Multi-chip double-base-island SOT packaging structure

Abstract

The utility model discloses a multi-chip double-base-island SOT packaging structure, which comprises a shell, two symmetrical base islands are arranged in the shell, the top surface of each base island is connected with a chip, two sides of each base island are respectively fixed with an outer pin, two sides of the shell are respectively provided with two gaps, each gap is internally abutted with an outer pin, and the outer pins are respectively connected with the two gaps. The cover plate is attached to the top face of the shell, the inserting blocks are fixed to the two sides of the bottom face of the cover plate respectively, the inserting grooves matched with the inserting blocks are formed in the two sides of the top face of the shell respectively, the inserting blocks are inserted into the inserting grooves respectively, the limiting blocks are movably connected to the two sides of each inserting block respectively, and the limiting blocks are movably connected into the inserting grooves. According to the utility model, the shell and the cover plate are arranged, the packaging structure is changed into a detachable structure, and the cover plate and the shell are fixed by using the limiting block, so that the base island and the chip in the packaging structure are convenient to maintain and replace, the whole packaging structure does not need to be replaced, and the maintenance cost is further reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of SOT packaging, in particular to a multi-chip double-base island SOT packaging structure. Background Art

[0002] SOT package is a form of integrated circuit packaging. SOT package is a surface mount technology package, commonly used for small semiconductor devices such as transistors, diodes and integrated circuits. SOT package has a small size and lightweight appearance, making it suitable for space-constrained electronic devices and high-density circuit board design. It is arranged on both sides of the package through the bending of the pins, making welding more convenient.

[0003] Common packaging materials for SOT packages include plastic, ceramic, metal, etc. Currently, plastic packaging is the most widely used, mainly used in integrated circuits. Although the existing SOT packages can be divided into many types according to the number of pins, there are still some shortcomings in use, such as inconvenience in disassembly and maintenance. Traditional packaging structures are mostly integrated, and once damaged, they need to be replaced as a whole, increasing maintenance costs. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a multi-chip double-island SOT packaging structure.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a multi-chip dual-base island SOT packaging structure, including a shell, two symmetrical base islands are arranged inside the shell, the top surface of each base island is connected to a chip, an external pin is fixed on both sides of each base island, two notches are arranged on both sides of the shell, each of the notches is abutted against one of the external pins, the top surface of the shell is fitted with a cover plate, an insert block is fixed on both sides of the bottom surface of the cover plate, a slot matching the insert block is opened on both sides of the top surface of the shell, a insert block is inserted in each of the slots, and a limit block is movably connected to both sides of each of the insert blocks, and the limit block is movably connected in the slot.

[0006] As a further description of the above technical solution: two symmetrical grooves are opened on the bottom surface of the shell, and the two grooves correspond to the two base islands respectively. A number of heat dissipation holes distributed at equal distances vertically penetrate each of the grooves.

[0007] As a further description of the above technical solution: a blind hole is horizontally opened on the side of the plug block, a first spring is horizontally fixed in the blind hole, the end of the first spring is fixedly connected to the limit block, the limit block is axially slidably connected in the blind hole, a through hole connected to the slot is horizontally opened on the side of the shell, the end of the limit block is axially slidably inserted in the through hole, and the end of the limit block is flush with the outside of the shell.

[0008] As a further description of the above technical solution: two mirror-symmetrical first sliding grooves are axially opened on the inner wall of the blind hole, a first sliding block is slidably connected in each of the first sliding grooves, and the two first sliding blocks are fixedly connected to the limit block.

[0009] As a further description of the above technical solution: two mirror-symmetrical second sliding grooves are vertically opened on the inner wall of the slot, a second slider is slidably connected in each of the second sliding grooves, a push plate is fixed between the two second sliders, the push plate abuts against the bottom surface of the insert block, two mirror-symmetrical second springs are vertically fixed on the bottom surface of the push plate, and the second springs are vertically fixed to the bottom wall of the slot.

[0010] As a further description of the above technical solution: eight mirror-symmetrical second positioning grooves are vertically opened on the inner wall of the shell, a second positioning block is axially inserted in each of the second positioning grooves, and a second positioning block is vertically fixed at the four corners of the bottom surface of each of the base islands; eight mirror-symmetrical first positioning grooves are vertically opened on the bottom surface of the cover plate, a first positioning block is axially inserted in each of the first positioning grooves, and a first positioning block is vertically fixed at the four corners of the top surface of each of the base islands.

[0011] The utility model has the following beneficial effects:

[0012] Compared with the prior art, the multi-chip dual-base island SOT packaging structure changes the packaging structure into a detachable structure by setting a shell and a cover plate, and uses limit blocks to fix the cover plate and the shell, so as to facilitate the maintenance and replacement of the base island and the chip in the packaging structure without replacing the entire packaging structure, thereby reducing the maintenance cost, and the base island is installed with the cover plate and the shell through multiple positioning grooves and positioning blocks, thereby improving the firmness of the base island installed in the shell and avoiding the position of the base island in the shell from being offset, and the grooves and heat dissipation holes are set to improve the heat dissipation of the shell, which has the function of cooling the heat generated by the base island and the chip during operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a three-dimensional diagram of the overall structure of a multi-chip dual-base island SOT packaging structure proposed by the utility model;

[0014] Figure 2 This is a main cross-sectional view of the overall structure of a multi-chip dual-base island SOT packaging structure proposed by the utility model;

[0015] Figure 3 A multi-chip dual-base island SOT packaging structure proposed by the utility model Figure 2 A magnified view of the structure at center.

[0016] Legend:

[0017] 1. Shell; 2. External pin; 3. Cover plate; 4. Through hole; 5. Limit block; 6. First positioning groove; 7. First positioning block; 8. Chip; 9. Base island; 10. Insert block; 11. Slot; 12. Second positioning groove; 13. Second positioning block; 14. Groove; 15. Heat dissipation hole; 16. First slider; 17. First slide groove; 18. Blind hole; 19. First spring; 20. Second slide groove; 21. Second slider; 22. Second spring; 23. Push plate. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] Reference Figures 1 to 3 The utility model provides a multi-chip dual-base island SOT packaging structure: comprising a shell 1, two symmetrical base islands 9 are arranged inside the shell 1, a chip 8 is connected to the top surface of each base island 9, an external pin 2 is fixed on both sides of each base island 9, two notches are arranged on both sides of the shell 1, and an external pin 2 is abutted in each notch, the top surface of the shell 1 fits the cover plate 3, an insert block 10 is fixed on both sides of the bottom surface of the cover plate 3, a slot 11 matching with the insert block 10 is opened on both sides of the top surface of the shell 1, an insert block 10 is inserted in each slot 11, and a limit block 5 is movably connected to both sides of each insert block 10, and the limit block 5 is movably connected in the slot 11;

[0020] A blind hole 18 is horizontally provided on the side of the plug block 10, a first spring 19 is horizontally fixed in the blind hole 18, the end of the first spring 19 is fixedly connected to the limit block 5, the limit block 5 is axially slidably connected in the blind hole 18, two mirror-symmetrical first slide grooves 17 are axially provided on the inner wall of the blind hole 18, a first slider is slidably connected in each first slide groove 17, and the two first sliders 16 are fixedly connected to the limit block 5, a through hole 4 connected to the slot 11 is horizontally provided on the side of the housing 1, the end of the limit block 5 is axially slidably connected in the through hole 4, and the end of the limit block 5 is flush with the outside of the housing 1;

[0021] Two mirror-symmetrical second slide grooves 20 are vertically formed on the inner wall of the slot 11, and a second slider 21 is slidably connected in each second slide groove 20. A push plate 23 is fixed between the two second sliders 21. The push plate 23 abuts against the bottom surface of the insert block 10. Two mirror-symmetrical second springs 22 are vertically fixed to the bottom surface of the push plate 23. The second springs 22 are vertically fixed to the bottom wall of the slot 11.

[0022] Two symmetrical grooves 14 are provided on the bottom surface of the shell 1, and the two grooves 14 correspond to two base islands 9 respectively. In each groove 14, a number of heat dissipation holes 15 distributed at equal distances are vertically penetrated; eight mirror-symmetrical second positioning grooves 12 are vertically provided on the inner wall of the shell 1, and a second positioning block 13 is axially inserted in each second positioning groove 12, and a second positioning block 13 is vertically fixed at the four corners of the bottom surface of each base island 9; eight mirror-symmetrical first positioning grooves 6 are vertically provided on the bottom surface of the cover plate 3, and a first positioning block 7 is axially inserted in each first positioning groove 6, and a first positioning block 7 is vertically fixed at the four corners of the top surface of each base island 9.

[0023] By providing the shell 1 and the cover plate 3, the packaging structure is changed into a detachable structure, and the cover plate 3 and the shell 1 are fixed by the limit block 5, so that the base island 9 and the chip 8 in the packaging structure can be easily repaired and replaced without replacing the entire packaging structure, thereby reducing the maintenance cost. The base island 9 is installed with the cover plate 3 and the shell 1 through multiple positioning grooves and positioning blocks, thereby improving the firmness of the base island 9 installed in the shell 1 and avoiding the position of the base island 9 in the shell 1 from shifting. The groove 14 and the heat dissipation hole 15 are provided to improve the heat dissipation of the shell 1, and play a role in cooling the heat generated by the base island 9 and the chip 8 during operation.

[0024] Working principle: When disassembling the cover plate 3 and the shell 1, first push the limit blocks 5 on both sides of the shell 1 toward the inside of the shell 1 at the same time, so that the limit blocks 5 are retracted into the blind hole 18, and the first spring 19 is compressed at the same time, and then the second spring 22 at the bottom of the slot 11 is in a compressed state. When the limit block 5 is retracted into the blind hole 18, the limit of the second spring 22 disappears and resets. At the same time, the push plate 23 is pushed up, and the push plate 23 pushes the plug 10 up, so that the limit block 5 moves out of the slot 11. At the same time, the cover plate 3 will be lifted up. At this time, the first spring 19 will be reset. When resetting, the limit block 5 is pushed out of the blind hole 18, and then the base island 9 and the chip 8 in the shell 1 can be replaced and repaired. When the repair is completed, first align the plug 10 with the shell 1 The two slots 11 on the top surface, and then push the two limit blocks 5 into the blind hole 18 at the same time, and the first spring 19 is compressed, so that the limit block 5 is pushed into the slot 11, so that the plug block 10 can continue to drop into the slot 11, and the limit block 5 will be always in the blind hole 18 under the limitation of the slot 11, and the push plate 23 will drop under the pressure of the plug block 10, and the second spring 22 is compressed. When the bottom surface of the cover plate 3 is completely in contact with the top surface of the shell 1, the blind hole 18 and the through hole 4 are on the same axis. After the limitation of the limit block 5 disappears, the spring in the compressed state is reset, and the first spring 19 is reset while pushing the limit block 5 out of the blind hole 18 and extending into the through hole 4, thereby completing the installation and fixation of the cover plate 3 and the shell 1.

[0025] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A multi-chip dual-island SOT packaging structure, comprising a housing (1), characterized in that: Two symmetrical base islands (9) are provided inside the shell (1), the top surface of each base island (9) is connected to a chip (8), and an external pin (2) is fixed on both sides of each base island (9). Two notches are provided on both sides of the shell (1), and each notch abuts against one external pin (2). The top surface of the shell (1) fits the cover plate (3), and an insert block (10) is fixed on both sides of the bottom surface of the cover plate (3). A slot (11) matching with the insert block (10) is provided on both sides of the top surface of the shell (1), and an insert block (10) is inserted into each slot (11). A limit block (5) is movably connected to both sides of each insert block (10), and the limit block (5) is movably connected in the slot (11).

2. The multi-chip dual-island SOT packaging structure according to claim 1, characterized in that: Two symmetrical grooves (14) are provided on the bottom surface of the shell (1), and the two grooves (14) correspond to the two base islands (9) respectively. A plurality of heat dissipation holes (15) distributed at equal distances vertically penetrate each groove (14).

3. The multi-chip dual-island SOT packaging structure according to claim 1, characterized in that: A blind hole (18) is horizontally formed on the side of the insert block (10), a first spring (19) is horizontally fixed in the blind hole (18), the end of the first spring (19) is fixedly connected to the limit block (5), the limit block (5) is axially slidably connected in the blind hole (18), a through hole (4) connected to the slot (11) is horizontally formed on the side of the shell (1), the end of the limit block (5) is axially slidably connected in the through hole (4), and the end of the limit block (5) is flush with the outside of the shell (1).

4. The multi-chip dual-island SOT packaging structure according to claim 3, characterized in that: Two mirror-symmetrical first sliding grooves (17) are axially formed on the inner wall of the blind hole (18), and a first sliding block (16) is slidably connected in each of the first sliding grooves (17), and the two first sliding blocks (16) are fixedly connected to the limit block (5).

5. The multi-chip dual-island SOT packaging structure according to claim 1, characterized in that: The inner wall of the slot (11) is vertically provided with two second sliding grooves (20) in mirror symmetry, each of the second sliding grooves (20) is slidably connected with a second slider (21), a push plate (23) is fixed between the two second sliders (21), the push plate (23) abuts against the bottom surface of the insert block (10), and two second springs (22) are vertically fixed to the bottom surface of the push plate (23), and the second springs (22) are vertically fixed to the bottom wall of the slot (11).

6. The multi-chip dual-island SOT packaging structure according to claim 1, characterized in that: The inner wall of the shell (1) is vertically provided with eight mirror-symmetrical second positioning grooves (12), each of which is axially inserted into a second positioning block (13), and each of the four corners of the bottom surface of the base island (9) is vertically fixed with a second positioning block (13); the bottom surface of the cover plate (3) is vertically provided with eight mirror-symmetrical first positioning grooves (6), each of which is axially inserted into a first positioning block (7), and each of the four corners of the top surface of the base island (9) is vertically fixed with a first positioning block (7).

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