High-reliability charging module and small high-performance electronic equipment

Abstract

The utility model provides a high-reliability charging module and small high-performance electronic equipment. The high-reliability charging module is provided with a plurality of conduction mounting holes, each conduction mounting hole extends to the outer surface of the high-reliability charging module, and the first components are arranged in the first ends of the conduction mounting holes in a one-to-one correspondence mode; the first heat-conducting insulating coating and the second heat-conducting insulating coating are respectively positioned on two sides of the first component group; each third heat-conducting insulating coating is arranged in a surrounding manner along the outer periphery of the first end of the conduction mounting hole; every two of the first heat-conducting insulating coating, the second heat-conducting insulating coating and the third heat-conducting insulating coating are connected through a corresponding first solder mask coating; any two third heat conduction insulating coatings are connected through the corresponding first solder mask coating. The multi-layer circuit board is low in noise, simple in structure and good in heat dissipation performance, the utilization rate of the first solder resist coating and the utilization rate of the heat conduction insulating coating are both high, and application of small and high-performance electronic equipment is better met.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation of multilayer circuit boards, and in particular to a high-reliability charging module and a small high-performance electronic device. Background Art

[0002] With the continuous advancement of science and technology, the performance requirements of electronic products are getting higher and higher. For example, high-performance computers, game consoles and graphics processors require higher processing speeds and larger storage capacities for their processing centers, namely circuit boards, which means that they will generate a lot of heat during operation. The heat generated will affect the normal operation of electronic products, such as early failure and damage.

[0003] For example, Chinese patent number CN210120692U discloses a multilayer circuit board with high efficiency in heat dissipation, and specifically discloses a core board (1), wherein the lower end surface of the core board (1) is fixedly connected with a heat dissipation coating layer (2), the lower end surface of the heat dissipation coating layer (2) is fixedly connected with a semi-cured board (3), the upper end surface of the core board (1) is fixedly connected with a thermal pad (4), the upper end surface of the thermal pad (4) is penetrated with a through hole (5), the upper end surface of the thermal pad (4) is fixedly installed with a condenser (6), one end of the condenser (6) is provided with a There is a water inlet (7), the other end of the condenser (6) is provided with a water outlet (8), the upper end of the condenser (6) is fixedly connected with a heat dissipation cover (9), the upper end surface of the heat dissipation cover (9) is penetrated with a heat dissipation hole (10), the inside of the core board (1) is fixedly connected with two pins (11), the outer side of the pins (11) is fixedly connected with a sleeve (12), the inner ends of the two pins (11) are fixedly connected with a first heating component (13), and the lower end surface of the first heating component (13) is fixedly connected with a heat conduction block (14). It can be seen that the above-mentioned multi-layer circuit board with high efficiency heat dissipation can prevent heat from directly contacting the circuit board by adding a heat dissipation coating layer, a heat dissipation cover, a heat conduction pad and a condenser, and the first heating component installed in a suspended manner can prevent heat from directly contacting the circuit board, and prevent the heat of the first heating component from being dissipated to the circuit board, so as to achieve high efficiency heat dissipation of the circuit board.

[0004] However, the additional condenser tube usually needs to be equipped with a water pump to circulate the coolant in the condenser tube, and the water pump is prone to generate noise during operation, which cannot meet the application of low-noise environment. In addition, since the height of the condenser tube will increase the volume of the multi-layer circuit board with high efficiency heat dissipation, it cannot better adapt to small high-performance electronic devices, and the structure of the multi-layer circuit board with high efficiency heat dissipation is relatively complex. Utility Model Content

[0005] The purpose of the present invention is to overcome the deficiencies in the prior art and to provide a high-reliability charging module and a small high-performance electronic device with low noise, simple structure, good heat dissipation, and high utilization rate of the first solder resist coating and the thermal conductive insulating coating.

[0006] The purpose of this disclosure is achieved through the following technical solutions:

[0007] A high-reliability charging module, the high-reliability charging module is provided with a plurality of conduction mounting holes, the high-reliability charging module comprises a plurality of core plates and a first component group, the first component group comprises a plurality of first components; the plurality of core plates are stacked in sequence; each of the conduction mounting holes passes through the plurality of core plates in sequence, and each of the conduction mounting holes extends to the outer surface of the high-reliability charging module, and each of the first components is arranged in a one-to-one correspondence in the first end of the conduction mounting hole;

[0008] The high-reliability charging module also includes a first thermally conductive insulating coating, a second thermally conductive insulating coating, a plurality of third thermally conductive insulating coatings and a plurality of first solder resist coatings;

[0009] The first thermally conductive insulating coating and the second thermally conductive insulating coating are respectively located on both sides of the first component group; each of the third thermally conductive insulating coatings is arranged around the outer periphery of the first end of the conductive mounting hole; the first thermally conductive insulating coating, the second thermally conductive insulating coating and each of the third thermally conductive insulating coatings are connected to each other through the corresponding first solder resist coating; any two of the third thermally conductive insulating coatings are connected through the corresponding first solder resist coating.

[0010] In one embodiment, the first thermally conductive insulating coating layer includes a plurality of first thermally conductive insulating sub-layers arranged in a matrix, and first heat dissipation channels crisscrossing each other are formed between adjacent first thermally conductive insulating sub-layers.

[0011] In one embodiment, the second thermally conductive insulating coating layer includes a plurality of second thermally conductive insulating sub-layers arranged in a matrix, and crisscross second heat dissipation channels are formed between each adjacent second thermally conductive insulating sub-layer.

[0012] In one of the embodiments, the third thermally conductive insulating coating forms a preset gap with the outer periphery of the conductive mounting hole, and forms a third heat dissipation channel with the outer periphery of the conductive mounting hole.

[0013] In one embodiment, the thickness of the first thermally conductive insulating coating is 120um to 150um; and / or,

[0014] The thickness of the second thermally conductive insulating coating is 120um to 150um; and / or,

[0015] The plurality of conductive mounting holes are distributed in a matrix; and / or,

[0016] The thickness of the third thermally conductive insulating coating is 120 um to 150 um.

[0017] In one embodiment, the thickness of the first thermally conductive insulating coating layer and the thickness of the second thermally conductive insulating coating layer are both greater than the thickness of the third thermally conductive insulating coating layer.

[0018] In one embodiment, the first thermally conductive insulating coating, the second thermally conductive insulating coating, and the third thermally conductive insulating coating are all HSP thermally conductive insulating ink coatings.

[0019] In one embodiment, honeycomb-shaped through holes are formed in the first thermally conductive insulating coating layer, the second thermally conductive insulating coating layer, and the third thermally conductive insulating coating layer.

[0020] In one embodiment, the high-reliability charging module further includes a fourth thermally conductive insulating coating, a fifth thermally conductive insulating coating, a plurality of sixth thermally conductive insulating coatings, a plurality of second solder resist coatings and a second component group;

[0021] The second components of the second component group are arranged one by one in the second end of the conductive mounting hole, and the fourth thermally conductive insulating coating and the fifth thermally conductive insulating coating are respectively located on both sides of the second component group; each of the sixth thermally conductive insulating coatings is arranged around the outer periphery of the second end of the conductive mounting hole; the fourth thermally conductive insulating coating, the fifth thermally conductive insulating coating and each of the sixth thermally conductive insulating coatings are connected to each other through the corresponding second solder resist coatings; any two of the sixth thermally conductive insulating coatings are connected through the corresponding second solder resist coatings.

[0022] A small high-performance electronic device comprises the high-reliability charging module described in any of the above embodiments.

[0023] Compared with the prior art, the present invention has at least the following advantages:

[0024] 1) Since heat is easily accumulated at the connection between the first component and the core board, the present invention dissipates the heat at the connection between the first component and the core board by surrounding each of the third thermally conductive insulating coatings along the outer periphery of the first end of the conductive mounting hole, so that the third thermally conductive insulating coating is arranged between the plurality of first components and the outer surface of the corresponding conductive mounting hole; at the same time, the heat at the connection between the first component and the core board and the heat of the core board can be dissipated more effectively when used in conjunction with the first thermally conductive insulating coating and the second thermally conductive insulating coating arranged on both sides of the first component group, without the need to add a condenser, and the structure is not only simple but also compact, which better meets the application requirements of small high-performance electronic equipment; and there is no need to configure a water pump, which well meets the application requirements of medium-sized high-performance electronic equipment in a low-noise environment.

[0025] 2) Since the first thermally conductive insulating coating, the second thermally conductive insulating coating and each of the third thermally conductive insulating coatings are connected to each other through the corresponding first solder resist coating, and any two of the third thermally conductive insulating coatings are connected through the corresponding first solder resist coating; the first thermally conductive insulating coating, the second thermally conductive insulating coating, each of the third thermally conductive insulating coatings and each first solder resist coating can be connected to form a protective layer, which effectively reduces the usage of the first solder resist coating or the usage of the thermally conductive insulating coating, thereby improving the utilization rate of the first solder resist coating and the thermally conductive insulating coating. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 This is a schematic diagram of the structure of a high-reliability charging module in one direction according to an embodiment of the utility model;

[0028] Figure 2 A cross-sectional view of a high-reliability charging module according to an embodiment of the utility model;

[0029] Figure 3 for Figure 2 A partial enlarged view shown in the middle.

[0030] Figure markings: 10, high-reliability charging module; 100, core board; 120, conductive mounting hole; 130, adhesive layer; 140, copper base layer; 200, first component; 300, first thermally conductive insulating coating; 310, first heat dissipation channel; 320, first thermally conductive insulating sublayer; 400, second thermally conductive insulating coating; 410, second heat dissipation channel; 420, second thermally conductive insulating sublayer; 500, third thermally conductive insulating coating; 510, third heat dissipation channel; 600, first solder resist coating; 700, fourth thermally conductive insulating coating; 800, fifth thermally conductive insulating coating; 900, sixth thermally conductive insulating coating; 910, second solder resist coating; 920, second component. DETAILED DESCRIPTION

[0031] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.

[0032] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0034] In order to better understand the technical solutions and beneficial effects of the present invention, the present invention is further described in detail below in conjunction with specific embodiments:

[0035] like Figures 1 to 3As shown, a high-reliability charging module 10 of an embodiment is provided with a plurality of conductive mounting holes 120. The high-reliability charging module 10 includes a plurality of core plates 100 and a first component group 200. The first component group 200 includes a plurality of first components 200. The plurality of core plates 100 are stacked in sequence. Each of the conductive mounting holes 120 passes through the plurality of core plates 100 in sequence, and each of the conductive mounting holes 120 extends to the outer surface of the high-reliability charging module 10. Each of the first components 200 is disposed in a one-to-one correspondence in the first end of the conductive mounting hole 120. The high The reliability charging module 10 also includes a first thermally conductive insulating coating 300, a second thermally conductive insulating coating 400, a plurality of third thermally conductive insulating coatings 500 and a plurality of first solder resist coatings 600; the first thermally conductive insulating coating 300 and the second thermally conductive insulating coating 400 are respectively located on both sides of the first component 200; each of the third thermally conductive insulating coatings 500 is arranged around the outer periphery of the first end of the conductive mounting hole 120; the first thermally conductive insulating coating 300, the second thermally conductive insulating coating 400 and each of the third thermally conductive insulating coatings 500 are connected in pairs through the corresponding first solder resist coatings 600; any two of the third thermally conductive insulating coatings 500 are connected through the corresponding first solder resist coatings 600.

[0036] It can be understood that since the multiple core plates 100 are stacked in sequence, each of the conductive mounting holes 120 passes through the multiple core plates 100 in sequence, and each of the conductive mounting holes 120 extends to the outer surface of the high-reliability charging module 10 to achieve a multi-layer structure of the high-reliability charging module 10, thereby ensuring the high performance of the high-reliability charging module 10; since each first component 200 is arranged one by one in the first end of the conductive mounting hole 120, conduction between the multiple first components 200 and the conductive mounting hole 120 is achieved; in actual applications, heat is usually easily accumulated at the connection between the first component 200 and the core plate 100, and the present disclosure provides a conductive mounting hole 50 along the conductive mounting hole in each of the third thermally conductive insulating coatings 500. The outer periphery of the first end of 120 is arranged around, so that a third thermally conductive insulating coating 500 is arranged between the plurality of first components 200 and the outer surface of the corresponding conductive mounting hole 120, so that the heat at the connection between the first component 200 and the core board 100 can be dissipated; at the same time, in conjunction with the first thermally conductive insulating coating 300 and the second thermally conductive insulating coating 400 arranged on both sides of the first component group, the heat at the connection between the first component 200 and the core board 100 and the heat of the core board 100 can be dissipated more effectively, without the need to add a condenser, which is not only simple in structure, but also compact in structure, which better meets the application of small high-performance electronic equipment; and there is no need to configure a water pump, which well meets the application of medium-sized high-performance electronic equipment in a low-noise environment.

[0037] Furthermore, since the first thermally conductive insulating coating 300, the second thermally conductive insulating coating 400 and each of the third thermally conductive insulating coatings 500 are connected to each other through the corresponding first solder resist coating 600, any two of the third thermally conductive insulating coatings 500 are connected through the corresponding first solder resist coating 600; the first thermally conductive insulating coating 300, the second thermally conductive insulating coating 400, each of the third thermally conductive insulating coatings 500 and each first solder resist coating 600 can be connected to form a protective layer, which effectively reduces the usage of the first solder resist coating 600 or the usage of the thermally conductive insulating coating, thereby improving the utilization rate of the first solder resist coating 600 and the thermally conductive insulating coating.

[0038] like Figure 2 and Figure 3As shown, in one embodiment, each adjacent core board 100 is fixed by adhesive layer 130 to achieve the fixation of multiple core boards 100. In one embodiment, a copper base layer 140 is provided on the front of the high-reliability charging module 10, and the conductive mounting hole 120 passes through the surface of the copper base layer 140, so that the addition of the copper base layer 140 is conducive to the production of the circuit layer, and the high performance of the high-reliability charging module 10 is better improved. Similarly, a copper base layer 140 of a similar structure is provided on the back of the high-reliability charging module 10, which further improves the high performance of the high-reliability charging module 10. Specifically, the copper base layer 140 is bonded to the outermost core board 100.

[0039] like Figure 1 and Figure 2 As shown, in one embodiment, the first thermally conductive insulating coating 300 includes a plurality of first thermally conductive insulating sublayers 320 arranged in a matrix, and a criss-crossing first heat dissipation channel 310 is formed between each adjacent first thermally conductive insulating sublayer 320, so as to enable the first thermally conductive insulating coating 300 to quickly dissipate heat from the core board 100 and the plurality of first components 200.

[0040] Similarly, the second thermally conductive insulating coating 400 also has the same structure. Specifically, the second thermally conductive insulating coating 400 includes a plurality of second thermally conductive insulating sublayers 420 arranged in a matrix, and a criss-cross second heat dissipation channel 410 is formed between each adjacent second thermally conductive insulating sublayer 420, so as to achieve rapid heat dissipation of the core board 100 and the plurality of first components 200 by the second thermally conductive insulating coating 400.

[0041] like Figure 1 As shown, in one embodiment, the third thermally conductive insulating coating 500 forms a preset gap with the outer periphery of the conductive mounting hole 120, and forms a third heat dissipation channel 510 with the outer periphery of the conductive mounting hole 120. It can be understood that the additional preset gap can ensure the conductivity of the connection between the first component 200 and the conductive mounting hole 120 on the one hand, and effectively avoid the poor connection between the first component 200 and the conductive mounting hole 120; on the other hand, the additional preset gap enables the first component 200 to form a third heat dissipation channel 510 with the third thermally conductive insulating coating 500 when installed in the conductive mounting hole 120, thereby improving the heat dissipation at the connection between the first component 200 and the conductive mounting hole 120. Specifically, the welding portion of the first component 200 is embedded in the first end of the conductive mounting hole 120, and the processing portion of the first component 200 forms the third heat dissipation channel 510 with the third thermally conductive insulating coating 500.

[0042] In one embodiment, the thickness of the first thermally conductive insulating coating 300 is 120um to 150um; to ensure that when the thickness of the first thermally conductive insulating coating 300 is less than 30um, it can meet the rapid heat dissipation of the core board 100 and multiple first components 200, and effectively avoid the first thermally conductive insulating coating 300 being thicker and causing the high-reliability charging module 10 to become thicker and unable to adapt to the application of small high-performance electronic devices. Similarly, the thickness of the second thermally conductive insulating coating 400 and the thickness of the third thermally conductive insulating coating 500 are the same, that is, the thickness of the second thermally conductive insulating coating 400 is 120um to 150um; the thickness of the third thermally conductive insulating coating 500 is to better adapt to the application of small high-performance electronic devices.

[0043] In one embodiment, the plurality of conductive mounting holes 120 are distributed in a matrix; on the one hand, the plurality of first components 200 can better meet higher processing speeds and larger storage containers, thereby better meeting the high performance requirements of small high-performance electronic devices; on the other hand, it is beneficial for the plurality of first components 200 to quickly dissipate heat.

[0044] In one embodiment, the thickness of the first thermally conductive insulating coating 300 and the thickness of the second thermally conductive insulating coating 400 are both greater than the thickness of the third thermally conductive insulating coating 500. It can be understood that, since the thickness of the first thermally conductive insulating coating 300 and the thickness of the second thermally conductive insulating coating 400 are both greater than the thickness of the third thermally conductive insulating coating 500, when the first component 200 is installed in the first end of the conductive mounting hole 120, the orthographic projections of the first thermally conductive insulating coating 300 and the second thermally conductive insulating coating 400 are located on the first component 200, thereby achieving rapid heat dissipation on both sides of the first component 200.

[0045] In one embodiment, the first thermally conductive insulating coating 300, the second thermally conductive insulating coating 400 and the third thermally conductive insulating coating 500 are all HSP thermally conductive insulating ink coatings. It can be understood that since the HSP thermally conductive insulating ink coating has thermal conductivity, insulation performance and enhances the mechanical strength of the core board 100, it not only achieves the thermal conductivity and insulation performance of the first thermally conductive insulating coating 300, the second thermally conductive insulating coating 400 and the third thermally conductive insulating coating 500, but also improves the mechanical properties of the high-reliability charging module 10.

[0046] It should be noted that the HSP thermal conductive insulating ink coating disclosed in the present invention is a known material, which only protects the connection relationship between it and the core board 100 and the first component 200, and does not protect its specific formula. The HSP thermal conductive insulating ink coating can be a HSP 4A series heat dissipation ink component, which can be purchased from Peters E80315. Of course, those skilled in the art can also choose inks with the same heat dissipation and insulation properties.

[0047] In one embodiment, honeycomb-shaped through holes are formed in the first thermally conductive insulating coating 300, the second thermally conductive insulating coating 400 and the third thermally conductive insulating coating 500. The additional honeycomb-shaped through holes can better dissipate the heat of the core board 100 and the first component 200.

[0048] like Figure 2 As shown, in one embodiment, the high-reliability charging module 10 also includes a fourth thermally conductive insulating coating 700, a fifth thermally conductive insulating coating 800, a plurality of sixth thermally conductive insulating coatings 900, a plurality of second solder resist coatings 910 and a second component group, and the second component group includes a plurality of second components 920; each of the second components 920 is arranged one by one in the second end of the conductive mounting hole 120, and the fourth thermally conductive insulating coating 700 and the fifth thermally conductive insulating coating 800 are respectively located on both sides of the second component group; each of the sixth thermally conductive insulating coatings 900 is arranged around the outer periphery of the second end of the conductive mounting hole 120; the fourth thermally conductive insulating coating 700, the fifth thermally conductive insulating coating 800 and each of the sixth thermally conductive insulating coatings 900 are connected to each other through the corresponding second solder resist coatings 910; any two of the sixth thermally conductive insulating coatings 900 are connected through the corresponding second solder resist coatings 910.

[0049] It can be understood that the additional multiple second components 920 can further improve the high performance of the high-reliability charging module 10, and the additional fourth thermal conductive insulating coating 700, the fifth thermal conductive insulating coating 800, and the multiple sixth thermal conductive insulating coatings 900 can better dissipate the heat of the core board 100, the second components 920, and the connection between the second component 920 and the second end of the conductive mounting hole 120, so as to better meet the application of small high-performance electronic devices, and reduce the use of the second solder resist coating 910, thereby improving the utilization rate of the second solder resist coating 910. Furthermore, when the middle part of the conductive mounting hole 120 is not filled, the heat in the middle part of the conductive mounting hole 120 can be well dissipated to both ends, thereby improving the heat dissipation inside the core board 100.

[0050] The present disclosure also provides a small high-performance electronic device, including the high-reliability charging module 10 described in any of the above embodiments. It can be understood that the small high-performance electronic device also includes a shell, and a heat-conducting and heat-dissipating layer is also provided in the shell. The high-reliability charging module 10 is located in the shell, so that the additional heat-conducting and heat-dissipating layer can better dissipate the heat of the first thermal conductive insulating coating 300, the second thermal conductive insulating coating 400, the third thermal conductive insulating coating 500, the fourth thermal conductive insulating coating 700, the fifth thermal conductive insulating coating 800 and the sixth thermal conductive insulating coating 900, thereby achieving faster heat dissipation of the small high-performance electronic device. Specifically, the thermal conductive heat dissipation layer can be a thermal conductive silicone layer.

[0051] Compared with the prior art, the present invention has at least the following advantages:

[0052] 1) Since heat is easily accumulated at the connection between the first component 200 and the core board 100, the present invention arranges each of the third thermally conductive insulating coatings 500 around the outer periphery of the first end of the conductive mounting hole 120, so that the third thermally conductive insulating coating 500 is arranged between the plurality of first components 200 and the outer surface of the corresponding conductive mounting hole 120, thereby dissipating the heat at the connection between the first component 200 and the core board 100; at the same time, in conjunction with the first thermally conductive insulating coating 300 and the second thermally conductive insulating coating 400 arranged on both sides of the first component group, the heat at the connection between the first component 200 and the core board 100 and the heat of the core board 100 can be dissipated more effectively, without the need to add a condenser, and the structure is not only simple, but also compact, which better meets the application of small high-performance electronic equipment; and there is no need to configure a water pump, which well meets the application of medium-sized high-performance electronic equipment in a low-noise environment.

[0053] 2) Since the first thermally conductive insulating coating 300, the second thermally conductive insulating coating 400 and each of the third thermally conductive insulating coatings 500 are connected to each other through the corresponding first solder resist coating 600, any two of the third thermally conductive insulating coatings 500 are connected through the corresponding first solder resist coating 600; the first thermally conductive insulating coating 300, the second thermally conductive insulating coating 400, each of the third thermally conductive insulating coatings 500 and each first solder resist coating 600 can be connected to form a protective layer, which effectively reduces the usage of the first solder resist coating 600 or the usage of the thermally conductive insulating coating, thereby improving the utilization rate of the first solder resist coating 600 and the thermally conductive insulating coating.

[0054] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the patent of the present disclosure shall be based on the attached claims.

Claims

1. A high-reliability charging module, the high-reliability charging module is provided with a plurality of conductive mounting holes, the high-reliability charging module comprises a plurality of core plates and a first component group, the first component group comprises a plurality of first components, the plurality of core plates are stacked in sequence, each of the conductive mounting holes penetrates through the plurality of core plates in sequence, and each of the conductive mounting holes extends to the outer surface of the high-reliability charging module; each of the first components is arranged in a one-to-one correspondence in the first end of the conductive mounting hole; it is characterized in that: The high-reliability charging module also includes a first thermally conductive insulating coating, a second thermally conductive insulating coating, a plurality of third thermally conductive insulating coatings and a plurality of first solder resist coatings; The first thermally conductive insulating coating and the second thermally conductive insulating coating are respectively located on two sides of the first component group; Each of the third thermally conductive insulating coatings is disposed around the outer periphery of the first end of the conductive mounting hole; the first thermally conductive insulating coating, the second thermally conductive insulating coating and each of the third thermally conductive insulating coatings are connected in pairs through the corresponding first solder resist coating; Any two of the third thermally conductive insulating coatings are connected via the corresponding first solder resist coatings.

2. The high reliability charging module according to claim 1, characterized in that: The first thermally conductive insulating coating layer includes a plurality of first thermally conductive insulating sub-layers arranged in a matrix, and first heat dissipation channels crisscrossing each other are formed between adjacent first thermally conductive insulating sub-layers.

3. The high reliability charging module according to claim 1, characterized in that: The second thermally conductive insulating coating layer includes a plurality of second thermally conductive insulating sub-layers arranged in a matrix, and crisscross second heat dissipation channels are formed between each adjacent second thermally conductive insulating sub-layer.

4. The high reliability charging module according to claim 1, characterized in that: The third thermally conductive insulating coating forms a preset gap with the outer periphery of the conductive mounting hole, and forms a third heat dissipation channel with the outer periphery of the conductive mounting hole.

5. The high reliability charging module according to claim 1, characterized in that: The thickness of the first thermally conductive insulating coating is 120um to 150um; and / or, The thickness of the second thermally conductive insulating coating is 120um to 150um; and / or, The plurality of conductive mounting holes are distributed in a matrix; and / or, The thickness of the third thermally conductive insulating coating is 120 um to 150 um.

6. The high reliability charging module according to claim 5, characterized in that: The thickness of the first thermally conductive insulating coating layer and the thickness of the second thermally conductive insulating coating layer are both greater than the thickness of the third thermally conductive insulating coating layer.

7. The high reliability charging module according to claim 1, characterized in that: The first thermally conductive insulating coating, the second thermally conductive insulating coating and the third thermally conductive insulating coating are all HSP thermally conductive insulating ink coatings.

8. The high reliability charging module according to claim 1, characterized in that: Honeycomb-shaped through holes are formed in the first thermally conductive insulating coating layer, the second thermally conductive insulating coating layer and the third thermally conductive insulating coating layer.

9. The high reliability charging module according to any one of claims 1 to 8, characterized in that: The high-reliability charging module also includes a fourth thermally conductive insulating coating, a fifth thermally conductive insulating coating, a plurality of sixth thermally conductive insulating coatings, a plurality of second solder resist coatings and a second component group; The second components of the second component group are arranged in a one-to-one correspondence in the second end of the conductive mounting hole, the fourth thermally conductive insulating coating and the fifth thermally conductive insulating coating are respectively located on both sides of the second component group; each of the sixth thermally conductive insulating coatings is arranged around the outer periphery of the second end of the conductive mounting hole; the fourth thermally conductive insulating coating, the fifth thermally conductive insulating coating and each of the sixth thermally conductive insulating coatings are connected to each other through the corresponding second solder resist coating; Any two of the sixth thermally conductive insulating coatings are connected via the corresponding second solder resist coatings.

10. A small high-performance electronic device, characterized in that: A high-reliability charging module comprising any one of claims 1 to 9.

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