Audio separation circuit and switcher

Abstract

The utility model discloses an audio separation circuit and a switcher, the audio separation circuit comprises a video input module, a switching processing module, a video output module and an audio output module, the video input module is used for collecting video signals and transmitting the video signals to the switching processing module; the switching processing module is used for executing target processing operation on the video signal to obtain a target output signal and outputting the target output signal to the video output module and the audio output module, and the target output signal comprises an output video signal and an output audio signal; the video output module is used for transmitting the output video signal to target display equipment; and the audio output module is used for transmitting the output audio signal to target audio equipment. According to the utility model, the audio and the video in the video can be separated and de-embedded, the intelligence of audio de-embedding is improved, and the use convenience of a user is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of audio processing, in particular to an audio separation circuit and a switch. Background Art

[0002] With the continuous development of science and technology, digital electronic devices have become an indispensable part of people's daily life. More and more multimedia devices, such as game consoles, computers, Blu-ray disc players, set-top boxes, video playback boxes, TVs, monitors, etc., use HDMI interfaces as the main audio and video signal transmission interfaces. Various signal source output devices and display devices need to be connected through HDMI cables to transmit high-quality and stable audio and video signals. HDMI switchers are convenient and practical electronic devices that can easily connect multiple HDMI input signals to a display device and allow users to easily switch different signal sources to select one channel for output. Whether in home theater systems or in commercial environments such as schools, HDMI switchers are ideal choices.

[0003] However, most of the solutions currently used by multi-channel HDMI video switchers on the market are hard switch signal switching solutions, and most switchers only support 4K resolution at maximum output. At the same time, HDMI multi-channel signal switchers do not have an audio separation function, resulting in low user convenience. It can be seen that it is particularly important to provide a new audio separation switcher to achieve audio de-embedding, thereby improving the intelligence of audio de-embedding and thus improving user convenience. Utility Model Content

[0004] The utility model provides an audio separation circuit and a switch, which can realize the separation and de-embedding of audio and video in a video, and is beneficial to improving the intelligence of audio de-embedding and also beneficial to improving the convenience of user use.

[0005] In order to solve the above technical problems, the utility model discloses an audio separation circuit in the first aspect, wherein the audio separation circuit includes a video input module, a switching processing module, a video output module and an audio output module, wherein:

[0006] The first end of the video input module is electrically connected to the first end of the switching processing module, the second end of the switching processing module is electrically connected to the first end of the video output module and the first end of the audio output module respectively, the second end of the video output module is used to electrically connect to the target display device, and the second end of the audio output module is used to electrically connect to the target audio device;

[0007] The video input module is used to collect video signals and transmit the video signals to the switching processing module;

[0008] The switching processing module is used to perform a target processing operation on the video signal to obtain a target output signal, and output the target output signal to the video output module and the audio output module, wherein the target output signal includes an output video signal and an output audio signal;

[0009] The video output module is used to transmit the output video signal to the target display device;

[0010] The audio output module is used to transmit the output audio signal to the target audio device.

[0011] As an optional implementation, in the first aspect of the utility model, the audio separation circuit further includes a control module, wherein:

[0012] The first end of the control module is electrically connected to the third end of the switching processing module;

[0013] The control module is used to determine the output audio signal format corresponding to the video signal, so that the switching processing module performs the target processing operation on the video signal to obtain an output audio signal matching the audio signal format.

[0014] As an optional implementation, in the first aspect of the utility model, the audio separation circuit further includes a signal conversion module, wherein:

[0015] The first end of the signal conversion module is electrically connected to the second end of the switching processing module, and the second end of the signal conversion module is electrically connected to the first end of the audio output module;

[0016] The signal conversion module is used to perform a signal type conversion operation on the target output signal to obtain a target output signal that matches the target signal type, and transmit the target output signal to the audio output module.

[0017] As an optional implementation, in the first aspect of the utility model, the audio separation circuit further includes a signal amplification module, wherein:

[0018] The first end of the signal amplification module is electrically connected to the second end of the signal conversion module, and the second end of the signal amplification module is electrically connected to the first end of the audio output module;

[0019] The signal amplification module is used to perform a first amplification operation on the target output signal to obtain an amplified target output signal, and transmit the target output signal to the audio output module.

[0020] As an optional implementation, in the first aspect of the utility model, the audio separation circuit further includes a driving module and a transmission output module, wherein:

[0021] The first end of the driving module is electrically connected to the fourth end of the switching processing module, the second end of the driving module is electrically connected to the first end of the transmitting output module, and the second end of the transmitting output module is used to electrically connect to the audio socket interface;

[0022] The driving module is used to perform a second amplification operation on the target output signal and transmit the target output signal to the transmitting output module;

[0023] The transmitting output module is used to transmit the target output signal to the audio output device corresponding to the audio socket interface.

[0024] As an optional implementation, in the first aspect of the utility model, the video input module includes a video input chip, a first DDC processing submodule, a first ESD protection submodule, and a first HPD conversion submodule, wherein:

[0025] The first end of the video input chip is electrically connected to the first end of the first DDC processing submodule, the second end of the video input chip is electrically connected to the second end of the first DDC processing submodule and the first end of the first HPD conversion submodule, the third end of the video input chip is electrically connected to the first end of the first ESD protection submodule, and the fourth end of the video input chip is electrically connected to the first end of the switching processing module;

[0026] The video input chip is used to collect video signals and transmit the video signals to the switching processing module;

[0027] The first DDC processing submodule is used to improve the driving capability of the video input chip;

[0028] The first ESD protection submodule is used to eliminate the influence of static electricity on the video input chip;

[0029] The first HPD conversion submodule is used to perform a level conversion operation on the level signal corresponding to the first DDC processing submodule and the level signal corresponding to the video input chip.

[0030] As an optional implementation, in the first aspect of the utility model, the video output module includes a video output chip, a second DDC processing submodule, a second HPD conversion submodule, a second ESD protection submodule and a current limiting protection submodule, wherein:

[0031] The first end of the video output chip is electrically connected to the first end of the second DDC processing submodule and the first end of the second ESD protection submodule, respectively; the first end of the second HPD conversion submodule is electrically connected to the second end of the second ESD protection submodule and the second end of the second DDC processing submodule, respectively; the third end of the second DDC processing submodule is electrically connected to the first end of the current limiting protection submodule; and the second end of the video output chip is used to electrically connect to a target display device;

[0032] The video output chip is used to transmit the output video signal to the target display device;

[0033] The second DDC processing submodule is used to improve the driving capability of the video output chip;

[0034] The second HPD conversion submodule is used to perform a level conversion operation on the level signal corresponding to the second DDC processing submodule and on the level signal corresponding to the second ESD protection submodule;

[0035] The second ESD protection submodule is used to eliminate the influence of static electricity on the video output chip;

[0036] The current limiting protection submodule is used to prevent the video output chip from short circuiting.

[0037] As an optional implementation, in the first aspect of the utility model, the switching processing module also includes a JTAG circuit, an I2C circuit and a QSPI circuit.

[0038] As an optional implementation, in the first aspect of the utility model, the video signal collected by the video input module includes four HDMI video signals, wherein the switching processing module is used to perform the target processing operation on the four HDMI video signals collected by the video input module.

[0039] The second aspect of the utility model discloses a switch, which includes an input port for receiving video, obtains a target output signal through any audio separation circuit disclosed in the first aspect, and includes an output port for outputting the target output signal.

[0040] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0041] The utility model provides an audio separation circuit, which includes a video input module, a switching processing module, a video output module and an audio output module, wherein: the first end of the video input module is electrically connected to the first end of the switching processing module, the second end of the switching processing module is electrically connected to the first end of the video output module and the first end of the audio output module respectively, the second end of the video output module is used to electrically connect to a target display device, and the second end of the audio output module is used to electrically connect to a target audio device; the video input module is used to collect a video signal and transmit the video signal to the switching processing module; the switching processing module is used to perform a target processing operation on the video signal to obtain a target output signal, and output the target output signal to the video output module and the audio output module, wherein the target output signal includes an output video signal and an output audio signal; the video output module is used to transmit the output video signal to the target display device; the audio output module is used to transmit the output audio signal to the target audio device. It can be seen that the utility model can realize the separation and de-embedding of audio and video in the video, which is conducive to improving the intelligence of audio de-embedding, and is also conducive to improving the convenience of user use. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0043] Figure 1 It is a structural schematic diagram of an audio separation circuit disclosed in an embodiment of the utility model;

[0044] Figure 2 It is a structural schematic diagram of another audio separation circuit disclosed in an embodiment of the utility model;

[0045] Figure 3 It is a schematic diagram of the structure of a GD32F330CBT6 chip disclosed in an embodiment of the utility model;

[0046] Figure 4 It is a structural schematic diagram of an LED selection circuit disclosed in an embodiment of the utility model;

[0047] Figure 5 It is a structural schematic diagram of another audio separation circuit disclosed in an embodiment of the utility model;

[0048] Figure 6 It is a structural schematic diagram of a signal conversion module disclosed in an embodiment of the utility model;

[0049] Figure 7It is a structural schematic diagram of a signal amplification module disclosed in an embodiment of the utility model;

[0050] Figure 8 It is a structural schematic diagram of a driving module disclosed in an embodiment of the utility model;

[0051] Fig. 9 It is a structural schematic diagram of a transmission output module disclosed in an embodiment of the utility model;

[0052] Fig.10 It is a structural schematic diagram of a video input chip disclosed in an embodiment of the utility model;

[0053] Fig.11 It is a structural schematic diagram of a first DDC processing submodule disclosed in an embodiment of the utility model;

[0054] Fig.12 It is a structural schematic diagram of a first ESD protection submodule disclosed in an embodiment of the utility model;

[0055] Fig.13 It is a structural schematic diagram of a first HPD conversion submodule disclosed in an embodiment of the utility model;

[0056] Fig.14 It is a structural schematic diagram of a second DDC processing submodule disclosed in an embodiment of the utility model;

[0057] Fig.15 It is a structural schematic diagram of a second ESD protection submodule disclosed in an embodiment of the utility model;

[0058] Fig.16 It is a structural schematic diagram of a second HPD conversion submodule disclosed in an embodiment of the utility model;

[0059] Fig.17 It is a structural schematic diagram of a current protection submodule disclosed in an embodiment of the utility model;

[0060] Fig.18 It is a structural schematic diagram of a JTAG circuit disclosed in an embodiment of the utility model;

[0061] Fig.19 It is a structural schematic diagram of an I2C circuit disclosed in an embodiment of the utility model;

[0062] Fig. 20 It is a structural schematic diagram of a QSPI circuit disclosed in an embodiment of the utility model;

[0063] Fig.21 It is a structural schematic diagram of a switch disclosed in an embodiment of the utility model. DETAILED DESCRIPTION

[0064] For better understanding and implementation, the technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0065] It should be noted that, unless otherwise clearly specified and limited, the term "electrical connection" in the specification and claims of the utility model and the above-mentioned drawings should be understood in a broad sense. For example, it can be a fixed electrical connection, a detachable electrical connection, or an integral electrical connection; it can be a mechanical electrical connection, an electrical electrical connection, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. In addition, the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. The terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For those of ordinary skill in the art, the specific meanings of the above terms in the utility model can be understood according to specific circumstances.

[0066] The utility model discloses an audio separation circuit, which can realize the separation and de-embedding of audio and video in a video, is conducive to improving the intelligence of audio de-embedding, and is also conducive to improving the convenience of user use. Detailed descriptions are given below.

[0067] Embodiment 1

[0068] See also Figure 1 , Figure 1 This is an audio separation circuit disclosed in the embodiment of the utility model. This circuit can not only realize the separation and de-embedding of audio and video in the video, but also help to improve the intelligence of audio de-embedding and the convenience of user use. The embodiment of the utility model is not limited. Figure 1 As shown, the audio separation circuit includes: a video input module 101, a switching processing module 102, a video output module 103 and an audio output module 104, wherein:

[0069] The first end of the video input module 101 is electrically connected to the first end of the switching processing module 102, the second end of the switching processing module 102 is electrically connected to the first end of the video output module 103 and the first end of the audio output module 104, the second end of the video output module 103 is used to electrically connect to the target display device, and the second end of the audio output module 104 is used to electrically connect to the target audio device;

[0070] The video input module 101 is used to collect video signals and transmit the video signals to the switching processing module 102;

[0071] The switching processing module 102 is used to perform a target processing operation on the video signal to obtain a target output signal, and output the target output signal to the video output module 103 and the audio output module 104, wherein the target output signal includes an output video signal and an output audio signal;

[0072] The video output module 103 is used to transmit the output video signal to the target display device;

[0073] The audio output module 104 is used to transmit the output audio signal to a target audio device.

[0074] In an embodiment of the utility model, optionally, the video input module 101 may include four HDMI video input modules, wherein the four HDMI video input modules may include a first HDMI video input module, a second HDMI video input module, a third HDMI video input module, and a fourth HDMI video input module. Further, the video input module may collect four HDMI video signals.

[0075] In the embodiment of the utility model, optionally, the switching processing module 102 includes a four-input and one-output video switching processing module 102, wherein the four-input and one-output video switching processing module 102 can be used to connect four HDMI video signals to perform target processing operations. Further optionally, the four-input and one-output video switching processing module 102 includes a GSV6705 chip with equalizer gain control. Furthermore, the four-input and one-output video switching processing module 102 is used to perform audio and video separation operations on the four-channel HDMI video signals to obtain a target output signal including an output video signal and an output audio signal. Furthermore, the target output signal processed by the switching processing module 102 can include an 8K signal, so that the target output signal processed by the switching processing module 102 can reach 8K, which can improve the video signal and video quality, which is conducive to improving the user experience and comfort, and can also meet the user's demand for high-quality video and audio signals.

[0076] In the embodiments of the utility model, optionally, the target display device may include a smart phone, a smart computer, a smart tablet, an LED screen, or the like that can be used to display video information; the target audio device may include a smart phone, a smart computer, a smart tablet, a smart radio, a smart player, or the like that can be used to play audio information; the embodiments of the utility model do not make specific limitations.

[0077] It can be seen that implementation Figure 1The described audio separation circuit can collect video signals through the video input module 101 and transmit them to the switching processing module 102. The switching processing module 102 performs target processing operations on the video signals to obtain target output signals including output video signals and output audio signals, and transmits them to the target display device and the target audio device through the video output module 103 and the audio output module 104. The switching processing module 102 can perform target processing operations on the video signals to obtain output video signals and output audio signals, and can realize intelligent audio and video screen separation to adapt to different display or playback requirements, so that the system can cope with various application scenarios, which is conducive to improving the adaptability and practicality of the device. The switching processing module 102 can perform corresponding target processing operations on the video signals, and can obtain audio and video corresponding to the video signals respectively, and can also ensure the synchronization of audio and video during transmission and playback, which is also conducive to improving the flexibility of video and audio signal processing, and ensures stable signal transmission and synchronous output of multimedia, and further helps to improve the user experience, convenience and comfort.

[0078] In an optional embodiment, if Figure 2 As shown, the audio separation circuit also includes a control module 105, wherein:

[0079] The first end of the control module 105 is electrically connected to the third end of the switching processing module 102;

[0080] The control module 105 is used to determine the output audio signal format corresponding to the video signal, so that the switching processing module 102 performs a target processing operation on the video signal to obtain an output audio signal matching the audio signal format.

[0081] In this optional embodiment, optionally, the control module 105 includes an MCU control module 105, wherein the MCU control module 105 is an electronic control module 105 based on a microcontroller (MCU), which is widely used in various electronic devices and systems. It is usually composed of an MCU and other auxiliary circuits, and can realize various control, calculation and data processing functions. The MCU controller usually includes modules such as a CPU, a memory, an input and output interface, a timer, an ADC, and a DAC. Through these modules, the MCU control module 105 can realize automatic control, such as controlling the operation of equipment such as motors, switches, and lights, to meet various automatic control requirements. In addition, it can also process various data, such as collecting sensor data, processing sound and image data, etc. In terms of communication, the MCU control module 105 can communicate and control with other devices, such as exchanging data and communicating through serial ports, Ethernet, wireless networks, etc. Further, the MCU control module 105 may include a GD32F330CBT6 chip. Among them, the communication connection method between the MCU control module 105 and the switching processing module 102 can be through an IIC bus connection method. Among them, Figure 3 This is a schematic diagram of the structure of a GD32F330CBT6 chip disclosed in an embodiment of the utility model. The components included in the GD32F330CBT6 chip and the connection method of each component can be as follows Figure 3 shown.

[0082] In this optional embodiment, further optional, such as Figure 4 As shown, Figure 4 It is a schematic diagram of the structure of an LED selection circuit disclosed in the utility model. Further, the second end of the control module 105 is electrically connected to the first end of the LED selection circuit, wherein the user can select the corresponding channel through the button in the LED selection circuit and transmit it to the control module 105 so that the control module 105 knows the output audio signal format corresponding to the video signal. For example, when the selected channel is LED1 channel, the level output by the LED selection circuit is composed of a high level 1 and a low level 0, and the output level enters the IO port of the MCU to detect the current state, such as outputting 1111 when the four-speed dial switches are all turned to a high level, and determining that the output audio signal format corresponding to the video signal is PC Control Mode.

[0083] In this optional embodiment, optionally, the target processing operation is used to perform a signal format conversion operation on the video signal to obtain an output audio signal that matches the format of the audio signal.

[0084] It can be seen that the implementation of this optional embodiment can connect the control module 105 with the switching processing module 102 and determine the output audio signal format corresponding to the video signal, so that the switching processing module 102 performs the target processing operation on the video signal to obtain an output audio signal that matches the audio signal format, and can determine the output audio signal format corresponding to the video signal through the EDID dip switch, which is conducive to improving the accuracy and reliability of determining the output audio signal format corresponding to the video signal, and is conducive to improving the intelligence and convenience of determining the output audio signal format corresponding to the video signal. Further, the output audio signal corresponding to the video signal is determined by the control module 105. The signal format can ensure the format matching of the video signal and the audio signal when they are output. By ensuring the format matching of the two, the accuracy and smoothness of the synchronous audio and video playback can be significantly improved. Since the control module 105 can determine the corresponding audio signal format according to different video signals, this enables the system to adapt to a variety of different audio and video format requirements. Whether it is high-definition video or low-bit rate audio, the system can achieve the best output effect through the adjustment of the control module 105, thereby enhancing the flexibility and adaptability of the system, and brings significant beneficial effects to the entire system by optimizing signal format matching, improving processing efficiency, enhancing system flexibility, reducing system complexity and improving user experience.

[0085] In another optional embodiment, Figure 5 As shown, the audio separation circuit further includes a signal conversion module 106, wherein:

[0086] A first end of the signal conversion module 106 is electrically connected to a second end of the switching processing module 102 , and a second end of the signal conversion module 106 is electrically connected to a first end of the audio output module 104 ;

[0087] The signal conversion module 106 is used to perform a signal type conversion operation on the target output signal to obtain a target output signal that matches the target signal type, and transmit the target output signal to the audio output module 104 .

[0088] In this optional embodiment, optionally, the target output signal corresponding to the signal type conversion operation includes an output audio signal.

[0089] In this optional embodiment, optionally, as Figure 6 As shown, Figure 6 is a schematic diagram of the structure of a signal conversion module 106 disclosed in the utility model, wherein the components included in the signal conversion module 106 and the connection method between the components can be as follows Figure 6As shown, further, the signal conversion module 106 includes a D / A conversion module, wherein the D / A conversion module, also known as a digital-to-analog conversion module, is mainly used to convert digital signals into analog signals. For example, in the field of industrial automation, the D / A conversion module can be used to convert control signals generated by a computer into analog signals to drive actuators, such as motors, valves, etc. In the field of instrumentation, it can convert digital display values ​​into analog outputs for more accurate measurement and calibration. Further, the D / A conversion module can include a CS4344 chip, which includes a 10-pin, 24-bit, 192kHz stereo digital-to-analog converter (DAC). It is a complete stereo digital-to-analog output system, including functions such as interpolation, multi-bit D / A conversion, and output analog filtering. CS: 4344 supports major audio data interface formats, such as I2 S, etc., and has the ability to automatically detect sampling rates up to 192kHz.

[0090] In this optional embodiment, further optionally, the IIS digital signal de-embedded from the GSV6705 chip in the switching processing module 102 enters the CS4344 chip in the D / A conversion module in the signal conversion module 106 to convert the IIS digital signal into an analog signal.

[0091] It can be seen that the implementation of this optional embodiment can perform a signal type conversion operation on the target output signal through the signal conversion module 106 to obtain a target output signal that matches the target signal type and transmit the target output signal to the audio output module 104, and can perform a signal type conversion operation on the output audio signal in the target output signal through the signal conversion module 106 to obtain a matching target output signal, and can convert it into a signal type that can be understood and processed by the audio output module 104 through the signal conversion module 106, which greatly enhances the signal compatibility of the system, enabling the system to process input signals of various formats, and performing type conversion on the signal through the signal conversion module 106 can effectively remove noise and interference in the original signal, thereby improving the signal-to-noise ratio and clarity of the audio signal, and is also beneficial to improving the accuracy and integrity of the audio signal and thereby improving the quality of the obtained output audio signal, and is further beneficial to improving the signal compatibility and the quality of the audio signal, enhancing the flexibility and adaptability of the system, and is also beneficial to improving the user experience, as well as the user's sense of use, comfort and convenience.

[0092] In yet another optional embodiment, Figure 5 As shown, the audio separation circuit further includes a signal amplification module 107, wherein:

[0093] A first end of the signal amplifying module 107 is electrically connected to a second end of the signal converting module 106 , and a second end of the signal amplifying module 107 is electrically connected to a first end of the audio output module 104 ;

[0094] The signal amplification module 107 is configured to perform a first amplification operation on the target output signal to obtain an amplified target output signal, and transmit the target output signal to the audio output module 104 .

[0095] In this optional embodiment, the signal amplification module 107 optionally includes an amplification circuit module, wherein Figure 7 As shown, Figure 7 The present invention discloses a schematic diagram of a structure of a signal amplification module 107, wherein the components included in the signal amplification module 107 and the connection between the components can be as follows: Figure 7 As shown. Among them, the amplifier circuit module is an electronic circuit system, which is mainly used to increase the amplitude of the input signal and keep the relative amplitude of the output signal and the input signal unchanged. The amplifier circuit module is usually composed of an amplifier, a power supply, and an input and output interface. Its core part is the amplifier, which provides a signal with a corresponding amplitude change at the output end according to the amplitude change of the input signal. Further optionally, the signal amplification module 107 may include an OPAMP circuit, wherein the OPAMP circuit is also an operational amplifier circuit, and the operational amplifier circuit is a common integrated circuit device in electronic circuits. The OPAMP circuit is mainly composed of an input stage, a differential amplifier stage, and an output stage. The input stage provides a high input impedance and differential input function for the differential amplifier. The differential amplifier stage amplifies the input signal, and the output stage converts the voltage after the signal is amplified into a current output; further, the differential input of the operational amplifier can accept two input signals, namely, a positive phase input and a negative phase input. Through the difference between the two input signals, the operational amplifier can amplify the differential signal. This differential input design enables the operational amplifier to offset some noise and interference in practical applications, thereby improving the quality of the signal. Furthermore, the operational amplifier has a very high amplification factor, which can reach several thousand or even tens of thousands of times. This enables the operational amplifier to amplify weak input signals to a large enough amplitude for subsequent circuit processing, and the high amplification factor also enables the operational amplifier to provide stable gain in the negative feedback circuit.

[0096] In this optional embodiment, the amplifier circuit module optionally includes a dual-power supply operational amplifier TL082 sub-circuit and peripheral sub-circuits, wherein the TL082 sub-circuit is a dual operational amplifier integrated circuit with a gain bandwidth product (Typ) of 3MHz, which means that it can maintain stable amplification performance over a wide frequency range. In addition, the TL082 also has characteristics such as low offset current and low input bias current, which helps to reduce noise and distortion in the circuit.

[0097] In this optional embodiment, optionally, after performing a signal type conversion operation on the audio output signal in the target output signal through the signal conversion module 106 to obtain an output audio signal whose signal type is an analog signal, the output output audio signal analog signal is amplified by the operational amplifier TL082 to obtain an amplified target output signal, and the output audio signal in the amplified target output signal is output to the audio output module 104, and then output through the audio output module 104.

[0098] It can be seen that the implementation of this optional embodiment can perform a first amplification operation on the target output signal through the signal amplification module 107 to obtain the amplified target output signal and transmit the target output signal to the audio output module 104, can amplify the target output signal processed by the signal conversion module 106, can significantly enhance the strength of the output audio signal through the signal amplification module 107, and make the output audio signal reach a level suitable for driving the audio output device, and can optimize the output audio signal through the signal amplification module 107, so that the obtained output audio signal can maintain stable performance under different output volume and output sound quality requirements, and can process audio signals of different intensities and types by separating audio and video, which is also conducive to enhancing the compatibility and flexibility of the audio signal, and further conducive to improving the compatibility of the signal and the quality of the audio signal, enhancing the flexibility and adaptability of the system, and is also conducive to improving the user experience, as well as the user's sense of use, comfort and convenience.

[0099] In yet another optional embodiment, Figure 5 As shown, the audio separation circuit also includes a driving module 108 and a transmitting output module 109, wherein:

[0100] The first end of the driving module 108 is electrically connected to the fourth end of the switching processing module 102, the second end of the driving module 108 is electrically connected to the first end of the transmitting output module 109, and the second end of the transmitting output module 109 is used to electrically connect to the audio socket interface;

[0101] The driving module 108 is used to perform a second amplification operation on the target output signal and transmit the target output signal to the transmitting output module 109;

[0102] The transmitting output module 109 is used to transmit the target output signal to the audio output device corresponding to the audio socket interface.

[0103] In this optional embodiment, optionally, as Figure 8 As shown, Figure 81 is a schematic diagram of a structure of a driving module 108 disclosed in an embodiment of the present utility model, wherein the components included in the driving module 108 and the connection relationship between the components can be as follows: Figure 8 As shown, further, the driving module 108 includes an SPDIF driving circuit module, wherein the SPDIF driving circuit module is a circuit module specifically used to drive the SPDIF signal. SPDIF is a digital audio transmission interface standard, which is usually used to transmit compressed audio signals, such as AC3 signals, or to transmit original audio signals from a CD player to an audio receiving end. Further, the SPDIF driving circuit module can amplify and drive the signal, that is, the SPDIF driving circuit module can receive the SPDIF signal and amplify it to an appropriate level through an internal amplifier circuit to drive subsequent audio devices or interfaces; and, the SPDIF driving circuit module can shape and stabilize the signal, that is, in order to ensure the accuracy and stability of the SPDIF signal, the driving circuit module usually shapes the signal to eliminate possible noise or distortion and ensure the quality of the signal; and, the SPDIF driving circuit module can match and convert the interface: the SPDIF driving circuit module may also have the function of interface matching and conversion to meet the connection requirements between different devices or systems. In this way, the accuracy and reliability of SPDIF signal transmission can be ensured through the SPDIF driving circuit module included in the driving module 108, and the stability of SPDIF signal transmission by the SPDIF driving circuit module can be ensured, which is conducive to providing a strong guarantee for high-quality output audio signals and audio experience.

[0104] In this optional embodiment, optionally, as Fig. 9 As shown, Fig. 9 1 is a schematic diagram of the structure of a transmission output module 109 disclosed in an embodiment of the present utility model, wherein the components included in the transmission output module 109 and the connection method between the components can be as follows: Fig. 9 As shown, further, the transmission output module 109 may include a fiber optic transmitter seat, wherein the fiber optic transmitter seat is also called a fiber optic transmitter, which is an electronic device used for signal transmission, and its main function is to convert electrical signals into optical signals and transmit them to the optical fiber; further, the fiber optic transmitter seat can achieve a higher data transmission speed, which is beneficial to improving the efficiency and quality of data transmission; and, by transmitting data through the fiber optic transmitter seat, long-distance data transmission can be achieved, and the data transmission quality can be improved during long-distance transmission.

[0105] In this optional embodiment, optionally, the audio jack interface can be a 3.5mm audio jack interface. Further, the audio output device corresponding to the audio jack interface can include one or more smart headphone devices, smart playback devices, etc. corresponding to the 3.5mm audio jack interface, and the embodiment of the utility model does not make specific limitations.

[0106] In this optional embodiment, optionally, the digital signal SPDIF de-embedded from the target output signal is passed through the SPDIF driving circuit module in the driving module 108 through the amplifier circuit included in the driving module 108, and a second amplification operation is performed through the amplifier circuit to obtain a target output signal including an output audio signal, and the output audio signal included in the target output signal is transmitted to an audio output device corresponding to the 3.5mm audio jack interface.

[0107] It can be seen that the implementation of this optional embodiment can perform a second amplification operation on the target output signal through the driving module 108 and transmit it to the transmitting output module 109, and transmit the target output signal to the audio output device corresponding to the audio socket interface through the transmitting output module 109, and can perform further processing operations on the audio signal in the target output signal through the driving module 108 and the transmitting output module, thereby realizing further processing and efficient transmission of the audio signal. Furthermore, the driving module 108 can perform a second amplification operation on the digital signal SPDIF to obtain a target output signal including the output audio signal, which can further enhance the strength of the audio signal, making the audio signal more stable during the signal transmission process, and the driving module 108 can perform a second amplification operation on the audio signal to ensure It ensures the clarity and accuracy of the audio signal, and also provides users with a high-quality audio experience. Furthermore, the SPDIF driving circuit module integrated in the driving module 108 can determine the transmission quality and stability of the SPDIF signal, providing a strong guarantee for high-quality audio output, and then transmits the target output signal to the audio output device corresponding to the audio socket interface through the transmitting output module 109, which can make the audio signal transmission speed faster, the transmission distance longer, and the transmission quality more stable, which is also conducive to enhancing the compatibility and flexibility of the audio signal, and further helps to improve the compatibility of the signal and the quality of the audio signal, enhance the flexibility and adaptability of the system, and is also conducive to improving the user experience, as well as the user's sense of use, comfort and convenience.

[0108] In yet another optional embodiment, the video input module 101 includes a video input chip, a first DDC processing submodule, a first ESD protection submodule, and a first HPD conversion submodule, wherein:

[0109] The first end of the video input chip is electrically connected to the first end of the first DDC processing submodule, the second end of the video input chip is electrically connected to the second end of the first DDC processing submodule and the first end of the first HPD conversion submodule, the third end of the video input chip is electrically connected to the first end of the first ESD protection submodule, and the fourth end of the video input chip is electrically connected to the first end of the switching processing module 102;

[0110] A video input chip, used to collect video signals and transmit the video signals to the switching processing module 102;

[0111] A first DDC processing submodule is used to improve the driving capability of the video input chip;

[0112] The first ESD protection submodule is used to eliminate the influence of static electricity on the video input chip;

[0113] The first HPD conversion submodule is used to perform a level conversion operation on the level signal corresponding to the first DDC processing submodule and the level signal corresponding to the video input chip.

[0114] In this optional embodiment, optionally, as Fig.10 As shown, Fig.10 : is a schematic diagram of the structure of a video input chip disclosed in an embodiment of the utility model, wherein the components included in the video input chip and the connection relationship between the components can be as follows Fig.10 As shown, further, the video input chip may include an HDMI-A-SMD chip, or may be other chips that can be used to collect video signals, which is not specifically limited in the embodiments of the present utility model.

[0115] In this optional embodiment, optionally, as Fig.11 As shown, Fig.11 : is a schematic diagram of the structure of a first DDC processing submodule disclosed in an embodiment of the utility model, wherein the components included in the first DDC processing submodule and the connection relationship between the components can be as follows: Fig.11As shown, the first DDC processing submodule includes a DDC processing circuit, wherein the DDC processing circuit is the abbreviation of a digital downconverter processing circuit, which is used in a communication system to mix with a sinusoidal signal (local oscillator) generated by a local oscillator, thereby changing the frequency band in which the signal is located. Specifically, increasing the frequency is up-conversion, and reducing the frequency is down-conversion. Wherein, the DDC processing circuit includes at least one pull-up resistor, wherein the pull-up resistor is a resistor device, and its main function is to pull a certain signal pin to a high level to keep the signal in a high level state. The pull-up resistor is usually used together with the pull-down resistor to control the signal transmission and logic function of the circuit. Further, the input signal of the video input chip is maintained at a high level of the signal by the pull-up resistor, which can avoid the signal from having a bad level, can be conducive to improving the accuracy and reliability of the input signal, and can improve the driving ability of the video input chip.

[0116] In this optional embodiment, optionally, as Fig.12 As shown, Fig.12 : is a schematic diagram of the structure of a first ESD processing submodule disclosed in an embodiment of the utility model, wherein the components included in the first ESD processing submodule and the connection relationship between the components can be as follows: Fig.12 As shown, further, the first ESD protection submodule includes an ESD protection circuit, wherein the ESD protection circuit is a circuit design for protecting electronic components from external electrostatic discharge damage. Electrostatic discharge refers to a short-term high-voltage discharge phenomenon caused by an imbalance of charge, which can cause irreversible damage to sensitive electronic devices. The design goal of the ESD protection circuit is to guide the energy of external electrostatic discharge to a safe place to prevent it from causing damage to electronic equipment.

[0117] In this optional embodiment, optionally, as Fig.13 As shown, Fig.13 : is a schematic diagram of the structure of a first HPD processing submodule disclosed in an embodiment of the utility model, wherein the components included in the first HPD processing submodule and the connection relationship between the components can be as follows: Fig.13As shown, the first HPD conversion submodule includes an HPD input level conversion circuit, wherein the HPD input level conversion circuit is a circuit specifically used to process HPD (high voltage discharge) signals, and its main function is to convert the level of the input HPD signal to a range suitable for subsequent circuit processing. For example, if the voltage corresponding to the device connected to the video input chip is 5V, and the operating voltage corresponding to the video input chip is 3.3V, then the voltage corresponding to the device connected to the video input chip does not match the voltage corresponding to the video input chip, then the HPD conversion submodule performs a level conversion operation, converting the voltage corresponding to the device connected to the video input chip, which is 5V, to the voltage corresponding to the video input chip, which is 3.3V, to ensure the normal operation of the chip and prevent the chip from being damaged by high voltage.

[0118] In this optional embodiment, optionally, video signals are collected through a video input chip, and an electrostatic protection operation is performed on the video input chip through an ESD protection sub-module to prevent external static electricity from entering the video input chip and causing damage to the video input chip. The driving capability of the video input chip is improved through a DDC processing sub-module, and a level conversion operation is performed through an HPD protection sub-module, which can effectively protect the video input chip from being damaged by external high voltage.

[0119] It can be seen that the implementation of this optional embodiment can collect video signals through the video input chip in the video input module 101 and transmit them to the switching processing module 102, and improve the driving capability of the video input chip through the first DDC processing submodule, and eliminate the influence of external static electricity on the video input chip through the first ESD protection submodule, and perform level conversion operations through the first HPD conversion submodule. The driving capability of the video input chip can be effectively improved through the first DDC processing submodule, which is beneficial to improving the stability and high quality of the video signal during data transmission, and when transmitting over long distances or in complex environments, it can reduce signal attenuation and distortion, thereby improving the performance of the overall system, and the first ESD protection submodule can effectively It can absorb and disperse the energy of electrostatic discharge, protect the video input chip from damage, improve the stability and reliability of the equipment, and through the first HPD conversion submodule, it can help ensure that the signals between different modules can be correctly matched and transmitted, avoiding signal distortion or errors caused by level mismatch. Among them, level conversion is a key step in circuit design, which can make the entire system more flexible and compatible, thereby helping to improve the flexibility and compatibility of the video input module 101, and then through the video input chip, the first DDC processing submodule, the first ESD protection submodule and the first HPD conversion submodule and other functional modules, the performance of the video input chip can be improved and protected, and the stability and reliability of the entire system are also improved.

[0120] In yet another optional embodiment, the video output module 103 includes a video output chip, a second DDC processing submodule, a second HPD conversion submodule, a second ESD protection submodule and a current limiting protection submodule, wherein:

[0121] The first end of the video output chip is electrically connected to the first end of the second DDC processing submodule and the first end of the second ESD protection submodule, the first end of the second HPD conversion submodule is electrically connected to the second end of the second ESD protection submodule and the second end of the second DDC processing submodule, the third end of the second DDC processing submodule is electrically connected to the first end of the current limiting protection submodule, and the second end of the video output chip is used to electrically connect to the target display device;

[0122] A video output chip, used to transmit the output video signal to a target display device;

[0123] The second DDC processing submodule is used to improve the driving capability of the video output chip;

[0124] A second HPD conversion submodule, used for performing a level conversion operation on a level signal corresponding to the second DDC processing submodule and a level signal corresponding to the second ESD protection submodule;

[0125] The second ESD protection submodule is used to eliminate the influence of static electricity on the video output chip;

[0126] The current limiting protection submodule is used to prevent the video output chip from short circuiting.

[0127] In this optional embodiment, the video output chip may include an HDMI_A_SM chip. Fig.14 As shown, Fig.14 : is a schematic diagram of the structure of a second DDC processing submodule disclosed in an embodiment of the utility model, wherein the components included in the second DDC processing submodule and the connection relationship between the components can be as follows: Fig.14 As shown, the further second DDC processing submodule may include a DDC processing circuit;

[0128] Further optional, such as Fig.15 As shown, Fig.15 : is a schematic diagram of the structure of a second ESD processing submodule disclosed in an embodiment of the utility model, wherein the components included in the second ESD processing submodule and the connection relationship between the components can be as follows: Fig.15 As shown, the second ESD protection submodule may include an ESD protection circuit;

[0129] Further optional, such as Fig.16 As shown, Fig.16: is a schematic diagram of the structure of a second HPD conversion submodule disclosed in an embodiment of the utility model, wherein the components included in the second HPD conversion submodule and the connection relationship between the components can be as follows: Fig.16 As shown, the second HPD conversion submodule may include an HPD input level conversion circuit.

[0130] In this optional embodiment, optionally, as Fig.17 As shown, Fig.17 : is a schematic diagram of the structure of a current protection submodule disclosed in an embodiment of the utility model, wherein the components included in the current protection submodule and the connection relationship between the components can be as follows Fig.17 As shown, the current protection submodule may include a current limiting short-circuit protection circuit, wherein the current limiting short-circuit protection circuit is an electronic protection circuit, wherein it is intended to limit current and provide protection in the event of a short circuit. Furthermore, the basic principle of the current limiting short-circuit protection circuit is to monitor the magnitude of the current and trigger protection measures when the current exceeds a certain threshold. Furthermore, specific protection measures may include one or more of cutting off power supply, reducing output voltage, and limiting current to prevent excessive current caused by a short circuit from damaging the circuit.

[0131] In this optional embodiment, optionally, the video signal is transmitted to the target video device through the video output chip, and the driving capability of the video output chip is improved through the second DDC processing submodule, and a level conversion operation is performed on the level signal corresponding to the second DDC processing submodule and the level signal corresponding to the ESD protection submodule according to the second HPD conversion submodule, so that the levels between the electronic components are balanced with each other, which can effectively protect the video output chip from being damaged by external high voltage, and can also prevent short circuits and chip burning through the current limiting protection submodule.

[0132] It can be seen that the implementation of this optional embodiment can transmit the output video signal to the target display device through the video output chip, and improve the driving ability of the video output chip through the second DDC processing submodule, perform level conversion operations on the level signal corresponding to the second DDC processing submodule and the level signal corresponding to the second HPD conversion submodule through the second HPD conversion submodule, eliminate the influence of static electricity on the video output chip through the second ESD protection submodule, and prevent the video output chip from short-circuiting and thus burning out the chip through the current limiting protection submodule, and can significantly improve the driving ability of the video output chip through the second DDC processing submodule, which is conducive to making the video signal more stable and more efficiently transmitted to the target display device, and through the second HPD conversion submodule, not only the output level signal of the second DDC processing submodule is realized, but also the level conversion operation of the second DDC processing submodule is realized. The system not only converts the signal, but also processes the level signal of the ESD protection submodule. In this way, the accuracy and integrity of the signal are ensured through double level conversion, so that the whole system can adapt to a variety of different devices or interfaces, greatly improving the compatibility. The second ESD protection submodule provides effective electrostatic protection for the video output chip to prevent the negative impact of external static electricity on the video output chip. Once a short circuit is detected by the current limiting protection submodule, the module can quickly cut off or limit the current to avoid irreversible damage to the chip and other related components. This not only optimizes the transmission and processing of video signals, but also strengthens the protection mechanism of the system, so that it can operate stably and safely in the face of various challenges, thereby achieving the improvement and protection of the performance of the video output chip, while also improving the stability and reliability of the entire system.

[0133] In yet another optional embodiment, the switching processing module 102 further includes a JTAG circuit, an I2C circuit, and a QSPI circuit.

[0134] In this optional embodiment, the switching processing module 102 may optionally include a GSV6705 chip, wherein the GSV6705 is a high-performance, low-power 4-input 1-output HDMI 2.1 repeater. By integrating an enhanced RISC-V-based microcontroller, the GSV6705 provides a cost-effective solution with a time-to-market advantage. It supports data transmission speeds of up to 48Gbps (FRL, 12G / 4Lane) for HDMI receivers and HDMI transmitters.

[0135] In this optional embodiment, optionally, as Fig.18 As shown, Fig.18 : is a schematic diagram of a JTAG circuit disclosed in an embodiment of the utility model, wherein the components included in the JTAG circuit and the connection relationship between the components can be as follows Fig.18As shown, the JTAG circuit is a JTAG (Joint Test Action Group) circuit, which is a standard interface circuit for testing, debugging and programming integrated circuits. It defines a set of pins and their corresponding electrical and logic specifications, so that operations such as testing, debugging and programming can be performed on integrated circuits. JTAG circuits are widely used in the field of chip testing and debugging. The logic circuit inside the chip can be tested and debugged through the JTAG interface to ensure the normal operation of the chip. In addition, the JTAG circuit can also be used for chip programming. The corresponding programming instructions are loaded through the TAP controller to program the internal memory of the chip to configure and upgrade the chip functions. The JTAG circuit can also be used for circuit board cascade debugging. By connecting the JTAG interfaces of multiple devices together, the entire circuit board can be tested and debugged.

[0136] In this optional embodiment, optionally, as Fig.19 As shown, Fig.19 : is a schematic diagram of the structure of an I2C circuit disclosed in an embodiment of the utility model, wherein the components included in the I2C circuit and the connection relationship between the components can be as follows Fig.19 As shown in the figure, the I2C circuit is a serial communication protocol circuit, which is usually used to connect microcontrollers, sensors, memory and other devices. I2C (Inter-Integrated Circuit) is the full name of "interconnect integrated circuit". It was developed by Philips (now NXP Semiconductors) in the early 1980s and has become a standard widely used in communication between electronic devices. The characteristic of the I2C circuit is that it only needs two wires to complete the communication, namely SDA (data line) and SCL (clock line). The SDA line is responsible for connecting data transmission, while the SCL line is used for synchronous data transmission. This circuit is simple, reliable and flexible, and is widely used in various applications. Although the communication speed of I2C is relatively slow, generally around 100kHz or 400kHz, the transmission speed can be increased by adjusting the clock frequency.

[0137] In this optional embodiment, optionally, as Fig. 20 As shown, Fig. 20 : is a schematic diagram of a QSPI circuit disclosed in an embodiment of the utility model, wherein the components included in the QSPI circuit and the connection relationship between the components can be as follows: Fig. 20As shown, the QSPI circuit is a dedicated communication interface circuit that can be used to connect single, dual or quad (data line) SPI Flash storage media. QSPI is the abbreviation of Queued SPI. Compared with the traditional SPI interface, QSPI has a wider range of applications. The QSPI circuit is mainly used to communicate with flash memory chips that support this interface, especially for applications involving a large amount of memory-intensive data (such as multimedia); further, the characteristics of the QSPI circuit include supporting three working modes: indirect mode, status polling mode and memory mapping mode. In indirect mode, QSPI uses its registers to perform all operations; the status polling mode works by periodically reading the external FLASH status register, and an interrupt is generated when a specific flag is set; and the memory mapping mode maps the external FLASH to the address space of the microcontroller, so that the system can regard it as internal memory. In addition, QSPI also supports dual flash mode, can access two FLASH in parallel, send / receive 8-bit data at the same time, and supports SDR (single rate data rate) and DDR (double rate data rate) modes.

[0138] In this optional embodiment, optionally, the GSV6705 chip in the switching processing module 102 performs corresponding target processing operations on the video signal, and can perform separation operations on the four-channel HDMI video signals to obtain corresponding output video signals and output audio signals. The JTAG circuit provides convenience for debugging and testing the switching processing module 102, which can help improve the accuracy and reliability of the output video signals and output audio signals. The I2C circuit can also provide a bidirectional two-wire bus for electronic components in the system, which can improve the flexibility of data exchange and data communication, and thus help improve the performance and response speed of the system. The QSPI circuit can also be used to improve the access method for the external memory, further improving the data transmission efficiency and processing speed.

[0139] It can be seen that the implementation of this optional embodiment can process high-quality video signal transmission through the GSV6705 chip included in the switching processing module 102, which provides cost-effectiveness for the system, which is conducive to ensuring that the video signal can maintain high clarity and smoothness in the switching processing module 102, and provide users with a high-quality visual experience; and the JTAG circuit included in the switching processing module 102 can provide convenience for debugging and testing, and operations such as testing, debugging and programming can be performed on the integrated circuit, which can facilitate developers to easily connect to the target device, detect and repair potential hardware defects, and improve product quality and reliability; and, the I2C circuit included in the switching processing module 102 provides a bidirectional two-wire bus for the connection between the microcontroller and various functional modules in the system, which can facilitate the devices in the system to flexibly communicate and exchange data, and is also conducive to optimizing the overall performance and response speed of the system; and, through the QSPI circuit included in the switching processing module 102, an efficient access method can be provided for the external FLASH memory. Through the QSPI interface system, data can be quickly read and written, thereby improving data transmission efficiency and processing speed, which is particularly important for application scenarios that process large amounts of video data or perform real-time processing. Furthermore, by switching the multiple circuits included in the processing module 102, it is possible to combine high-performance video processing chips and multiple interfaces, flexible communication protocols, and efficient storage access methods, thereby providing the entire system with excellent performance and stability and speed in video data processing and data transmission, and further helping to improve signal compatibility and audio signal quality, thereby enhancing the flexibility and adaptability of the system, and also helping to improve user experience, as well as user comfort, and convenience.

[0140] In yet another optional embodiment, the video signal collected by the video input module 101 includes four HDMI video signals, wherein the switching processing module 102 is used to perform target processing operations on the four HDMI video signals collected by the video input module 101 .

[0141] In this optional embodiment, optionally, the video input module 101 can be used to connect a first HDMI video input module, a second HDMI video input module, a third HDMI video input module, and a fourth HDMI video input module. Further, the video input module can collect video signals corresponding to the first HDMI video input module, the second HDMI video input module, the third HDMI video input module, and the fourth HDMI video input module; for example, the first HDMI video input module can be HDMIIN1, the second HDMI video input module can be HDMIIN2, the third HDMI video input module can be HDMIIN3, and the fourth video input module can be HDMIIN4, and the video input module can collect four HDMI video signals and transmit them to the switching processing module 102 to perform corresponding target processing operations.

[0142] In this optional embodiment, the switching processing module 102 may optionally perform target processing operations on the four HDMI video signals collected by the video input module 101 simultaneously, or may process each HDMI video signal separately, which is not specifically limited in the embodiment of the present invention.

[0143] It can be seen that the implementation of this optional embodiment can enable the simultaneous processing of multiple video sources through four-channel HDMI video signals, which is beneficial to improving the efficiency and intelligence of video processing, and by processing the four-channel HDMI video signals, the flexibility and intelligence of video signal processing can be improved, and the high definition and stability of the processing of the four-channel HDMI video signals can be guaranteed, thereby meeting the user's requirements for efficient processing operations on multiple video sources, and further, the design of collecting four-channel HDMI video signals through the video input module 101 and performing target processing operations on the video signals through the switching processing module 102 brings higher flexibility, scalability, video quality and performance to the system.

[0144] Embodiment 2

[0145] See also Fig.21 , Fig.21 1 is a schematic diagram of the structure of a switch disclosed in an embodiment of the utility model, and the switch includes any audio separation circuit as in Embodiment 1. The detection functions that can be realized by the switch include but are not limited to the separation and de-embedding of audio and video in the video, which is beneficial to improving the intelligence of audio de-embedding and also beneficial to improving the convenience of user use. It should be noted that for the detailed description of the audio separation circuit, please refer to the specific description of the relevant content in Embodiment 1, which will not be repeated in this embodiment.

[0146] It can be seen that implementation Figure 8The switch described can realize the separation and de-embedding of audio and video in a video, which is beneficial to improving the intelligence of audio de-embedding and also beneficial to improving the convenience of user use.

[0147] The audio separation circuit and switch disclosed in the embodiment of the utility model are introduced in detail above. The principle and implementation mode of the utility model are explained in this article by using specific embodiments. However, the above preferred embodiments are not used to limit the utility model. The description of the above embodiments is only used to help understand the method of the utility model and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the utility model, there will be changes in the specific implementation mode and the scope of application without departing from the spirit and scope of the utility model. Therefore, the scope of protection of the utility model is defined by the claims.

Claims

1. An audio separation circuit, characterized in that: The audio separation circuit includes a video input module, a switching processing module, a video output module and an audio output module, wherein: The first end of the video input module is electrically connected to the first end of the switching processing module, the second end of the switching processing module is electrically connected to the first end of the video output module and the first end of the audio output module respectively, the second end of the video output module is used to electrically connect to the target display device, and the second end of the audio output module is used to electrically connect to the target audio device; The video input module is used to collect video signals and transmit the video signals to the switching processing module; The switching processing module is used to perform a target processing operation on the video signal to obtain a target output signal, and output the target output signal to the video output module and the audio output module, wherein the target output signal includes an output video signal and an output audio signal; The video output module is used to transmit the output video signal to the target display device; The audio output module is used to transmit the output audio signal to the target audio device; Furthermore, the audio separation circuit further includes a driving module and a transmitting output module, wherein: The first end of the driving module is electrically connected to the fourth end of the switching processing module, the second end of the driving module is electrically connected to the first end of the transmitting output module, and the second end of the transmitting output module is used to electrically connect to the audio socket interface; The driving module is used to perform a second amplification operation on the target output signal and transmit the target output signal to the transmitting output module; The transmitting output module is used to transmit the target output signal to the audio output device corresponding to the audio socket interface.

2. The audio separation circuit according to claim 1, characterized in that: The audio separation circuit further includes a control module, wherein: The first end of the control module is electrically connected to the third end of the switching processing module; The control module is used to determine the output audio signal format corresponding to the video signal, so that the switching processing module performs the target processing operation on the video signal to obtain an output audio signal matching the audio signal format.

3. The audio separation circuit according to claim 1, characterized in that: The audio separation circuit further includes a signal conversion module, wherein: The first end of the signal conversion module is electrically connected to the second end of the switching processing module, and the second end of the signal conversion module is electrically connected to the first end of the audio output module; The signal conversion module is used to perform a signal type conversion operation on the target output signal to obtain a target output signal that matches the target signal type, and transmit the target output signal to the audio output module.

4. The audio separation circuit according to claim 3, characterized in that: The audio separation circuit further includes a signal amplification module, wherein: The first end of the signal amplification module is electrically connected to the second end of the signal conversion module, and the second end of the signal amplification module is electrically connected to the first end of the audio output module; The signal amplification module is used to perform a first amplification operation on the target output signal to obtain an amplified target output signal, and transmit the target output signal to the audio output module.

5. The audio separation circuit according to claim 1, characterized in that: The video input module includes a video input chip, a first DDC processing submodule, a first ESD protection submodule, and a first HPD conversion submodule, wherein: The first end of the video input chip is electrically connected to the first end of the first DDC processing submodule, the second end of the video input chip is electrically connected to the second end of the first DDC processing submodule and the first end of the first HPD conversion submodule, the third end of the video input chip is electrically connected to the first end of the first ESD protection submodule, and the fourth end of the video input chip is electrically connected to the first end of the switching processing module; The video input chip is used to collect video signals and transmit the video signals to the switching processing module; The first DDC processing submodule is used to improve the driving capability of the video input chip; The first ESD protection submodule is used to eliminate the influence of static electricity on the video input chip; The first HPD conversion submodule is used to perform a level conversion operation on the level signal corresponding to the first DDC processing submodule and the level signal corresponding to the video input chip.

6. The audio separation circuit according to claim 1, characterized in that: The video output module includes a video output chip, a second DDC processing submodule, a second HPD conversion submodule, a second ESD protection submodule and a current limiting protection submodule, wherein: The first end of the video output chip is electrically connected to the first end of the second DDC processing submodule and the first end of the second ESD protection submodule, respectively; the first end of the second HPD conversion submodule is electrically connected to the second end of the second ESD protection submodule and the second end of the second DDC processing submodule, respectively; the third end of the second DDC processing submodule is electrically connected to the first end of the current limiting protection submodule; and the second end of the video output chip is used to electrically connect to a target display device; The video output chip is used to transmit the output video signal to the target display device; The second DDC processing submodule is used to improve the driving capability of the video output chip; The second HPD conversion submodule is used to perform a level conversion operation on the level signal corresponding to the second DDC processing submodule and on the level signal corresponding to the second ESD protection submodule; The second ESD protection submodule is used to eliminate the influence of static electricity on the video output chip; The current limiting protection submodule is used to prevent the video output chip from short circuiting.

7. The audio separation circuit according to claim 1, characterized in that: The switching processing module also includes a JTAG circuit, an I2C circuit and a QSPI circuit.

8. The audio separation circuit according to claim 7, characterized in that: The video signals collected by the video input module include four HDMI video signals, wherein the switching processing module is used to perform the target processing operation on the four HDMI video signals collected by the video input module.

9. A switch, characterized in that: The switch includes an input port for receiving a video signal, and obtains a target output signal through an audio separation circuit as described in any one of claims 1-8, and includes an output port for outputting the target output signal.

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