Display card heat dissipation structure

Abstract

The utility model relates to a graphics card heat dissipation structure which comprises two heat dissipation plates, the two heat dissipation plates are oppositely arranged at the rear end of a graphics card module, a heat pipe is arranged between the two heat dissipation plates, a plurality of arrayed arc grooves are formed in the back faces of the heat dissipation plates, the arc grooves are matched with the heat pipe in pipe diameter, and the heat pipe is arranged in the arc grooves. The heat dissipation plate is connected with the display card module through rivets, the heat dissipation plate is provided with rivet holes connected with the rivets, and the rivet holes and the top face of the heat dissipation plate are located on the same plane. Local heat conduction of the heat pipe cannot be affected by the periphery of the rivet of the structure, flattening treatment is not needed, temperature equalization of the heat pipe is facilitated through the complete capillary, the contact area is increased, the heat dissipation effect is good, and the service life of the display card is longer.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of graphics cards, in particular to a heat dissipation structure of a graphics card. Background Art

[0002] In the technical field of computer graphics card CPU cooling devices, the existing technologies are all made through the convex hull process of the GPU rivet position. Since the rivet diameter range of 15mm cannot effectively conduct heat, the heat pipe and VC need to be flattened. The contact area between the heat pipe and VC is small, and the heat dissipation capacity of the heat pipe cannot be fully exerted, resulting in insufficient heat dissipation of the graphics card, affecting the use of the graphics card. Summary of the invention

[0003] The utility model provides a graphics card heat dissipation structure, aiming to solve the problem that the existing VC heat dissipation structure has poor heat dissipation effect and affects the use of the graphics card.

[0004] The utility model provides a graphics card heat dissipation structure, comprising two heat dissipation plates, the two heat dissipation plates are relatively arranged at the rear end of a graphics card module, a heat pipe is arranged between the two heat dissipation plates, a plurality of arranged arc grooves are arranged on the back side of the heat dissipation plates, the arc grooves match the pipe diameter of the heat pipe, the heat dissipation plates are connected to the graphics card module through rivets, the heat dissipation plates are provided with rivet holes connected to the rivets, and the rivet holes and the top surface of the heat dissipation plates are located in the same plane.

[0005] As a further improvement of the present invention, the bottom of the rivet hole is consistent with the shape of the circular arc groove.

[0006] As a further improvement of the utility model, a heat phase cavity is provided on the top surface of the heat dissipation plate, and the setting direction of the heat phase cavity is consistent with the setting direction of the heat pipe.

[0007] As a further improvement of the utility model, a cold phase cavity is provided on the top surface of the heat sink, a cold pipe is provided inside the heat sink, the cold pipe is arranged in the cold phase cavity, and the setting direction of the cold pipe is perpendicular to the setting direction of the heat pipe.

[0008] As a further improvement of the present invention, the cold phase cavity and the hot phase cavity are cross-arranged on the top surface of the heat sink.

[0009] As a further improvement of the utility model, a water injection port is provided on one side of the heat sink, and the water injection port is connected to the cold pipe.

[0010] As a further improvement of the present invention, the length of the circular arc groove is 10 mm.

[0011] The beneficial effects of the utility model are as follows: the periphery of the structural rivets will not affect the local heat conduction of the heat pipe, and does not require flattening treatment. The complete capillary is conducive to the uniform temperature of the heat pipe, increases the contact area, has a good heat dissipation effect, and prolongs the service life of the graphics card. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a front schematic diagram of the heat dissipation plate of the utility model;

[0013] Figure 2 It is a schematic diagram of the back side of the heat dissipation plate of the utility model;

[0014] Figure 3 It is a schematic diagram of placing heat pipes on the back of the heat sink of the utility model;

[0015] Figure 4 It is a schematic diagram of the connection between the heat sink and the graphics card module of the utility model. DETAILED DESCRIPTION

[0016] Figure numerals: 1-heat sink, 2-rivet hole, 3-water inlet, 4-cold phase cavity, 5-hot phase cavity, 6-arc groove, 7-heat pipe, 8-graphics card module.

[0017] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail in conjunction with the accompanying drawings and embodiments. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to the directions in the accompanying drawings, and the words "bottom surface" and "top surface", "inside" and "outside" refer to the directions toward or away from the geometric center of a specific component, respectively.

[0018] like Figure 1-4 As shown, the utility model provides a graphics card heat dissipation structure, including two heat sinks 1, the two heat sinks 1 are relatively arranged at the rear end of a graphics card module 8, a heat pipe 7 is arranged between the two heat sinks 1, a plurality of arranged arc grooves 6 are provided on the back of the heat sink 1, the arc grooves 6 match the pipe diameter of the heat pipe 7, the heat sink 1 is connected to the graphics card module 8 by rivets, the heat sink 1 is provided with a rivet hole 2 connected to the rivet, and the rivet hole 2 and the top surface of the heat sink 1 are located in the same plane.

[0019] As another embodiment of the present invention, the bottom of the rivet hole 2 is consistent in shape with the arc groove 6 .

[0020] As another embodiment of the present utility model, a heat phase cavity 5 is disposed on the top surface of the heat dissipation plate 1 , and the arrangement direction of the heat phase cavity 5 is consistent with the arrangement direction of the heat pipe 7 .

[0021] As another embodiment of the utility model, a cold phase cavity 4 is provided on the top surface of the heat sink 1 , and a cold pipe is provided inside the heat sink 1 . The cold pipe is arranged in the cold phase cavity 4 , and the setting direction of the cold pipe is perpendicular to the setting direction of the heat pipe 7 .

[0022] As another embodiment of the present utility model, the cold phase cavity 4 and the hot phase cavity 5 are cross-arranged on the top surface of the heat sink 1 .

[0023] As another embodiment of the present utility model, a water injection port 3 is provided on one side of the heat sink 1, and the water injection port 3 is connected to the cooling pipe.

[0024] As another embodiment of the present invention, the length of the arc groove 6 is 10 mm.

[0025] The utility model provides a graphics card heat dissipation structure, in which the rivet periphery of the structure will not affect the local heat conduction of the heat pipe 7, and does not need to be flattened. The complete capillary is conducive to the uniform temperature of the heat pipe 7, increases the contact area, has a good heat dissipation effect, and prolongs the service life of the graphics card.

[0026] Two heat sinks 1 are arranged at the rear end of the graphics card module 8, and the two heat sinks 1 are arranged opposite to each other, so that the two arc grooves 6 are combined to form a circular groove for placing the heat pipe 7, and the arc groove 6 matches the diameter of the heat pipe 7. The length of the arc groove 6 is 10 mm, and the contact area is increased by 66% compared with the flattened state, so that the heat pipe 7 can contact with the VC to the maximum extent. The contact area of ​​the heat pipe 7 is 1.66 times the product of the flattened contact area.

[0027] At the same time, the rivet hole 2 arranged on the heat sink 1 is a non-groove structure, flush with the top surface of the heat sink 1, and has a complete capillary inside. The bottom of the rivet hole 2 is consistent with the shape of the arc groove 6. This design allows the heat pipe 7 to be arranged around the rivet without flattening, thereby increasing the contact area. In the embodiment of the utility model, four rivet holes 2 are provided.

[0028] The heat pipe 7 is placed in the arc groove 6, and the cold pipe is filled with cold water through the water injection port 3, so as to realize heat exchange at the intersection of the hot phase cavity 5 and the cold phase cavity 4 to achieve the purpose of heat dissipation.

[0029] The above contents are further detailed descriptions of the present invention in combination with specific preferred implementations, and the specific implementation of the present invention cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims

1. A graphics card heat dissipation structure, characterized in that: It includes two heat sinks, which are relatively arranged at the rear end of the graphics card module, a heat pipe is arranged between the two heat sinks, a plurality of arranged arc grooves are arranged on the back of the heat sink, and the arc grooves match the pipe diameter of the heat pipe, the heat sink and the graphics card module are connected by rivets, and the heat sink is provided with rivet holes connected with the rivets, and the rivet holes and the top surface of the heat sink are located in the same plane.

2. A graphics card heat dissipation structure according to claim 1, characterized in that: The bottom of the rivet hole is consistent with the shape of the circular arc groove.

3. A graphics card heat dissipation structure according to claim 1, characterized in that: A heat phase cavity is arranged on the top surface of the heat dissipation plate, and the arrangement direction of the heat phase cavity is consistent with the arrangement direction of the heat pipe.

4. A graphics card heat dissipation structure according to claim 3, characterized in that: A cold phase cavity is provided on the top surface of the heat dissipation plate, a cold pipe is provided inside the heat dissipation plate, and the cold pipe is arranged in the cold phase cavity. The arrangement direction of the cold pipe is perpendicular to the arrangement direction of the heat pipe.

5. A graphics card heat dissipation structure according to claim 4, characterized in that: The cold phase cavity and the hot phase cavity are cross-arranged on the top surface of the heat dissipation plate.

6. A graphics card heat dissipation structure according to claim 4, characterized in that: A water inlet is provided on one side of the heat sink, and the water inlet is connected to the cold pipe.

7. A graphics card heat dissipation structure according to claim 1, characterized in that: The length of the circular arc groove is 10 mm.

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