Ultrahigh vacuum circular magnetron sputtering cathode

Abstract

The utility model relates to the technical field of physical vapor deposition films, in particular to an ultrahigh vacuum circular magnetron sputtering cathode which comprises a connecting and fixing seat, a metal sealing cathode base is fixedly mounted in the middle of the upper end of the connecting and fixing seat, and the vacuum sealing mode of the cathode base is changed into metal sealing from original rubber ring sealing. When the cathode is used, a vacuum sealing mode of the cathode body base is changed from an original rubber ring sealing mode to a metal sealing mode, and the ceramic supporting body is matched with high-performance engineering plastics of a traditional insulating part which is replaced by high-purity aluminum oxide ceramics of 95 ceramics or above and is used under the ultrahigh vacuum condition, so that the outgassing rate of the material is greatly reduced, and the service life of the cathode is prolonged. Therefore, the purity of the film layer is higher, the quality of the film layer is better, and the working efficiency of the system is also higher.

Description

Technical Field

[0001] The utility model relates to the technical field of physical vapor deposition thin films, in particular to an ultra-high vacuum circular magnetron sputtering cathode. Background Art

[0002] Magnetron sputtering cathode refers to a device used to carry magnetic field, electric field structure and target material to be sputtered. It is the core component of magnetron sputtering technology. There are many types of magnetron sputtering cathodes. Among them, the circular magnetron sputtering cathode is a small cathode. It is the core component of the magnetron sputtering coating machine for scientific research and small batch production, and it is also the most critical component affecting the coating quality.

[0003] A typical circular magnetron sputtering cathode is mainly composed of the following parts: anode [shielding cover], cathode module [target bead, diaphragm bead, diaphragm plate, cathode body, etc.], magnetic circuit module [magnetic steel and magnetic yoke], gas distribution system, mounting flange, water, electricity, gas and cathode shell external connection system, etc. The cathode body is assembled from stainless steel structural components and insulating components. The insulating components are generally made of polytetrafluoroethylene or PEEK materials. The insulating components play the role of electrical insulation, electrical support and vacuum sealing, and have very high requirements on materials.

[0004] In recent years, with the development of cutting-edge technology, the requirements for film quality and performance have become increasingly higher, and the requirements for equipment have become increasingly stringent. In some cutting-edge scientific research and production fields, thin film deposition is required to be carried out in an ultra-high vacuum environment. Ultra-high vacuum (pressure <10 -6 Pa) The research and development of magnetron sputtering technology has become more and more urgent. The above magnetron sputtering cathode cannot meet the requirements of ultra-high vacuum conditions due to the following problems:

[0005] 1. The seal is sealed with an O-ring. The leakage rate of the O-ring does not affect normal use under high vacuum conditions, but the leakage rate is obvious under ultra-high vacuum conditions, making the system unable to reach ultra-high vacuum;

[0006] 2. The use of high-performance engineering plastics (PTFE or PEEK) for insulating parts is fine under high vacuum conditions, but the air leakage under ultra-high vacuum conditions significantly affects the vacuum degree, and also makes the vacuum system unable to reach ultra-high vacuum;

[0007] 3. At the same time, slight deformation of PTFE or PEEK at high temperature also affects the vacuum degree and normal use of the system;

[0008] 4. The traditional cathode cannot be sealed with a metal gasket due to structural reasons.

[0009] Therefore, those skilled in the art provide an ultra-high vacuum circular magnetron sputtering cathode to solve the problems raised in the above background technology. Utility Model Content

[0010] In order to solve the above technical problems, the utility model provides an ultra-high vacuum circular magnetron sputtering cathode, including a connecting and fixing seat, a metal sealed cathode base is fixedly installed in the middle of the upper end of the connecting and fixing seat, and the vacuum sealing method of the cathode body base is changed from the original rubber ring sealing to metal sealing, which greatly reduces the vacuum leakage rate of the system. The ceramic support body serves as a support member for the upper end surface of the metal sealed cathode base. The ceramic support body is a high-purity alumina ceramic of porcelain or above, which greatly reduces the degassing rate of the material.

[0011] Preferably: the lower end of the connection fixing seat is connected with a cooling water connector and an electrical connector.

[0012] Preferably: a central magnet is installed in the middle of the upper end surface of the metal sealed cathode base, and an annular magnet is installed along the edge of the upper end surface of the metal sealed cathode base. The annular magnet and the central magnet replace the single set of magnets in the existing typical circular magnetron sputtering cathode, so that the sputtering area of ​​the target material of the same size is larger and the coating is more uniform.

[0013] Preferably: a water-cooled copper ring is arranged on the upper end of the central magnet, a magnetron sputtering target is placed on the upper end of the water-cooled copper ring, and the magnetron sputtering target is directly adsorbed and fixed to the central magnet and the annular magnet, thereby making it more convenient to disassemble and replace the target.

[0014] Preferably, the water-cooled copper ring is a closed copper annular water channel instead of the traditional water channel plus a water sealing plate structure, so that it is closer to the magnetron sputtering target and has a better cooling effect.

[0015] Preferably, an anode shield is provided on top of the metal sealed cathode base.

[0016] Technical effects and advantages of the utility model:

[0017] 1. When the utility model is used, the ring magnet and the central magnet are used to replace the single set of magnets in the existing typical circular magnetron sputtering cathode, so that the sputtering area of ​​the target material of the same size is larger and the coating is more uniform.

[0018] 2. When the utility model is used, a water-cooled copper ring is used as a closed copper annular water channel to replace the traditional water channel plus a water sealing plate structure, so that it is closer to the magnetron sputtering target and has a better cooling effect.

[0019] 3. When the utility model is used, the ceramic support body is a high-purity alumina ceramic with a purity of 95% or more, which replaces the high-performance engineering plastics of the traditional insulating parts and is used under ultra-high vacuum conditions, so that the degassing rate of the material is greatly reduced.

[0020] 4. When the utility model is used, the vacuum sealing method of the cathode body base is changed from the original rubber ring sealing to metal sealing, which greatly reduces the system vacuum leakage rate and ensures the system vacuum degree. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure provided by this application;

[0022] In the figure: 1. Magnetron sputtering target; 2. Water-cooled copper ring; 3. Ring magnet; 4. Center magnet; 5. Ceramic support; 6. Anode shield; 7. Metal sealed cathode base; 8. Connecting bracket; 9. Cooling water connector and electrical connector. DETAILED DESCRIPTION

[0023] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and design various embodiments with various modifications suitable for specific purposes.

[0024] See also Figure 1 In this embodiment, an ultra-high vacuum circular magnetron sputtering cathode is provided, including a connecting and fixing seat 8, the lower end of the connecting and fixing seat 8 is connected to a cooling water connector and an electrical connector 9, a metal sealed cathode base 7 is fixedly installed in the middle of the upper end of the connecting and fixing seat 8, and the vacuum sealing method of the cathode body base is changed from the original rubber ring sealing to metal sealing, which greatly reduces the vacuum leakage rate of the system, an anode shielding cover 6 is arranged above the metal sealed cathode base 7, a central magnet 4 is installed in the middle of the upper end surface of the metal sealed cathode base 7, and an annular magnet 3 is installed along the edge of the upper end surface of the metal sealed cathode base 7, and the single group of magnets in the existing typical circular magnetron sputtering cathode is replaced by the annular magnet 3 and the central magnet 4. Iron, so that the sputtering area of ​​the target of the same size is larger and the coating is more uniform. A water-cooled copper ring 2 is arranged on the upper end of the central magnet 4, and a magnetron sputtering target 1 is placed on the upper end of the water-cooled copper ring 2. The magnetron sputtering target 1 is directly adsorbed and fixed to the central magnet 4 and the annular magnet 3, so that it is more convenient to disassemble and replace the target. The water-cooled copper ring 2 is a closed copper annular waterway instead of the traditional waterway plus a sealing water plate structure, so that it is closer to the magnetron sputtering target 1 and has a better cooling effect. The lower end of the water-cooled copper ring 2 adopts a ceramic support body 5 as a support for the upper end surface of the metal sealed cathode base 7. The ceramic support body 5 is a high-purity alumina ceramic with a purity of 95% or more, which greatly reduces the degassing rate of the material.

[0025] Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. Structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to conventional means in the field unless otherwise specified and limited.

Claims

1. An ultra-high vacuum circular magnetron sputtering cathode, comprising a connecting fixing seat (8), characterized in that: A metal sealed cathode base (7) is fixedly installed in the middle of the upper end of the connecting fixing base (8), and the vacuum sealing method of the cathode body base is changed from the original rubber ring sealing to metal sealing. A central magnet (4) is installed in the middle of the upper end surface of the metal sealed cathode base (7), and an annular magnet (3) is installed along the edge of the upper end surface of the metal sealed cathode base (7). The annular magnet (3) and the central magnet (4) replace the single group of magnets in the existing typical circular magnetron sputtering cathode. A water-cooled copper ring (2) is arranged on the upper end of the central magnet (4), and a magnetron sputtering target (1) is placed on the upper end of the water-cooled copper ring (2). The magnetron sputtering target (1) is directly adsorbed and fixed to the central magnet (4) and the annular magnet (3). The water-cooled copper ring (2) is a closed copper annular water channel that replaces the traditional water channel plus a sealing water plate structure, so that it is closer to the magnetron sputtering target (1). The ceramic support body (5) serves as a support member for the upper end surface of the metal sealed cathode base (7), and the ceramic support body (5) is a high-purity alumina ceramic with a purity of 95% or more.

2. The ultra-high vacuum circular magnetron sputtering cathode according to claim 1, characterized in that: The lower end of the connection fixing seat (8) is connected with a cooling water connector and an electrical connector (9).

3. The ultra-high vacuum circular magnetron sputtering cathode according to claim 1, characterized in that: An anode shielding cover (6) is provided above the metal sealed cathode base (7).

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