Gas distribution system

Abstract

The utility model discloses a gas distribution system which at least comprises a first input pipe communicated with a first gas source; the second input pipe is communicated with a second air source; the receiving cavity is arranged between the first input pipe and the second input pipe, and the receiving cavity is far away from the first gas source and the second gas source; the first multi-way valve is arranged on the first input pipe between the first air source and the receiving cavity; the second multi-way valve is arranged on the second input pipe between the second air source and the receiving cavity; the first circulating pipeline is arranged between the first multi-way valve and the first air source; the second circulating pipeline is arranged between the second multi-way valve and the second air source; and the tail gas treatment unit is connected with the first multi-way valve and the second multi-way valve. According to the distribution system provided by the utility model, the switching of the process gas can be quickly carried out, and the time interval between the switching of the process gas is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a gas distribution system. Background Art

[0002] In the semiconductor manufacturing process, the deposition or etching process usually includes many processes, and the process gases used in each process are not the same. Therefore, when the process changes, the process gas must also change accordingly. When the current gas distribution system switches the process gas, the supply of the process gas required for the next process will only start after the previous process is completed. Therefore, the process gas required for the next process must pass through a transmission pipeline to reach the receiving chamber to start the next process. The long time interval between process gas switching will affect the process effect and thus affect the quality of semiconductor production. Utility Model Content

[0003] The utility model aims to provide a gas distribution system, which can quickly switch process gases and reduce the time interval between process gas switches.

[0004] In order to achieve the above-mentioned purpose and other related purposes, the utility model is implemented through the following technical solutions.

[0005] The utility model provides a gas distribution system, comprising:

[0006] A first input pipe, connected to a first gas source;

[0007] A second input pipe is connected to a second gas source;

[0008] A receiving chamber, disposed between the first input pipe and the second input pipe, and the receiving chamber is far away from the first gas source and the second gas source;

[0009] a first multi-way valve, disposed on the first input pipe between the first gas source and the receiving chamber;

[0010] a second multi-way valve, disposed on the second input pipe between the second gas source and the receiving chamber;

[0011] A first circulation pipeline is arranged between the first multi-way valve and the first gas source;

[0012] a second circulation pipeline, disposed between the second multi-way valve and the second gas source; and

[0013] An exhaust gas treatment unit is connected to the first multi-way valve and the second multi-way valve.

[0014] In an embodiment of the present utility model, the first multi-way valve is a first four-way valve and includes three first outlets, and the first outlets are respectively connected to the first circulation pipeline, the receiving chamber and the exhaust gas treatment unit.

[0015] In one embodiment of the present invention, the second multi-way valve is a second four-way valve and includes three second outlets, and the second outlets are respectively connected to the second circulation pipeline, the receiving chamber and the exhaust gas treatment unit.

[0016] In an embodiment of the utility model, at least one first regulating valve is arranged on the first input pipe, and the first regulating valve is arranged on the first input pipe between the first gas source and the first multi-way valve.

[0017] In one embodiment of the utility model, a first controller is also provided on the first input pipe, and the first controller is provided on the first input pipe between the first regulating valve and the first multi-way valve.

[0018] In an embodiment of the present invention, at least one second regulating valve is disposed on the second input pipe, and the second regulating valve is disposed on the second input pipe between the second gas source and the second multi-way valve.

[0019] In an embodiment of the present invention, a second controller is further provided on the second input pipe, and the second controller is provided on the second input pipe between the second regulating valve and the second multi-way valve.

[0020] In one embodiment of the present invention, the first multi-way valve and the second multi-way valve are forced reversing type, unloading reversing type, dead point free reversing type or rotary reversing type multi-way valves.

[0021] In one embodiment of the present invention, the first controller and the second controller are mechanical pressure controllers or electronic pressure controllers.

[0022] In one embodiment of the utility model, the tail gas treatment unit is a zeolite wheel adsorption concentration device, a spray tower or a catalytic combustion device.

[0023] In summary, the utility model proposes a gas distribution system, which can transmit the process gas required for the next process to the front of the receiving chamber through the second input pipe and the second multi-way valve when the previous process is about to end, and immediately deliver the process gas required for the next process in front of the receiving chamber into the receiving chamber after the previous process ends. The gas distribution system of the utility model can quickly switch the process gas, reduce the time interval between the process gas switching, avoid affecting the process results, and thus improve the quality of semiconductors. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 A schematic diagram of the structure of a gas distribution system.

[0026] Marking Description:

[0027] 10. Receiving chamber; 11. First gas source; 12. First input pipe; 13. First multi-way valve; 14. First circulation pipeline; 15. First regulating valve; 16. First controller; 20. Exhaust gas treatment unit; 21. Second gas source; 22. Second input pipe; 23. Second multi-way valve; 24. Second circulation pipeline; 25. Second regulating valve; 26. Second controller. DETAILED DESCRIPTION

[0028] The following describes the implementation of the present invention through specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementations. The details in the present invention can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0029] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention, and thus the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed at will, and the component layout may also be more complicated.

[0030] In the present invention, it should be noted that, if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, if the terms "first" and "second" appear, they are only used for description and distinction purposes, and cannot be understood as indicating or implying relative importance.

[0031] The utility model provides a gas distribution system, which can quickly switch between process gases through a second input pipe and a second multi-way valve, reduce the time interval between process gas switching, avoid affecting process results, and thus ensure the quality of semiconductors.

[0032] See also Figure 1 As shown, the utility model provides a gas distribution system, for example, including a receiving chamber 10, a first gas source 11, a first input pipe 12, a first multi-way valve 13, a first circulation pipeline 14, a first regulating valve 15, a first controller 16, an exhaust gas treatment unit 20, a second gas source 21, a second input pipe 22, a second multi-way valve 23, a second circulation pipeline 24, a second regulating valve 25, and a second controller 26. When the first input pipe 12 is about to stop transmitting the gas in the first gas source 11, the gas in the second gas source 21 can be sent between the second multi-way valve 23 and the second controller 26 through the second input pipe 22 and the second multi-way valve 23. When the first input pipe 12 stops transmitting the gas, the gas in the second input pipe 22 can be immediately sent to the receiving chamber 10 through the second multi-way valve 23, so as to realize the rapid switching between different gases.

[0033] See also Figure 1 As shown, in one embodiment of the utility model, the first gas source 11 is connected to the first input pipe 12 to transmit the gas in the first gas source 11. The second gas source 21 is connected to the second input pipe 22 to transmit the gas in the second gas source 21. In this embodiment, the first gas source 11 or the second gas source 21 is, for example, one or more of silicon sources such as silane, chlorosilane, dichlorodihydrosilane, disilane or tungsten hexafluoride, and the second gas source 21 or the first gas source 11 is, for example, one or more of reactive gases such as oxygen, ozone or ammonia. In other embodiments, the first gas source 11 and the second gas source 21 are, for example, different etching gases.

[0034] See also Figure 1 As shown, in one embodiment of the utility model, the receiving chamber 10 is disposed between the first input pipe 12 and the second input pipe 22, and the receiving chamber 10 is far away from the first gas source 11 and the second gas source 21. The receiving chamber 10 receives gas from the first input pipe 12 or the second input pipe 22 to perform etching or thin film deposition on the wafer. In this embodiment, the receiving chamber 10 is, for example, a reaction chamber of a deposition device or a reaction chamber of an etching device.

[0035] See also Figure 1As shown, in one embodiment of the utility model, the first multi-way valve 13 is arranged on the first input pipe 12 between the first gas source 11 and the receiving chamber 10. In this embodiment, the first multi-way valve 13 is, for example, a first four-way valve, including one inlet and three first outlets, the inlet is connected to the first input pipe 12, and receives the gas from the first input pipe 12, and the three first outlets are respectively connected to the first circulation pipeline 14, the receiving chamber 10 and the exhaust gas treatment unit 20. Therefore, the gas entering through the inlet of the first multi-way valve 13 includes three flow paths, that is, the gas from the first input pipe 12 directly enters the receiving chamber 10, or enters the first circulation pipeline 14, or enters the exhaust gas treatment unit 20. In this embodiment, the first multi-way valve 13 is, for example, one of a forced reversing type, a load-unloading reversing type, a dead-point reversing type or a rotary reversing type multi-way valve.

[0036] See also Figure 1 As shown, in one embodiment of the utility model, at least one first regulating valve 15 is disposed on the first input pipe 12, and the first regulating valve 15 is disposed on the first input pipe 12 between the first gas source 11 and the first multi-way valve 13. In this embodiment, for example, one first regulating valve 15 is disposed on the first input pipe 12, and the first regulating valve 15 is close to the first gas source 11, and is used to control the amount of gas transmitted from the first gas source 11 to the first input pipe 12.

[0037] See also Figure 1 As shown, in one embodiment of the utility model, a first controller 16 is also provided on the first input pipe 12, and the first controller 16 is provided on the first input pipe 12 between the first regulating valve 15 and the first multi-way valve 13. In this embodiment, the first controller 16 is, for example, provided between the output end of the first circulation pipeline 14 and the inlet of the first multi-way valve 13. The first controller 16 is used to stabilize the pressure of the transmission gas in the first input pipe 12, thereby outputting stable gas. Therefore, the pressure-stable gas output by the first controller 16 enters the receiving chamber 10 through the first multi-way valve 13 to process the wafer, thereby ensuring the stability of the gas source for etching or depositing the wafer and improving the wafer quality. In this embodiment, the first controller 16 is, for example, a mechanical pressure controller or an electronic pressure controller.

[0038] See also Figure 1As shown, in one embodiment of the utility model, the first circulation pipeline 14 is arranged between the first multi-way valve 13 and the first gas source 11. In this embodiment, the input end of the first circulation pipeline 14 is connected to one outlet of the first multi-way valve 13, for example, and the output end of the first circulation pipeline 14 is connected to the first input pipe 12 between the first multi-way valve 13 and the first gas source 11, for example. The gas from the outlet of the first multi-way valve 13 enters the first circulation pipeline 14, and the gas flows through the first circulation pipeline 14 and returns to the first input pipe 12. Therefore, when the inlet of the first multi-way valve 13 is connected to the first circulation pipeline 14, the gas circulates in the first input pipe 12 and the first circulation pipeline 14.

[0039] See also Figure 1 As shown, in one embodiment of the utility model, the second multi-way valve 23 is arranged on the second input pipe 22 between the second gas source 21 and the receiving chamber 10. In this embodiment, the second multi-way valve 23 is, for example, a second four-way valve, including one inlet and three second outlets, the inlet is connected to the second input pipe 22, and receives the gas from the second input pipe 22, and the three second outlets are respectively connected to the second circulation pipeline 24, the receiving chamber 10 and the exhaust gas treatment unit 20. Therefore, the gas entering through the inlet of the second multi-way valve 23 includes three flow paths, that is, the gas from the second input pipe 22 enters the receiving chamber 10, or enters the second circulation pipeline 24, or enters the exhaust gas treatment unit 20. In this embodiment, the second multi-way valve 23 is, for example, one of a forced reversing type, a load-unloading reversing type, a dead-point reversing type or a rotary reversing type multi-way valve.

[0040] See also Figure 1 As shown, in one embodiment of the utility model, at least one second regulating valve 25 is provided on the second input pipe 22, and the second regulating valve 25 is provided on the second input pipe 22 between the second gas source 21 and the second multi-way valve 23. In this embodiment, for example, one second regulating valve 25 is provided on the second input pipe 22, and the second regulating valve 25 is close to the second gas source 21, and is used to control the amount of gas transmitted from the second gas source 21 to the second input pipe 22.

[0041] See also Figure 1As shown, in one embodiment of the utility model, a second controller 26 is also provided on the second input pipe 22, and the second controller 26 is provided on the second input pipe 22 between the second regulating valve 25 and the second multi-way valve 23. In this embodiment, the second controller 26 is, for example, provided between the output end of the second circulation pipeline 24 and the inlet of the second multi-way valve 23. The second controller 26 is used to stabilize the pressure of the transmission gas in the second input pipe 22, thereby outputting stable gas. Therefore, the gas with stable pressure output by the second controller 26 enters the receiving chamber 10 through the second multi-way valve 23 to process the wafer, thereby ensuring the stability of the gas source for etching or depositing the wafer and improving the quality of the wafer. In this embodiment, the second controller 26 is, for example, a mechanical pressure controller or an electronic pressure controller.

[0042] See also Figure 1 As shown, in one embodiment of the utility model, the second circulation pipeline 24 is arranged between the second multi-way valve 23 and the second gas source 21. In this embodiment, the input end of the second circulation pipeline 24 is connected to one outlet of the second multi-way valve 23, for example, and the output end of the second circulation pipeline 24 is connected to the second input pipe 22 between the second multi-way valve 23 and the second gas source 21, for example. The gas from the outlet of the second multi-way valve 23 enters the second circulation pipeline 24, and the gas flows through the second circulation pipeline 24 and returns to the second input pipe 22. Therefore, when the inlet of the second multi-way valve 23 is connected to the second circulation pipeline 24, the gas circulates in the second input pipe 22 and the second circulation pipeline 24.

[0043] See also Figure 1 As shown, in one embodiment of the utility model, the tail gas treatment unit 20 is connected to the first multi-way valve 13 and the second multi-way valve 23. When the process stops and the receiving chamber 10 does not need gas, that is, the first gas source 11 or the second gas source 21 stops supplying gas, the inlet of the first multi-way valve 13 or the second multi-way valve 23 is connected to the tail gas treatment unit 20, and the residual gas in the first input pipe 12 or the second input pipe 22 enters the tail gas treatment unit 20, and the tail gas treatment unit 20 receives and processes the residual gas to avoid direct gas discharge and harm to the environment and operators. In this embodiment, the tail gas treatment unit 20 is, for example, a zeolite wheel adsorption concentration device, a spray tower or a catalytic combustion device.

[0044] In order to further illustrate a gas distribution system provided by the present invention, the working process of gas distribution is specifically described below. The specific process is as follows.

[0045] See also Figure 1As shown, the first regulating valve 15 is opened, and the gas in the first gas source 11 enters the first input pipe 12. After passing through the first controller 16, the pressure of the gas is stabilized, and the stable gas enters the first multi-way valve 13. The first multi-way valve 13 is adjusted so that the gas at the inlet of the first multi-way valve 13 flows into the receiving chamber 10 to process the wafer.

[0046] When the process of treating the wafer with the gas in the first gas source 11 is about to end, the second regulating valve 25 is opened, and the gas in the second gas source 21 enters the second input pipe 22, passes through the second controller 26, and the pressure of the gas is stabilized. The stabilized gas enters the second multi-way valve 23, and the second multi-way valve 23 is adjusted so that the gas at the inlet of the second multi-way valve 23 enters the second circulation pipeline 24. The gas in the second circulation pipeline 24 returns to the second input pipe 22, passes through the second controller 26 again, and the pressure of the gas is stabilized again. The stabilized gas enters the second multi-way valve 23 again. At this time, the gas output from the second gas source 21 circulates in the second controller 26, the second multi-way valve 23, and the second circulation pipeline 24, ensuring the stability of the pressure of the gas at the inlet of the second multi-way valve 23.

[0047] When the process of treating the wafer with the gas in the first gas source 11 is finished, the first regulating valve 15 is closed, and the first multi-way valve 13 is adjusted to allow the residual gas in the first input pipe 12 to flow to the tail gas treatment unit 20. At the same time, the second multi-way valve 23 is adjusted to allow the gas with a stable inlet pressure of the second multi-way valve 23 to flow directly to the receiving chamber 10, and the wafer is started to be treated with the gas in the second gas source 21.

[0048] In summary, the utility model proposes a gas distribution system, which can transmit the process gas required for the next process to the front of the receiving chamber through the second input pipe and the second multi-way valve when the previous process is about to end, and immediately deliver the process gas required for the next process in front of the receiving chamber into the receiving chamber after the previous process ends. The gas distribution system of the utility model can quickly switch the process gas, reduce the time interval between the process gas switching, avoid affecting the process results, and thus improve the quality of semiconductors.

[0049] References throughout the specification to "one embodiment," "an embodiment," or "a specific embodiment" mean that the specific features, structures, or characteristics described in conjunction with the embodiment are included in at least one embodiment of the utility model, and not necessarily in all embodiments. Thus, the various appearances of the phrases "in one embodiment," "in an embodiment," or "in a specific embodiment" in different places throughout the specification do not necessarily refer to the same embodiment. In addition, the specific features, structures, or characteristics of any specific embodiment of the utility model may be combined with one or more other embodiments in any suitable manner. It should be understood that other variations and modifications of the utility model embodiments described and shown herein may be based on the teachings herein and will be considered part of the spirit and scope of the utility model.

[0050] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the utility model involved in the present application is not limited to the technical solution formed by a specific combination of the above-mentioned technical features, but should also cover other technical solutions formed by any combination of the above-mentioned technical features or their equivalent features without departing from the concept of the utility model, such as the technical solution formed by replacing the above-mentioned features with the technical features with similar functions disclosed in this application (but not limited to). In addition to the technical features described in the specification, the remaining technical features are known technologies to those skilled in the art. In order to highlight the innovative features of the present utility model, the remaining technical features will not be repeated here.

Claims

1. A gas distribution system, characterized in that: At least: A first input pipe, connected to a first gas source; A second input pipe is connected to a second gas source; A receiving chamber, disposed between the first input pipe and the second input pipe, and the receiving chamber is far away from the first gas source and the second gas source; a first multi-way valve, disposed on the first input pipe between the first gas source and the receiving chamber; a second multi-way valve, disposed on the second input pipe between the second gas source and the receiving chamber; A first circulation pipeline is arranged between the first multi-way valve and the first gas source; a second circulation pipeline, disposed between the second multi-way valve and the second gas source; and An exhaust gas treatment unit is connected to the first multi-way valve and the second multi-way valve.

2. The dispensing system according to claim 1, characterized in that The first multi-way valve is a first four-way valve and includes three first outlets, and the first outlets are respectively connected to the first circulation pipeline, the receiving chamber and the exhaust gas treatment unit.

3. The dispensing system according to claim 1, characterized in that The second multi-way valve is a second four-way valve and includes three second outlets, and the second outlets are respectively connected to the second circulation pipeline, the receiving chamber and the exhaust gas treatment unit.

4. The dispensing system according to claim 1, characterized in that At least one first regulating valve is disposed on the first input pipe, and the first regulating valve is disposed on the first input pipe between the first gas source and the first multi-way valve.

5. The dispensing system according to claim 4, characterized in that A first controller is also arranged on the first input pipe, and the first controller is arranged on the first input pipe between the first regulating valve and the first multi-way valve.

6. The dispensing system according to claim 5, characterized in that At least one second regulating valve is disposed on the second input pipe, and the second regulating valve is disposed on the second input pipe between the second gas source and the second multi-way valve.

7. The dispensing system according to claim 6, characterized in that A second controller is also arranged on the second input pipe, and the second controller is arranged on the second input pipe between the second regulating valve and the second multi-way valve.

8. The dispensing system according to claim 7, characterized in that The first controller and the second controller are mechanical pressure controllers or electronic pressure controllers.

9. The dispensing system according to claim 1, characterized in that The first multi-way valve and the second multi-way valve are forced reversing type, unloading reversing type, dead point free reversing type or rotary reversing type multi-way valves.

10. The dispensing system according to claim 1, characterized in that The tail gas treatment unit is a zeolite wheel adsorption concentration device, a spray tower or a catalytic combustion device.

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