High-flux Raman spectrometer detection control circuit

Abstract

The utility model discloses a high-flux Raman spectrometer detection control circuit, which comprises a control module, a power supply module, a communication module, a motor driving module, a photoelectric coupling module and a position detection module, the control module, the photoelectric coupling module and the motor driving module are connected in sequence; the signal output end of the position detection module is connected with the signal input end of the control module; the control module, the communication module, the motor driving module, the photoelectric coupling module and the position detection module are respectively connected with corresponding output ends of the power supply module; and the control module comprises an STM32F103 main chip. The Raman spectrometer provided by the utility model solves the technical problems of low integration level and large volume of the existing Raman spectrometer. The device can be widely applied to the field of analytical instrument control.

Description

Technical Field

[0001] The utility model relates to the field of analytical instrument control, in particular to a high-throughput Raman spectrometer detection control circuit. Background Art

[0002] As a molecular vibration spectrum, Raman spectroscopy is widely used in life sciences, environmental and food sciences, medical testing, public safety and other fields due to its advantages such as molecular fingerprint recognition, rapid non-destructive detection, high sensitivity and simple operation.

[0003] Although Raman spectroscopy has the advantages of being non-contact and non-destructive, due to its weak signal intensity, it is usually necessary to enhance the signal intensity by extending the integration time, thereby improving the sensitivity and accuracy of the detection. For example, due to the weak signal of a Raman spectrometer using a wavelength of 785nm, the detection time of a single sample may be as long as several minutes, which results in a relatively long total time for sample detection, and the detection time of a sample usually takes 30-50 seconds. In addition, in order to obtain reliable test results, a dark current scan is required before each test, which further increases the time consumption of sample detection. When it comes to the detection of a large number of samples (such as 96 samples), the detection process alone may take at least 2 hours of working time for the experimenter.

[0004] In addition, in the current Raman detection process, each change of a sample requires manual focusing and sample loading and unloading, which is not only time-consuming and labor-intensive, but also increases the complexity of the operation. Moreover, the current Raman spectrometer has a low degree of automation, low integration, and large size, which is not convenient for use in outdoor environments such as security inspection departments and field sites. Utility Model Content

[0005] In order to solve the above technical problems, the purpose of the utility model is to provide a high-throughput Raman spectrometer detection control circuit.

[0006] The technical solution adopted by the utility model is: a high-throughput Raman spectrometer detection control circuit, including a control module, a power module, a communication module, a motor drive module, a photoelectric coupling module, and a position detection module, wherein:

[0007] The control module is connected to the communication module via a communication port, and the control module, the photoelectric coupling module and the motor drive module are connected in sequence;

[0008] The signal output terminal of the position detection module is connected to the signal input terminal of the control module;

[0009] The control module, the communication module, the motor driving module, the photoelectric coupling module and the position detection module are respectively connected to corresponding output terminals of the power supply module.

[0010] In some embodiments, the control module includes an STM32F103 main chip.

[0011] In this embodiment, a peripheral circuit corresponding to the STM32F103 main chip is also included.

[0012] In some embodiments, the power module includes an MPS2359 power chip, an AMS1117 power chip, a first diode, a second diode, a first resistor, a second resistor, a third resistor, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a fifth capacitor, a sixth capacitor, a seventh capacitor, an eighth capacitor, a first inductor, a first power socket, and a first switch, wherein:

[0013] The first pin of the MPS2359 power chip is connected to the first end of the third capacitor;

[0014] The second pin of the MPS2359 power chip, the first end of the second resistor, the second port of the first power socket and the third port of the first power socket are connected and grounded;

[0015] The third pin of the MPS2359 power chip, the second end of the second resistor and the first end of the third resistor are connected;

[0016] The fourth pin of the MPS2359 power chip is connected to the first end of the first resistor;

[0017] The fifth pin of the MPS2359 power chip, the first end of the first capacitor, the first end of the second capacitor and the second end of the second diode are connected;

[0018] The sixth pin of the MPS2359 power chip, the second end of the third capacitor, the first end of the first diode and the first end of the first inductor are connected;

[0019] The second end of the first inductor, the first end of the fourth capacitor and the first end of the fifth capacitor are connected; the second end of the fourth capacitor and the second end of the fifth capacitor are connected and grounded;

[0020] The second end of the first capacitor and the second end of the second capacitor are connected to each other and grounded;

[0021] The first end of the second diode is connected to the first port of the first power socket;

[0022] The first pin of the AMS1117 power chip is connected to the first end of the sixth capacitor and is grounded;

[0023] The second pin of the AMS1117 power chip, the fourth pin of the AMS1117 power chip, the first end of the seventh capacitor and the first end of the eighth capacitor are connected;

[0024] The third pin of the AMS1117 power chip, the second end of the sixth capacitor and the second port of the first switch are connected;

[0025] The second end of the seventh capacitor is connected to the second end of the eighth capacitor and is grounded.

[0026] In some embodiments, the communication module includes a CH340G chip, a first crystal oscillator, a ninth capacitor, a tenth capacitor, an eleventh capacitor, a twelfth capacitor, a thirteenth capacitor and a USB interface structure, wherein:

[0027] The first pin of the CH340G chip, the fifth pin of the USB interface structure, the first end of the twelfth capacitor and the first end of the thirteenth capacitor are connected and grounded;

[0028] The fifth pin of the CH340G chip is connected to the third pin of the USB interface structure;

[0029] The sixth pin of the CH340G chip is connected to the second pin of the USB interface structure;

[0030] The seventh pin of the CH340G chip, the second end of the twelfth capacitor and the first end of the first crystal oscillator are connected;

[0031] The eighth pin of the CH340G chip, the second end of the thirteenth capacitor and the second end of the first crystal oscillator are connected;

[0032] The sixteenth pin of the CH340G chip, the first end of the ninth capacitor and the first end of the tenth capacitor are connected;

[0033] The second end of the ninth capacitor is connected to the second end of the tenth capacitor and is grounded;

[0034] The USB interface structure is also connected to the eleventh capacitor.

[0035] In some embodiments, the motor driving module includes a TMC2209 driving chip.

[0036] In some embodiments, the photoelectric coupling module includes a fourteenth capacitor, a HCPL2630 photocoupler driver chip, a first EL817 chip, a second EL817 chip, a third diode, a fourth diode, a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, an eighth resistor and a ninth resistor, wherein:

[0037] The second pin of the HCPL2630 optocoupler driver chip is connected to the first end of the fourth resistor;

[0038] The third pin of the HCPL2630 optocoupler driver chip is connected to the first end of the fifth resistor;

[0039] The sixth pin of the HCPL2630 optocoupler driver chip is connected to the first end of the fourteenth capacitor;

[0040] The first pin of the first EL817 chip, the first end of the sixth resistor and the second end of the third diode are connected;

[0041] The second pin of the first EL817 chip is connected to the first end of the third diode;

[0042] The fourth pin of the first EL817 chip is connected to the first end of the seventh resistor;

[0043] The first pin of the second EL817 chip, the first end of the eighth resistor and the second end of the fourth diode are connected;

[0044] The second pin of the second EL817 chip is connected to the first end of the fourth diode;

[0045] The fourth pin of the second EL817 chip is connected to the first end of the ninth resistor.

[0046] In some embodiments, the position detection module includes an AS5600 magnetic encoder and an H21A1 photoelectric switch.

[0047] In this embodiment, corresponding peripheral circuits are also included.

[0048] The beneficial effects of the utility model are:

[0049] First, the utility model integrates multiple modules into the control circuit, effectively saving the internal space of the Raman spectrometer, improving the integration of the Raman spectrometer, reducing the size of the Raman spectrometer, solving the limitation of the instrument use place, and expanding the application scenarios of the detection;

[0050] Second, the control module in the utility model receives the control instructions input by the communication module, controls the enable, pulse number and direction of each motor through the motor drive module, thereby controlling the movement of multiple motors, thereby realizing high-throughput detection of Raman spectra of multiple samples, and the experimental operator does not need to perform cumbersome manual sample in and out, which effectively reduces the detection time of the experimenter and improves the detection efficiency;

[0051] Third, the utility model is equipped with a magnetic encoder, which uses the magnetic encoder to obtain the position information of the rotation angle of the height adjustment motor, and adjusts the position of the height adjustment motor through the control module, thereby realizing the focusing control of the sample Raman detection, avoiding manual focusing during the experiment, and solving the problem that the instrument operation requires high user skills, complex operation and time-consuming. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 It is a structural block diagram of the detection control circuit of the utility model high-throughput Raman spectrometer;

[0053] Figure 2 It is the principle diagram of the control module in the utility model;

[0054] Figure 3 It is the principle diagram of the power module in the utility model;

[0055] Figure 4 It is the principle diagram of the communication module in the utility model;

[0056] Figure 5 It is the principle diagram of the motor drive module in the utility model;

[0057] Figure 6 It is the principle diagram of the photoelectric coupling module in the utility model;

[0058] Figure 7 It is a schematic diagram of the position detection module in the utility model.

[0059] Figure symbols: D1, first diode; D2, second diode; R1, first resistor; R2, second resistor; R3, third resistor; C1, first capacitor; C2, second capacitor; C3, third capacitor; C4, fourth capacitor; C5, fifth capacitor; C6, sixth capacitor; C7, seventh capacitor; C8, eighth capacitor; L1, first inductor; DC1, first power socket; SW1, first switch; X1, first crystal oscillator; C9, ninth capacitor; C10, tenth capacitor; C11, eleventh capacitor; C12, twelfth capacitor; C13, thirteenth capacitor; USB1, USB interface structure; D3, third diode; D4, fourth diode; R4, fourth resistor; R5, fifth resistor; R6, sixth resistor; R7, seventh resistor; R8, eighth resistor; R9, ninth resistor; U1, first EL817 chip; U2, second EL817 chip. DETAILED DESCRIPTION

[0060] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0061] It should be noted that, for the convenience of description, only the parts related to the relevant utility model are shown in the drawings. In the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other.

[0062] It should be understood that the "system", "device", "unit" and / or "module" used in this application is a method for distinguishing different components, elements, parts, portions or assemblies at different levels. However, if other words can achieve the same purpose, the word can be replaced by other expressions.

[0063] As shown in this application and claims, unless the context clearly indicates an exception, the words "a", "an", "a kind" and / or "the" do not refer to the singular, but also include the plural. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements. The elements defined by the sentence "includes a..." do not exclude the existence of other identical elements in the process, method, commodity or device that includes the elements.

[0064] In the description of the embodiments of the present application, "plurality" means two or more than two. The following terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0065] The utility model provides a high-throughput Raman spectrometer detection control circuit, referring to Figure 1 , including control module, power module, communication module, motor drive module, photoelectric coupling module, position detection module, among which:

[0066] The control module is connected to the communication module via a communication port, and the control module, the photoelectric coupling module and the motor drive module are connected in sequence;

[0067] The signal output terminal of the position detection module is connected to the signal input terminal of the control module;

[0068] The control module, the communication module, the motor driving module, the photoelectric coupling module and the position detection module are respectively connected to corresponding output terminals of the power supply module.

[0069] In addition, the control module is configured with a communication port and multiple signal input and output terminals, the power module is configured with multiple output terminals, the motor drive port and the external signal detection port are configured with at least four, and the signal input terminal of the control module is MCU_Det.

[0070] The signal output end of the control module is connected to the signal input end of the photoelectric coupling module, and then connected to the signal input end of the motor driving module through the signal output end of the photoelectric coupling module.

[0071] In some possible embodiments, reference Figure 2 , the control module includes an STM32F103 main chip and its peripheral circuits;

[0072] Among them, the peripheral circuit uses an 8MHz crystal oscillator, and the main frequency can reach 72MHz after frequency multiplication, and one clock cycle is 1 / 72MHz. The STM32F103 chip has five clock sources, namely: HIS, HSE, LSI, LSE, and PLL, where HSE is a high-speed external clock, HSI is a high-speed internal clock, LSI is a low-speed internal clock, LSE is a low-speed external clock, and PLL is a phase-locked loop frequency multiplication output. The STM32F103 chip uses an 8MHz crystal oscillator as an external clock source, which becomes 72MHz as the system master clock after frequency multiplication by the PLL phase-locked loop.

[0073] In some possible embodiments, reference Figure 3 The power module includes an MPS2359 power chip, an AMS1117 power chip, a first diode D1, a second diode D2, a first resistor R1, a second resistor R2, a third resistor R3, a first capacitor C1, a second capacitor C2, a third capacitor C3, a fourth capacitor C4, a fifth capacitor C5, a sixth capacitor C6, a seventh capacitor C7, an eighth capacitor C8, a first inductor L1, a first power socket DC1 and a first switch SW1, wherein:

[0074] The first pin of the MPS2359 power chip is connected to the first end of the third capacitor C3;

[0075] The second pin of the MPS2359 power chip, the first end of the second resistor R2, the second port of the first power socket DC1 and the third port of the first power socket DC1 are connected and grounded;

[0076] The third pin of the MPS2359 power chip, the second end of the second resistor R2 and the first end of the third resistor R3 are connected;

[0077] The fourth pin of the MPS2359 power chip is connected to the first end of the first resistor R1;

[0078] The fifth pin of the MPS2359 power chip, the first end of the first capacitor C1, the first end of the second capacitor C2 and the second end of the second diode D2 are connected;

[0079] The sixth pin of the MPS2359 power chip, the second end of the third capacitor C3, the first end of the first diode D1 and the first end of the first inductor L1 are connected;

[0080] The second end of the first inductor L1, the first end of the fourth capacitor C4 and the first end of the fifth capacitor C5 are connected; the second end of the fourth capacitor C4 and the second end of the fifth capacitor C5 are connected and grounded;

[0081] The second end of the first capacitor C1 and the second end of the second capacitor C2 are connected to each other and grounded;

[0082] The first end of the second diode D2 is connected to the first port of the first power socket DC1;

[0083] The first pin of the AMS1117 power chip is connected to the first end of the sixth capacitor C6 and is grounded;

[0084] The second pin of the AMS1117 power chip, the fourth pin of the AMS1117 power chip, the first end of the seventh capacitor C7 and the first end of the eighth capacitor C8 are connected;

[0085] The third pin of the AMS1117 power chip, the second end of the sixth capacitor C6 and the second port of the first switch SW1 are connected;

[0086] The second end of the seventh capacitor C7 and the second end of the eighth capacitor C8 are connected to each other and are grounded.

[0087] The first diode D1 and the second diode D2 are both transient suppression diodes, the model of the first power socket DC1 is DC-005-25A, and the model of the first switch SW1 is SP-2212.

[0088] The third pin of the power chip MPS2359 reduces the 12V voltage at the power supply end to 5V voltage through the third resistor R3.

[0089] The second pin and the fourth pin of the power chip AMS1117 reduce the 5V voltage at the power supply end to 3.3V through one end of the seventh capacitor C7 and the positive electrode of the eighth capacitor C8.

[0090] In some possible embodiments, reference Figure 4 The communication module includes a CH340G chip, a first crystal oscillator X1, a ninth capacitor C9, a tenth capacitor C10, an eleventh capacitor C11, a twelfth capacitor C12, a thirteenth capacitor C13 and a USB interface structure USB1, wherein:

[0091] The first pin of the CH340G chip, the fifth pin of the USB interface structure USB1, the first end of the twelfth capacitor C12 and the first end of the thirteenth capacitor C13 are connected and grounded;

[0092] The fifth pin of the CH340G chip is connected to the third pin of the USB interface structure USB1;

[0093] The sixth pin of the CH340G chip is connected to the second pin of the USB interface structure USB1;

[0094] The seventh pin of the CH340G chip, the second end of the twelfth capacitor C12 and the first end of the first crystal oscillator X1 are connected;

[0095] The eighth pin of the CH340G chip, the second end of the thirteenth capacitor C13 and the second end of the first crystal oscillator X1 are connected;

[0096] The sixteenth pin of the CH340G chip, the first end of the ninth capacitor C9 and the first end of the tenth capacitor C10 are connected;

[0097] The second end of the ninth capacitor is connected to the second end of the tenth capacitor C10 and is grounded;

[0098] The USB interface structure USB1 is also connected to the eleventh capacitor C11.

[0099] In addition, the second end of the eleventh capacitor C11 is grounded, the first crystal oscillator X1 is a 12 MHz crystal oscillator, and the USB interface structure USB1 is a USB-Micro model.

[0100] In some possible embodiments, reference Figure 5 , the motor drive module includes a TMC2209 drive chip.

[0101] In addition, the motor drive module also includes a diode, a resistor, and a capacitor. The motor drive module is also provided with a motor drive port and a connector, the motor drive port is implemented by WJ15EDGRC-3.81-4P, and the connector is implemented by C4201WVA-F-2XCP. There are at least four TMC2209 drive chips, motor drive ports, and connectors. In order to prevent the motor from generating a large current to damage the chip, the motor drive port uses a Schottky diode for surge protection.

[0102] exist Figure 5 The signal input terminal of the motor drive module is Figure 5 Mortor1_EN, Mortor1_STEP and Mortor1_DIR in .

[0103] In some possible embodiments, reference Figure 6 The photoelectric coupling module includes a fourteenth capacitor C14, a HCPL2630 photocoupler driver chip, a first EL817 chip U1, a second EL817 chip U2, a third diode D3, a fourth diode D4, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, a seventh resistor R7, an eighth resistor R8 and a ninth resistor R9, wherein:

[0104] The second pin of the HCPL2630 optocoupler driver chip is connected to the first end of the fourth resistor R4;

[0105] The third pin of the HCPL2630 optocoupler driver chip is connected to the first end of the fifth resistor R5;

[0106] The sixth pin of the HCPL2630 optocoupler driver chip is connected to the first end of the fourteenth capacitor C14;

[0107] The first pin of the first EL817 chip U1, the first end of the sixth resistor R8 and the second end of the third diode D3 are connected;

[0108] The second pin of the first EL817 chip U1 is connected to the first end of the third diode D3;

[0109] The fourth pin of the first EL817 chip U1 is connected to the first end of the seventh resistor R7;

[0110] The first pin of the second EL817 chip U2, the first end of the eighth resistor R8 and the second end of the fourth diode D4 are connected;

[0111] The second pin of the second EL817 chip U2 is connected to the first end of the fourth diode D4;

[0112] The fourth pin of the second EL817 chip U2 is connected to the first end of the ninth resistor R9.

[0113] Among them, the HCPL2630 optocoupler driver chip is a high-speed optocoupler driver chip, the first EL817 chip U1 and the second EL817 chip U2 are both low-speed optocoupler driver chips, at least two high-speed optocoupler driver chips are configured, and the low-speed optocoupler driver chips are configured with four or five.

[0114] exist Figure 6 In the example, the signal input terminals of the optocoupler module are MCU_PUL1, MCU_PUL2, MCU_EN1, and MCU_DIR1. The signal output terminals of the optocoupler module are Mortor1_STEP, Mortor2_STEP, Mortor1_EN, and Mortor1_DIR.

[0115] In some possible embodiments, reference Figure 7 , the position detection module includes an AS5600 magnetic encoder and an H21A1 photoelectric switch.

[0116] The position detection module further includes a resistor, a capacitor, an inductor and an external signal detection port. The external signal detection port is implemented using WJ15EDGRC-3.81-4P. There is at least one magnetic encoder and at least three photoelectric switches.

[0117] Among them, the signal output terminal of the position detection module is OUT.

[0118] The above is a specific description of the preferred implementation of the utility model, but the invention of the utility model is not limited to the described embodiments. Technical personnel familiar with the field can also make various equivalent deformations or substitutions without violating the spirit of the utility model. These equivalent deformations or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A high-throughput Raman spectrometer detection control circuit, characterized in that: It includes a control module, a power module, a communication module, a motor drive module, a photoelectric coupling module, and a position detection module, among which: The control module is connected to the communication module via a communication port, and the control module, the photoelectric coupling module and the motor drive module are connected in sequence; The signal output terminal of the position detection module is connected to the signal input terminal of the control module; The control module, the communication module, the motor driving module, the photoelectric coupling module and the position detection module are respectively connected to corresponding output terminals of the power supply module; The control module includes an STM32F103 main chip.

2. A high-throughput Raman spectrometer detection control circuit according to claim 1, characterized in that: The power module includes an MPS2359 power chip, an AMS1117 power chip, a first diode, a second diode, a first resistor, a second resistor, a third resistor, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a fifth capacitor, a sixth capacitor, a seventh capacitor, an eighth capacitor, a first inductor, a first power socket and a first switch, wherein: The first pin of the MPS2359 power chip is connected to the first end of the third capacitor; The second pin of the MPS2359 power chip, the first end of the second resistor, the second port of the first power socket and the third port of the first power socket are connected and grounded; The third pin of the MPS2359 power chip, the second end of the second resistor and the first end of the third resistor are connected; The fourth pin of the MPS2359 power chip is connected to the first end of the first resistor; The fifth pin of the MPS2359 power chip, the first end of the first capacitor, the first end of the second capacitor and the second end of the second diode are connected; The sixth pin of the MPS2359 power chip, the second end of the third capacitor, the first end of the first diode and the first end of the first inductor are connected; The second end of the first inductor, the first end of the fourth capacitor and the first end of the fifth capacitor are connected; the second end of the fourth capacitor and the second end of the fifth capacitor are connected and grounded; The second end of the first capacitor and the second end of the second capacitor are connected to each other and grounded; The first end of the second diode is connected to the first port of the first power socket; The first pin of the AMS1117 power chip is connected to the first end of the sixth capacitor and is grounded; The second pin of the AMS1117 power chip, the fourth pin of the AMS1117 power chip, the first end of the seventh capacitor and the first end of the eighth capacitor are connected; The third pin of the AMS1117 power chip, the second end of the sixth capacitor and the second port of the first switch are connected; The second end of the seventh capacitor is connected to the second end of the eighth capacitor and is grounded.

3. A high-throughput Raman spectrometer detection control circuit according to claim 1, characterized in that: The communication module includes a CH340G chip, a first crystal oscillator, a ninth capacitor, a tenth capacitor, an eleventh capacitor, a twelfth capacitor, a thirteenth capacitor and a USB interface structure, wherein: The first pin of the CH340G chip, the fifth pin of the USB interface structure, the first end of the twelfth capacitor and the first end of the thirteenth capacitor are connected and grounded; The fifth pin of the CH340G chip is connected to the third pin of the USB interface structure; The sixth pin of the CH340G chip is connected to the second pin of the USB interface structure; The seventh pin of the CH340G chip, the second end of the twelfth capacitor and the first end of the first crystal oscillator are connected; The eighth pin of the CH340G chip, the second end of the thirteenth capacitor and the second end of the first crystal oscillator are connected; The sixteenth pin of the CH340G chip, the first end of the ninth capacitor and the first end of the tenth capacitor are connected; The second end of the ninth capacitor is connected to the second end of the tenth capacitor and is grounded; The USB interface structure is also connected to the eleventh capacitor.

4. A high-throughput Raman spectrometer detection control circuit according to claim 1, characterized in that: The motor drive module includes a TMC2209 drive chip.

5. The high-throughput Raman spectrometer detection control circuit according to claim 1, characterized in that: The photoelectric coupling module includes a fourteenth capacitor, a HCPL2630 photocoupler driver chip, a first EL817 chip, a second EL817 chip, a third diode, a fourth diode, a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, an eighth resistor and a ninth resistor, wherein: The second pin of the HCPL2630 optocoupler driver chip is connected to the first end of the fourth resistor; The third pin of the HCPL2630 optocoupler driver chip is connected to the first end of the fifth resistor; The sixth pin of the HCPL2630 optocoupler driver chip is connected to the first end of the fourteenth capacitor; The first pin of the first EL817 chip, the first end of the sixth resistor and the second end of the third diode are connected; The second pin of the first EL817 chip is connected to the first end of the third diode; The fourth pin of the first EL817 chip is connected to the first end of the seventh resistor; The first pin of the second EL817 chip, the first end of the eighth resistor and the second end of the fourth diode are connected; The second pin of the second EL817 chip is connected to the first end of the fourth diode; The fourth pin of the second EL817 chip is connected to the first end of the ninth resistor.

6. The high-throughput Raman spectrometer detection control circuit according to claim 1, characterized in that: The position detection module includes an AS5600 magnetic encoder and an H21A1 photoelectric switch.

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