Ultrathin quartz glass wafer polishing equipment

Abstract

The utility model relates to the technical field of wafer processing, in particular to ultra-thin quartz glass wafer polishing equipment which comprises a polishing motor, a polishing unit fixedly installed at the output end of the polishing motor, an installation plate installed on the periphery of the polishing unit, a plurality of sliding columns installed in the middle of the installation plate in a sliding and penetrating mode, and check blocks fixedly installed at the tops of the sliding columns. A spring is fixedly installed between the bottom of the stop block and the top of the installation plate, a transparent soft curtain is fixedly installed between every two adjacent sliding columns, and a wiping block is fixedly installed at the bottoms of the sliding columns jointly. Dust enters the dust collection device from the air outlet, the wiping block is a sponge soft body and is tightly attached to the wafer or the top of the main body frame, the absorption area of the dust collection device is reduced, the dust collection effect is improved, the air inlet is close to the surface layer of the wafer, and flowing air can rapidly take away dust near the surface layer of the wafer.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to an ultra-thin quartz glass wafer polishing device. Background Art

[0002] Wafers, also known as silicon wafers or silicon chips, are the core material for the production of semiconductor integrated circuits. High-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rods are formed into silicon wafers, i.e. wafers. During the polishing process, some ultra-thin quartz glass wafer polishing devices place the wafer in a fixed position. When polishing different positions of the wafer is required, the wafer needs to be constantly re-fixed and adjusted, which is inconvenient for people to use. For this reason, some patents have begun to upgrade the polishing equipment.

[0003] For example, the patent with authorization announcement number CN212145917U discloses an ultra-thin quartz glass wafer polishing device. When polishing the wafer, the wafer is first placed in the groove in the polishing plate, and then the moving motor is started to drive the reciprocating screw to rotate, and the slide is moved to the appropriate position through the engagement of the reciprocating screw and the slide, and then the rotating motor is turned on to drive the driving wheel to rotate, and the driven wheel is driven to rotate through the engagement between the driving wheel and the driven wheel, and then the support rod is driven to rotate, thereby driving the entire polishing plate to rotate to adjust the polishing position of the wafer, thereby improving the efficiency of wafer polishing, and there is no need to repeatedly fix the wafer, which is convenient for people to use, but there are still certain shortcomings.

[0004] Powder will be generated during the polishing process. If it is not cleaned in time, the surrounding environment will be polluted, affecting the work safety of the staff. The dust will float everywhere and is not easy to clean. Some polishing equipment in the prior art will add a dust suction device on the top of the equipment, but the dust suction port is far away from the polishing point, and the dust suction effect needs to be improved. At the same time, dust will adhere to the surface of the polished wafer and needs to be cleaned again, which increases the production process and reduces production efficiency. Utility Model Content

[0005] In response to the above problems, the present application provides an ultra-thin quartz glass wafer polishing device to solve the problem that powder will be generated during the polishing process. If it is not cleaned in time, the surrounding environment will be polluted, affecting the work safety of the staff. The dust will float everywhere and is not easy to clean. Some polishing equipment in the prior art will add a dust suction device on the top of the equipment, but the dust suction port is far away from the polishing point, and the dust suction effect needs to be improved. At the same time, dust will adhere to the surface of the polished wafer, which needs to be cleaned again, increasing the production process and reducing the production efficiency.

[0006] An ultra-thin quartz glass wafer polishing device comprises a polishing motor, a polishing unit is fixedly installed at the output end of the polishing motor, a mounting plate is installed on the periphery of the polishing unit, a plurality of sliding columns are installed in the middle of the mounting plate for sliding through, a stopper is fixedly installed on the top of the sliding column, a spring is fixedly installed between the bottom of the stopper and the top of the mounting plate, a transparent soft curtain is fixedly installed between two adjacent sliding columns, and a wiping block is fixedly installed on the bottom of the sliding columns.

[0007] Furthermore, the mounting plate is fixedly mounted on the outside of the polishing motor, and the spring is movably mounted on the periphery of the sliding column.

[0008] Furthermore, an air inlet is provided through the outer side of the sliding column near the bottom, and an air outlet is provided through the middle of the mounting plate, and the air outlet is communicated with an external dust collection device.

[0009] Furthermore, a liftable mounting frame is fixedly mounted on the outer side of the polishing motor, and a main frame is fixedly mounted on the bottom of the liftable mounting frame.

[0010] Furthermore, a fixing plate is installed on the top of the main frame, a plurality of electric push rods are symmetrically fixedly installed on the outer side of the fixing plate, and a clamp is fixedly installed on the telescopic end of the electric push rod.

[0011] Furthermore, a rotating motor is fixedly installed at the bottom of the main frame, and an output end of the rotating motor rotates and passes through the top of the main frame, and the output end of the rotating motor is fixedly connected to the bottom of the fixing plate.

[0012] The beneficial effects of the utility model are as follows:

[0013] The utility model discloses an ultra-thin quartz glass wafer polishing device, which adopts a wiping block. During polishing, the wiping block is deformed and fits the outer side of the wafer. Polishing generates dust, and an external dust suction device is started. The dust enters the dust suction device from the air outlet. The wiping block is a sponge-like soft body, which fits tightly with the wafer or the top of the main frame, so that the absorption area of ​​the dust suction device is reduced and the dust suction effect is improved. Moreover, the air inlet is close to the surface of the wafer, and the flowing air can quickly take away the dust near the surface of the wafer.

[0014] When the polishing area is changed, the staff starts the rotating motor, which drives the wafer to rotate, causing the wafer and the wiping block to have a relative displacement, thereby wiping the dust on the surface of the wafer and improving the wafer production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0016] Figure 1 A schematic diagram of the overall structure of an ultra-thin quartz glass wafer polishing device provided by the utility model;

[0017] Figure 2 A schematic diagram of the side structure of an ultra-thin quartz glass wafer polishing device provided by the utility model;

[0018] Figure 3 for Figure 2 A magnified image of point A;

[0019] Figure 4 The utility model provides a schematic diagram of the connection of a sliding column of an ultra-thin quartz glass wafer polishing device.

[0020] In the figure:

[0021] 1. Main frame; 2. Liftable mounting frame; 3. Polishing motor; 4. Polishing unit; 5. Mounting plate; 6. Sliding column; 7. Stop block; 8. Spring; 9. Wiping block; 10. Air inlet; 11. Air outlet; 12. Transparent soft curtain; 13. Fixed plate; 14. Electric push rod; 15. Clamp; 16. Rotating motor. DETAILED DESCRIPTION

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the utility model will be briefly introduced below in combination with the drawings and the description of the embodiments or the prior art. Obviously, the following description of the structure of the drawings is only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. It should be noted that the description of these embodiments is used to help understand the utility model, but does not constitute a limitation of the utility model.

[0023] like Figure 1-Figure 4 As shown, an embodiment of the utility model provides an ultra-thin quartz glass wafer polishing device, including a polishing motor 3, a polishing unit 4 is fixedly installed at the output end of the polishing motor 3, and is used for polishing the surface of the wafer; a mounting plate 5 is installed on the periphery of the polishing unit 4, a plurality of sliding columns 6 are installed and slidably penetrated in the middle of the mounting plate 5, a stopper 7 is fixedly installed on the top of the sliding column 6, a spring 8 is fixedly installed between the bottom of the stopper 7 and the top of the mounting plate 5, a transparent soft curtain 12 is fixedly installed between two adjacent sliding columns 6, so that the staff can check the polishing progress, and a wiping block 9 is fixedly installed on the bottom of the sliding column 6, which is used to prevent dust from overflowing and clean the dust attached to the outside of the wafer.

[0024] Specifically, the mounting plate 5 is fixedly mounted on the outside of the polishing motor 3 , and the spring 8 is movably mounted on the periphery of the sliding column 6 .

[0025] Specifically, a liftable mounting frame 2 is fixedly installed on the outside of the polishing motor 3 to drive the polishing motor 3 to move laterally and axially. This is a relatively mature existing technology and will not be described in detail herein. A main frame 1 is fixedly installed on the bottom of the liftable mounting frame 2.

[0026] In this embodiment, the staff uses the liftable mounting frame 2 to adjust the polishing angle and height of the polishing motor 3 and the polishing unit 4. When adjusting the height, the wiping block 9 and the sliding column 6 move downward and are hindered by the wafer. The wiping block 9 is deformed and fits the outside of the wafer. The blocked sliding column 6 stops moving. The mounting plate 5 continues to move downward with the polishing motor 3, the spring 8 is stretched, and the polishing motor 3 drives the polishing unit 4 to rotate to polish the surface of the wafer.

[0027] Specifically, an air inlet 10 is provided on the outer side of the sliding column 6 near the bottom, from which outside air is replenished, and an air outlet 11 is provided on the middle of the mounting plate 5, from which dust is sucked out, and the air outlet 11 is connected to an external dust collection device.

[0028] In this embodiment, the polishing operation generates dust, and the external dust collection device is started. The dust enters the dust collection device from the air outlet 11, and the outside air is replenished from the air inlet 10. The wiping block 9 is a sponge-like soft material, which fits tightly against the wafer or the top of the main frame 1, so that the absorption area of ​​the dust collection device is reduced and the dust collection effect is improved. Moreover, the air inlet 10 is close to the surface of the wafer, and the flowing air can quickly take away the dust near the surface of the wafer.

[0029] Specifically, a fixing plate 13 is installed on the top of the main frame 1, and a plurality of electric push rods 14 are symmetrically fixedly installed on the outer side of the fixing plate 13. A clamp 15 is fixedly installed at the telescopic end of the electric push rod 14 for clamping and stabilizing the wafer.

[0030] In this embodiment, during polishing, the staff uses the electric push rod 14 to drive the clamp 15 to approach the wafer to clamp and fix the wafer.

[0031] Specifically, a rotating motor 16 is fixedly installed at the bottom of the main frame 1 to drive the wafer to rotate and then change the polishing area. The output end of the rotating motor 16 rotates through the top of the main frame 1 and is fixedly connected to the bottom of the fixed plate 13.

[0032] In this embodiment, when the polishing area is replaced, the staff starts the rotating motor 16, and the rotating motor 16 drives the wafer to rotate, so that the wafer and the wiping block 9 produce relative displacement, thereby wiping the dust on the surface of the wafer, thereby improving the production efficiency of the wafer.

[0033] How it works:

[0034] During polishing, the staff first uses the electric push rod 14 and the clamp 15 to clamp and fix the wafer, and then uses the liftable mounting frame 2 to adjust the polishing angle and height of the polishing motor 3 and the polishing unit 4. When adjusting the height, the wiping block 9 and the sliding column 6 move downward and are hindered by the wafer. The wiping block 9 is deformed and fits the outside of the wafer. The blocked sliding column 6 stops moving, and the mounting plate 5 continues to move downward with the polishing motor 3. The spring 8 is stretched, and the polishing motor 3 drives the polishing unit 4 to rotate, polishing the surface of the wafer to generate dust. The external dust suction device is started, and the dust enters the dust suction device from the air outlet 11, and the outside air is replenished from the air inlet 10. The wiping block 9 is a sponge-like soft body, which fits tightly with the wafer or the top of the main frame 1, so that the absorption area of ​​the dust suction device is reduced and the dust suction effect is improved. Moreover, the air inlet 10 is close to the surface of the wafer, and the flowing air can quickly take away the dust near the surface of the wafer.

[0035] When the polishing area is changed, the staff starts the rotating motor 16, which drives the wafer to rotate, so that the wafer and the wiping block 9 are relatively displaced, thereby wiping the dust on the surface of the wafer, thereby improving the production efficiency of the wafer.

[0036] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An ultra-thin quartz glass wafer polishing device, comprising a polishing motor (3), wherein a polishing unit (4) is fixedly mounted at the output end of the polishing motor (3), characterized in that: The polishing unit (4) is provided with a mounting plate (5) on the periphery thereof, a plurality of sliding columns (6) are slidably installed through the middle of the mounting plate (5), a stopper (7) is fixedly installed on the top of the sliding column (6), a spring (8) is fixedly installed between the bottom of the stopper (7) and the top of the mounting plate (5), a transparent soft curtain (12) is fixedly installed between two adjacent sliding columns (6), and a wiping block (9) is fixedly installed on the bottom of the sliding column (6), and the wiping block (9) is a soft body.

2. The ultra-thin quartz glass wafer polishing device according to claim 1, characterized in that: The mounting plate (5) is fixedly mounted on the outside of the polishing motor (3), and the spring (8) is movably mounted on the periphery of the sliding column (6).

3. The ultra-thin quartz glass wafer polishing device according to claim 1, characterized in that: An air inlet (10) is provided through the outer side of the sliding column (6) near the bottom, and an air outlet (11) is provided through the middle of the mounting plate (5), and the air outlet (11) is connected to an external dust collection device.

4. The ultra-thin quartz glass wafer polishing device according to claim 1, characterized in that: A liftable mounting frame (2) is fixedly mounted on the outside of the polishing motor (3), and a main frame (1) is fixedly mounted on the bottom of the liftable mounting frame (2).

5. The ultra-thin quartz glass wafer polishing device according to claim 4, characterized in that: A fixing plate (13) is installed on the top of the main frame (1), a plurality of electric push rods (14) are symmetrically fixedly installed on the outer side of the fixing plate (13), and a clamp (15) is fixedly installed on the telescopic end of the electric push rod (14).

6. The ultra-thin quartz glass wafer polishing device according to claim 5, characterized in that: A rotating motor (16) is fixedly mounted on the bottom of the main frame (1); the output end of the rotating motor (16) rotates and passes through the top of the main frame (1); the output end of the rotating motor (16) is fixedly connected to the bottom of the fixing plate (13).

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