IGBT module wafer temperature test system

Abstract

The utility model relates to the technical field of semiconductor detection, and discloses an IGBT module wafer temperature test system, which comprises an infrared temperature tester vertically arranged above an IGBT module to be tested and used for detecting the wafer temperature of the IGBT module to be tested within the detection range of the infrared temperature tester; the temperature acquisition instrument is arranged on one side of the air inlet of the radiator and is used for acquiring environment temperature, and the radiator is used for radiating the IGBT module to be tested; and the controller is electrically connected with the infrared temperature tester and the temperature acquisition instrument and is used for controlling the temperature acquisition instrument and the infrared temperature tester to carry out synchronous detection. According to the utility model, the wafer temperature of the to-be-tested IGBT module can be visually tested without risk through the infrared temperature tester, and the temperature of the air inlet of the radiator can be synchronously tested through the temperature acquisition instrument, so that a reference can be established for a test result, the influence of environment temperature can be decoupled, and the test result is more accurate.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor detection, in particular to an IGBT module wafer temperature testing system. Background Art

[0002] IGBT modules are the core main power devices in photovoltaic inverters. Each manufacturer has strict application standards for the internal wafer temperature. During the research, development and production of the inverter, it must be strictly ensured that the wafer temperature of the IGBT module is lower than the application standard given by the manufacturer.

[0003] At present, most tests are performed by sticking a temperature rise line on the surface of the wafer. However, this test method results in a very limited test position and cannot comprehensively test the temperature of every point on the wafer. The process of sticking the temperature rise line can easily cause the wafer to short-circuit or abnormal. In addition, the test data is easily affected by factors such as the thickness of the colloid used to fix the temperature rise line, resulting in the inability to guarantee the accuracy and consistency of the tested wafer temperature. Utility Model Content

[0004] In view of this, the utility model provides an IGBT module wafer temperature testing system to solve the problem of low testing accuracy in the prior art method of using a temperature rise line to test the surface temperature of the wafer.

[0005] In a first aspect, the utility model provides an IGBT module wafer temperature testing system, the system comprising:

[0006] An infrared temperature tester is vertically arranged above the IGBT module to be tested, and is used to detect the wafer temperature of the IGBT module to be tested within the detection range of the infrared temperature tester;

[0007] The temperature collector is set on the side of the air inlet of the radiator to collect the ambient temperature. The radiator is used to dissipate heat for the IGBT module to be tested;

[0008] The controller is electrically connected to the infrared temperature tester and the temperature collector, and is used to control the temperature collector and the infrared temperature tester to perform synchronous detection.

[0009] The IGBT module wafer temperature test system provided in this embodiment can intuitively and risk-freely test the wafer temperature of the IGBT module to be tested by using an infrared temperature tester. At the same time, the temperature of the radiator air inlet is synchronously tested using a temperature acquisition instrument, which can establish a benchmark for the test results, decouple the influence of the ambient temperature, and make the test results more accurate. The test system can also solve the problem of limited test points during the test of the temperature rise line on the wafer surface. It can detect all wafer temperatures within its test range in real time through an infrared temperature tester, and can comprehensively and conveniently observe the internal wafer temperature of the IGBT module, greatly shortening the test time, and the measurement consistency can be fully guaranteed. In addition, the test system can also avoid the risk of short circuit or abnormality caused by sticking the temperature rise line on the wafer surface, and can also avoid the influence of factors such as the thickness of the colloid used to fix the temperature rise line.

[0010] In an optional embodiment, the temperature acquisition instrument includes: a temperature rise line and a temperature acquisition card;

[0011] One end of the temperature rise line is pasted on the air inlet of the radiator, and the other end is connected to the temperature acquisition card;

[0012] The temperature acquisition card is electrically connected to the controller and is used to convert the ambient temperature signal collected by the temperature rise line into ambient temperature data.

[0013] A temperature collector is used to test the air inlet temperature, which solves the impact of unstable ambient temperature on experimental data during temperature testing.

[0014] In an optional embodiment, the system further includes:

[0015] Support fixture for supporting infrared temperature tester.

[0016] The supporting and fixing device can be used to support and fix the infrared temperature tester, which can effectively improve the stability during the test and further improve the accuracy of the test results.

[0017] In an optional embodiment, the supporting and fixing device comprises:

[0018] A vertical telescopic support frame, comprising a support base and a first telescopic rod;

[0019] The horizontal telescopic device comprises an infrared temperature tester fixing frame and a second telescopic rod. One end of the second telescopic rod is fixedly connected to the infrared temperature tester fixing frame, and the other end is horizontally rotatably connected to the vertical telescopic support frame.

[0020] The supporting and fixing device provided in this embodiment can assist the infrared temperature tester to flexibly observe the real-time temperature of any point and local wafer area, solve the problem of test point limitations during the test process, and at the same time avoid wafer failure and pasting consistency problems caused by the temperature rise line pasted on the wafer surface, thereby improving the efficiency, accuracy and consistency of IGBT module temperature testing.

[0021] In an optional implementation, the infrared temperature tester is mounted on the infrared temperature tester fixing bracket by means of fasteners.

[0022] The use of fasteners for installation can improve the stability of the installation and avoid falling during the test, which will affect the test accuracy.

[0023] In an optional embodiment, the system further includes:

[0024] Protective device, used to protect the detection head of the infrared temperature tester.

[0025] The protection device can protect the infrared temperature tester when performing extreme tests, and can be used to prevent the infrared temperature tester from being scratched by foreign objects or damaged by external energy, thereby extending the service life of the infrared temperature tester.

[0026] In an optional embodiment, the protection device includes:

[0027] A mirror frame, provided with a mounting hole, the mirror frame being connected to a supporting fixture;

[0028] The protective lens is arranged in the mounting hole and on the emission path of the infrared temperature tester.

[0029] The protective lens can be used to prevent the infrared temperature tester from being scratched and damaged by foreign objects, so as to extend the service life of the infrared temperature tester. The lens frame can be connected to the infrared temperature tester fixing frame on the supporting fixing device, which can not only save space, but also reduce installation time and workload, and improve work efficiency.

[0030] In an optional embodiment, the mirror frame is mounted on the infrared temperature tester fixing frame by means of fasteners.

[0031] By installing the fasteners, the frame can be firmly fixed on the infrared temperature tester fixing frame to ensure that the device will not shake or tilt during use, thereby improving the stability of the device.

[0032] In an optional embodiment, the protective lens is germanium glass.

[0033] Germanium glass is selected as the protective lens, which has high light transmittance, high temperature resistance and high hardness. It can effectively protect the infrared temperature tester without affecting the accuracy of the observed data.

[0034] In an optional embodiment, the frame is made of stainless steel, which can effectively ensure a stable and corrosion-resistant connection. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 It is a structural schematic diagram of a specific example of an IGBT module wafer temperature testing system according to an embodiment of the utility model;

[0037] Explanation of the reference numerals: 1 - infrared temperature tester, 21 - temperature rise line, 22 - temperature acquisition card, 31 - support base, 32 - first telescopic rod, 33 - infrared temperature tester fixing frame, 34 - second telescopic rod, 41 - frame, 42 - protective lens. DETAILED DESCRIPTION

[0038] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0039] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0040] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can also be the internal connection of two components, it can be a wireless connection, or it can be a wired connection. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0041] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0042] Reference Figure 1 As shown, it is a structural schematic diagram of an IGBT module wafer temperature testing system provided in this embodiment. The IGBT module wafer temperature testing system includes: an infrared temperature tester 1, a temperature collector, and a controller (not shown in the figure), as follows.

[0043] The infrared temperature tester 1 is vertically arranged above the IGBT module to be tested, and is used to detect the wafer temperature of the IGBT module to be tested within the detection range of the infrared temperature tester 1 , wherein the infrared temperature tester 1 may be an infrared thermal imager.

[0044] The temperature collector is arranged at one side of the air inlet of the radiator, and is used to collect the ambient temperature. The radiator is used to dissipate heat for the IGBT module to be tested, wherein the radiator can be arranged below the IGBT module to be tested. The ambient temperature of the air inlet of the radiator collected by the temperature collector can establish a benchmark for the wafer temperature tested by the infrared temperature tester 1, thereby reducing variables in the test process.

[0045] The controller is electrically connected to the infrared temperature tester 1 and the temperature collector, and is used to control the temperature collector and the infrared temperature tester 1 to perform synchronous detection, wherein the controller can adopt a host computer and be controlled by the host computer.

[0046] The IGBT module wafer temperature test system provided in this embodiment can intuitively and risk-freely test the wafer temperature of the IGBT module to be tested by using an infrared temperature tester. At the same time, the temperature of the radiator air inlet is synchronously tested using a temperature acquisition instrument, which can establish a benchmark for the test results, decouple the influence of the ambient temperature, and make the test results more accurate. The test system can also solve the problem of limited test points during the test of the temperature rise line on the wafer surface. It can detect all wafer temperatures within its test range in real time through an infrared temperature tester, and can comprehensively and conveniently observe the internal wafer temperature of the IGBT module, greatly shortening the test time, and the measurement consistency can be fully guaranteed. In addition, the test system can also avoid the risk of short circuit or abnormality caused by sticking the temperature rise line on the wafer surface, and can also avoid the influence of factors such as the thickness of the colloid used to fix the temperature rise line.

[0047] In some optional implementations, the temperature acquisition instrument includes: a temperature rise line 21 and a temperature acquisition card 22 .

[0048] One end of the temperature rise line 21 is attached to the air inlet of the radiator, and the other end is connected to the temperature acquisition card 22;

[0049] The temperature acquisition card 22 is electrically connected to the controller and is used to convert the ambient temperature signal acquired by the temperature rise line 21 into ambient temperature data.

[0050] A temperature collector is used to test the air inlet temperature, which solves the impact of unstable ambient temperature on experimental data during temperature testing.

[0051] In some optional embodiments, the system further includes: a supporting fixture for supporting the infrared temperature tester 1 .

[0052] The supporting and fixing device can be used to support and fix the infrared temperature tester 1, which can effectively improve the stability during the test, and further improve the accuracy of the test result.

[0053] In some optional embodiments, the supporting and fixing device includes:

[0054] The vertical telescopic support frame includes a support base 31 and a first telescopic rod 32. The support base 31 can be a triangular telescopic support frame or a fixed base. The first telescopic rod 32 can move up and down to adjust the height of the infrared temperature tester 1, so that the infrared temperature tester 1 can be adjusted to a proper position to prevent the problem of test error caused by the inability of the infrared temperature tester 1 to focus.

[0055] The horizontal telescopic device includes an infrared temperature tester fixing frame 33 and a second telescopic rod 34. One end of the second telescopic rod 34 is fixedly connected to the infrared temperature tester fixing frame 33, and the other end is horizontally rotatably connected to the vertical telescopic support frame. The infrared temperature tester fixing frame 33 can be a shelf for installing the infrared temperature tester 1, or a clamp for fixing. The second telescopic rod 34 can not only be telescopic, but also can be rotatably connected to the first telescopic rod 32 to achieve horizontal rotation to adjust the horizontal position of the infrared temperature tester 1.

[0056] The supporting and fixing device provided in this embodiment can assist the infrared temperature tester to flexibly observe the real-time temperature of any point and local wafer area, solve the problem of test point limitations during the test process, and at the same time avoid wafer failure and pasting consistency problems caused by the temperature rise line pasted on the wafer surface, thereby improving the efficiency, accuracy and consistency of IGBT module temperature testing.

[0057] In some optional implementations, the infrared temperature tester 1 is mounted on the infrared temperature tester fixing bracket 33 via fasteners.

[0058] The use of fasteners for installation can improve the stability of the installation and avoid falling during the test, which will affect the test accuracy.

[0059] In some optional implementations, the system further includes: a protection device for protecting the detection head of the infrared temperature tester 1 .

[0060] When the infrared temperature tester 1 is an infrared thermal imager, the protection device can be used to protect the test lens of the infrared thermal imager.

[0061] The protection device can protect the infrared temperature tester 1 when performing an extreme test, and can be used to prevent the infrared temperature tester 1 from being scratched by foreign objects or damaged by external energy, thereby extending the service life of the infrared temperature tester 1.

[0062] In some optional embodiments, the protection device includes:

[0063] The mirror frame 41 is provided with a mounting hole, and the mirror frame 41 is connected to the supporting and fixing device;

[0064] The protective lens 42 is arranged in the mounting hole, and the protective lens 42 is arranged on the emission path of the infrared temperature tester 1 .

[0065] The protection device includes a vertically arranged mirror frame 41, which can be arranged between the infrared temperature tester 1 and the IGBT module to be tested, and can also be installed on a supporting and fixing device through fasteners. The protective lens 42 can be arranged below the infrared temperature tester 1 to protect the test lens of the infrared temperature tester 1. The protective lens 42 can be attached to the test lens of the infrared temperature tester 1, or it can be kept at an appropriate distance as long as it can play a protective role.

[0066] The protective lens 42 can be used to prevent the infrared temperature tester 1 from being scratched or damaged by foreign objects, so as to extend the service life of the infrared temperature tester 1. The lens frame 41 can be connected to the infrared temperature tester fixing frame 33 on the supporting fixing device, which can not only save space, but also reduce installation time and workload, and improve work efficiency.

[0067] In some optional embodiments, the frame 41 is mounted on the infrared temperature tester fixing frame 33 by fasteners. By means of the fastener installation method, the frame 41 can be firmly fixed on the infrared temperature tester fixing frame 33, ensuring that the device will not shake or tilt during use, thereby improving the stability of the device.

[0068] In some optional embodiments, the protective lens 42 is germanium glass.

[0069] Germanium glass is selected as the protective lens 42, which has high light transmittance, high temperature resistance and high hardness, and can effectively protect the infrared temperature tester 1 without affecting the accuracy of the observed data.

[0070] In some optional embodiments, the frame 41 is made of stainless steel, specifically 316 stainless steel, which can effectively ensure a stable and corrosion-resistant connection.

[0071] A specific embodiment is provided below:

[0072] When using the IGBT module wafer temperature test system for testing, it is necessary to first hollow out the PCB circuit board corresponding to the test position of the IGBT module wafer to be tested. If the hollowed-out position of the PCB circuit board is blocked by components, the blocked position should be vacated by modifying the board or flying wires, and then hollowed out. Then, a debonding agent is used to remove the colloid used to protect the wafer inside the IGBT module to be tested, and then the wafer surface is painted black with an infrared thermal imager and black body paint.

[0073] Before testing, adjust the infrared thermal imager to the appropriate position through the support fixture, and then adjust the focal length to prevent test errors caused by misfocus; after setting up the infrared thermal imager, install a protective device for it. Because extreme testing is required, the IGBT module to be tested faces the risk of failure, and the IGBT module has huge energy at the moment of failure. If it is not protected, it will damage the infrared thermal imager, so a protective device is needed for protection. When in use, the protective device needs to be placed between the infrared thermal imager and the IGBT module to be tested, and fixed firmly with fixing screws before testing.

[0074] When installing the temperature collector, one end of the temperature rise line 21 must be pasted to the air inlet of the radiator, and the other end must be locked to the temperature collection card 22, and then the temperature collection card 22 is connected; the temperature rise line 21 is placed at the air inlet of the radiator because when the object under test is running, the surrounding ambient temperature will be raised, and the temperature at the air inlet of the radiator has the strongest correlation with the test data. Therefore, when performing multiple tests, the ambient temperature of the air inlet is collected in real time through the temperature collector, and then the test results of the infrared thermal imager are removed from the changes in ambient temperature, so that the test results of the infrared thermal imager can be established on the same basis. Specifically, taking two tests as an example, the test result of the infrared thermal imager under test condition 1 is 100°C, and the ambient temperature collected by the temperature collector is 25°C. The test result of the infrared thermal imager under test condition 2 is 80°C, and the ambient temperature collected by the temperature collector is 30°C. The test result of the infrared thermal imager under test condition 2 is reduced by the change of ambient temperature, and the calculated result is the corrected test result of test condition 2, that is, the corrected test result of test condition 2 is 80°C-(30°C-25°C)=75°C, thereby establishing the two test results of the infrared thermal imager on the same basis.

[0075] In addition, before the test, you need to connect the host computer and the infrared thermal imager through the data cable equipped with the infrared thermal imager, and then adjust the ambient temperature and reflectivity according to the actual situation in the infrared thermal imager software of the host computer, and adjust the focal length to the appropriate position; then connect the temperature collector through the network cable. Here, you need to pay attention to select the corresponding temperature rise line type in the host computer according to the temperature rise line type, otherwise the different calculation methods after sampling by the host computer will cause incorrect test results. Then adjust the host computer to split screen mode, monitor the test data of the infrared thermal imager and the temperature collector in real time, and you can solve the impact of ambient temperature changes on the test.

[0076] The IGBT module wafer temperature test system provided in this embodiment is safer and more accurate than the previous point temperature rise line 21 test of wafer temperature, and can avoid the short circuit risk caused by pasting the temperature rise line 21, and the test error caused by poor heat dissipation after the temperature rise glue is covered. It also greatly saves the time cost in the test process, can flexibly change the test point, and is equipped with a temperature collector to detect the air inlet temperature, solving the impact of ambient temperature changes on the test results. In addition, the infrared thermal imager collects infrared thermal radiation for measurement, which is more real-time than the heat transfer measurement method of the temperature rise line 21, and the collection frequency also greatly exceeds the temperature rise line 21.

[0077] In addition, the IGBT module wafer temperature testing system provided in this embodiment realizes the testing of the entire surface of the wafer inside the IGBT module, can observe the overall temperature, know the temperature distribution inside the test object, and clarify the direction for the optimization of the heat dissipation system; it solves the point limitation problem during the conventional test of pasting the temperature rise line 21, and the simultaneous observation of multiple points also improves the efficiency of the wafer temperature test inside the IGBT module; in addition, it also eliminates the risk of wafer short circuit when pasting the temperature rise line 21 on the wafer surface.

[0078] The test system can be applied not only to IGBT modules, but also to temperature testing of other power devices and semiconductor devices, which will not be elaborated here.

[0079] It should be noted that the embodiment of the utility model mainly introduces the hardware structure of the IGBT module wafer temperature test system. The utility model is also intended to protect the structure of the test system and the components included therein. As for the control logic and other method contents therein, the existing logic can be fully adopted.

[0080] Although the embodiments of the present invention are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. An IGBT module wafer temperature test system, characterized in that: The system comprises: An infrared temperature tester (1) is vertically arranged above the IGBT module to be tested and is used to detect the wafer temperature of the IGBT module to be tested within the detection range of the infrared temperature tester (1); A temperature collector is arranged at one side of the air inlet of the radiator, and is used to collect the ambient temperature. The radiator is used to dissipate heat for the IGBT module to be tested; A controller is electrically connected to the infrared temperature tester (1) and the temperature collector, and is used to control the temperature collector and the infrared temperature tester (1) to perform synchronous detection.

2. The system according to claim 1, characterized in that The temperature acquisition instrument comprises: a temperature rise line (21) and a temperature acquisition card (22); One end of the temperature rise line (21) is attached to the air inlet of the radiator, and the other end is connected to the temperature acquisition card (22); The temperature acquisition card (22) is electrically connected to the controller and is used to convert the ambient temperature signal acquired by the temperature rise line (21) into ambient temperature data.

3. The system according to claim 1, characterized in that The system further comprises: A supporting and fixing device is used to support the infrared temperature tester (1).

4. The system according to claim 3, characterized in that The supporting and fixing device comprises: A vertical telescopic support frame, comprising a support base (31) and a first telescopic rod (32); The horizontal telescopic device comprises an infrared temperature tester fixing frame (33) and a second telescopic rod (34), wherein one end of the second telescopic rod (34) is fixedly connected to the infrared temperature tester fixing frame (33), and the other end is horizontally rotatably connected to the vertical telescopic support frame.

5. The system according to claim 4, characterized in that The infrared temperature tester (1) is mounted on the infrared temperature tester fixing frame (33) via fasteners.

6. The system according to claim 4, characterized in that The system further comprises: A protection device is used to protect the detection head of the infrared temperature tester (1).

7. The system according to claim 6, characterized in that The protection device comprises: A mirror frame (41) is provided with a mounting hole, and the mirror frame (41) is connected to the supporting and fixing device; A protective lens (42) is arranged in the mounting hole, and the protective lens (42) is arranged on the emission path of the infrared temperature tester (1).

8. The system according to claim 7, characterized in that The mirror frame (41) is mounted on the infrared temperature tester fixing frame (33) via fasteners.

9. The system according to claim 7, characterized in that The protective lens (42) is made of germanium glass.

10. The system according to claim 7, characterized in that The mirror frame (41) is made of stainless steel.

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