Wafer box and wafer turnover device

Abstract

The utility model provides a wafer box. The wafer box comprises a box body; the plurality of fixed supporting table groups are arranged inside the box body, each fixed supporting table group comprises a plurality of fixed supporting tables, and the plurality of fixed supporting tables are respectively and fixedly connected with the inner wall of the box body; each movable supporting table assembly comprises a sliding rod movably connected with the inner wall of the box body and a plurality of movable supporting tables connected with the sliding rod; and each movable supporting table in the plurality of movable supporting tables is matched with one fixed supporting table in the plurality of fixed supporting tables, and the movable supporting tables and the fixed supporting tables are oppositely arranged in position so as to clamp the wafer. The utility model further provides a wafer turnover device which comprises the wafer box and the turnover support. According to the wafer box and the wafer turnover device provided by the invention, the wafer can be turned over on the premise that the wafer is not taken out of the wafer box, the operation is simple and convenient, and the wafer cannot be polluted.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a wafer box and a wafer flipping device. Background Art

[0002] In the chip manufacturing process, wafer processing equipment usually uses a robotic arm to take the wafer out of the wafer box and place it on a carrier platform in the process chamber. If the position of the wafer placed on the carrier platform deviates, the spacing between the wafer and the ring consumables of the carrier platform will be uneven. On the one hand, it will cause the actual processing parameters to be inconsistent with the set parameters during the wafer processing process. On the other hand, the particles accumulated in the gaps with wider spacing may overflow to the wafer surface under the action of airflow and accumulate on the wafer surface, causing wafer defects and even abnormal conditions such as tip discharge. Therefore, the concentricity of the wafer and the carrier platform is related to the wafer defects, critical dimensions, etching amount or uniformity of film thickness in the wafer processing process, which determine the yield of the final product.

[0003] Regular maintenance of wafer processing equipment often involves removing the carrier platform for cleaning or replacement, after which the wafer transfer position needs to be recalibrated to meet process requirements.

[0004] For example, the commonly used calibration method on some etching machines is: transfer the flipped wafer to the carrier platform, contact the front side of the wafer with the carrier platform, measure its surface defect data through the measuring machine, and finally use the measuring machine's unique software to perform vector calculation and analysis to obtain more accurate transmission position calibration data.

[0005] This method requires opening the box door to flip the wafer upside down, that is, manually taking out, flipping, and putting back the wafer. This operation ignores the impact of manual operation on the wafer measurement results. In addition, flipping the wafer is cumbersome, and different people have different operating techniques. The wafer is easily contaminated when exposed to the external environment, which will reduce the utilization rate of some wafers.

[0006] Although some inspection and cleaning equipment can flip wafers or wafer boxes, such as the wafer backside inspection machine whose robotic arm can take out and flip a single wafer, and the wafer box cleaning machine that can grab and flip the wafer box to adjust its position, etc. Some specific hand-held tools with suction can reach into the wafer box to take out wafers with large space between them and flip the wafers, but this method is still similar to manual flipping operation and does not have obvious advantages.

[0007] A slight deviation in the transfer position will lead to problems such as wafer edge defects, which will ultimately affect the product yield. Accurately calibrating the wafer transfer position to meet the requirements of process wafer products is crucial for chip foundry production. In the process of calibrating the wafer transfer position, a wafer flip mold with the characteristics of easy operation, no wafer contamination, and less impact on graphic data is needed to flip the wafer to improve the accuracy of wafer transfer position calibration, thereby improving product yield. Utility Model Content

[0008] The present application provides a wafer box and a wafer flipping device, which can flip the wafer without moving the wafer out of the wafer box, and is easy to operate and will not contaminate the wafer.

[0009] In a first aspect, an embodiment of the present application provides a wafer box, comprising: a box body; a plurality of fixed pallet groups arranged inside the box body, the fixed pallet groups comprising a plurality of fixed pallets, the plurality of fixed pallets being respectively fixedly connected to the inner wall of the box body; and a plurality of movable pallet assemblies, the movable pallet assemblies comprising a sliding rod movably connected to the inner wall of the box body and a plurality of movable pallets connected to the sliding rod; and each of the plurality of movable pallets is matched with a fixed pallet among the plurality of fixed pallets and are relatively positioned to clamp the wafer.

[0010] In some embodiments, the inner wall of the box body is provided with a sliding groove matching the sliding rod.

[0011] In some embodiments, an outer edge of one side of the first end of the sliding rod is serrated.

[0012] In some embodiments, the movable support assembly also includes a lifting knob, which includes a rotating cap, a rotating shaft and a gear. The rotating cap is located outside the box body and is connected to the first end of the rotating shaft; the rotating shaft passes through the peripheral wall of the box body; the gear is connected to the second end of the rotating shaft, and the gear matches the serrated outer edge of the sliding rod.

[0013] In some embodiments, a buffer block is provided on the end face of any fixed support for placing the wafer, and the buffer block is arranged on the side of the end face close to the inner wall of the box body, the width of the buffer block is smaller than the width of the corresponding fixed support, and the height of the buffer block is greater than the height of the wafer.

[0014] In some embodiments, the number of the plurality of movable platform assemblies is an even number, and they are arranged opposite to each other in pairs, and the sliding rods of the two opposite movable platform assemblies are connected by a connecting rod.

[0015] In some embodiments, the wafer box includes two wafer box doors that are oppositely disposed and can be opened.

[0016] In some embodiments, a first handle and a second handle are respectively connected to the outer side of the peripheral wall of the box body adjacent to the two wafer box doors.

[0017] The beneficial effects of the wafer box provided by the embodiment of the present application include but are not limited to:

[0018] A conventional wafer box only has a fixed tray for placing wafers. If the wafer box is directly flipped, the wafer will slide off the fixed tray, causing damage to the wafer. Therefore, for conventional wafer boxes, the wafer cannot be flipped by flipping the wafer box.

[0019] The wafer box provided in the embodiment of the present application includes multiple fixed platform groups and multiple movable platform assemblies. The multiple movable platform assemblies match the multiple fixed platform groups and can clamp the wafers to ensure that the wafers will not be significantly displaced during the flipping of the wafer box.

[0020] In addition, the wafer box provided in the embodiment of the present application also includes two wafer box doors arranged opposite to each other. After the wafer box is flipped, the wafer box can still be opened in the preset opening direction before flipping without horizontal rotation, thereby avoiding the influence of horizontal rotation on the calibration accuracy of the wafer transfer position.

[0021] In a second aspect, an embodiment of the present application provides a wafer flipping device, comprising: a wafer box as described in the first aspect of the present application, wherein the outer side of the peripheral wall of the box body is provided with a first protrusion and a second protrusion positioned opposite to each other; and a flip bracket, wherein a first receiving hole and a second receiving hole are provided on the flip bracket, and the first receiving hole and the second receiving hole are respectively adapted to the first protrusion and the second protrusion to connect the wafer box and the flip bracket

[0022] In some embodiments, the flip bracket is an inverted U-shaped structure, including a first side panel, a second side panel and a connecting plate connecting the first side panel and the second side panel, and the first accommodating hole and the second accommodating hole are respectively arranged on the first side panel and the second side panel.

[0023] In some embodiments, the end face of the first protrusion away from the box body is provided with a groove, and a telescopic component is embedded in the groove; and the first side panel is provided with a plurality of slot pairs matching the telescopic component, and the telescopic component can be engaged with any one of the plurality of slot pairs.

[0024] In some embodiments, the telescopic assembly includes an elastic member and a bayonet pin respectively connected to both ends of the elastic member, the elastic member can be telescopic along the axial direction of the groove, and the bayonet pin can slide within the groove and the plurality of slot pairs.

[0025] In some embodiments, the telescopic assembly further comprises a rigid pull rope, and both ends of the rigid pull rope are respectively connected to the bayonet pins.

[0026] In some embodiments, the end surface of the first protrusion away from the box body is connected to a third handle; and / or the end surface of the second protrusion away from the box body is connected to a fourth handle.

[0027] The beneficial effects of the wafer flipping device provided in the embodiment of the present application include but are not limited to the following:

[0028] The wafer flipping device provided in the embodiment of the present application realizes flipping of the wafer without opening the wafer box by adopting the wafer box in the technical solution of the present application. The flipping bracket of the wafer flipping device is connected to the wafer box through a first boss and a second boss arranged on the peripheral wall of the wafer box. A telescopic component matching with a plurality of slots on the flipping bracket is arranged on the first boss. By controlling the telescopic state of the telescopic component and rotating the first boss, the flipping and fixing of the wafer box at different angles can be realized. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The following figures describe in detail the exemplary embodiments disclosed in this application. The same reference numerals represent similar structures in several views of the drawings. Those skilled in the art will understand that these embodiments are non-limiting, exemplary embodiments, and the drawings are only for the purpose of illustration and description, and are not intended to limit the scope of this application. Other embodiments may also accomplish the inventive intent in this application. It should be understood that the drawings are not drawn to scale.

[0030] in:

[0031] Figure 1 is a schematic structural diagram of a wafer box according to some embodiments of the present application;

[0032] Figure 2 for Figure 1 a side view of the wafer cassette shown;

[0033] Figure 3 For along Figure 2 A cross-sectional view of the wafer box cut along the AA direction;

[0034] Figure 4 is a schematic structural diagram of an inner side wall of a wafer box according to some embodiments of the present application;

[0035] Figure 5 It is a schematic diagram of the structure of a wafer flipping device according to some embodiments of the present application;

[0036] Figure 6 A side view of a wafer flipping device in a first direction according to some embodiments of the present application;

[0037] Figure 7 for Figure 6 An enlarged view of the structure shown in box B;

[0038] Figure 8 It is a structural schematic diagram of a telescopic assembly in a retracted state according to some embodiments of the present application;

[0039] Fig. 9 A side view of a wafer flipping device in a second direction according to some embodiments of the present application;

[0040] Fig.10 A schematic diagram of the structure of a wafer after the wafer is flipped by a wafer flipping device according to some embodiments of the present application; and

[0041] Fig.11 It is a schematic diagram of the structure of flipping the flip bracket relative to the wafer box according to some embodiments of the present application. DETAILED DESCRIPTION

[0042] The following description provides specific application scenarios and requirements of the present application, with the purpose of enabling those skilled in the art to make and use the content in the present application. It will be apparent to those skilled in the art that various local modifications to the disclosed embodiments are apparent, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the present application. Therefore, the present application is not limited to the embodiments shown, but to the widest scope consistent with the claims.

[0043] The present application provides a wafer box, comprising: a box body; a plurality of fixed pallet groups, arranged inside the box body, the fixed pallet groups comprising a plurality of fixed pallets, the plurality of fixed pallets being respectively fixedly connected to the inner wall of the box body; and a plurality of movable pallet assemblies, the movable pallet assemblies comprising a sliding rod movably connected to the inner wall of the box body and a plurality of movable pallets connected to the sliding rod; and each of the plurality of movable pallets matches with a fixed pallet among the plurality of fixed pallets and the positions are relatively arranged to clamp the wafer.

[0044] When the wafer needs to be flipped, the multiple movable platform assemblies and the multiple fixed platform groups match each other to clamp and fix the wafer, and then the wafer box is flipped. After the flipping is completed, the multiple movable platform assemblies are adjusted to release the wafer to facilitate the robot arm to grab the wafer.

[0045] The wafer box and wafer flipping device provided by the application will be described in detail below in combination with the embodiments and drawings.

[0046] refer to Figures 1 to 4An embodiment of the present application provides a wafer box, comprising: a box body 100, a plurality of fixed pallet groups arranged inside the box body 100, and a plurality of movable pallet assemblies matching the plurality of fixed pallet groups.

[0047] In some embodiments, a slide groove 101 matching the movable support assembly is disposed inside the box body 100 .

[0048] In some embodiments, the box body 100 includes two wafer box doors 102 that are relatively disposed and can be opened, so that the side of the wafer box facing the wafer processing equipment can be opened before and after the wafer box is flipped. The wafer box door 102 is a conventional wafer box door and will not be described in detail here.

[0049] In some embodiments, the outer side of the peripheral wall of the box body 100 adjacent to the two wafer box doors 102 is respectively connected with a first handle 103 and a second handle 104. When the wafers in the wafer box need to be turned over, the operator can hold the first handle 103 and the second handle 104 to turn the wafer box over.

[0050] In some embodiments, the plurality of fixed platform groups are respectively disposed on opposite inner walls of the wafer box.

[0051] In some embodiments, the fixed support platform group includes a plurality of fixed supports 201 , and the plurality of fixed supports 201 are respectively fixedly connected to the inner wall of the box body 100 .

[0052] In some embodiments, the ratio of the width of the fixed support 201 to the width of the wafer box is 1:(1:1.5). Figure 4 The X direction shown in .

[0053] In some embodiments, the end surface of the fixed support 201 for placing the wafer is a curved surface to better fit the wafer.

[0054] In some embodiments, the end surface of the fixed support 201 for placing the wafer is provided with a buffer block 202, and the buffer block 202 is provided on the side of the end surface close to the inner wall of the box body 100, and the width of the buffer block 202 is smaller than the width of the corresponding fixed support 201, and the height of the buffer block 202 is greater than the height of the wafer. The width direction of the buffer block 202 is the 4 direction shown in the figure, and the height direction of the buffer block 202 is the Z direction shown in the figure.

[0055] On one hand, the buffer block 202 can prevent the wafer from colliding with the inner wall of the box body 100 , and on the other hand, the buffer block 202 can also prevent the multiple fixed platform groups and multiple movable platform assemblies from excessively clamping the wafer and causing damage to the wafer.

[0056] In some embodiments, the material of the buffer block 202 includes polycarbonate (PC).

[0057] In some embodiments, reference Figure 4 The movable support assembly includes a sliding rod 301 movably connected to the inner wall of the box body 100 and a plurality of movable supports 302 connected to the sliding rod 301; and each of the plurality of movable supports 302 matches with a fixed support 201 among the plurality of fixed supports 201 and is relatively positioned to clamp the wafer.

[0058] In some embodiments, the sliding rod 301 is inserted into the slide groove 101 and can move 6 to 10 mm along the slide groove 101. The sliding rod 301 slides along the slide groove 101 to drive the multiple movable supports 302 to move closer to or away from the corresponding fixed supports 201 to clamp or release the wafer.

[0059] In some embodiments, the end surface of the movable support 302 that contacts the wafer is a curved surface to better fit the wafer.

[0060] In some embodiments, the ratio of the width of the movable platform 302 to the width of the wafer box is 1:(1:1.5). Figure 4 The X direction is shown.

[0061] In some embodiments, reference Figures 3-4The movable support assembly also includes a lifting knob 303, which is arranged on the outside of the box body 100 and the first end of the lifting knob 303 passes through the peripheral wall of the box body 100 and matches the sliding rod 301 and the sliding groove 101 to control the sliding rod 301 to move along the sliding groove 101. In some embodiments, the lifting knob 303 includes a rotating cap 303a, a rotating shaft 303b and a gear 303c, wherein the rotating cap 303a is located outside the box body 100 and is connected to the first end of the rotating shaft 303b; the rotating shaft 303b passes through the peripheral wall of the box body 100; the gear 303c is connected to the second end of the rotating shaft 303b, and the gear 303c matches the serrated outer edge of the sliding rod 301. The operator can twist the rotating cap 303a to rotate the rotating shaft 303b, and the rotating shaft 303b drives the gear 303c to rotate, thereby driving the sliding rod 301 to move along the slide groove 101.

[0062] In some embodiments, reference Figure 3 The number of the plurality of movable platform assemblies is an even number, and they are arranged opposite to each other in pairs. The sliding rods 301 of the two opposite movable platform assemblies are connected by a connecting rod 304 to ensure the synchronous movement of the sliding rods 301 of the two opposite movable platform assemblies, thereby avoiding damage to the wafer due to the asynchronous movement of the sliding rods 301 of the two opposite movable platform assemblies.

[0063] In some embodiments, the calibration process of wafer processing equipment using the wafer box provided in the present application is as follows: Move the wafer box pre-installed with at least two wafers (for example, a first wafer and a second wafer) to the station to be set, with the front faces of the first wafer box and the second wafer facing the top surface of the wafer box. Adjust the lifting knob 303 so that the multiple movable platform assemblies and the multiple fixed platform 201 groups clamp the first wafer box and the second wafer. Operate by turning the wafer box upside down using the first handle 103 and the second handle 104 so that the top surface of the wafer box faces downward. Rotate the lifting knob 303 so that the multiple movable platform assemblies release the first wafer box and the second wafer through the multiple fixed platform groups.

[0064] Subsequently, the wafer box door 102 of the wafer box is opened toward the wafer processing equipment, the first wafer is taken out from the wafer box by the robotic arm of the wafer processing equipment, and the first wafer is placed on the wafer carrying platform of the wafer processing equipment, with the front of the first wafer facing the wafer carrying platform.

[0065] After the first wafer has been placed on the wafer carrying platform for a preset period of time, the wafer is placed back from the wafer carrying platform to the inside of the wafer box by the robotic arm. The lifting knob 303 is rotated to allow the multiple movable platform assemblies to clamp the first wafer box and the second wafer again with the multiple fixed platform groups. The wafer box is flipped up and down by the first handle 103 and the second handle 104 so that the top surface of the wafer box faces upward. The lifting knob 303 is rotated to allow the multiple movable platform assemblies to release the first wafer box and the second wafer through the multiple fixed platform groups.

[0066] Subsequently, the wafer box door 102 of the wafer box is opened toward the wafer processing equipment, the first wafer is taken out from the inside of the wafer box by a robotic arm, and the first wafer is moved to an analysis device for analyzing surface defects on the front side of the first wafer, and the wafer processing equipment is calibrated according to the analysis results.

[0067] After the wafer processing equipment is calibrated, the second wafer is flipped and moved in the same manner as the first wafer to inspect the calibration structure.

[0068] In some embodiments, at least four wafers are pre-installed inside the wafer box. This is because many wafer processing equipment has a dual transfer arm structure, and the detection and calibration processes require two wafers to participate respectively. The detection and calibration processes are similar to the above-mentioned single transfer arm mode and will not be repeated here.

[0069] The beneficial effects of the wafer box provided by the embodiment of the present application include but are not limited to the following:

[0070] A conventional wafer box only has a fixed tray for placing wafers. If the wafer box is directly flipped, the wafer will slide off the fixed tray, causing damage to the wafer. Therefore, for conventional wafer boxes, the wafer cannot be flipped by flipping the wafer box.

[0071] The wafer box provided in the embodiment of the present application includes multiple fixed platform groups and multiple movable platform assemblies. The multiple movable platform assemblies match the multiple fixed platform groups and can clamp the wafers to ensure that the wafers will not be significantly displaced during the flipping of the wafer box.

[0072] In addition, the wafer box provided in the embodiment of the present application also includes two wafer box doors arranged opposite to each other. After the wafer box is flipped, the wafer box can still be opened in the preset opening direction before flipping without horizontal rotation, thereby avoiding the influence of horizontal rotation on the calibration accuracy of the wafer transfer position.

[0073] The present application also provides a wafer flipping device, including a wafer box provided by the technical solution of the present application, wherein the outer side of the peripheral wall of the box body is provided with a first protrusion and a second protrusion positioned opposite to each other; and a flipping bracket, wherein a first accommodating hole and a second accommodating hole are provided on the flipping bracket, and the first accommodating hole and the second accommodating hole are respectively adapted to the first protrusion and the second protrusion to connect the wafer box and the flipping bracket.

[0074] The wafer is placed in the wafer box, and the wafer box is flipped by using the flip bracket to flip the wafer, so that the wafer can be flipped.

[0075] The wafer flipping device provided in the present application will be described in detail below in combination with the embodiments and drawings.

[0076] refer to Figures 5 to 11 An embodiment of the present application provides a wafer flipping device, including a flipping bracket 400 and a wafer box provided in an embodiment of the present application.

[0077] In some embodiments, reference Figure 5 , 6 And 9, the flip bracket 400 is an inverted U-shaped structure, including a first side plate 401, a second side plate 402, and a connecting plate 403 connecting the first side plate 401 and the second side plate 402. In some embodiments, the first side plate 401 and the second side plate 402 are respectively provided with a first receiving hole 401a and a second receiving hole 402a matching the wafer box.

[0078] In some embodiments, the first receiving hole 401a is a through hole penetrating the first side plate 401. In some embodiments, the second receiving hole 402a is a through hole penetrating the second side plate 402.

[0079] In some embodiments, reference Figures 6 to 8 The first side plate 401 is provided with a plurality of slot pairs 404 near the edge of the first receiving hole 401a, and the slot pairs 404 match the wafer box to achieve flipping of the wafer box at different angles.

[0080] In some embodiments, the slot pair 404 is symmetrically distributed about the center of the first receiving hole 401 a.

[0081] In some embodiments, the plurality of card slot pairs include a first card slot pair 404a and a second card slot pair 404b, and an angle between a line connecting the two card slots of the first card slot pair 404a and a line connecting the two card slots of the second card slot pair 404b is 90°.

[0082] In some embodiments, the angle between the line connecting the two slots of the first slot pair 404a and the length direction of the first side plate 401 is 45°; in some embodiments, the angle between the line connecting the two slots of the first slot pair 404a and the length direction of the first side plate 401 is 45°. Figure 5 The Z direction in .

[0083] In some embodiments, reference Figure 5 , 6 And 9, the outer sides of the two opposite peripheral walls of the box body 100 are respectively connected with a first protrusion 501 and a second protrusion 502, and the first protrusion 501 and the second protrusion 502 are respectively inserted into the first receiving hole 401a and the second receiving hole 402a to clamp the wafer box with the flip bracket 400.

[0084] In some embodiments, the first protrusion and the second protrusion 502 are integrally connected to the peripheral wall of the box body 100 .

[0085] In some embodiments, the first protrusion 501 and the second protrusion 502 are cylindrical.

[0086] In some embodiments, reference Figures 6 to 8 The end surface of the first protrusion 501 away from the box body 100 is provided with a groove 501a, and the groove is arranged along the diameter direction of the end surface.

[0087] In some embodiments, reference Figures 6 to 8 A telescopic component 600 is embedded in the groove 501 a , and the telescopic component 600 can be engaged with any one of the multiple slot pairs 404 .

[0088] In some embodiments, the telescopic assembly 600 includes an elastic member 601 and a latch 602 connected to both ends of the elastic member 601. The elastic member 601 can be telescopic along the axial direction of the groove, and the latch 602 can slide in the groove and the plurality of slot pairs 404.

[0089] The sum of the length of the elastic member 601 in the natural state and the length of the pin 602 in the axial direction is greater than the length of the groove, so that the telescopic assembly 600 can be engaged with the slot pair 404; and the sum of the length of the elastic member 601 in the contracted state and the length of the pin 602 in the axial direction is less than or equal to the length of the groove, so that the pin 602 can be completely pulled out of the slot pair 404 and moved into the groove, so that the first protrusion 501 can rotate in the first accommodating hole 401a.

[0090] In some embodiments, the elastic member 601 is a spring.

[0091] In some embodiments, reference Figure 7 and Figure 8 The telescopic assembly 600 further includes a rigid pull rope 603, the two ends of which are respectively connected to the bayonet pins 602 at the two ends of the elastic member 601. It should be noted that: Figure 7 In order to show the rigid pull rope 603, the Figure 6 When the wafer box needs to be rotated, the rigid pull rope 603 is pulled to move the latch pin 602 toward the direction of the elastic member 601 to shrink the elastic member 601. When the latch pin 602 is completely moved out of the slot pair 404, the first protrusion 501 is rotated to rotate the wafer box. When the wafer box is rotated to the target position, the rigid pull rope 603 is released to allow the elastic member 601 to stretch naturally, so that the latch pin 602 extends into the slot pair 404 corresponding to the target position, fixes the first protrusion 501, and fixes the position of the wafer box.

[0092] In some embodiments, a third handle 501 b is further connected to the end surface of the first protrusion 501 away from the box body 100 to facilitate an operator to rotate the first protrusion 501 .

[0093] In some embodiments, the third handle 501 b is arranged in parallel with the telescopic assembly 600 so that the operator can pull or release the rigid pull rope 603 while holding the third handle 501 b.

[0094] In some embodiments, a fourth handle 502a is connected to the end surface of the second protrusion 502 away from the box body 100, and an operator can hold the third handle 501b and the fourth handle 502a to move or flip the wafer box.

[0095] In some embodiments, reference Figures 6 to 8 as well as Fig.10The process of flipping the wafer using the wafer flipping device is as follows: the operator fixes the wafer in the wafer box by rotating the lifting knob 303, and then holds the third handle 501b and the fourth handle 502a with both hands respectively, and the hand holding the third handle 501b pulls the rigid pull rope 603 located on the inner side of the third handle 501b at the same time. When the latch 602 is completely moved out of the slot pair 404, the first protrusion 501 and the second protrusion 502 are rotated respectively by the third handle 501b and the fourth handle 502a to drive the wafer box to rotate. When the wafer box is rotated 180° and the flip is completed, the rigid pull rope 603 is released to make the latch pin 602 engage with the slot pair 404 again to fix the wafer box.

[0096] In some embodiments, reference Fig.11 The position of the flip bracket 400 relative to the wafer box can also be adjusted to meet the requirements of different placement spaces. The adjustment process is similar to that of flipping the wafer box and will not be repeated here.

[0097] The beneficial effects of the wafer flipping device provided in the embodiment of the present application include but are not limited to the following:

[0098] The wafer flipping device provided in the embodiment of the present application realizes flipping of the wafer without opening the wafer box by adopting the wafer box in the technical solution of the present application. The flipping bracket of the wafer flipping device is connected to the wafer box through a first boss and a second boss arranged on the peripheral wall of the wafer box. A telescopic component matching with a plurality of slots on the flipping bracket is arranged on the first boss. By controlling the telescopic state of the telescopic component and rotating the first boss, the flipping and fixing of the wafer box at different angles can be realized.

[0099] It should be noted that different embodiments may produce different beneficial effects. In different embodiments, the beneficial effects that may be produced may be any one or a combination of the above, or any other possible beneficial effects.

[0100] The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only for example and does not constitute a limitation of this specification. Although not explicitly stated here, those skilled in the art may make various modifications, improvements and corrections to this application. Such modifications, improvements and corrections are suggested in this specification, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of this application.

[0101] It should be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", and "fix" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a rotating connection or a sliding connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood in combination with specific circumstances.

[0102] In addition, when terms such as "first", "second", and "third" are used in the specification of this application to describe various features, these terms are only used to distinguish these features and cannot be understood as indicating or implying the relationship between the features, the relative importance, or implicitly indicating the number of features indicated.

[0103] In addition, the present specification describes exemplary embodiments by reference to idealized exemplary cross-sectional views and / or plan views and / or stereograms. Therefore, differences from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are foreseeable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but should include deviations in shapes caused by, for example, manufacturing. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to illustrate the actual shapes of the regions of the device nor to limit the scope of the exemplary embodiments.

[0104] At the same time, the present application uses specific words to describe the embodiments of this specification. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in the present application does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.

[0105] Similarly, it should be noted that in order to simplify the description of the disclosure of this application and thus help understand one or more embodiments of the invention, in the above description of the embodiments of this application, multiple features are sometimes combined into one embodiment, figure or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than the features mentioned in the claims. In fact, the features of the embodiments are less than all the features of the single embodiment disclosed above.

[0106] Finally, it should be understood that the embodiments described in this application are only used to illustrate the principles of the embodiments of the present application. Other variations may also fall within the scope of the present application. Therefore, as an example and not a limitation, the alternative configurations of the embodiments of the present application may be considered to be consistent with the teachings of the present application. Accordingly, the embodiments of the present application are not limited to the embodiments explicitly introduced and described in the present application.

Claims

1. A wafer box, characterized in that: include: Box body; A plurality of fixed support platforms are arranged inside the box body, the fixed support platform group includes a plurality of fixed support platforms, and the plurality of fixed support platforms are respectively fixedly connected to the inner wall of the box body; and A plurality of movable support assemblies, wherein the movable support assemblies include a sliding rod movably connected to the inner wall of the box body and a plurality of movable supports connected to the sliding rod; and each of the plurality of movable supports matches with a fixed support among the plurality of fixed supports and the positions are relatively arranged to clamp the wafer.

2. The wafer box according to claim 1, characterized in that: The inner wall of the box body is provided with a sliding groove matching the sliding rod.

3. The wafer box according to claim 2, characterized in that: An outer edge of one side of the first end of the sliding rod is serrated.

4. The wafer box according to claim 3, characterized in that: The movable support assembly also includes a lifting knob, which includes a rotating cap, a rotating shaft and a gear. The rotating cap is located outside the box body and is connected to the first end of the rotating shaft; the rotating shaft passes through the peripheral wall of the box body; the gear is connected to the second end of the rotating shaft, and the gear matches the serrated outer edge of the sliding rod.

5. The wafer box according to claim 1, characterized in that: The end face of the fixed support for placing the wafer is provided with a buffer block, the buffer block is arranged on one side of the end face close to the inner wall of the box body, the width of the buffer block is smaller than the width of the corresponding fixed support, and the height of the buffer block is greater than the height of the wafer.

6. The wafer box according to claim 1, characterized in that: The number of the plurality of movable platform assemblies is an even number and they are arranged opposite to each other in pairs, and the sliding rods of the two opposite movable platform assemblies are connected by a connecting rod.

7. The wafer box according to claim 1, characterized in that: The wafer box comprises two wafer box doors which are arranged opposite to each other and can be opened.

8. The wafer box according to claim 7, characterized in that: The outer sides of the peripheral walls of the box body adjacent to the two wafer box doors are respectively connected with a first handle and a second handle.

9. A wafer flipping device, characterized in that: include: The wafer box according to any one of claims 1 to 7, wherein a first protrusion and a second protrusion opposite to each other are provided on the outer side of the peripheral wall of the box body; as well as A flip bracket is provided with a first accommodating hole and a second accommodating hole, wherein the first accommodating hole and the second accommodating hole are respectively matched with the first protrusion and the second protrusion to connect the wafer box and the flip bracket.

10. The wafer flipping device according to claim 9, characterized in that: The flip bracket is an inverted U-shaped structure, including a first side plate and a second side plate respectively located on both sides of the wafer box and a connecting plate connecting the first side plate and the second side plate, and the first accommodating hole and the second accommodating hole are respectively arranged on the first side plate and the second side plate.

11. The wafer flipping device according to claim 10, characterized in that: The end surface of the first protrusion away from the box body is provided with a groove, and the telescopic component is embedded in the groove; and the first side plate is provided with a plurality of slot pairs matching the telescopic component, and the telescopic component can be engaged with any one of the plurality of slot pairs.

12. The wafer flipping device according to claim 11, characterized in that: The telescopic assembly comprises an elastic member and bayonet pins respectively connected to both ends of the elastic member, the elastic member can be telescoped along the axial direction of the groove, and the bayonet pin can slide in the groove and the plurality of slot pairs.

13. The wafer flipping device according to claim 12, characterized in that: The telescopic assembly also includes a rigid pull rope, and both ends of the rigid pull rope are respectively connected to the bayonet pins.

14. The wafer flipping device according to claim 13, characterized in that: The end surface of the first protrusion away from the box body is connected to a third handle; and / or the end surface of the second protrusion away from the box body is connected to a fourth handle.

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