Driving device of workpiece adsorption mechanism for wafer sorting

Abstract

The utility model discloses a driving device of a workpiece adsorption mechanism for wafer sorting, which comprises a base plate, a workpiece adsorption mechanism, a driving device and a driving device, the middle part of the base plate is provided with a mounting groove, and the middle part of the mounting groove is provided with a corresponding guide hole; the shock absorber comprises a shock absorption container fixedly embedded in the mounting groove, and the shock absorption container is filled with a plurality of corresponding damping particles; the driving motor is fixedly mounted at the bottom of the base plate; the plurality of spherical jacking pieces are respectively mounted on the two sides of the inner hole of the vibration reduction container in a rolling manner according to the height; and the jacking convex edges are arranged on the two sides of the output shaft of the driving motor in a step shape, and in the rotating process of the output shaft of the driving motor, the jacking convex edges are in rolling abutting connection with the corresponding spherical jacking pieces in sequence. According to the utility model, the normal driving of the workpiece adsorption mechanism can be effectively maintained, and an obvious vibration reduction effect can be effectively formed in the driving process.

Description

Technical Field

[0001] The utility model relates to a driving device, in particular to a driving device of a workpiece adsorption mechanism for wafer sorting. Background Art

[0002] The wafer sorting machine needs to sort the different electronic data wafers that have passed the test. Hundreds or thousands of wafers with different data are attached to a substrate, and multiple substrates are placed vertically in a substrate slot. During the sorting process, the substrate moves to effectively transport the qualified wafers to the location of the workpiece adsorption mechanism, and then the corresponding ejector mechanism ejects the corresponding wafer so that it is adsorbed by the suction nozzle of the workpiece adsorption mechanism, and the qualified wafer is transferred to the substrate on the other side by the rotation of the workpiece adsorption mechanism.

[0003] At present, the workpiece adsorption mechanism for wafer sorting is generally driven by a corresponding driving device. The driving device of the workpiece adsorption mechanism for existing wafer sorting generally adopts a conventional driving motor. In the process of driving the workpiece adsorption mechanism to rotate, due to the relatively fast rotation speed, the overall operation of the equipment has relatively large vibrations, which may cause the wafer to be unable to be accurately attached to the qualified product receiving substrate in severe cases.

[0004] Therefore, the purpose of the present invention is to design a driving device for the workpiece adsorption mechanism that can effectively maintain the normal driving of the workpiece adsorption mechanism and can effectively form an obvious vibration reduction effect during the driving process, thereby effectively reducing the vibration amount during the operation of the equipment, so as to ensure that the chip can be accurately attached to the qualified product holding substrate and use the drive device of the workpiece adsorption mechanism. Summary of the invention

[0005] In view of the technical problems existing in the above-mentioned prior art, the utility model provides a driving device for a workpiece adsorption mechanism for wafer sorting. The workpiece adsorption mechanism for a wafer sorting machine based on a vibration-damping base can effectively solve the technical problems existing in the above-mentioned prior art.

[0006] The technical solution of the utility model is:

[0007] A driving device for a workpiece adsorption mechanism for wafer sorting, comprising:

[0008] A base plate is fixedly mounted on a corresponding workbench, a mounting groove is provided in the middle of the base plate, and a corresponding guide hole is provided in the middle of the mounting groove;

[0009] The vibration damper comprises a vibration damping container fixedly embedded in the installation groove, the vibration damping container is arranged in a ring shape, and a plurality of corresponding damping particles are filled and installed in the vibration damping container;

[0010] A driving motor is fixedly mounted on the bottom of the base plate, and the output shaft of the driving motor extends to the upper side of the vibration damper after passing through the guide hole and the inner hole of the vibration damping container;

[0011] A plurality of spherical tightening members are respectively and rollingly installed on both sides of the inner hole of the vibration damping container according to height;

[0012] A plurality of tightening convex edges are arranged in a step-like manner on both sides of the output shaft of the driving motor. When the output shaft of the driving motor rotates, the tightening convex edges form rolling contact with the corresponding spherical tightening members in sequence.

[0013] The vibration-damping container comprises a vibration-damping groove arranged in a ring shape and an annular cover plate fixedly connected to the upper part of the vibration-damping groove, and the damping particles are filled in the space formed by the vibration-damping groove and the annular cover plate.

[0014] The outer edge of the annular cover plate extends to the outside of the mounting groove and is fixedly mounted on the upper surface of the base plate by corresponding locking bolts.

[0015] The outer bottom of the vibration-damping groove is concavely provided with a corresponding slot, in which a corresponding rubber gasket is fixedly installed. After the vibration-damping groove is installed in place, the rubber gasket is located between the vibration-damping groove and the base plate in an extruded state.

[0016] A corresponding spherical installation groove is arranged on the inner hole wall of the vibration-damping container, and the spherical pressing member is assembled into the spherical installation groove by stamping.

[0017] The damping particles are iron-based or aluminum-based spherical particles.

[0018] Advantages of the utility model:

[0019] 1) The utility model sets installation grooves and guide holes on the base plate, so that the vibration damper can be effectively installed while the drive motor is normally installed. The spherical tightening parts set on both sides of the vibration damping container are used to roll and tighten the tightening convex edge set on the output shaft end of the drive motor, which can not only effectively improve the installation and operation stability of the drive motor, but also transmit the vibration generated by the operation of the equipment to the vibration damper, so as to achieve the vibration reduction effect through the friction energy consumption between the damping particles of the vibration damper. In this way, the normal drive of the workpiece adsorption mechanism can be effectively maintained, and an obvious vibration reduction effect can be effectively formed during the driving process, so as to effectively reduce the vibration amount during the operation of the equipment, thereby ensuring that the chip can be accurately attached to the qualified product holding substrate.

[0020] 2) Since the equipment is in operation most of the time, the continuous rolling friction between the tightening ridge and the spherical tightening member can easily cause overheating of the components. To this end, the utility model further arranges the spherical tightening member on both sides of the vibration damping container according to height, and arranges the tightening ridge in a step-like manner on both sides of the output shaft of the drive motor. In this way, during the operation of the equipment, the tightening ridge and the spherical tightening member can achieve rolling contact through one-by-one contact, thereby greatly reducing the contact rate between each tightening ridge and the spherical tightening member, and the tightening ridge arranged in a step-like manner can also form obvious disturbances to the airflow during rotation, thereby improving the heat dissipation effect. Thereby effectively solving the problem of friction overheating between the tightening ridge and the spherical tightening member, thereby ensuring the practical effect of the utility model.

[0021] 3) The vibration-damping container of the utility model comprises a vibration-damping groove arranged in a ring shape, and an annular cover plate fixedly connected to the upper part of the vibration-damping groove. The outer bottom of the vibration-damping groove is concavely provided with a corresponding card groove, and a corresponding rubber gasket is fixedly installed in the card groove. After the vibration-damping groove is installed in place, the rubber gasket is located between the vibration-damping groove and the base plate in an extruded state, so as to ensure the installation stability of the vibration-damping container while effectively improving the vibration-damping effect through the buffering effect of the rubber gasket. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of the utility model.

[0023] Figure 2 It is a partial cross-sectional view of the utility model.

[0024] Figure 3 It is a structural schematic diagram of a drive motor installed on the base plate.

[0025] In the accompanying drawings: base plate 1, mounting groove 101, guide hole 102, shock absorber 2, shock absorbing container 201, shock absorbing groove 2011, annular cover plate 2012, damping particles 202, drive motor 3, spherical tightening member 4, tightening convex edge 5, locking bolt 6, rubber gasket 7, workpiece adsorption mechanism 8. DETAILED DESCRIPTION

[0026] In order to facilitate understanding by those skilled in the art, the structure of the present invention is further described in detail with reference to the accompanying drawings:

[0027] refer to Figure 1-3 , a driving device for a workpiece adsorption mechanism for wafer sorting, comprising:

[0028] A base plate 1 is fixedly mounted on a corresponding workbench, a mounting groove 101 is provided in the middle of the base plate 1, and a corresponding guide hole 102 is provided in the middle of the mounting groove 101;

[0029] The vibration damper 2 comprises a vibration damping container 201 fixedly embedded in the installation groove 101, the vibration damping container 201 is arranged in a ring shape, and a plurality of corresponding damping particles 202 are filled and installed in the vibration damping container 201;

[0030] The driving motor 3 is fixedly mounted on the bottom of the base plate 1, and the output shaft of the driving motor 3 extends to the upper side of the shock absorber 2 after passing through the guide hole 102 and the inner hole of the shock absorber container 201;

[0031] A plurality of spherical tightening members 4 are respectively and rollingly installed on both sides of the inner hole of the vibration damping container 201 according to height;

[0032] A plurality of tightening ridges 5 are arranged in a step-like manner on both sides of the output shaft of the driving motor 3. When the output shaft of the driving motor 3 rotates, the tightening ridges 5 are in rolling contact with the corresponding spherical tightening members 4 in sequence.

[0033] The utility model sets the installation groove 101 and the guide hole 102 on the base plate 1, so as to effectively install the vibration damper 2 while the driving motor 3 is normally installed. The spherical tightening parts 4 set on both sides of the vibration damping container 201 are used to roll and tighten the tightening convex edge 5 set on the output shaft end of the driving motor 3, which can effectively improve the installation and operation stability of the driving motor 3, and can transmit the vibration generated by the operation of the equipment to the vibration damper 2, so as to achieve the vibration reduction effect through the friction energy consumption between the damping particles 202 of the vibration damper 2. Therefore, the normal driving of the workpiece adsorption mechanism 8 can be effectively maintained, and an obvious vibration reduction effect can be effectively formed during the driving process, so as to effectively reduce the vibration amount during the operation of the equipment, thereby ensuring that the chip can be accurately attached to the qualified product holding substrate.

[0034] Since the equipment is in operation most of the time, the continuous rolling friction between the tightening ridge 5 and the spherical tightening member 4 can easily cause overheating of the components. To this end, the utility model further arranges the spherical tightening member 4 on both sides of the vibration damping container 201 according to height, and arranges the tightening ridge 5 in a step-like manner on both sides of the output shaft of the driving motor 3. In this way, during the operation of the equipment, the tightening ridge 5 and the spherical tightening member 4 can be brought into rolling contact by contacting one by one, thereby greatly reducing the contact rate between each tightening ridge 5 and the spherical tightening member 4, and the tightening ridge 5 arranged in a step-like manner can also form obvious disturbances to the airflow during the rotation process, thereby improving the heat dissipation effect. Thereby effectively solving the problem of friction overheating between the tightening ridge 5 and the spherical tightening member 4, so as to ensure the practical effect of the utility model.

[0035] The vibration-damping container 201 includes a vibration-damping groove 2011 arranged in a ring shape, and an annular cover plate 2012 fixedly connected to the upper portion of the vibration-damping groove 2011 . The damping particles 202 are filled in the space formed by the vibration-damping groove 2011 and the annular cover plate 2012 .

[0036] The outer edge of the annular cover plate 2012 extends to the outside of the mounting groove 101 and is fixed to the upper surface of the base plate 1 by corresponding locking bolts 6 .

[0037] The outer bottom of the vibration-damping groove 2011 is concavely provided with a corresponding card slot, and a corresponding rubber gasket 7 is fixedly installed in the card slot. After the vibration-damping groove 2011 is installed in place, the rubber gasket 7 is located between the vibration-damping groove 2011 and the base plate 1 in an extruded state.

[0038] The rubber gasket 7 is introduced to ensure the installation stability of the vibration-damping container 201 and at the same time, the vibration-damping effect is further improved through the effective buffering effect of the rubber gasket 7 .

[0039] The inner hole wall of the vibration-damping container 201 is provided with a corresponding spherical installation groove, and the spherical pressing member 4 is assembled into the spherical installation groove by stamping. The damping particles 202 are aluminum-based spherical particles.

[0040] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A driving device for a workpiece adsorption mechanism for wafer sorting, characterized in that: include: A base plate (1) is fixedly mounted on a corresponding workbench, a mounting groove (101) is provided in the middle of the base plate (1), and a corresponding guide hole (102) is provided in the middle of the mounting groove (101); The vibration damper (2) comprises a vibration damping container (201) fixedly embedded in the installation groove (101), the vibration damping container (201) being arranged in a ring shape, and a plurality of corresponding damping particles (202) being filled and installed in the vibration damping container (201); A drive motor (3) is fixedly mounted on the bottom of the base plate (1), and an output shaft of the drive motor (3) extends to the upper side of the vibration damper (2) through the guide hole (102) and the inner hole of the vibration damping container (201); A plurality of spherical tightening members (4) are respectively and rollingly mounted on both sides of the inner hole of the vibration damping container (201) according to height; A plurality of tightening convex edges (5) are arranged in a step-like manner on both sides of the output shaft of the drive motor (3); when the output shaft of the drive motor (3) rotates, the tightening convex edges (5) are in rolling contact with corresponding spherical tightening members (4) in sequence.

2. The driving device of the workpiece adsorption mechanism for wafer sorting according to claim 1, characterized in that: The vibration-damping container (201) comprises a vibration-damping groove (2011) arranged in a ring shape, and an annular cover plate (2012) fixedly connected to the upper part of the vibration-damping groove (2011), and the damping particles (202) are filled in a space formed by the vibration-damping groove (2011) and the annular cover plate (2012).

3. The driving device of the workpiece adsorption mechanism for wafer sorting according to claim 2, characterized in that: The outer edge of the annular cover plate (2012) extends to the outside of the mounting groove (101) and is fixedly mounted on the upper surface of the base plate (1) via corresponding locking bolts (6).

4. The driving device of the workpiece adsorption mechanism for wafer sorting according to claim 3, characterized in that: The outer bottom of the vibration-damping groove (2011) is concavely provided with a corresponding slot, and a corresponding rubber gasket (7) is fixedly installed in the slot; after the vibration-damping groove (2011) is installed in place, the rubber gasket (7) is located between the vibration-damping groove (2011) and the base plate (1) in an extruded state.

5. The driving device of the workpiece adsorption mechanism for wafer sorting according to claim 1, characterized in that: A corresponding spherical installation groove is provided on the inner hole wall of the vibration-damping container (201), and the spherical pressing member (4) is assembled into the spherical installation groove by stamping.

6. The driving device of the workpiece adsorption mechanism for wafer sorting according to claim 1, characterized in that: The damping particles (202) are iron-based or aluminum-based spherical particles.

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