Chip receiving device, reaction kettle and disc dryer

By designing a chip contact device for abrasive metal chips, including a carrier container and an adsorption assembly, the problem of metal chips being mixed into the material is solved, and effective metal chip collection and material quality improvement is achieved.

CN222659607UActive Publication Date: 2025-03-25YICHANG BRUNP RECYCLING TECH CO LTD +2
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Patent Information

Application Number
CN202420461479.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-08
Publication Date
2025-03-25
Estimated Expiration
2034-03-08

AI Technical Summary

Technical Problem

In operating equipment, metal chips generated by shaft wear are difficult to collect and remove in a centralized manner, resulting in metal chips being mixed into the material, affecting the quality of the material.

Method used

A chip contact device is designed, including a receiving container and an adsorption assembly. One side of the receiving container is provided with an open opening, and a through hole is opened on the side away from the opening, and the shaft body is arranged through the through hole, and the adsorption assembly is installed on the through hole side of the receiving container for adsorption of metal chips.

Benefits of technology

Through the use of the chip contact device, the metal chips generated by the wear of the shaft body are effectively collected to prevent them from being mixed into the material and improve the quality of the material.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a chip receiving device, a reaction kettle and a disc dryer, and relates to the technical field of waste chip collection. The chip receiving device comprises a receiving container and an adsorption assembly, an opening is formed in one side of the receiving container, a through hole is formed in the side, away from the opening, of the receiving container, the shaft body penetrates through the through hole, and the inner wall of the through hole is attached to the shaft body; the adsorption assembly is installed on the side, provided with the through hole, of the receiving container and used for adsorbing the metal filings to the receiving container. The problem that the quality of materials is affected due to the fact that metal filings are mixed into the materials is solved.
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Description

Technical Field

[0001] The present application relates to the technical field of waste chip collection, and in particular to a chip collecting device, a reaction kettle and a disc dryer. Background Art

[0002] There are many shaft parts in the running equipment. During the operation, the shaft and mechanical seal are worn. The metal chips generated by the wear cannot be collected and removed in a centralized manner, and fall into the key process, thereby mixing with the materials and entering the back-end process, affecting the quality of the materials. To this end, a chip collecting device, a reactor and a disc dryer are provided. Utility Model Content

[0003] In view of this, the purpose of the present application is to provide a chip collecting device, a reactor and a disc dryer, aiming to solve the technical problem of metal chips generated by shaft wear mixing into the material in the related technology.

[0004] To achieve the above objectives, the technical solutions adopted in this application are as follows:

[0005] In a first aspect, an embodiment of the present application provides a chip collecting device for collecting metal chips caused by shaft wear, the chip collecting device comprising:

[0006] A receiving container, wherein one side of the receiving container is provided with an opening, a side of the receiving container away from the opening is provided with a through hole, the shaft body is passed through the through hole, and the inner wall of the through hole is in contact with the shaft body;

[0007] An adsorption component is installed on a side of the receiving container where the through hole is provided, and the adsorption component is used to adsorb the metal chips to the receiving container.

[0008] In one embodiment of the first aspect, the receiving container includes a base and a frame, one side of the frame is connected to the peripheral side of the base, and the base is provided with the through hole.

[0009] In one embodiment of the first aspect, the adsorption assembly includes a magnetic element and a fixing element, and the magnetic element is detachably mounted on a side of the base away from the frame through the fixing element.

[0010] In one embodiment of the first aspect, the magnetic attraction member is a single magnetic attraction plate, and the magnetic attraction plate has a ring structure.

[0011] In one embodiment of the first aspect, the magnetic attraction component includes a plurality of magnetic blocks, and the plurality of magnetic blocks are assembled into the magnetic attraction component of a ring structure.

[0012] In one embodiment of the first aspect, two magnetic blocks are provided, and both of the two magnetic blocks are in a semicircular arc shape.

[0013] In one of the embodiments of the first aspect, the chip receiving device further includes a fixing component, one end of which is connected to the receiving container and fixes the receiving container to the shaft body.

[0014] In one embodiment of the first aspect, the fixing assembly includes a clamp and a locking piece, the clamp is sleeved on the shaft body, and the locking piece is used to fix the clamp to the shaft body.

[0015] In one embodiment of the first aspect, the clamp includes two locking blocks arranged opposite to each other;

[0016] The receiving container comprises a first part and a second part which are arranged opposite to each other, the two locking blocks are respectively arranged at the first part and the second part, and the first part and the second part are locked and assembled together by the locking member.

[0017] In a second aspect, an embodiment of the present application further provides a reaction kettle, comprising the chip receiving device described in any of the above embodiments.

[0018] In a third aspect, an embodiment of the present application further provides a disc dryer, comprising the chip collecting device described in any of the above embodiments.

[0019] Compared with the related art, the beneficial effects of the present application are as follows: the present application provides a chip collecting device, a reactor and a disc dryer, which can be used to collect metal chips from shaft wear. The chip collecting device includes a receiving container and an adsorption component. An opening is provided on one side of the receiving container, a through hole is provided in the middle of the side of the receiving container away from the opening, and the adsorption component is installed on the side of the receiving container where the through hole is provided. In this way, the shaft is penetrated by the through hole of the receiving container, and the opening is located at the wear end where the shaft is connected to the mechanical seal. During the operation of the shaft, the shaft and the mechanical seal are worn to generate metal chips, which enter the receiving container from the open side and are adsorbed in the receiving container by the adsorption component, thereby improving the problem of metal chips mixed into the material and affecting the material quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 The schematic diagram of the structure of the chip receiving device in some embodiments of the present application is shown. Figure 1 ;

[0022] Figure 2 The schematic diagram of the structure of the chip receiving device in some embodiments of the present application is shown. Figure 2 ;

[0023] Figure 3 The structure of the receiving container in some embodiments of the present application is shown Figure 1 ;

[0024] Figure 4 The structure of the magnetic attraction member in some embodiments of the present application is shown Figure 1 ;

[0025] Figure 5 The structure of the magnetic attraction member in some embodiments of the present application is shown Figure 1 ;

[0026] Figure 6 The structure of the receiving container in some embodiments of the present application is shown Figure 2 ;

[0027] Figure 7 It shows a schematic diagram of the structure of the reactor in some embodiments of the present application;

[0028] Figure 8 A schematic structural diagram of a disc dryer in some embodiments of the present application is shown.

[0029] Description of main component symbols:

[0030] 100-chip receiving device; 110-receiving container; 111-base; 112-frame; 113-opening; 114-accommodating cavity; 115-through hole; 116-first part; 117-second part; 120-adsorption component; 121-magnetic element; 1211-magnetic block; 122-fixing element; 130-fixing component; 131-hoop; 132-locking element; 133-locking block;

[0031] 200-shaft; 300-mechanical seal; 400-cylinder; 500-stirring blade; 600-housing; 700-drying plate;

[0032] 1000-reactor; 2000-disc dryer. DETAILED DESCRIPTION

[0033] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0034] In the description of the present application, it should be understood that, in the description of the present application, “plurality” means two or more than two, unless otherwise clearly and specifically defined.

[0035] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0037] At present, in the related technology, in the running equipment with shaft, because the shaft runs through the inside and outside of the equipment, there is a circumferential gap between the shaft and the equipment, and the medium in the equipment leaks out through the gap. If the pressure inside the equipment is lower than the atmospheric pressure, the air leaks into the equipment. Therefore, there must be a mechanical sealing device to prevent leakage. The commonly used mechanical sealing device is the shaft seal. During the operation of the equipment, there is wear between the shaft and the mechanical seal. Therefore, metal chips are easily generated there. If they are not collected and removed, they are easy to fall into the key process, thereby mixing into the material and affecting the quality of the material.

[0038] Mechanical seal refers to a device that prevents fluid leakage by at least one pair of end faces perpendicular to the axis of rotation, which are kept in close contact and slide relative to each other under the action of fluid pressure and the elastic force or magnetic force of the compensation mechanism and the cooperation of auxiliary seals. Mechanical seals are mostly used for shaft sealing devices of rotating fluid machinery. By arranging the mechanical seal sleeve at the end of the shaft body, the equipment can maintain a sealed state during the rotation of the shaft body.

[0039] To this end, the embodiment of the present application provides a chip collecting device 100, which can be used to collect metal chips generated by the operation wear of the shaft 200. The chip collecting device 100 provided by the present application can also be applied to the reactor 1000 and the disc dryer 2000. During the operation of the reactor 1000 and the disc dryer 2000, the metal chips generated by the operation wear are adsorbed and collected to improve the problem that the metal chips are mixed into the material, thereby affecting the quality of the material.

[0040] It should be noted that the chip receiving device 100 provided in the present application is not only used in the reaction kettle 1000 and the disc dryer 2000, but can also be used in other operating equipment with a rotating shaft 200 structure.

[0041] like Figure 1 As shown, the embodiment of the present application provides a chip collecting device 100 for collecting metal chips worn by a shaft body 200, and the chip collecting device 100 includes a receiving container 110 and an adsorption assembly 120. Among them, an opening 113 is provided on one side of the receiving container 110, and a through hole 115 is provided on the side of the receiving container 110 away from the opening 113, and the shaft body 200 is penetrated through the through hole 115, and the inner wall of the through hole 115 is in contact with the shaft body 200. The adsorption assembly 120 is installed on the side of the receiving container 110 where the through hole 115 is provided, and the adsorption assembly 120 is used to adsorb metal chips to the receiving container 110.

[0042] Exemplarily, the receiving container 110 may be made of PTFE (Polytetrafluoroethylene), PEEK (poly (ether-ether-ketone)), or other materials that cannot be adsorbed by magnets. The various parts of the receiving container 110 are firmly connected without cracks, and the appearance is kept neat, smooth, and beautiful. The receiving container 110 can be made according to the size of the shaft body 200 to form a suitable collection range to meet the requirements of sufficient collection of metal chips. The receiving container 110 is a box structure, with a accommodating cavity 114 provided inside and an opening 113 provided on one side. During installation, the opening 113 side of the receiving container 110 is located vertically above, and the shaft body 200 passes through the bottom through hole 115 of the receiving container 110 so that the receiving container 110 is installed on the shaft body 200. At the same time, the connection end of the shaft body 200 and the mechanical seal 300 is located above the receiving container 110, so that the metal chips generated by the wear of the shaft body 200 and the mechanical seal 300 enter the receiving cavity 114 through the side of the opening 113. At the same time, the shaft body 200 is completely fitted with the inner wall of the through hole 115 to achieve a sealed connection between the shaft body 200 and the through hole 115, so as to prevent some metal chips from leaking out from the gap between the shaft body 200 and the wall of the through hole 115.

[0043] The adsorption assembly 120 can adsorb the metal chips so that the metal chips are confined in the receiving container 110, and prevent the metal chips from splashing into the running equipment during the rotation of the shaft body 200, causing material pollution. The adsorption member can be installed at the bottom of the receiving container 110 so that the metal chips are confined at the bottom of the receiving container 110. When cleaning, the receiving container 110 only needs to be removed from the shaft body 200, and at the same time, the adsorption assembly 120 is removed to pour out the metal chips.

[0044] Specifically, during the operation, the adsorption component 120 can be first fixed to the bottom of the receiving container 110, and then the chip receiving device 100 can be installed as a whole on the shaft body 200. The chip receiving device 100 is located at the vertical top of the shaft body 200, and the open end 113 is facing the wear end of the shaft body 200. When the shaft body 200 rotates, the metal chips generated by the wear at the top will fall into the receiving container 110 from the open end 113 under the action of gravity. At the same time, the adsorption component 120 adsorbs and fixes the metal chips, so that the metal chips are confined in the receiving container 110, preventing the shaft body 200 from splashing during the rotation process and falling into the material. After the operation of the shaft body 200 is completed, it is only necessary to stop the rotation of the shaft body 200, remove the chip receiving device 100 from the shaft body 200, disassemble the adsorption component 120, and pour out the metal chips for cleaning.

[0045] Combination Figure 1 and Figure 2 As shown, in some embodiments, the receiving container 110 includes a base 111 and a frame 112 , one side of the frame 112 is connected to the peripheral side of the base 111 , and the base 111 is provided with a through hole 115 .

[0046] Combined Figure 3 As shown, the base 111 can be a flat plate, and a through hole 115 for the shaft 200 to pass through is opened in the middle of the base 111. The frame 112 is perpendicular to the base 111 and connected to the edge of the base 111. One side of the frame 112 is spliced ​​with the base 111 to form a receiving space with an opening 113 on one side.

[0047] In this embodiment, the base 111 may be a circular plate, the through hole 115 is located at the center thereof, and the frame 112 is a cylindrical structure to adapt to the installation of the shaft 200 and meet the collection requirements of metal chips in different directions.

[0048] In some embodiments, the adsorption assembly 120 includes a magnetic member 121 and a fixing member 122 . The magnetic member 121 is detachably mounted on a side of the base 111 away from the frame 112 via the fixing member 122 .

[0049] Exemplarily, the magnetic attraction member 121 may be a magnetic material, specifically a magnet or an electromagnet, and the fixing member 122 may be a fastening bolt, by which the magnetic attraction member 121 is fixed to the bottom of the base 111, and under the adsorption effect of the magnetic force, metal chips are deposited on the base 111, thereby realizing the collection of metal chips.

[0050] like Figure 4 As shown, in some embodiments, the magnetic attraction member 121 is a single magnetic attraction plate, and the magnetic attraction plate has a ring structure.

[0051] For example, the magnetic member 121 may be a ring-shaped magnetic plate with a hole in the center, so that the shaft 200 passes through the hole. At the same time, the inner diameter of the hole should be larger than the diameter of the shaft 200, so that when the shaft 200 passes through the magnetic member 121, there is a gap between the shaft 200 and the magnetic member 121. It is avoided that the magnetic member 121 is in direct contact with the shaft 200, which causes magnetic interference and may cause the problem of metal chips being adsorbed on the shaft 200.

[0052] Threaded holes are provided on the magnetic member 121 and the base 111 , and fastening bolts are passed through the threaded blocks of the magnetic member 121 and the base 111 in sequence to lock the magnetic member 121 on the base 111 .

[0053] In some embodiments, the magnetic member 121 includes a plurality of magnetic blocks 1211 , and the plurality of magnetic blocks 1211 are assembled into a magnetic member 121 having a ring structure.

[0054] Exemplarily, a plurality of fixing members 122 may be provided, and the fixing members 122 may penetrate different parts of the magnetic block 1211 to stably install the magnetic block 1211 on the base 111. By combining two magnetic blocks 1211, the two magnetic blocks 1211 may be installed on two opposite sides of the shaft 200 during installation, which not only meets the magnetic attraction range, but also facilitates the installation of the magnetic member 121.

[0055] The number of magnetic blocks 1211 can be two, three, four, five, etc. Each magnetic block 1211 has an arc-shaped structure. A plurality of magnetic blocks 1211 are assembled together to form an annular structural plate to facilitate the disassembly and assembly of the magnetic block 1211 on the base 111.

[0056] like Figure 5 As shown, in some embodiments, two magnetic blocks 1211 are provided, and both magnetic blocks 1211 are in a semicircular shape.

[0057] Exemplarily, the magnetic block 1211 is a semicircular plate structure. After being assembled, the two magnetic blocks 1211 form an annular plate with a hole in the middle, so that the magnetic component 121 is a circular structure with an area close to that of the base 111. By splicing two semicircular magnetic blocks 1211 to form a circular magnetic component 121, the magnetic force of the base 111 is evenly distributed, thereby improving the metal chip adsorption capacity.

[0058] In some embodiments, the chip receiving device 100 further includes a fixing assembly 130 , one end of which is connected to the receiving container 110 and fixes the receiving container 110 to the shaft body 200 .

[0059] Exemplarily, one end of the fixing component 130 is fixed to the base 111 , so that after the shaft 200 passes through the base 111 , the receiving container 110 is fixed to the shaft 200 through the fixing component 130 to maintain a stable installation.

[0060] like Figure 2 As shown, in some embodiments, the fixing assembly 130 includes a clamp 131 and a locking member 132 . The clamp 131 is sleeved on the shaft body 200 , and the locking member 132 is used to fix the clamp 131 to the shaft body 200 .

[0061] Exemplarily, the locking member 132 may be an adjusting bolt, by which the tightness of the clamp 131 is adjusted, thereby locking the clamp 131 to the shaft 200, so that the chip collecting device 100 can collect metal chips at the connection end of the shaft 200 and the mechanical seal 300 while following the movement and rotation of the shaft 200.

[0062] like Figure 6 As shown, in one embodiment, the clamp 131 includes two locking blocks 133 arranged opposite to each other, and the receiving container 110 includes a first part 116 and a second part 117 arranged opposite to each other. The two locking blocks 133 are distributed in the first part 116 and the second part 117, and the first part 116 and the second part 117 are locked and assembled together by the locking piece 132.

[0063] Exemplarily, the first part 116 and the second part 117 are symmetrically arranged, and both the first part 116 and the second part 117 include a semicircular base 111 and a semi-cylindrical frame 112, so that the first part 116 and the second part 117 form a receiving container 110 after being assembled.

[0064] The inner wall surfaces of the two locking blocks 133 arranged opposite to each other are completely fitted with the surface of the shaft body 200. Connecting ears are provided at both ends of each locking block 133. The connecting ears are provided with threaded holes. The locking piece 132 can be a fastening bolt. The locking piece 132 passes through the connecting ears. By rotating the locking piece 132, the distance between the two locking blocks 133 is adjusted, so that the first part 116 and the second part 117 are spliced ​​together, and the chip receiving device 100 is fixed on the shaft body 200.

[0065] like Figure 7 As shown, an embodiment of the present application further provides a reaction kettle 1000, comprising the chip receiving device 100 in any of the above embodiments.

[0066] This embodiment has the chip receiving device 100 in any of the above embodiments, and therefore has all the beneficial effects of the chip receiving device 100 in any of the above embodiments, which will not be described in detail here.

[0067] Exemplarily, the driving motor of the reactor 1000 is located at the top of the cylinder 400, and the shaft 200 is connected to the output end of the motor so as to rotate under the drive of the motor. The end of the shaft 200 connected to the motor passes through the cylinder 400, and then a mechanical seal 300 is set at the end of the shaft 200 that passes through the cylinder 400, so that the cylinder 400 forms a closed working space. The chip receiving device 100 is installed at the end of the shaft 200 connected to the mechanical seal 300. During the operation of the reactor 1000, the motor drives the shaft 200 to rotate, and the stirring blade 500 in the reactor 1000 performs a stirring operation. At the same time, the shaft 200 and the mechanical seal 300 are worn during the rotation process, and the chip receiving device 100 receives metal chips generated by the wear of the shaft 200 in real time.

[0068] In other embodiments, the chip receiving device 100 can also be applied to an aging tank, and the operating principle of the chip receiving device 100 in the aging tank is similar to that of the reaction kettle 1000.

[0069] like Figure 8 As shown, the embodiment of the present application further provides a disc drying machine 2000, comprising the chip receiving device 100 in any of the above embodiments.

[0070] This embodiment has the chip receiving device 100 in any of the above embodiments, and therefore has all the beneficial effects of the chip receiving device 100 in any of the above embodiments, which will not be described in detail here.

[0071] For example, the drive motor of the disc dryer 2000 is arranged at the bottom of the housing 600, one end of the shaft 200 is connected to the output end of the motor, and the other end of the shaft 200 passes through the cover. Thus, a mechanical seal 300 is arranged at one end of the shaft 200 passing through the cover, and the chip receiving device 100 is installed at the top of the shaft 200. During the operation of the disc dryer 2000, the motor drives the shaft 200 to rotate, and the drying disc 700 in the reactor 1000 performs a rotating drying operation. At the same time, the shaft 200 and the mechanical seal 300 are worn during the rotation process, and the chip receiving device 100 receives metal chips generated by the wear of the shaft 200 in real time.

[0072] In summary, the chip collecting device 100, the reactor 1000 and the disc dryer 2000 provided in the present application can, during the operation of the shaft 200, allow the metal chips generated by the wear of the shaft 200 and the mechanical seal 300 to enter the receiving container 110 from the open side 113 and be adsorbed in the receiving container 110 by the adsorption component 120, thereby improving the problem of metal chips mixing into the material and affecting the material quality.

[0073] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0074] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A chip receiving device, characterized in that: Used to collect metal chips from shaft wear, the chip collecting device includes: A receiving container, wherein one side of the receiving container is provided with an opening, a side of the receiving container away from the opening is provided with a through hole, the shaft body is passed through the through hole, and the inner wall of the through hole is in contact with the shaft body; An adsorption component is installed on a side of the receiving container where the through hole is provided, and the adsorption component is used to adsorb the metal chips to the receiving container.

2. The chip-collecting device according to claim 1, characterized in that: The receiving container comprises a base and a frame, one side of the frame is connected to the peripheral side of the base, and the base is provided with the through hole.

3. The chip-collecting device according to claim 2, characterized in that: The adsorption assembly includes a magnetic attraction component and a fixing component. The magnetic attraction component is detachably mounted on a side of the base away from the frame through the fixing component.

4. The chip-collecting device according to claim 3, characterized in that: The magnetic attraction member is a single magnetic attraction plate, and the magnetic attraction plate is in a ring structure.

5. The chip-collecting device according to claim 3, characterized in that: The magnetic attraction component includes a plurality of magnetic attraction blocks, and the plurality of magnetic attraction blocks are assembled into the magnetic attraction component of an annular structure.

6. The chip-collecting device according to claim 5, characterized in that: There are two magnetic blocks, and both of them are in a semicircular arc shape.

7. The chip-collecting device according to claim 1, characterized in that: The chip receiving device also includes a fixing component, one end of which is connected to the receiving container and fixes the receiving container to the shaft body.

8. The chip-collecting device according to claim 7, characterized in that: The fixing assembly comprises a clamp and a locking piece. The clamp is sleeved on the shaft body, and the locking piece is used to fix the clamp to the shaft body.

9. The chip-collecting device according to claim 8, characterized in that: The clamp comprises two locking blocks arranged opposite to each other; The receiving container comprises a first part and a second part which are arranged opposite to each other, the two locking blocks are respectively arranged at the first part and the second part, and the first part and the second part are locked and assembled together by the locking member.

10. A reaction kettle, characterized in that: The invention comprises the chip collecting device according to any one of claims 1 to 9.

11. A disc drying machine, characterized in that: The invention comprises the chip collecting device according to any one of claims 1 to 9.