Copper-clad plate

Abstract

In order to solve the problems that in the prior art, after a copper-clad plate is cured, the dielectric constant cannot be adjusted, and power-on and power-on signals cannot be met, the copper-clad plate comprises a dielectric copper plate and a film, a circuit pattern is formed on the dielectric copper plate, and the film is arranged on the dielectric copper plate and at least partially covers the circuit pattern. The circuit pattern is provided with a power-on area and a signal transmission area, the dielectric constant of the film corresponding to the power-on area is 1.0-10000, and the dielectric constant of the film corresponding to the signal transmission area is 1.0-10000. According to the copper-clad plate provided by the utility model, laser processing is carried out at the positions, corresponding to the electrifying region and the signal transmission region, of the film (single-layer film layer or N-layer film layer), and the molecular chain reaction of the film (single-layer film layer or N-layer film layer) is controlled through temperature control of laser and polymerization reaction of ions, so that the electrical matching problem of material performance is changed; and requirements of electrification and signal transmission in different areas of the copper-clad plate are met.

Description

Technical Field

[0001] The utility model belongs to the technical field of integrated circuit processing and manufacturing, and specifically relates to a copper clad plate. Background Art

[0002] Circuit boards generally include components such as integrated circuits, fine-tuning capacitors and printed circuit boards, and copper clad laminates are an important component of printed circuit boards. Copper clad laminates are generally composed of a substrate, an insulating dielectric layer and a conductive layer.

[0003] At present, glass fiber cloth materials are generally used in the preparation of copper clad laminates, and a single resin is used as a base for solidification. After solidification, the dielectric constant and dielectric loss of the entire copper clad laminate cannot be changed.

[0004] With the application of 5G / 6G signals, the copper clad laminate of the circuit board requires a mixed pressure / integrated setting. The mixed pressure preparation process of the copper clad laminate is relatively complicated and the prepared copper clad laminate either has too high loss or too high or too low dielectric constant (εr), which is not conducive to the adjustment of the dielectric constant of the copper clad laminate. There is a problem of mismatching signal transmission requirements and power consumption, so that the final circuit board product cannot meet the needs of market applications. Utility Model Content

[0005] The technical problem to be solved by the utility model is to provide a copper clad laminate for the problem that the dielectric constant of the copper clad laminate in the prior art cannot be adjusted after curing and cannot meet the power-on and signal-passing requirements.

[0006] The technical solution adopted by the utility model to solve the above technical problems is as follows:

[0007] A copper clad laminate is provided, comprising a dielectric copper plate and a film, wherein a circuit pattern is formed on the dielectric copper plate, the film is arranged on the dielectric copper plate and at least partially covers the circuit pattern, a power-on area and a signal transmission area are arranged on the circuit pattern, a dielectric constant on the film corresponding to the power-on area is 1.0 to 10000, and a dielectric constant on the film corresponding to the signal transmission area is 1.0 to 10000.

[0008] Optionally, the dielectric constant of the film corresponding to the energized area is 1.05 to 9998, and the dielectric constant of the film corresponding to the signal transmission area is 1.05 to 9998.

[0009] Optionally, the dielectric copper plate includes a substrate and a plurality of copper layers, the plurality of copper layers are arranged on one side or both sides of the substrate, and the circuit pattern is formed by the plurality of copper layers.

[0010] Optionally, there are multiple films, and the films are located between multiple copper layers and / or the films are located outside the copper layers.

[0011] Optionally, the substrate and / or the film are provided with via holes, and inner walls of the via holes are covered with copper to electrically connect different copper layers.

[0012] Optionally, the film includes at least one of a first film layer, a second film layer, and a third film layer, the first film layer includes a hydrocarbon resin layer, the second film layer includes an epoxy resin layer, and the third film layer includes a polytetrafluoroethylene layer.

[0013] Optionally, the dielectric constant of the first film layer is 2.4-22.

[0014] Optionally, the dielectric constant of the second film layer is 3.0-6.5.

[0015] Optionally, the dielectric constant of the third film layer is 1.8-30.

[0016] Optionally, the thickness of the first film layer is 0.01 mm to 2 mm, the thickness of the second film layer is 0.01 mm to 2 mm, and the thickness of the third film layer is 0.01 mm to 2 mm.

[0017] The copper clad laminate provided by the present application has a circuit pattern arranged on the dielectric copper plate and is correspondingly arranged into a single or multiple power-on areas and signal transmission areas, the film is arranged on the dielectric copper plate and at least partially covers the circuit pattern, and laser processing is performed on the film at positions corresponding to the power-on areas and signal transmission areas, respectively. After the processing, the original properties of the film are changed, that is, the molecular chain reaction of the film is controlled by laser processing to achieve the electrical matching problem of changing the material performance, thereby meeting the needs of powering and transmitting signals in different areas of the copper clad laminate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of the dielectric copper plate provided by the utility model;

[0019] Figure 2 It is a schematic diagram of the structure of a copper clad laminate provided in one embodiment of the utility model.

[0020] The reference numerals in the drawings of the specification are as follows:

[0021] 1. Dielectric copper plate; 11. Substrate; 12. Copper layer; 13. Power-on area; 14. Signal transmission area; 2. Film; 21. First film layer; 22. Second film layer; 23. Third film layer. DETAILED DESCRIPTION

[0022] In order to make the technical problems, technical solutions and beneficial effects solved by the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0023] In the description of the present invention, it should be understood that the terms "longitudinal", "radial", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0024] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] An embodiment of the utility model provides a copper clad laminate, comprising a dielectric copper plate 1 and a film 2, wherein a circuit pattern is formed on the dielectric copper plate 1, the film 2 is arranged on the dielectric copper plate 1 and at least partially covers the circuit pattern, a power-on area 13 and a signal transmission area 14 are arranged on the circuit pattern, a dielectric constant on the film 2 corresponding to the power-on area 13 is 1.0 to 10000, and a dielectric constant on the film 2 corresponding to the signal transmission area 14 is 1.0 to 10000.

[0026] The dielectric constant (εr) is a key parameter for measuring the insulation performance and charge binding ability of a material. Piezoelectric elements for different purposes have different requirements for the dielectric constant of piezoelectric materials, which means that the size of the dielectric constant is directly related to the application performance of the material in electrical engineering. For copper-clad laminates formed by solidification with a single resin as the base, the dielectric constant and dielectric loss of the entire copper-clad laminate cannot be changed once solidified.

[0027] With the application of 5G / 6G signals, the copper clad laminate of the circuit board requires a mixed pressure / integrated setting. The mixed pressure preparation process of the copper clad laminate is relatively complicated and the prepared copper clad laminate either has too high loss or too high or too low dielectric constant, which is not conducive to the adjustment of the dielectric constant of the copper clad laminate. There is a problem of mismatching signal transmission requirements and power consumption, so that the final circuit board product cannot meet the needs of market applications.

[0028] The copper clad laminate provided in the present application has a circuit pattern arranged on the dielectric copper plate 1 and is correspondingly arranged into a single or multiple power-on areas 13 and a signal transmission area 14; the film 2 is arranged on the dielectric copper plate 1 and at least partially covers the circuit pattern; laser treatment is performed on the film 2 at positions corresponding to the power-on areas 13 and the signal transmission areas 14, respectively; and the original characteristics of the film 2 are changed after the treatment, that is, the molecular chain reaction of the film 2 is controlled by laser treatment to achieve the electrical matching problem of the performance of the film 2, thereby meeting the requirements of powering and signal transmission in different areas of the copper clad laminate.

[0029] Specifically, laser processing is performed at positions of the film 2 corresponding to the power-on area 13 and the signal transmission area 14, respectively. The high energy density of the laser is used to accurately act on the film 2, triggering a series of physical and chemical reactions, thereby realizing regulation of the performance of the film 2 to meet the needs of powering and transmitting signals in different areas of the copper clad laminate. Specifically, when the high-energy laser beam of the laser is irradiated onto the surface of the film 2, its high energy can quickly heat the material to cause a curing reaction in the material. On the other hand, the energy of the laser can break the chemical bonds inside the film 2, triggering the film 2 to produce a corresponding chemical reaction, changing the chemical structure of the material, and then by changing the electrical matching of the material, the needs of powering and transmitting signals in different areas of the same copper clad laminate can be met.

[0030] In one embodiment, the dielectric constant of the film 2 corresponding to the energized area 13 is 1.05-9998, and the dielectric constant of the film 2 corresponding to the signal transmission area 14 is 1.05-9998.

[0031] Reference Figure 1 In one embodiment, the dielectric copper plate 1 includes a substrate 11 and a plurality of copper layers 12 , wherein the plurality of copper layers 12 are arranged on one side or both sides of the substrate 11 , and the circuit pattern is formed by the plurality of copper layers 12 .

[0032] Specifically, the substrate 11 and the copper layer 12 described in the present application constitute the dielectric copper plate 1. Since a circuit pattern is provided on the copper layer 12, a plurality of the copper layers 12 are provided on one side or both sides of the substrate 11 to form a conductive path of the circuit. The substrate 11 is generally an insulating layer or a dielectric layer, which is composed of a polymer synthetic resin material and plays the role of electrical insulation and supporting the copper layer 12.

[0033] Specifically, the preparation process of the circuit pattern on the copper layer includes one of chemical etching and industrial manufacturing methods. Chemical etching is to cover the copper layer with a photosensitive material (such as a photosensitive glue or an anti-etching dry film), expose the circuit pattern on the photosensitive material through a negative film, develop and solidify to form an anti-etching layer, and use a chemical etchant to remove the portion of the copper layer not protected by the anti-etching layer to form a circuit pattern. Chemical etching is suitable for circuit board production with high precision requirements; the industrial manufacturing method is to open circuit holes and then coat the film, and then expose and develop. Industrial manufacturing is suitable for large-scale circuit board production. Specifically, the preparation of the circuit pattern can select the corresponding preparation process according to the preparation requirements.

[0034] Specifically, the substrate 11 may be made of a paper substrate, a glass fiber board, a composite substrate, a metal substrate or a ceramic substrate.

[0035] In one embodiment, there are multiple films 2 , and the films 2 are located between multiple copper layers 12 and / or the films 2 are located outside the copper layer 12 .

[0036] Specifically, a single layer, two layers or multiple layers of film 2 can be selectively provided according to the preparation requirements of the copper clad laminate; in a preferred embodiment of the present invention, the film 2 is provided on the outer side of the copper layer 12 (such as Figure 2 ) to correspond to the power-on area 13 and the signal transmission area 14 on the copper layer 12.

[0037] In one embodiment, via holes are provided on the substrate 11 and / or the film 2 , and copper is attached to the inner wall of the via holes to electrically connect different copper layers 12 .

[0038] Specifically, the via holes are mainly used for circuit conduction. The via holes penetrate the corresponding areas on the substrate 11 or the film 2, and copper is attached to the inner wall of the via holes, thereby meeting the requirement that the electrical connections of each layer can be interconnected.

[0039] In one embodiment, the film 2 includes at least one of a first film layer 21, a second film layer 22, and a third film layer 23, wherein the first film layer 21 includes a hydrocarbon resin layer, the second film layer 22 includes an epoxy resin layer, and the third film layer 23 includes a polytetrafluoroethylene layer.

[0040] The film 2 is located between the copper layers 12 and / or the film 2 is located outside the copper layer 12; specifically, refer to Figure 2 The film 2 is located on both sides of the copper layer 12. The film 2 can be a multi-layer stack of a first film layer 21, a second film layer 22 and a third film layer 23, or any one or two of the first film layer 21, the second film layer 22 and the third film layer 23 can be selected.

[0041] In addition, the film 2 may further include a fourth film layer, a fifth film layer, a sixth film layer, a seventh film layer and an eighth film layer, wherein the fourth film layer includes a polyimide layer, the fifth film layer includes a thermosetting cyanate resin layer, the sixth film layer includes a polyphenylene ether resin layer, the seventh film layer includes a liquid crystal polymer layer, and the eighth film layer includes an Ajinomoto stacking layer;

[0042] That is, the first film layer to the eighth film layer described in the present application are only partial structures of the film 2 provided by the present invention. The specific number of film layers is not limited thereto and should not be understood as a limitation to the present invention. In addition, the film 2 in the copper clad laminate can also be stacked with N layers of film layers on this basis. When preparing the copper clad laminate, the number of film layers, the type of film, and the order of placement when multiple layers of film are selected can be selected according to the size of the dielectric constants of the components and circuits carried in the specific preparation process. Appropriate film layers and types of film layers can be selected.

[0043] Specifically, different medium matching films are used in the preparation of the copper clad laminate, and the films and original properties are changed through laser curing, so that the layers that cannot form signal matching can achieve electrical conduction and signal transmission after processing.

[0044] Specifically, the main function of the first film layer 21 and / or the second film layer 22 and / or the third film layer 23 on the copper clad laminate is to adjust the dielectric constant of a single or multiple power-on areas 13 and a signal transmission area 14 set on the copper layer 12 after laser modification. Since the dielectric constants of the components and circuits carried in the specific preparation process are different, matching film layers are selected for different circuit board products to achieve adjustable dielectric constants after the copper clad laminate is cured. In addition, when multiple film layers are set, low-temperature laser curing can be performed first to allow the film layers to be bonded and fixed, and then the power-on and signal-transmitting areas can be heated and cured again. The molecular chain reaction of the film layer of the film 2 is controlled by laser processing to achieve the change of the electrical matching problem of the film 2 and meet the power-on and signal transmission requirements of different areas.

[0045] Specifically, the hydrocarbon resin film layer mainly includes hydrocarbon resin material. As a polymer material, hydrocarbon resin has excellent electrical properties and thermal stability. When making high-frequency and high-speed copper-clad laminates, hydrocarbon resin can provide good electrical insulation and low dielectric constant, which is beneficial to improving the signal transmission speed of the circuit and reducing energy consumption. In addition, hydrocarbon resin can also be used in combination with other types of resins to further improve the performance of the material. The epoxy resin in the epoxy resin film layer is a multifunctional thermosetting polymer, which mainly plays a bonding role in the copper-clad laminate. The polytetrafluoroethylene The polytetrafluoroethylene in the film layer has good dielectric properties, chemical corrosion resistance and heat resistance, and can maintain a small change in dielectric constant and dielectric loss within a high frequency range, which is beneficial to improving signal transmission efficiency; the aforementioned Ajinomoto stacking layer (ABF), also known as Ajinomoto stacking layer, is a film made of highly insulating resin synthetic materials, namely aromatic benzocyclobutane film, the main component of which is benzocyclobutane monomer. In addition, the ABF material also contains some auxiliary components, such as solvents, stabilizers, hardeners, etc.; benzocyclobutane monomer is a compound with aromaticity and cyclic structure, and its molecular formula is C 14 H 12 , has high thermal stability and chemical stability, is not easy to decompose and deteriorate, can withstand harsh environments such as high temperature and high humidity, and at the same time, benzocyclobutane monomer also has good mechanical and electrical properties, so it can be used to manufacture high-performance circuit substrates. According to the requirements for the performance of the prepared copper-clad laminate, one or more layers of the first film layer 21, the second film layer 22, the third film layer 23, the fourth film layer, the fifth film layer, the sixth film layer, the seventh film layer and the eighth film layer can be selected. When multiple film layers are selected, their stacking order can also be set according to the performance requirements of the copper-clad laminate.

[0046] In one embodiment, the dielectric constant of the first film layer 21 is 2.4-22.

[0047] In one embodiment, the dielectric constant of the second film layer 22 is 3.0-6.5.

[0048] In one embodiment, the dielectric constant of the third film layer 23 is 1.8-30.

[0049] Specifically, the dielectric constants of the first film layer 21, the second film layer 22 and the third film layer 23 of the present application are different. Therefore, when preparing the copper clad laminate, the film layer with the corresponding dielectric constant can be selected for preparation according to the electrical requirements of the prepared copper clad laminate, thereby achieving the adjustable dielectric constant of a single or multiple regions on the copper clad laminate.

[0050] In one embodiment, the thickness of the first film layer 21 is 0.01 mm to 2 mm, the thickness of the second film layer 22 is 0.01 mm to 2 mm, and the thickness of the third film layer 23 is 0.01 mm to 2 mm.

[0051] Specifically, when setting the thickness of the film 2, on the one hand, it is necessary to set it according to the preset total thickness of the preparation mold, and on the other hand, it is necessary to consider the relationship between thickness and laser curing (when the film thickness is thicker, the corresponding laser time needs to be extended accordingly) to prevent the film 2 from being too thick or too thin and affecting the overall performance of the copper clad laminate.

[0052] Specifically, the thickness of the first film layer 21 can be 0.01mm, 0.05mm, 0.15mm, 0.20mm, 0.25mm, 0.35mm, 0.40mm, 0.50mm, 0.60mm, 0.70mm, 0.80mm, 0.90mm, 1.00mm, 1.30mm, 1.50mm, 1.80mm or 2.00mm; the thickness of the second film layer 22 can be 0.01mm, 0.05mm, 0.15mm, 0.20mm, 0.25mm, 0.35mm, 0.40mm, the thickness of the third film layer 23 is 0.01mm, 0.05mm, 0.15mm, 0.20mm, 0.25mm, 0.35mm, 0.40mm, 0.50mm, 0.60mm, 0.70mm, 0.80mm, 0.90mm, 1.00mm, 1.30mm, 1.50mm, 1.80mm or 2.00mm; the thickness of the third film layer 23 is 0.01mm, 0.05mm, 0.15mm, 0.20mm, 0.25mm, 0.35mm, 0.40mm, 0.50mm, 0.60mm, 0.70mm, 0.80mm, 0.90mm, 1.00mm, 1.30mm, 1.50mm, 1.80mm or 2.00mm.

[0053] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A copper clad laminate, characterized in that: It includes a dielectric copper plate and a film, wherein a circuit pattern is formed on the dielectric copper plate, the film is arranged on the dielectric copper plate and at least partially covers the circuit pattern, the circuit pattern is provided with a power-on area and a signal transmission area, the dielectric constant on the film corresponding to the power-on area is 1.0 to 10000, and the dielectric constant on the film corresponding to the signal transmission area is 1.0 to 10000.

2. A copper clad laminate according to claim 1, characterized in that: The dielectric constant of the film corresponding to the energized area is 1.05 to 9998, and the dielectric constant of the film corresponding to the signal transmission area is 1.05 to 9998.

3. A copper clad laminate according to claim 1, characterized in that: The dielectric copper plate includes a substrate and a plurality of copper layers, wherein the plurality of copper layers are arranged on one side or both sides of the substrate, and the circuit pattern is formed by the plurality of copper layers.

4. A copper clad laminate according to claim 3, characterized in that: There are multiple films, and the films are located between multiple copper layers and / or the films are located outside the copper layers.

5. A copper clad laminate according to claim 3, characterized in that: The substrate and / or the film are provided with via holes, and the inner walls of the via holes are covered with copper to electrically connect different copper layers.

6. A copper clad laminate according to claim 1, characterized in that: The film includes at least one of a first film layer, a second film layer and a third film layer, the first film layer includes a hydrocarbon resin layer, the second film layer includes an epoxy resin layer, and the third film layer includes a polytetrafluoroethylene layer.

7. A copper clad laminate according to claim 6, characterized in that: The dielectric constant of the first film layer is 2.4-22.

8. A copper clad laminate according to claim 6, characterized in that: The dielectric constant of the second film layer is 3.0-6.

5.

9. The copper clad laminate according to claim 6, characterized in that: The dielectric constant of the third film layer is 1.8-30.

10. The copper clad laminate according to claim 6, characterized in that: The thickness of the first film layer is 0.01 mm to 2 mm, the thickness of the second film layer is 0.01 mm to 2 mm, and the thickness of the third film layer is 0.01 mm to 2 mm.

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