Ceramic-based anti-oxidation circuit board
By setting conductive lines in the ceramic baseline circuit board and covering the anti-static, anti-oxidation and high-temperature layers, the problems of conductive lines oxidation and electronic devices are solved, achieving a longer service life and better heat dissipation effect.
Patent Information
- Application Number
- CN202420884883.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-26
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2034-04-26
AI Technical Summary
The conductive lines of existing ceramic baseline circuit boards are easily oxidized, resulting in increased load and severe heat generation, while electronic devices are prone to fall off.
The conductive lines are arranged in the ceramic substrate and the anti-static layer, an oxidation layer and a high-temperature layer are covered on the outer surface, while an embedded cavity is provided on the ceramic substrate to fix the electronic devices.
Effectively prevent oxidation of conductive lines, avoid heat generation and load increase, extend service life, and ensure stable installation of electronic devices and good thermal conductivity through embedded cavity.
Smart Images
Figure CN222655393U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of ceramic circuit boards, in particular to an anti-oxidation circuit board using a ceramic base. Background Art
[0002] With the gradual deepening of electronic technology in various application fields, the high integration of circuit boards has become an inevitable trend. Highly integrated packaging modules require a good heat dissipation bearing system, and the disadvantages of traditional circuit boards FR-4 and CEM-3 in TC (thermal conductivity) have become a bottleneck restricting the development of electronic technology. The LED industry, which has developed rapidly in recent years, has also put forward higher requirements for the TC indicators of its bearing circuit boards. In the field of high-power LED lighting, materials with good heat dissipation performance such as metals and ceramics are often used to prepare circuit substrates. The thermal conductivity of high thermal conductivity aluminum-based circuit boards is generally 1-4W / MK, while the thermal conductivity of ceramic-based circuit boards can reach about 220W / MK depending on their preparation methods and material formulations.
[0003] The main structure of the existing ceramic-based circuit board includes a ceramic substrate and a conductive circuit; the conductive circuit is arranged on the ceramic substrate, and the conductive circuit has a plurality of pads, and the plurality of pads are used for welding and conducting with electronic devices.
[0004] However, in the prior art, the conductive circuit is completely exposed on the surface of the ceramic substrate. Since the conductive circuit is generally made of copper-plated material, it is easy to be oxidized by air, thereby increasing the load of the conductive circuit, causing the conductive circuit to heat up seriously. At the same time, the electronic devices thereon lack the necessary fixing structure, making the electronic devices easy to fall off. Therefore, it is necessary to improve the current ceramic-based circuit board. Utility Model Content
[0005] In view of this, the present invention aims to overcome the deficiencies in the prior art, and its main purpose is to provide a ceramic-based anti-oxidation circuit board, which can effectively solve the problem that the conductive circuits of the existing ceramic-based circuit boards are easily oxidized and the electronic components are easily detached.
[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0007] A ceramic-based anti-oxidation circuit board comprises a ceramic substrate and a conductive circuit; the conductive circuit is arranged on the ceramic substrate, and the conductive circuit has a plurality of first pads; the upper surface of the ceramic substrate is concavely provided with a plurality of embedding cavities for electronic devices to be tightly fitted and embedded, the conductive circuit is located in the ceramic substrate, and the plurality of first pads are respectively located on the bottom surfaces of the corresponding embedding cavities; the bottom surface of the ceramic substrate is provided with a second pad, the outer surface of the second pad is a gold-plated layer, a vertical conductive column is arranged in the ceramic substrate, and the vertical conductive column is conductively connected between the second pad and the conductive circuit; and the outer surface of the ceramic substrate is completely covered with an antistatic layer, the outer surface of the antistatic layer is completely covered with an anti-oxidation layer, the outer surface of the anti-oxidation layer is completely covered with a high-temperature resistant layer, and the gold-plated layer exposes the outer surface of the high-temperature resistant layer.
[0008] As a preferred embodiment, the ceramic substrate includes a lower ceramic layer and an upper ceramic layer; the upper and lower surfaces of the lower ceramic layer are penetrated with through holes, the vertical conductive column is formed and fixed in the through holes, and the second solder pad is electroplated and fixed on the lower surface of the lower ceramic layer; the upper ceramic layer is bonded and fixed on the upper surface of the lower ceramic layer, and the upper and lower surfaces of the upper ceramic layer are penetrated with through grooves, and the lower ceramic layer seals the lower end opening of the through groove to form the aforementioned embedded cavity, which has a simple structure and is easy to manufacture.
[0009] As a preferred solution, the upper ceramic layer is fixed to the upper surface of the lower ceramic layer by bonding or welding, and the combination is firm and reliable, and the production is simple.
[0010] As a preferred solution, the upper surface of the lower ceramic layer is provided with a recessed groove, the conductive circuit is electroplated in the recessed groove, and the first soldering pad protrudes from the upper surface of the lower ceramic layer to prevent the conductive circuit from falling off and enable the first soldering pad to be more reliably bonded and soldered to the electronic device.
[0011] As a preferred solution, the antistatic layer is a polyurethane antistatic coating, and the provision of the polyurethane antistatic coating enables the ceramic substrate to have good antistatic performance.
[0012] As a preferred embodiment, the anti-oxidation layer is composed of a molybdenum disulfide coating and a boron nitride coating. The molybdenum disulfide coating is coated on the outer surface of the antistatic layer, and the boron nitride coating is coated on the outer surface of the molybdenum disulfide coating. By setting the molybdenum disulfide coating, it has moisture-proof, waterproof, alkali-proof, acid-proof and antioxidant properties. By setting the boron nitride coating, it has excellent lubricity and antioxidant ability.
[0013] As a preferred solution, the high temperature resistant layer is a Teflon coating. By providing the Teflon coating, the high temperature resistance of the ceramic substrate is further improved.
[0014] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:
[0015] By setting the conductive circuit in the ceramic substrate and coordinating with the antistatic layer, anti-oxidation layer and anti-high temperature layer, the risk of oxidation of the conductive circuit is effectively eliminated, the load of the conductive circuit is prevented from increasing due to oxidation, serious heating will not occur, and the service life is also longer. At the same time, by providing an embedded cavity, the electronic device is tightly embedded in the embedded cavity, so that the electronic device is stably installed and not prone to falling off. In addition, the contact area between the electronic device and the ceramic substrate is larger, the thermal conductivity is better, and the heat generated by the electronic device can be transferred out through the ceramic substrate more quickly, achieving a better heat dissipation effect for the electronic device.
[0016] In order to more clearly illustrate the structural features and functions of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a cross-sectional schematic diagram of a preferred embodiment of the utility model;
[0018] Figure 2 yes Figure 1 A magnified schematic diagram of position A in the middle.
[0019] Description of the accompanying drawings:
[0020] 10. Ceramic substrate 11. Lower ceramic layer
[0021] 111, through hole 112, embedded groove
[0022] 12. Upper ceramic layer 121. Through groove
[0023] 101, embedded cavity 20, conductive circuit
[0024] 21, first pad 30, second pad
[0025] 31. Gold-plated layer 40. Vertical conductive column
[0026] 50. Antistatic layer 60. Antioxidation layer
[0027] 61. Molybdenum disulfide coating 62. Boron nitride coating
[0028] 70. High temperature resistant layer. DETAILED DESCRIPTION
[0029] Please refer to Figure 1 and Figure 2 As shown, it shows the specific structure of a preferred embodiment of the utility model, including a ceramic substrate 10 and a conductive circuit 20.
[0030] The upper surface of the ceramic substrate 10 is concavely provided with a plurality of embedding cavities 101 for tightly fitting and embedding electronic devices. Specifically, the ceramic substrate 10 includes a lower ceramic layer 11 and an upper ceramic layer 12; the upper and lower surfaces of the lower ceramic layer 11 are penetrated with through holes 111, the upper ceramic layer 12 is fixedly attached to the upper surface of the lower ceramic layer 11, and the upper and lower surfaces of the upper ceramic layer 12 are penetrated with through grooves 121, and the lower ceramic layer 11 seals the lower end opening of the through grooves 121 to form the aforementioned embedding cavity 101. In this embodiment, the upper ceramic layer 12 is fixedly attached to the upper surface of the lower ceramic layer 11 by bonding or welding, and the combination is stable and reliable. In addition, the upper surface of the lower ceramic layer 11 is concavely provided with an embedding groove 112.
[0031] The conductive circuit 20 is arranged on the ceramic substrate 10, and the conductive circuit 20 has a plurality of first pads 21; and the conductive circuit 20 is located in the ceramic substrate 10, and the plurality of first pads 21 are respectively located on the bottom surface of the corresponding embedding cavity 101; the bottom surface of the ceramic substrate 10 is provided with a second pad 30, and the outer surface of the second pad 30 is a gold-plated layer 31, and the ceramic substrate 10 is provided with a vertical conductive column 40, and the vertical conductive column 40 is conductively connected between the second pad 30 and the conductive circuit 20. In this embodiment, the conductive circuit 20 is electroplated in the embedding groove 112, and the first pad 21 protrudes from the upper surface of the lower ceramic layer 11 to prevent the conductive circuit 20 from falling off, and to make the first pad 21 more reliably bonded and welded with the electronic device. In addition, the vertical conductive column 40 is formed and fixed in the through hole 111, and the second pad 30 is electroplated and fixed on the lower surface of the lower ceramic layer 11, which has a simple structure and is easy to manufacture. In addition, the conductive circuit 20 is made of copper-plated material, the main body of the second pad 30 is made of copper-plated material, and the vertical conductive column 40 is made of copper material formed by deposition.
[0032] Furthermore, the outer surface of the ceramic substrate 10 is completely covered with an antistatic layer 50, the outer surface of the antistatic layer 50 is completely covered with an anti-oxidation layer 60, the outer surface of the anti-oxidation layer 60 is completely covered with an anti-high temperature layer 70, and the gold-plated layer 31 exposes the outer surface of the anti-high temperature layer 70. In this embodiment, the antistatic layer 50 is a polyurethane antistatic coating, and the thickness of the polyurethane antistatic coating is 0.05-0.07 mm. By providing the antistatic layer 50, the provision of the polyurethane antistatic coating enables the ceramic substrate 10 to have good antistatic performance. The anti-oxidation layer 60 is composed of a molybdenum disulfide coating 61 and a boron nitride coating 62. The molybdenum disulfide coating 61 is coated on the outer surface of the antistatic layer 50, and the boron nitride coating 62 is coated on the outer surface of the molybdenum disulfide coating 61. By setting the molybdenum disulfide coating 61, it has moisture-proof, waterproof, alkali-proof, acid-proof and anti-oxidation properties. By setting the boron nitride coating 62, it has excellent lubricity and anti-oxidation ability. The thickness of the molybdenum disulfide coating 61 and the boron nitride coating 62 is the same. The high temperature resistant layer 70 is a Teflon coating. By setting the Teflon coating, the high temperature resistance of the ceramic substrate 10 is further improved.
[0033] The production process of this embodiment is described in detail as follows:
[0034] First, a conductive circuit 20, a vertical conductive column 40 and a second pad 30 are produced on the lower ceramic layer 11 by electroplating. Then, the upper ceramic layer 12 is bonded and fixed to the upper surface of the lower ceramic layer 11. Then, a polyurethane antistatic coating is coated on the outer surface of the ceramic substrate 10 to form an antistatic layer 50. Then, a molybdenum disulfide coating 61 and a boron nitride coating 62 are sequentially coated on the outer surface of the antistatic layer 50 to form an anti-oxidation layer 60. Finally, a Teflon coating is coated on the outer surface of the anti-oxidation layer 60 to form a high temperature resistant layer 70.
[0035] When in use, the electronic device is embedded in the embedding cavity 101 , so that the patch solder feet at the bottom of the electronic device are welded and fixed to the first solder pad 21 and connected. At the same time, the outer peripheral side wall of the electronic device is sealed with the inner peripheral side wall of the embedding cavity 101 .
[0036] The design focus of the utility model is: by setting the conductive circuit in the ceramic substrate, and coordinating the antistatic layer, the anti-oxidation layer and the anti-high temperature layer, the risk of oxidation of the conductive circuit is effectively eliminated, the load of the conductive circuit is prevented from increasing due to oxidation, serious heating will not occur, and the service life is also longer. At the same time, by providing an embedded cavity, the electronic device is tightly embedded in the embedded cavity, so that the electronic device is stably installed and not prone to falling off, and the contact area between the electronic device and the ceramic substrate is larger, the thermal conductivity is better, and the heat generated by the electronic device can be transferred out through the ceramic substrate more quickly, achieving a better heat dissipation effect for the electronic device.
[0037] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.
Claims
1. A ceramic-based anti-oxidation circuit board, comprising a ceramic substrate and a conductive circuit; the conductive circuit is arranged on the ceramic substrate, and the conductive circuit has a plurality of first pads; characterized in that: The upper surface of the ceramic substrate is recessed with a plurality of embedding cavities for tightly fitting electronic devices, the conductive circuit is located in the ceramic substrate, and the plurality of first pads are respectively located on the bottom surfaces of the corresponding embedding cavities; the bottom surface of the ceramic substrate is provided with a second pad, the outer surface of the second pad is a gold-plated layer, a vertical conductive column is provided in the ceramic substrate, and the vertical conductive column is conductively connected between the second pad and the conductive circuit; and the outer surface of the ceramic substrate is completely covered with an antistatic layer, the outer surface of the antistatic layer is completely covered with an anti-oxidation layer, the outer surface of the anti-oxidation layer is completely covered with a high-temperature resistant layer, and the gold-plated layer exposes the outer surface of the high-temperature resistant layer.
2. The ceramic-based anti-oxidation circuit board according to claim 1, characterized in that: The ceramic substrate includes a lower ceramic layer and an upper ceramic layer; the upper and lower surfaces of the lower ceramic layer are penetrated with through holes, the vertical conductive column is formed and fixed in the through holes, and the second pad is electroplated and fixed on the lower surface of the lower ceramic layer; the upper ceramic layer is bonded and fixed on the upper surface of the lower ceramic layer, and the upper and lower surfaces of the upper ceramic layer are penetrated with through grooves, and the lower ceramic layer seals the lower end opening of the through groove to form the aforementioned embedded cavity.
3. The ceramic-based anti-oxidation circuit board according to claim 2, characterized in that: The upper ceramic layer is fixed on the upper surface of the lower ceramic layer by bonding or welding.
4. The ceramic-based anti-oxidation circuit board according to claim 2, characterized in that: An embedding groove is concavely arranged on the upper surface of the lower ceramic layer, the conductive circuit is formed by electroplating in the embedding groove, and the first pad protrudes from the upper surface of the lower ceramic layer.
5. The ceramic-based anti-oxidation circuit board according to claim 1, characterized in that: The antistatic layer is a polyurethane antistatic coating.
6. The ceramic-based anti-oxidation circuit board according to claim 1, characterized in that: The anti-oxidation layer consists of a molybdenum disulfide coating and a boron nitride coating. The molybdenum disulfide coating is coated on the outer surface of the antistatic layer, and the boron nitride coating is coated on the outer surface of the molybdenum disulfide coating.
7. The ceramic-based anti-oxidation circuit board according to claim 1, characterized in that: The high temperature resistant layer is a Teflon coating.