Testing module and semiconductor testing machine using same
By designing a flexible test interface module in the test module of the semiconductor test machine, the problem of inelasticity of the standardized interface of the traditional semiconductor test machine is solved, more flexible testing functions and higher testing accuracy are achieved, and production efficiency and cost-effectiveness are improved.
Patent Information
- Application Number
- CN202420288788.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-01-11
- Filing Date
- 2024-02-07
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-02-07
AI Technical Summary
Due to the lack of elasticity of standardized interfaces, traditional semiconductor test machines are difficult to adapt to future semiconductor circuit products, resulting in limited expansion of test modules.
A test module is designed, including a reinforcement plate, a test head and a test interface module, providing an elastically set test interface module other than a standardized test interface. Through the connection between the first sinking module and the second sinking module, the alignment connection between the first test interface and the second test interface and the additional test signal provision are realized.
It realizes a test interface module that is elastically set according to different test needs, expands the test function, reduces positioning errors, and improves the test accuracy, thereby improving production yields and reducing process costs.
Smart Images
Figure CN222636250U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to semiconductor testing equipment, in particular to a testing module and a semiconductor testing machine using the same. Background Art
[0002] With the evolution of semiconductor process technology, the diversification and complexity of semiconductor components have increased, making the process more difficult, which also greatly affects the product yield and increases the packaging cost. In order to meet the requirements for product quality, strict control procedures must be relied upon. Therefore, the testing of semiconductor components is becoming more and more complex and important.
[0003] A semiconductor tester for testing semiconductor components includes a test head with a test module having a test signal and a DUT carrier mounted on the test head. The DUT carrier carries the DUT and transmits the test signal output from the test head to the DUT. Traditional semiconductor testers have standardized interfaces designed by various manufacturers. In the face of future semiconductor circuit products with great variability, they will be limited by the lack of flexibility of standardized interfaces and will not be easy to flexibly expand test modules.
[0004] Therefore, the industry currently urgently needs to seek a test module interface that can be flexibly configured according to different test requirements, so that the various difficulties and deficiencies encountered in the above-mentioned prior art can be resolved. Utility Model Content
[0005] In view of the above problems, the purpose of the present invention is to provide a test module and a semiconductor test machine using the same, which provides, in addition to a standardized test interface, a test interface module that can be flexibly configured according to different test requirements, thereby improving the problem that traditional semiconductor test machines are restricted by standardized interfaces.
[0006] In order to achieve the above-mentioned purpose, the utility model provides a test module for a semiconductor tester, wherein the semiconductor tester has a carrier board for an object to be tested, the carrier board for the object to be tested includes a socket base for fixing the tested component, and the test module includes a reinforcement plate, a test head and a test interface module. Among them, the reinforcement plate is installed below the carrier board for the object to be tested, and the reinforcement plate includes a first sink module corresponding to the socket base. The reinforcement plate is installed above the test head, and the test head includes a standardized test interface for providing a standard test signal and a second sink module corresponding to the first sink module. The test interface module includes a first test interface and a second test interface, the first test interface is flexibly arranged in the first sink module, the second test interface is flexibly arranged in the second sink module, and can be connected to the second sink module by the first sink module, so that the second test interface is connected to the first test interface to provide an additional test signal.
[0007] In an embodiment of the present invention, the aforementioned test module further comprises a fixing seat with a floating alignment mechanism, and the fixing seat with a floating alignment mechanism is installed on the second sink module to assist the alignment connection between the first test interface and the second test interface.
[0008] In an embodiment of the present invention, the aforementioned first sink trough module has a plurality of positioning holes, and the aforementioned fixing seat with a floating alignment mechanism includes a floating module plate, the floating module plate is used to flexibly set the second test interface, and the floating module plate has a plurality of positioning columns corresponding to these positioning holes. The positioning columns are inserted into the positioning holes to correct the floating module plate installed on the second sink trough module, so that the floating module plate is aligned with the first sink trough module.
[0009] In the embodiment of the utility model, guide post bushings are respectively installed in the aforementioned positioning holes, so that when the positioning post is inserted into the positioning hole, it can be clamped into the guide post bushing for fixation.
[0010] In an embodiment of the present invention, the aforementioned positioning columns are respectively fixed on a plurality of supporting edge strips at the periphery of the bottom of the second sink module.
[0011] In an embodiment of the present invention, the aforementioned second sink module further comprises a plurality of fixed side panels, and the fixed side panels surround the supporting edge strips to form a groove for accommodating the floating module plate.
[0012] In an embodiment of the present invention, the aforementioned second sink module further includes a top flange, which is disposed on the top periphery of the fixed side plate and protrudes outwards.
[0013] In an embodiment of the present invention, the aforementioned second sinking trough module further includes a sinking trough cover plate, and the sinking trough cover plate covers the top flange.
[0014] In an embodiment of the present invention, the aforementioned fixing seat with floating alignment mechanism includes a terminal auxiliary plate, which is located between the first test interface and the second test interface, and is used to vertically press the terminals of the first test interface and the second test interface by means of the terminal auxiliary plate when the first sink slot module and the second sink slot module are connected.
[0015] On the other hand, the utility model further provides a semiconductor testing machine, comprising the aforementioned DUT carrier and a testing module.
[0016] Compared with the prior art, the utility model has at least one of the following advantages:
[0017] (1) According to the test module and the semiconductor test machine using the same provided by the present invention, in addition to providing a standardized test interface, additional test functions can be provided by installing a flexibly configured test interface module in the test module to meet the test requirements of the tested component.
[0018] (2) According to the test module and the semiconductor tester using the same provided by the present invention, the first test interface and the second test interface in the test interface module can be replaced according to the test requirements.
[0019] (3) According to the test module and the semiconductor test machine using the same provided by the present invention, a fixing seat with a floating alignment mechanism can also be provided, thereby reducing the positioning error when the first test interface is connected to the second test interface.
[0020] The following is a detailed description of the specific embodiments in conjunction with the attached drawings, so that the purpose, technical content, characteristics and effects achieved by the present invention can be more easily understood. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The above and other purposes, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:
[0022] Figure 1 It is a schematic diagram of a test module provided by an embodiment of the utility model and a semiconductor test machine using the same;
[0023] Figure 2 is a schematic diagram of a connection mechanism of a test module provided in an embodiment of the utility model;
[0024] Figure 3 is a schematic diagram of a first sink module in a test module provided in an embodiment of the utility model;
[0025] Figure 4 and Figure 5 They are schematic diagrams of the second sink module before and after the sink cover plate covers the test module provided in the embodiments of the present utility model.
[0026] Reference numerals:
[0027] 1:Semiconductor testing machine
[0028] 10: Test object carrier
[0029] 12: Socket base
[0030] 20: Test Head
[0031] 22: Standardized test interface
[0032] 30: Test module
[0033] 32: Reinforcement plate
[0034] 34: The first sink module
[0035] 341: Positioning hole
[0036] 342: Guide column bushing
[0037] 36: Second sink module
[0038] 38: Test interface module
[0039] 381: First test interface
[0040] 382: Second test interface
[0041] 40: Fixed seat with floating alignment mechanism
[0042] 42: Floating module board
[0043] 421: Positioning column
[0044] 44:Support edge strip
[0045] 46:Fixed side panels
[0046] 461: Left and right side panels
[0047] 462: Upper and lower side panels
[0048] 48: Top flange
[0049] 50: Terminal auxiliary board
[0050] 52: Sink cover DETAILED DESCRIPTION
[0051] The embodiments of the present invention will be further explained below with reference to the relevant drawings. As far as possible, the same reference numerals represent the same or similar components in the drawings and the specification. In the drawings, shapes and thicknesses may be exaggerated for simplicity and convenience. It is understood that the components not specifically shown in the drawings or described in the specification are known to those skilled in the art. Those skilled in the art may make various changes and modifications based on the contents of the present invention.
[0052] It should be noted that all directional indications (such as up, down, left, right, front, and back) in the embodiments of the present invention are only used to explain the relative positional relationship, movement, etc. between the components under a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly. In the description of the present invention, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the present invention also includes the description of plural elements or components unless it is obvious from the specific context that the plural is excluded. Moreover, in the description of the present invention, the meaning of "plural" or "multiple" is two or more.
[0053] Please refer to Figure 1 , which illustrates a schematic diagram of a test module provided by an embodiment of the utility model and a semiconductor test machine using the test module. The semiconductor test machine 1 of the present embodiment includes a test object carrier 10 and a test module 30. The test object carrier 10 is provided with a socket base 12 for fixing the tested component (omitted and not shown in the figure). The test module 30 includes a reinforcement plate 32, a test head 20 and a test interface module 38. The reinforcement plate 32 is installed below the test object carrier 10, and the reinforcement plate 32 is provided with a first sink module 34 corresponding to the socket base 12. The reinforcement plate 32 is installed above the test head 20, and the test head 20 includes a standardized test interface 22 for providing a standard test signal, and is provided with a second sink module 36 corresponding to the first sink module 34. The test interface module 38 includes a first test interface 381 and a second test interface 382 that can be connected to each other. The first test interface 381 is flexibly set in the first sink module 34, and the second test interface 382 is flexibly set in the second sink module 36. The first sink module 34 can be connected to the second sink module 36, so that the second test interface 382 is connected to the first test interface 381 to provide an additional test signal. Therefore, the first test interface 381 and the second test interface 382 can be replaced according to the test requirements of the tested component, and have a variety of test functions of the test interface module 38. In other words, in addition to providing a standardized test interface 22, the utility model can also flexibly install various test interface modules 38 according to the test requirements of the tested component to perform additional test functions.
[0054] The connection alignment mechanism between the first test interface 381 and the second test interface 382 is further described. In this embodiment, the object carrier 10 is mounted on the reinforcement plate 32, and is fixed to the test head 20 by the reinforcement plate 32, and the first test interface 381 and the second test interface 382 are elastically arranged in the first sink module 34 in the reinforcement plate 32 and the second sink module 36 in the test head 20, respectively. In this embodiment, the test module 30 is specifically further equipped with a fixing seat 40 with a floating alignment mechanism in the second sink module 36 to assist the alignment connection between the first test interface 381 and the second test interface 382, which can reduce the accuracy error when the first test interface 381 and the second test interface 382 are connected.
[0055] For more detailed instructions, please also refer to Figures 2 to 5 . Figure 2 is a schematic diagram of a connection mechanism of a test module provided in an embodiment of the utility model; Figure 3 is a schematic diagram of a first sink module in a test module provided in an embodiment of the utility model; Figure 4 and Figure 5 They are schematic diagrams of the second sink module before and after the sink cover plate covers the test module provided in the embodiments of the present utility model.
[0056] The first sink module 34 of this embodiment is fixed on the reinforcing plate 32. The first sink module 34 can be flexibly arranged for the first test interface 381, and the first sink module 34 has a plurality of positioning holes 341. The fixing seat 40 with a floating alignment mechanism includes a floating module plate 42. The floating module plate 42 can be flexibly arranged for the second test interface 382, and the floating module plate 42 has a plurality of positioning posts 421 that can be inserted into the plurality of positioning holes 341 to fix the positions. In this embodiment, a guide post bushing 342 is respectively installed in each positioning hole 341, so that when the positioning post is inserted into the positioning hole 341, it can be clamped into the guide post bushing 342 for fixing. During the connection process between the first trough module 34 and the second trough module 36, the positioning column 421 is inserted into the positioning hole 341 by the guidance of the positioning hole 341, so that the floating module plate 42 installed on the second trough module 36 can be corrected, so that the floating module plate 42 is aligned with the first trough module 34, so that the first trough module 34 and the second trough module 36 can be aligned with each other.
[0057] In this embodiment, the floating module plate 42 can flexibly replace the second test interface 382, and the positioning column 421 is set on the floating module plate 42, which can effectively and accurately position and has a foolproof function. Specifically, the second sinking tank module 36 of this embodiment has a plurality of supporting edge strips 44 at the bottom periphery, and is surrounded by a plurality of fixed side panels 46 including left and right side panels 461 and upper and lower side panels 462 to form a groove that can accommodate the floating module plate 42, and the top periphery of the fixed side panel 46 protrudes outward to form a top flange 48, and is provided with a sinking tank cover plate 52 (see Figure 5 ) covers the top flange 48. More specifically, the floating module plate 42 of this embodiment is provided with four positioning columns 421, which are fixed to the multiple supporting edge strips 44 at the bottom periphery of the second sinking trough module 36 using equal height screws. Through the guidance of the positioning holes 341, the positioning columns 421 of the floating module plate 42 are automatically aligned with the first sinking trough module 34, so that the first sinking trough module 34 is combined with the second sinking trough module 36, thereby achieving the effect of guiding and automatic alignment.
[0058] In addition, the fixing seat 40 with a floating alignment mechanism provided in this embodiment may also include a terminal auxiliary board 50. The terminal auxiliary board 50 is arranged between the first test interface 381 and the second test interface 382. Its main function is to maintain the pressed-in terminal vertically. When the first sink slot module 34 and the second sink slot module 36 are connected, the terminals of the first test interface 381 and the second test interface 382 can be accurately pressed together by the terminal auxiliary board 50 to improve the test accuracy.
[0059] In summary, according to the test module provided by the utility model and the semiconductor test machine using the same, in addition to providing a standardized test interface, additional test functions can be provided by installing a flexibly set test interface module in the test module to meet the test requirements of the tested components. Furthermore, in the test module provided by the utility model and the semiconductor test machine using the same, the first test interface and the second test interface in the test interface module can be replaced according to the requirements of the tested components to expand the test functions. The test module provided by the utility model and the semiconductor test machine using the same can also be provided with a fixed seat with a floating alignment mechanism, thereby reducing the positioning error when the first test interface and the second test interface are connected, and the test accuracy can be improved, so as to achieve the ultimate goal of improving production yield and reducing process costs.
[0060] Although the content of the utility model has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the utility model. After reading the above content, various modifications and substitutions of the utility model will be obvious to those skilled in the art. Therefore, the protection scope of the utility model should be limited by the attached claims.
Claims
1. A test module for a semiconductor tester, wherein the semiconductor tester has a test object carrier, wherein the test object carrier includes a socket base for fixing a test component, wherein: The test module comprises: A reinforcing plate installed below the DUT carrier plate, the reinforcing plate comprising a first sink module corresponding to the socket base; a test head, the reinforcing plate is installed above the test head, the test head comprises a standardized test interface for providing a standard test signal and a second sink module corresponding to the first sink module; and A test interface module includes: a first test interface, flexibly set in the first sink module; and a second test interface, flexibly set in the second sink module, and connected with the second sink module through the first sink module, so that the second test interface is connected to the first test interface to provide an additional test signal.
2. The test module according to claim 1, characterized in that: The test module further includes a fixing seat with a floating alignment mechanism, and the fixing seat with a floating alignment mechanism is installed on the second sink module to assist the alignment connection between the first test interface and the second test interface.
3. The test module according to claim 2, characterized in that: The first sink trough module has a plurality of positioning holes, and the fixing seat with a floating alignment mechanism includes a floating module plate. The floating module plate is used to flexibly set the second test interface, and the floating module plate has a plurality of positioning columns corresponding to the plurality of positioning holes. The plurality of positioning columns are inserted into the plurality of positioning holes to calibrate the floating module plate installed on the second sink trough module so that the floating module plate is aligned with the first sink trough module.
4. The test module according to claim 3, characterized in that: Guide column bushings are respectively installed in the plurality of positioning holes, so that when the plurality of positioning columns are inserted into the plurality of positioning holes, they are clamped into the guide column bushings for fixing.
5. The test module according to claim 3, characterized in that: The plurality of positioning columns are respectively fixed on a plurality of supporting edge strips at the periphery of the bottom of the second sink module.
6. The test module according to claim 5, characterized in that: The second sink module further includes a plurality of fixed side plates, and the plurality of fixed side plates surround a plurality of supporting edge strips to form a groove for accommodating the floating module plate.
7. The test module according to claim 6, characterized in that: The second sink module further includes a top flange, which is disposed on the top periphery of a plurality of the fixed side plates and protrudes outwards.
8. The test module according to claim 7, characterized in that: The second sink trough module further includes a sink trough cover plate, and the sink trough cover plate covers the top flange.
9. The test module according to claim 2, wherein: The fixing seat with floating alignment mechanism includes a terminal auxiliary board, which is located between the first test interface and the second test interface. When the first sinking slot module is connected to the second sinking slot module, the terminals of the first test interface and the second test interface are vertically pressed together by the terminal auxiliary board.
10. A semiconductor testing machine, characterized in that: It comprises a test object carrier and a test module as described in any one of claims 1 to 9.