Plate feeding auxiliary device for electroplated thin plate

Abstract

The utility model discloses an electroplating thin plate feeding auxiliary device, which comprises a fixing rod arranged along the vertical direction and used for being connected with a circuit board feeding frame; the guide rod is fixedly connected with the fixed rod, and the guide rod is arranged in the horizontal direction; the positioning blocks are arranged on the guide rods in a sliding mode, and positioning grooves are formed in the upper walls of the positioning blocks and used for positioning the bottom end of the circuit board. The bottom end of the circuit board is accurately positioned and supported through the connection of the fixed rod arranged in the vertical direction and the circuit board feeding frame and the plurality of positioning blocks which are arranged at intervals in the horizontal direction and are provided with the positioning grooves. According to the design, the problems of shaking and deformation caused by no constraint at the bottom in the electroplating process of the circuit board are innovatively solved, the stability of the electroplating process is remarkably improved, and the quality and the consistency of an electroplated layer are guaranteed, so that the electroplating efficiency and the final product quality of the circuit board are improved, the rejection rate caused by deformation is reduced, and the production cost is reduced. The method has important practical value and economic benefit.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board electroplating, in particular to an auxiliary device for electroplating a thin plate. Background Art

[0002] In the modern electronic manufacturing industry, the electroplating of circuit boards is a crucial step, which directly affects the conductivity, corrosion resistance and overall life of the circuit board. In the traditional electroplating process, the fixing and transportation of the circuit board mostly rely on a clamping device in a single direction or point. Such a design performs well when processing circuit boards of conventional thickness, but with the development of electronic products towards thinness, especially when it comes to the electroplating of ultra-thin circuit boards (such as less than 0.7mm), the limitations of existing technologies become prominent.

[0003] In the related art, the clamping mechanism is mainly used to fix the upper surface of the circuit board. However, for ultra-thin boards, due to the lack of effective support on the bottom, the board surface is easily shaken or even deformed during the electroplating process due to factors such as vibration and liquid flow impact. In particular, when the ultra-thin board is immersed in the electroplating solution in the vertical direction, it is difficult for the ultra-thin board to maintain an unchanged vertical shape and penetrate the liquid surface, resulting in deformation of the board. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes an electroplating thin board loading auxiliary device, which can be conveniently installed on a circuit board loading rack, suitable for constraining the bottom end of an ultra-thin circuit board and reducing deformation of the circuit board during electroplating.

[0005] The electroplating thin plate auxiliary device according to the embodiment of the utility model comprises:

[0006] A fixing rod is arranged in a vertical direction and is used to connect with a circuit board loading rack;

[0007] A guide rod, fixedly connected to the fixed rod, and the guide rod is arranged in a horizontal direction;

[0008] A plurality of positioning blocks are respectively slidably arranged on the guide rods, and the upper walls of the positioning blocks are provided with positioning grooves, and the positioning grooves are used to position the bottom end of the circuit board.

[0009] The electroplating thin plate loading auxiliary device according to the embodiment of the utility model has at least the following beneficial effects: through the connection between the fixing rod arranged in the vertical direction and the circuit board loading rack, and the multiple positioning blocks arranged in the horizontal direction and provided with positioning grooves, the bottom of the circuit board is provided with accurate positioning and support. This design innovatively solves the shaking and deformation problems caused by the lack of constraints on the bottom of the circuit board during the electroplating process, significantly improves the stability of the electroplating process, ensures the quality and consistency of the electroplating layer, thereby improving the electroplating efficiency and the final product quality of the circuit board, and reduces the scrap rate caused by deformation, which has important practical value and economic benefits.

[0010] According to the electroplating thin plate boarding auxiliary device described in the utility model, it also includes a connecting block, the fixing rod is vertically penetrated through the connecting block and fixed by a first screw, and the guide rod is horizontally penetrated through the connecting block and fixed by a second screw.

[0011] According to the electroplated thin plate loading auxiliary device described in the utility model, the lower end of the guide rod is provided with a first external thread, and there are two first screws, which are respectively located on the upper and lower sides of the connecting block and are screwed with the first external thread to be pressed and fixed to the connecting block.

[0012] According to the electroplated thin plate loading auxiliary device described in the utility model, a second external thread is provided at the end of the guide rod, and there are two second screws, which are respectively located on the left and right sides of the connecting block and are screwed with the second external thread to press and fix the connecting block.

[0013] According to the electroplating thin plate boarding auxiliary device described in the utility model, there are two fixing rods, which are respectively located at the two ends of the guide rod, and there are two connecting blocks, which correspond to the fixing rods one by one.

[0014] According to the electroplating thin plate boarding auxiliary device described in the utility model, the guide rod is a round rod, there are two guide rods, the two guide rods are horizontally spaced apart along a length direction perpendicular to the guide rods, and the positioning blocks are respectively sleeved on the two guide rods and horizontally slidably matched with the guide rods.

[0015] According to the electroplating thin plate loading auxiliary device described in the utility model, the positioning groove extends in the horizontal direction and passes through the positioning block.

[0016] According to the electroplating thin plate mounting auxiliary device of the utility model, the width of the positioning groove is greater than the thickness of the circuit board.

[0017] According to the electroplating thin plate board auxiliary device described in the utility model, the positioning block is equipped with a rotating key, the center line of the rotating key is parallel to the width direction of the positioning groove, and the rotating key is screwed to the positioning block to move along the width direction of the positioning groove and press and fix the circuit board.

[0018] According to the electroplating thin plate loading auxiliary device described in the utility model, the fixing rod is a round rod, and the round rod is adjustably installed on the circuit board loading rack along the vertical direction.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0021] Figure 1 This is a front view of the auxiliary device for electroplating a thin plate according to an embodiment of the utility model;

[0022] Figure 2 It is a top view of the auxiliary device for electroplating a thin plate according to an embodiment of the utility model.

[0023] Description of Figure Numbers:

[0024] Fixed rod 100; first external thread 101;

[0025] Guide rod 200; second external thread 201;

[0026] Positioning block 300; positioning slot 301; rotating key 310;

[0027] Connecting block 400; first screw 410; second screw 420;

[0028] Circuit board 500. DETAILED DESCRIPTION

[0029] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0030] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0031] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0032] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0033] In the description of the utility model, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0034] In the modern electronic manufacturing industry, the electroplating of circuit boards is a crucial step, which directly affects the conductivity, corrosion resistance and overall life of the circuit board. In the traditional electroplating process, the fixing and transportation of the circuit board mostly rely on a clamping device in a single direction or point. Such a design performs well when processing circuit boards of conventional thickness, but with the development of electronic products towards thinness, especially when it comes to the electroplating of ultra-thin circuit boards (such as less than 0.7mm), the limitations of existing technologies become prominent.

[0035] In the related art, the clamping mechanism is mainly used to fix the upper surface of the circuit board. However, for ultra-thin boards, due to the lack of effective support on the bottom, the board surface is easily shaken or even deformed during the electroplating process due to factors such as vibration and liquid flow impact. In particular, when the ultra-thin board is immersed in the electroplating solution in the vertical direction, it is difficult for the ultra-thin board to maintain an unchanged vertical shape and penetrate the liquid surface, resulting in deformation of the board.

[0036] For this reason, Figure 1 and Figure 2 As shown, the electroplating thin plate auxiliary device proposed by the utility model includes a fixing rod 100, a guide rod 200 fixedly connected to the fixing rod 100, and a positioning block 300 slidably arranged on the guide rod 200, wherein the fixing rod 100 is arranged in the vertical direction, the guide rod 200 is arranged in the horizontal direction, there are multiple positioning blocks 300, and the multiple positioning blocks 300 are respectively horizontally slidably arranged on the guide rod 200. Specifically, the fixing rod 100 is used to connect with the circuit board loading rack, and the upper wall of the positioning block 300 is provided with a positioning groove 301, and the positioning groove 301 is used to position the bottom end of the circuit board 500. It should be noted that the circuit board loading rack is used to clamp the upper end of the circuit board 500. For example, the circuit board loading rack is provided with a plurality of clamps arranged at intervals in the horizontal direction. The operator loads the circuit board 500 and clamps the upper end of the circuit board 500 by manually operating the clamp. After the clamping operation is completed, the circuit board loading rack and the circuit board 500 are immersed in the electroplating agent. It is easy to understand that the electroplating thin plate loading auxiliary device is installed on the circuit board loading rack through the fixing rod 100. For example, the circuit board loading rack is provided with a connecting sleeve, and the fixing rod 100 is passed through the connecting sleeve and fixed by screws. Optionally, the screw is threadedly connected to the connecting sleeve, and the bottom end of the screw presses against the outer wall of the fixing rod 100 to achieve a fixed connection between the fixing rod 100 and the connecting sleeve. In some embodiments, the fixing rod 100 is a square rod or a round rod. By adjusting the depth of the fixing rod 100 penetrating into the connecting sleeve, the fixing rod 100 can be adjustably installed on the circuit board loading rack along the vertical direction to adapt to the application of circuit boards 500 of different length specifications.

[0037] The bottom end of the circuit board 500 is provided with precise positioning and support by connecting the fixing rod 100 arranged in the vertical direction with the circuit board loading rack, and multiple positioning blocks 300 arranged at intervals in the horizontal direction and provided with positioning grooves 301. Optionally, there are two positioning blocks 300, and the two positioning blocks 300 respectively support and position the two corners of the bottom end of the circuit board 500. This design innovatively solves the shaking and deformation problems caused by the lack of constraints on the bottom of the circuit board 500 during the electroplating process, significantly improves the stability of the electroplating process, especially avoids the problem of deformation of the circuit board 500 when penetrating the liquid surface, ensures the quality and consistency of the electroplating layer, thereby improving the electroplating efficiency and the final product quality of the circuit board 500, and reducing the scrap rate caused by deformation, which has important practical value and economic benefits.

[0038] In some embodiments of the present invention, the fixing rod 100 and the guide rod 200 are connected by a connecting block 400. Specifically, referring to Figure 1, the fixing rod 100 is vertically penetrated in the connection block 400 and fixed by the first screw 410, and the guide rod 200 is horizontally penetrated in the connection block 400 and fixed by the second screw 420. The fixing rod 100 and the guide rod 200 are respectively fixed to the connection block 400 by means of screws, so as to ensure a more solid connection between the fixing rod 100 and the guide rod 200 and the connection block 400, thereby improving the mechanical stability of the entire auxiliary device, especially in the face of corrosion and mechanical vibration of chemical solutions during the electroplating process, it is possible to maintain good structural integrity. Further, the lower end of the guide rod 200 is provided with a first external thread 101, and there are two first screws 410, which are respectively located on the upper and lower sides of the connection block 400 and are screwed with the first external thread 101 to be pressed and fixed to the connection block 400. By providing the first external thread 101 at the lower end of the guide rod 200 and using two first screws 410 to be screwed from the upper and lower sides of the connection block 400, the height of the guide rod 200 can be finely adjusted. This design allows the user to accurately adjust the height position of the auxiliary device according to the actual thickness of the circuit board 500 and the specific conditions of the electroplating tank, thereby ensuring the best fixed state of the circuit board 500 during the electroplating process and reducing the risk of deformation. Similarly, the end of the guide rod 200 is provided with a second external thread 201, and there are two second screws 420. The two second screws 420 are respectively located on the left and right sides of the connecting block 400 and are screwed with the second external thread 201 to press and fix the connecting block 400. The second external thread 201 is provided at the end of the guide rod 200 and fixed from the left and right sides of the connecting block 400 by two second screws 420, which enhances the lateral stability of the guide rod 200, ensures that during the electroplating process, even if it is subjected to lateral forces, the device can remain stable, reduce the deviation and shaking of the circuit board 500, and improve the uniformity and success rate of electroplating.

[0039] Reference Figure 1 There are two fixing rods 100, which are located at both ends of the guide rod 200 respectively. There are two connecting blocks 400, which correspond to the fixing rods 100 one by one. By fixing both ends of the guide rod 200, both ends of the guide rod 200 are constrained, so that the weight and force of the circuit board 500 can be distributed more evenly, avoiding local stress concentration caused by single-point load bearing, thereby protecting the thin circuit board 500 from being easily damaged during electroplating. Figure 2, the guide rod 200 is a round rod, there are two guide rods 200, and the two guide rods 200 are arranged horizontally and spaced apart along the length direction perpendicular to the guide rod 200, and the positioning block 300 is respectively set on the two guide rods 200 and cooperates with the guide rod 200 in horizontal sliding, constraining the positioning block 300, and the positioning block 300 after installation will not deflect. It is easy to understand that when the guide rod is a square rod (not shown in the figure), the positioning block is penetrated in a single guide rod and will not deflect. Further, the positioning groove 301 extends in the horizontal direction and penetrates the positioning block 300, making the insertion and removal of the circuit board 500 more convenient and quick, while ensuring the accurate alignment of the circuit board 500 before electroplating, and improving production efficiency. It is easy to understand that due to the penetration setting of the positioning groove 301, the positioning groove 301 can be provided for the bottom edge of the circuit board 500 to pass horizontally, that is, the positioning block 300 can support any position of the bottom edge of the circuit board 500. In some embodiments, the positioning groove is not penetrated, and the positioning block can only support the corner position of the bottom edge of the circuit board (not shown in the figure).

[0040] Optionally, the width of the positioning groove 301 is greater than the thickness of the circuit board 500. In this regard, the auxiliary device can be compatible with circuit boards 500 of different thicknesses within a certain range, thereby enhancing the versatility and practicality of the device and reducing the frequency of adjusting or replacing the auxiliary device due to changing the specifications of the circuit board 500. Figure 1 and Figure 2 The positioning block 300 is equipped with a rotating key 310, the center line of the rotating key 310 is parallel to the width direction of the positioning slot 301, and the rotating key 310 is screwed to the positioning block 300 to move along the width direction of the positioning slot 301 and press and fix the circuit board 500. In application, according to the thickness of the circuit board 500, the rotating key 310 can move along the width direction of the positioning slot 301 and press and fix the circuit board 500. The manual operation is convenient, and dynamic adjustment and tight clamping are realized. Even in the vibration environment during the electroplating process, the circuit board 500 can be kept stable, thereby improving the electroplating quality.

[0041] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. Auxiliary device for electroplating thin plates, characterized in that: include: A fixing rod is arranged in a vertical direction and is used to connect with a circuit board loading rack; A guide rod, fixedly connected to the fixed rod, and the guide rod is arranged in a horizontal direction; A plurality of positioning blocks are respectively slidably arranged on the guide rods, and the upper walls of the positioning blocks are provided with positioning grooves, and the positioning grooves are used to position the bottom end of the circuit board.

2. The electroplating sheet auxiliary device according to claim 1, characterized in that: It also includes a connecting block, the fixing rod is vertically penetrated through the connecting block and fixed by a first screw, and the guide rod is horizontally penetrated through the connecting block and fixed by a second screw.

3. The electroplating sheet auxiliary device according to claim 2, characterized in that: The lower end of the guide rod is provided with a first external thread, and there are two first screws, which are respectively located at the upper and lower sides of the connecting block and are screwed with the first external thread to be pressed and fixed to the connecting block.

4. The electroplating sheet auxiliary device according to claim 2, characterized in that: The end of the guide rod is provided with a second external thread, and there are two second screws, which are respectively located on the left and right sides of the connecting block and are screwed with the second external thread to press and fix the connecting block.

5. The electroplating thin plate auxiliary device according to any one of claims 2 to 4, characterized in that: There are two fixing rods, which are respectively located at two ends of the guide rod. There are two connecting blocks, which correspond to the fixing rods one by one.

6. The electroplating sheet auxiliary device according to claim 1, characterized in that: The guide rod is a round rod, there are two guide rods, the two guide rods are horizontally spaced apart along a length direction perpendicular to the guide rods, and the positioning blocks are respectively sleeved on the two guide rods and horizontally slidably cooperate with the guide rods.

7. The electroplating sheet auxiliary device according to claim 1, characterized in that: The positioning groove extends in a horizontal direction and passes through the positioning block.

8. The electroplating sheet auxiliary device according to claim 7, characterized in that: The width of the positioning groove is greater than the thickness of the circuit board.

9. The electroplating sheet auxiliary device according to claim 8, characterized in that: The positioning block is equipped with a rotating key, the center line of which is parallel to the width direction of the positioning slot. The rotating key is screwed to the positioning block to move along the width direction of the positioning slot and press and fix the circuit board.

10. The electroplating sheet auxiliary device according to claim 1, characterized in that: The fixing rod is a round rod, and the round rod is adjustably mounted on the circuit board loading rack along a vertical direction.

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