Low-power-consumption multi-temperature detection device
By using the CD74HC4051 chip instead of the temperature sensor, the problem of limited number of temperature detection and large power consumption in existing BMS systems is solved, and the multi-temperature detection and accuracy improvement of low power consumption is achieved.
Patent Information
- Application Number
- CN202421462636.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-25
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-06-25
AI Technical Summary
The number of temperature detection in existing BMS systems is limited, with errors, large power consumption and more pins.
The CD74HC4051 chip is used instead of the temperature sensor, which is directly connected to the MCU, supports the use of 8-channel temperature sensors simultaneously, and can be used in parallel to increase the number of temperature detection, save I/O interface, and turn off the CD74HC4051 when not in use to reduce power consumption.
It realizes multi-temperature detection with low power consumption, reduces the occupation of I/O interface, and improves the accuracy and reliability of temperature detection.
Smart Images
Figure CN222635643U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of temperature detection, in particular to a low-power consumption multi-temperature detection device. Background Art
[0002] Currently in BMS, there are only one or two temperature detectors, which are generally directly controlled by MCU. However, the number of temperature detection is limited, there are errors, the power consumption is large, and more pins are occupied. Utility Model Content
[0003] In order to make up for the deficiencies of the prior art, the embodiments of the present application solve the problems in the prior art by providing a low-power multi-temperature detection device.
[0004] In order to solve the above technical problems, the utility model provides the following technical solutions:
[0005] A low-power multi-temperature detection device includes a chip U802, a resistor R807, a resistor R808, a resistor R809, a resistor R810, a MOS tube Q800 and a capacitor C803, wherein the pin 3 of the chip U802 is connected to the resistor R807 and the resistor R808, the other end of the resistor R807 is grounded, the other end of the resistor R808 is connected to the capacitor C804, the other end of the capacitor C804 is grounded, the pin 6 of the chip U802 is connected to the pin 7 of the chip U802, the pin 8 of the chip U802, the resistor R830, the resistor R831, and the resistor R83 2 and the collector of transistor Q800, the base of transistor Q800 is connected to resistor R809 and resistor R810, the other end of resistor R810 is connected to the emitter of transistor Q800 and the ground terminal, the other end of resistor R809 is connected to the communication power control signal VIN, the other end of resistor R830 is connected to pin 11 of chip U802, the other end of resistor R831 is connected to pin 10 of chip U802, the other end of resistor R832 is connected to pin 9 of chip U802, and pin 16 of chip U802 is connected to capacitor C803 and power supply VCC_MCU.
[0006] As a further technical solution of the utility model: the model of the chip U802 is CD74HC4051.
[0007] As a further technical solution of the utility model: the transistor Q800 is an NPN transistor.
[0008] As a further technical solution of the utility model: 1 to 8 temperature sensors are connected to the chip U802.
[0009] As a further technical solution of the utility model: Pins 1-2, pins 4-5, and pins 12-15 of the chip U802 are connected to temperature sensors.
[0010] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
[0011] The utility model uses CD74HC4051 to replace the temperature sensor and directly connect it to MCU. The temperature sensor is connected to CD74HC4051. It supports the simultaneous use of 8 temperature sensors and can also be used in parallel to increase the number of temperature detection and save I / O interfaces. CD74HC4051 is controlled by MCU and can be turned off when not in use to reduce power consumption. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 This is a circuit diagram of the utility model. DETAILED DESCRIPTION
[0013] The technical solutions in the embodiments of the utility model are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0014] Reference Figure 1 A low-power multi-temperature detection device includes a chip U802, a resistor R807, a resistor R808, a resistor R809, a resistor R810, a MOS tube Q800 and a capacitor C803, wherein the pin 3 of the chip U802 is connected to the resistor R807 and the resistor R808, the other end of the resistor R807 is grounded, the other end of the resistor R808 is connected to the capacitor C804, the other end of the capacitor C804 is grounded, the pin 6 of the chip U802 is connected to the pin 7 of the chip U802, the pin 8 of the chip U802, the resistor R830, the resistor R831, and the resistor R832. 32 and the collector of transistor Q800, the base of transistor Q800 is connected to resistor R809 and resistor R810, the other end of resistor R810 is connected to the emitter of transistor Q800 and the ground terminal, the other end of resistor R809 is connected to the communication power control signal VIN, the other end of resistor R830 is connected to pin 11 of chip U802, the other end of resistor R831 is connected to pin 10 of chip U802, the other end of resistor R832 is connected to pin 9 of chip U802, and pin 16 of chip U802 is connected to capacitor C803 and power supply VCC_MCU.
[0015] The model of chip U802 is CD74HC4051. Transistor Q800 is an NPN transistor. Chip U802 is connected with 1 to 8 temperature sensors.
[0016] Here’s how it works:
[0017] Pins 1-2, 4-5, and 12-15 of CD74HC4051 are connected to the temperature sensor. The temperature sensor is directly connected to the MCU instead of the CD74HC4051. The temperature sensor is connected to the CD74HC4051. It supports the simultaneous use of 8 temperature sensors, and can also be used in parallel to increase the number of temperature detection and save I / O interfaces. The MCU controls the CD74HC4051. When not in use, the CD74HC4051 can be turned off to reduce power consumption.
[0018] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be considered exemplary and non-restrictive in all respects, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention.
[0019] In addition, it should be understood that although this specification is described according to implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment have also been appropriately combined to form other implementation methods that are easy for those skilled in the art to understand.
Claims
1. A low-power multi-temperature detection device, comprising a chip U802, a resistor R807, a resistor R808, a resistor R809, a resistor R810, a MOS tube Q800 and a capacitor C803, characterized in that: Pin 3 of the chip U802 is connected to resistor R807 and resistor R808, the other end of resistor R807 is grounded, the other end of resistor R808 is connected to capacitor C804, the other end of capacitor C804 is grounded, pin 6 of chip U802 is connected to pin 7 of chip U802, pin 8 of chip U802, resistor R830, resistor R831, resistor R832 and the collector of transistor Q800, the base of transistor Q800 is connected to resistor R809 and resistor R810, the other end of resistor R810 is connected to the emitter of transistor Q800 and the ground terminal, the other end of resistor R809 is connected to the communication power control signal VIN, the other end of resistor R830 is connected to pin 11 of chip U802, the other end of resistor R831 is connected to pin 10 of chip U802, the other end of resistor R832 is connected to pin 9 of chip U802, and pin 16 of chip U802 is connected to capacitor C803 and power supply VCC_MCU.
2. A low-power multi-temperature detection device according to claim 1, characterized in that: The model of the chip U802 is CD74HC4051.
3. The low-power multi-temperature detection device according to claim 1, characterized in that: The transistor Q800 is an NPN transistor.
4. The low-power multi-temperature detection device according to claim 1, characterized in that: The chip U802 is connected to 1-8 temperature sensors.
5. The low-power multi-temperature detection device according to claim 1, characterized in that: Pins 1-2, pins 4-5, and pins 12-15 of the chip U802 are connected to the temperature sensor.