Surface coating equipment for semiconductor component

Abstract

The utility model relates to the technical field of surface spraying of semiconductor parts, and discloses surface coating equipment for semiconductor parts, according to the scheme, the surface coating equipment comprises a spraying box, a first vertical plate is fixedly connected to the inner wall of the bottom side of the spraying box, and a second vertical plate is slidably connected to the inner wall of the bottom side of the spraying box; the right side of the first vertical plate and the left side of the second vertical plate are rotationally connected with pressing discs, and the inner wall of the left side of the spraying box is fixedly connected with a motor. A spraying ring is arranged, the two pressing discs are matched with each other to extrude and fix a semiconductor part, and at the moment, the motor generates driving force to drive a reciprocating lead screw to rotate; the reciprocating screw rod drives the spraying ring to reciprocate left and right, when the spraying ring reciprocates left and right, the surface of the semiconductor part can be effectively sprayed, compared with a manual spraying mode, the semiconductor part can be sprayed more uniformly, the spraying operation is sealed, pollution to the environment can be avoided, and the spraying efficiency is improved. Therefore, the body health of surrounding workers is protected.

Description

Technical Field

[0001] The present application relates to the technical field of surface spraying of semiconductor components, and in particular to surface coating equipment for semiconductor components. Background Art

[0002] Matter exists in various forms, such as solid, liquid, gas, plasma, etc. We usually call materials with poor conductivity, such as coal, artificial crystal, amber, ceramics, etc., insulators. Metals with good conductivity, such as gold, silver, copper, iron, tin, aluminum, etc., are called conductors. Materials between conductors and insulators can be simply called semiconductors.

[0003] However, in actual applications, most of the existing tubular semiconductor parts are sprayed manually during spraying. Although manual operation is more flexible, manual spraying will inevitably cause the thickness of the sprayed layer to deviate and become less uniform, thus affecting the aesthetics. Moreover, long-term spraying operations will also pose a threat to the health of workers.

[0004] Therefore, those skilled in the art provide a surface coating device for semiconductor components to solve the problems raised in the above background technology. Utility Model Content

[0005] In order to solve the problem proposed in the above background technology that manual operation has high flexibility, but manual spraying will inevitably cause deviation in the thickness uniformity of the sprayed layer, thereby affecting the aesthetics, and long-term spraying operations will also pose a threat to the health of workers, the present application provides surface coating equipment for semiconductor components.

[0006] The surface coating equipment for semiconductor components provided in the present application adopts the following technical scheme: it includes a spray box, the bottom inner wall of the spray box is fixedly connected with a first vertical plate, the bottom inner wall of the spray box is slidably connected with a second vertical plate, the right side of the first vertical plate and the left side of the second vertical plate are both rotatably connected with a pressure plate, the left inner wall of the spray box is fixedly connected with a motor, the left and right inner walls of the spray box are rotatably connected with the same reciprocating screw, the outer side of the reciprocating screw is spirally driven with a spray ring, the output shaft of the motor and the outer side of the reciprocating screw are fixedly sleeved with sprockets, the outer sides of the two sprockets are meshed with the same chain, and an elastic hose is fixedly connected to the center of the rear side of the spray box, and the elastic hose is fixedly connected to the rear side of the spray ring.

[0007] Preferably, the output shaft of the motor is fixedly connected to the left side of one of the two pressure plates.

[0008] Preferably, positioning round blocks are threadedly connected at the inner centers of the two pressure plates.

[0009] Preferably, a plurality of heating rods are fixedly mounted on the inner wall of the top side of the spray box, and the plurality of heating rods are electrically connected to an external power source.

[0010] Preferably, the right side wall of the spray box is rotatably connected with a spiral rod, and the spiral rod is spirally connected to the second vertical plate.

[0011] In summary, this application includes the following beneficial technical effects:

[0012] 1. By setting up the spray ring, the two pressure plates cooperate with each other to squeeze and fix the semiconductor components. At this time, the motor generates a driving force to drive the reciprocating screw to rotate, and the reciprocating screw drives the spray ring to move back and forth left and right. When the spray ring moves back and forth left and right, the surface of the semiconductor components can be effectively sprayed. Compared with the manual spraying method, the semiconductor components can be sprayed more evenly, and the sealed spraying operation can avoid pollution to the environment, thereby protecting the health of surrounding workers.

[0013] 2. By setting the output shaft of the motor to be fixedly connected to the left side of one of the two pressure plates, the motor can use the pressure plate to drive the semiconductor components to rotate when working, and the spray ring sprays the semiconductor components in a rotating state, which can further improve the uniformity of the spray layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the appearance structure of a surface coating device for semiconductor components in an embodiment of the present application;

[0015] Figure 2 It is a left sectional structural schematic diagram of a surface coating device for semiconductor components in an embodiment of the present application;

[0016] Figure 3 It is a right sectional structural schematic diagram of a surface coating device for semiconductor components in an embodiment of the present application;

[0017] Figure 4 It is a schematic diagram of the rear cross-sectional structure of the surface coating equipment for semiconductor components in the embodiment of the present application.

[0018] Explanation of the reference numerals: 1. spray box; 2. first vertical plate; 3. second vertical plate; 4. pressure plate; 5. motor; 6. reciprocating screw; 7. spray ring; 8. sprocket; 9. chain; 10. elastic hose; 11. positioning round block; 12. heating rod; 13. spiral rod. DETAILED DESCRIPTION

[0019] The following will be combined with the attached Figure 1-4The technical solution of the utility model is described clearly and completely. Obviously, the described embodiments are part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] In the description of the present utility model, it should be noted that the orientation or position relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present utility model. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances. In addition, the technical features involved in the different embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0021] The present application embodiment discloses a surface coating device for semiconductor components, referring to Figure 1-4, including a spray box 1, a first vertical plate 2 is fixedly connected to the inner wall of the bottom side of the spray box 1, a second vertical plate 3 is slidably connected to the inner wall of the bottom side of the spray box 1, a pressure plate 4 is rotatably connected to the right side of the first vertical plate 2 and the left side of the second vertical plate 3, a motor 5 is fixedly connected to the inner wall of the left side of the spray box 1, the inner walls of the left and right sides of the spray box 1 are rotatably connected to the same reciprocating screw 6, the outer side of the reciprocating screw 6 is spirally driven with a spray ring 7, the output shaft of the motor 5 and the outer side of the reciprocating screw 6 are fixedly sleeved with a sprocket 8, the outer sides of the two sprockets 8 are meshed and connected with the same chain 9, the rear center of the spray box 1 is fixedly connected There is an elastic hose 10, which is fixedly connected to the rear side of the spray ring 7; by setting the spray ring 7, the two pressure plates 4 cooperate with each other to squeeze and fix the semiconductor components. At this time, the motor 5 generates a driving force to drive the reciprocating screw 6 to rotate, and the reciprocating screw 6 drives the spray ring 7 to move back and forth left and right. When the spray ring 7 moves back and forth left and right, the surface of the semiconductor components can be effectively sprayed. Compared with the manual spraying method, the semiconductor components can be sprayed more evenly, and the sealed spraying operation can avoid pollution to the environment, thereby protecting the health of surrounding workers.

[0022] In the present application, the output shaft of the motor 5 is fixedly connected to the left side of one of the two pressure plates 4; by setting the output shaft of the motor 5 to be fixedly connected to the left side of one of the two pressure plates 4, the motor 5 can use the pressure plate 4 to drive the semiconductor components to rotate when working, and the spray ring 7 sprays the semiconductor components in a rotating state, which can further improve the uniformity of the spray layer.

[0023] In the present application, the inner centers of the two pressure plates 4 are both threadedly connected with positioning blocks 11; by providing the positioning blocks 11, when the two pressure plates 4 squeeze and fix the semiconductor components, the positioning blocks 11 can be used to support and contact the inner walls of the semiconductor components, thereby preventing the semiconductor components from shifting during rotation. At the same time, the threaded positioning blocks 11 can be replaced according to the inner diameters of different semiconductor components, thereby effectively improving the scope of application.

[0024] In the present application, a plurality of heating rods 12 are fixedly installed on the inner wall of the top side of the spray box 1, and the plurality of heating rods 12 are electrically connected to an external power supply; by setting the heating rods 12, the heating rods 12 can increase the ambient temperature inside the spray box 1, thereby accelerating the drying speed of the paint and improving work efficiency.

[0025] In the present application, the right side wall of the spray box 1 is rotatably connected with a screw rod 13, and the screw rod 13 is spirally connected to the second vertical plate 3; by setting the screw rod 13 and twisting the screw rod 13, the distance between the two pressure plates 4 can be adjusted when the screw rod 13 rotates, so that the semiconductor components can be easily taken out after spraying is completed, thereby improving the convenience of use.

[0026] The standard parts used in the utility model can all be purchased from the market, and special-shaped parts can be customized according to the instructions and the drawings. The specific connection methods of each part adopt the conventional means such as mature bolts, rivets, welding, etc. in the existing technology. The machinery, parts and equipment all adopt the conventional models in the existing technology, and the circuit connection adopts the conventional connection method in the existing technology, which will not be described in detail here.

[0027] The implementation principle of the surface coating equipment for semiconductor components in the embodiment of the present application is as follows: when in use, the two pressure plates 4 cooperate with each other to squeeze and fix the tubular semiconductor components. At this time, the output shaft of the motor 5 cooperates with the sprocket 8 and the chain 9 to drive the reciprocating screw 6 to rotate, and the reciprocating screw 6 drives the spray ring 7 to move back and forth left and right. When the spray ring 7 moves back and forth left and right, the surface of the semiconductor components can be effectively sprayed. Compared with the manual spraying method, the semiconductor components can be sprayed more evenly, and the sealed spraying operation can avoid pollution to the environment, thereby protecting the health of surrounding workers. The output shaft of the motor 5 drives one of the two pressure plates 4 to rotate, so that the motor 5 can use the pressure plate 4 to drive the semiconductor components to rotate when working, and the spray ring 7. Spraying the semiconductor components in a rotating state can further improve the uniformity of the spray layer. When the two pressure plates 4 squeeze and fix the semiconductor components, the positioning block 11 can be used to support and contact the inner wall of the semiconductor components, thereby avoiding the semiconductor components from shifting during rotation. At the same time, the threaded positioning block 11 can be replaced according to the inner diameter of different semiconductor components, thereby effectively improving the scope of application. The heating rod 12 can increase the ambient temperature inside the spray box 1, thereby accelerating the drying speed of the paint and improving work efficiency. Twist the spiral rod 13, and the distance between the two pressure plates 4 can be adjusted when the spiral rod 13 rotates, so that the semiconductor components can be easily taken out after spraying, which improves the convenience of use.

[0028] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change;

[0029] Secondly: The drawings of the embodiments disclosed in the present utility model only involve structures related to the embodiments disclosed in the present utility model, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present utility model can be combined with each other;

[0030] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A surface coating device for semiconductor components, comprising a spray box (1), characterized in that: The bottom inner wall of the spray box (1) is fixedly connected to a first vertical plate (2), the bottom inner wall of the spray box (1) is slidably connected to a second vertical plate (3), the right side of the first vertical plate (2) and the left side of the second vertical plate (3) are both rotatably connected to a pressure plate (4), the left inner wall of the spray box (1) is fixedly connected to a motor (5), the left and right inner walls of the spray box (1) are rotatably connected to a reciprocating screw (6), the outer side of the reciprocating screw (6) is spirally driven with a spray ring (7), the output shaft of the motor (5) and the outer side of the reciprocating screw (6) are fixedly sleeved with a sprocket (8), the outer sides of the two sprockets (8) are meshedly connected with a chain (9), the rear center of the spray box (1) is fixedly connected to an elastic hose (10), and the elastic hose (10) is fixedly connected to the rear side of the spray ring (7).

2. The surface coating equipment for semiconductor components according to claim 1, characterized in that: The output shaft of the motor (5) is fixedly connected to the left side of one of the two pressure plates (4).

3. The surface coating equipment for semiconductor components according to claim 1, characterized in that: Positioning round blocks (11) are threadedly connected at the inner centers of the two pressure plates (4).

4. The surface coating equipment for semiconductor components according to claim 1, characterized in that: A plurality of heating rods (12) are fixedly mounted on the inner wall of the top side of the spray box (1), and the plurality of heating rods (12) are all electrically connected to an external power source.

5. The surface coating equipment for semiconductor components according to claim 1, characterized in that: The right side wall of the spray box (1) is rotatably connected to a screw rod (13), and the screw rod (13) is connected to the second vertical plate (3) by screw transmission.

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