermore, the first grooves 11 are arranged in ten rows and ten columns to form a grid of grooves, wherein the size of the first grooves 11 is 0.1 mm*0.1 mm.
[0030] In another embodiment, the glue layer 10 is aligned with the double-sided adhesive body 21 to improve the utilization rate of the glue layer 10, and more foam glue 20 can be produced at one time. The thickness of the buffer layer 22 is greater than the thickness of the double-sided adhesive body 21. The buffer layer 22 has a certain elasticity and can play a certain buffering role on the product, thereby protecting the product. Preferably, the buffer layer 22 is one of PU foam, antistatic foam or conductive foam. In addition, a plurality of double-sided adhesive bodies 21 and the same number of buffer layers 22 as the double-sided adhesive bodies 21 are provided on the glue layer 10, and multiple double-sided adhesive bodies 21 can be attached to a piece of glue layer 10 to improve the production efficiency.
[0031] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A low-cost foam glue molding structure, characterized in that: include: The adhesive layer has a plurality of first grooves disposed on one side of the adhesive layer.
2. The low-cost foam adhesive molding structure according to claim 1, characterized in that: The glue-pressing layer is a release film.
3. The low-cost foam adhesive molding structure according to claim 1, characterized in that: The first groove is arranged at a non-edge portion of the adhesive layer.
4. The low-cost foam adhesive molding structure according to claim 1, characterized in that: The first grooves are arranged in ten rows and ten columns to form a grid of grooves.
5. The low-cost foam adhesive molding structure according to claim 1, characterized in that: It also includes foam glue, which includes a double-sided adhesive body and a buffer layer. One side of the double-sided adhesive body is bonded to the buffer layer, and the pressing layer is pressed with the other side of the double-sided adhesive body on the side where the first groove is provided, so that the double-sided adhesive body is pressed into shape to form a second groove.
6. The low-cost foam adhesive molding structure according to claim 5, characterized in that: The glue layer is aligned with the double-sided adhesive body.
7. The low-cost foam adhesive molding structure according to claim 5, characterized in that: The thickness of the buffer layer is greater than the thickness of the double-sided adhesive.
8. The low-cost foam adhesive molding structure according to claim 5, characterized in that: The adhesive layer is provided with a plurality of double-sided adhesive bodies and the same number of buffer layers as the double-sided adhesive bodies, and the buffer layers are bonded to the adhesive layer through the double-sided adhesive bodies.
9. The low-cost foam adhesive molding structure according to claim 1, characterized in that: The intervals between the first grooves are the same.
10. The low-cost foam adhesive molding structure according to claim 5, characterized in that: The buffer layer is one of PU foam, antistatic foam or conductive foam.