Wafer grinding and polishing structure

Abstract

The utility model discloses a wafer grinding and polishing structure which comprises a bottom plate, the upper side of the bottom plate is fixedly connected with a machining seat, the inner side of the machining seat is provided with a fixed clamping device, the lower side of the fixed clamping device is fixedly connected with a baffle, and the lower side of the baffle is connected with a first driving motor. The first driving motor is fixedly connected to one side of the bottom plate, a protection box is arranged on the outer side of the machining base and fixedly connected to the upper side of the bottom plate, a downward pressing device is arranged on the upper side of the bottom plate, a polishing solution box is fixedly connected to the end, away from the downward pressing device, of the upper side of the bottom plate, and a liquid conveying pipe is fixedly connected to the upper side of the polishing solution box. The infusion tube is connected with an infusion pump, and the other end of the infusion tube is fixedly connected with a spray head. Compared with the prior art, the wafer grinding and polishing structure has the advantage that the wafer grinding and polishing structure is provided with the fixed clamping device.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer grinding and polishing, in particular to a wafer grinding and polishing structure. Background Art

[0002] Wafer grinding and polishing structures are important structures in the semiconductor manufacturing process, which are used to grind and polish the surface of wafers to ensure their surface flatness and finish. In the semiconductor manufacturing process, the surface quality of the wafer has an important impact on the performance of the device, so the grinding and polishing process is crucial.

[0003] The existing patent number CN209425259U discloses a wafer grinding and polishing structure, which is intended to solve the problem in the current process of the prior art that when grinding the wafer, the polishing liquid will splash everywhere, causing pollution to the working environment, and the polishing liquid cannot be recycled, resulting in increased grinding costs. The solution of the prior art is: a wafer grinding and polishing structure, including a machine base, a rotating table rotatably connected to the machine base, the rotating table is horizontally arranged, and a working disc is fixedly arranged on the rotating table, a circular groove matching the wafer is opened on the working disc, and the wafer is placed in the groove, a grinding seat connected to the robot transmission is correspondingly arranged above the working disc, a grinding stone is installed on the grinding seat, and a polishing liquid nozzle is correspondingly arranged in correspondence with the working disc, the machine base is arranged in an outer collecting box body, and the outer collecting box body is surrounded by a front side plate, a left side plate, a rear side plate and a right side plate in sequence, a bottom plate is arranged at the bottom of the front side plate, the left side plate, the rear side plate and the right side plate, and a gap is left between the bottom of the machine base and the bottom plate, and a slide groove is opened on the front side plate, the left side plate, the rear side plate and the right side plate, and a lifting plate is slidably connected in the slide groove, and a vertical cylinder is correspondingly arranged next to the lifting plate, and the cylinder is located outside the outer collecting box body, and the extended end of the piston rod of the cylinder is transmission-connected to the corresponding lifting plate through a transmission plate.

[0004] Disadvantages of the patent in the prior art: In the process of grinding and polishing the wafer, the patent in the prior art does not set a fixed clamping device to fix the wafer, which may easily cause the wafer to loosen and fall off the grinding table during grinding and polishing, affecting the normal operation of the grinding processing device. Utility Model Content

[0005] The technical problem to be solved by the utility model is to overcome the above technical defects and provide a wafer grinding and polishing structure with a fixed clamping device.

[0006] In order to solve the above problems, the technical solution of the utility model is: a wafer grinding and polishing structure, including a base plate, a processing seat is fixedly connected to the upper side of the base plate, a fixed clamping device is provided on the inner side of the processing seat, a baffle is fixedly connected to the lower side of the fixed clamping device, a first driving motor is connected to the lower side of the baffle, the first driving motor is fixedly connected to one side of the base plate, a protection box is provided on the outer side of the processing seat, the protection box is fixedly connected to the upper side of the base plate, a pressing device is provided on the upper side of the base plate, and a polishing liquid tank is fixedly connected to the end of the upper side of the base plate away from the pressing device. An infusion tube is fixedly connected to the upper side of the polishing liquid box, a liquid suction pump is connected to the infusion tube, a nozzle is fixedly connected to the other end of the infusion tube, the fixed clamping device includes a second driving motor, the bottom of the second driving motor is fixedly connected to the top of the baffle, the output shaft of the second driving motor is fixedly connected to a pulley 1 and the end is rotatably connected to a round table, one side of the pulley 1 is connected to a pulley 2 via a belt, the top of the pulley 2 is fixedly connected to a gear 1, the gear 1 is rotatably connected to the bottom of the round table, and the bottom of the round table is provided with a gear 2 meshing with the gear 1.

[0007] Furthermore, the bottom of the truncated table is evenly provided with a plurality of grooves, and the grooves are all slidably connected with a T-shaped clamping plate, one end of the T-shaped clamping plate is fixedly connected with a sliding rod, and the gear 2 is provided with arc grooves corresponding to the number of grooves, and the sliding rod is slidably connected in the corresponding arc grooves.

[0008] Furthermore, a connecting plate is rotatably connected to the output shaft of the driving motor.

[0009] Further, the pressing device includes a mounting plate, the mounting plate is fixedly connected to the upper side of the base plate, one side of the mounting plate is fixedly connected with a motor seat, one side of the motor seat is fixedly connected with a third drive motor, the output end of the third drive motor is connected with a connecting rod 1, one end of the connecting rod 1 is rotatably connected with a connecting rod 2, one end of the connecting rod 2 is rotatably connected with a connecting rod 3, one end of the connecting rod 3 is connected with a connecting rod 4, one side of the connecting rod 3 is rotatably connected with a fixed connecting rod, the other end of the fixed connecting rod is fixedly connected to one side of the mounting plate, and the connecting rod 4 is slidably connected to a slide groove on the mounting plate.

[0010] Furthermore, a grinding and polishing disc is fixedly connected to the lower side of the connecting rod.

[0011] The advantages of the utility model compared with the existing technology are: the utility model sets up a fixed clamping device, and drives pulley one and pulley two to rotate through the second driving motor, and transmission gear one and gear two start to rotate. When gear two rotates, the arc groove in gear two is displaced, thereby driving the internal sliding rod to move. The movement of the sliding rod drives the T-shaped clamping plate to move in the sliding groove at the bottom of the round table, thereby clamping and fixing the grinding and polishing table, avoiding the wafer from loosening during the processing process and affecting the normal operation of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 The utility model is a three-dimensional wafer grinding and polishing structure Figure 1 .

[0013] Figure 2 The utility model is a three-dimensional wafer grinding and polishing structure Figure 2 .

[0014] Figure 3 The utility model is a three-dimensional processing table in a wafer grinding and polishing structure. Figure 3 .

[0015] Figure 4 The utility model is a three-dimensional fixed clamping device in a wafer grinding and polishing structure. Figure 4 .

[0016] Figure 5 The utility model is a three-dimensional processing table in a wafer grinding and polishing structure. Figure 5 .

[0017] As shown in the figure: 1. Base plate; 2. Processing seat; 3. Pressing device; 4. Baffle; 5. First drive motor; 6. Protection box; 7. Fixed clamping device; 701. Second drive motor; 702. Pulley one; 703. Round table; 704. Pulley two; 705. Gear one; 706. Gear two; 707. T-shaped clamp; 708. Sliding rod; 709. Connecting plate; 8. Polishing liquid box; 9. Infusion tube; 10. Liquid pump; 11. Nozzle; 12. Mounting plate; 13. Motor seat; 14. Third drive motor; 15. Connecting rod one; 16. Connecting rod two; 17. Connecting rod three; 18. Grinding and polishing disc; 19. Connecting rod four; 20. Fixed connecting rod. DETAILED DESCRIPTION

[0018] The specific implementation of the utility model is further described below in conjunction with the accompanying drawings, wherein the same parts are represented by the same reference numerals.

[0019] It should be noted that the words "front", "rear", "left", "right", "up" and "down" used in the following description refer to directions in the drawings, and the words "inside" and "outside" refer to directions toward or away from the geometric center of a specific component, respectively.

[0020] In order to make the contents of the present invention more clearly understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention.

[0021] like Figures 1 to 5 As shown, a wafer grinding and polishing structure comprises a bottom plate 1, a processing seat 2 is fixedly connected to the upper side of the bottom plate 1, a fixed clamping device 7 is provided inside the processing seat 2, a baffle 4 is fixedly connected to the lower side of the fixed clamping device 7, a first drive motor 5 is connected to the lower side of the baffle 4, the first drive motor 5 is fixedly connected to one side of the bottom plate 1, a protection box 6 is provided on the outer side of the processing seat 2, the protection box 6 is fixedly connected to the upper side of the bottom plate 1, a pressing device 3 is provided on the upper side of the bottom plate 1, a polishing liquid tank 8 is fixedly connected to one end of the upper side of the bottom plate 1 away from the pressing device 3, a liquid infusion tube 9 is fixedly connected to the upper side of the polishing liquid tank 8, a liquid pump 10 is connected to the liquid infusion tube 9, and a nozzle 11 is fixedly connected to the other end of the liquid infusion tube 9. The processing seat 2 is driven to rotate by the first drive motor 5, so as to facilitate grinding and polishing of the wafer. The polishing liquid in the polishing liquid tank 8 is pumped into the liquid infusion tube 9 through the liquid pump 10 and sprayed onto the wafer through the nozzle 11.

[0022] The fixed clamping device 7 comprises a second driving motor 701, the bottom of the second driving motor 701 is fixedly connected to the top of the baffle 4, the output shaft of the second driving motor 701 is fixedly connected with a pulley 1 702 and the end is rotatably connected with a round table 703, one side of the pulley 1 702 is connected with a pulley 2 704 through a belt, the top of the pulley 2 704 is fixedly connected with a gear 1 705, the gear 1 705 is rotatably connected to the bottom of the round table 703, and the bottom of the round table 703 is provided with a gear 2 706 meshing with the gear 1 705. The bottom of the round table 703 is evenly provided with a number of grooves and the grooves are all slidably connected with T-shaped clamps 707, one end of the T-shaped clamp 707 is fixedly connected with a slide bar 708, the gear 2 706 is provided with arc grooves corresponding to the number of grooves, and the slide bar 708 is slidably connected in the corresponding arc groove. A connecting plate 709 is rotatably connected to the output shaft of the driving motor 701. The driving motor 701 drives the pulley 1 702 and the pulley 2 704 to rotate, thereby driving the gear 1 705 and the gear 2 706 to rotate. When the gear 2 706 rotates, the arc groove in the gear 2 706 is displaced, thereby driving the internal slide bar 708 to move. The movement of the slide bar 708 drives the T-shaped clamp 707 to move in the slide groove at the bottom of the truncated table 703, thereby clamping and fixing the wafer.

[0023] The pressing device 3 includes a mounting plate 12, the mounting plate 12 is fixedly connected to the upper side of the bottom plate 1, a motor seat 13 is fixedly connected to one side of the mounting plate 12, a third drive motor 14 is fixedly connected to one side of the motor seat 13, a connecting rod 15 is connected to the output end of the third drive motor 14, one end of the connecting rod 15 is rotatably connected to a connecting rod 2 16, one end of the connecting rod 2 16 is rotatably connected to a connecting rod 3 17, one end of the connecting rod 3 17 is connected to a connecting rod 4 19, one side of the connecting rod 3 17 is rotatably connected to a fixed connecting rod 20, the other end of the fixed connecting rod 20 is fixedly connected to one side of the mounting plate 12, and the connecting rod 4 19 is slidably connected to the upper slide groove of the mounting plate 12. A grinding and polishing disc 18 is fixedly connected to the lower side of the connecting rod 4 19. The third driving motor 14 drives the connecting rod 15 to rotate, and the transmission connecting rod 2 16 and the connecting rod 3 17 start to rotate, and then drives the connecting rod 4 19 to slide on the mounting plate 12, thereby pressing down the grinding and polishing disk 18 so that the grinding and polishing disk 18 fits the wafer.

[0024] In specific use, the wafer is placed on the processing seat 2, and the pulley 1 702 and the pulley 2 704 are driven to rotate by the driving motor 701, and then the gear 1 705 and the gear 2 706 are driven to rotate. When the gear 2 706 rotates, the arc groove in the gear 2 706 is displaced and the internal slide bar 708 is driven to move. The movement of the slide bar 708 drives the T-shaped clamping plate 707 to move in the slide groove at the bottom of the round table 703, thereby clamping and fixing the wafer. The polishing liquid in the polishing liquid tank 8 is pumped into the infusion tube 9 through the nozzle 11 and sprayed onto the wafer. The third driving motor 14 drives the connecting rod 15 to rotate, and the transmission connecting rod 2 16 and the connecting rod 3 17 start to rotate, and then drives the connecting rod 4 19 to slide on the mounting plate 12, so as to press down the grinding and polishing disc 18, so that the grinding and polishing disc 18 fits the wafer. Finally, the first driving motor 5 drives the processing seat 2 to rotate, so as to facilitate the grinding and polishing of the wafer. The polishing liquid after processing flows into the protection box 6. The work is completed.

[0025] The above description of the utility model and its implementation methods is not restrictive. The drawings show only one implementation method of the utility model, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention of the utility model, they should all fall within the protection scope of the utility model.

Claims

1. A wafer grinding and polishing structure, comprising a base plate (1), characterized in that: A processing seat (2) is fixedly connected to the upper side of the base plate (1), a fixed clamping device (7) is provided on the inner side of the processing seat (2), a baffle (4) is fixedly connected to the lower side of the fixed clamping device (7), a first drive motor (5) is connected to the lower side of the baffle (4), the first drive motor (5) is fixedly connected to one side of the base plate (1), a protection box (6) is provided on the outer side of the processing seat (2), the protection box (6) is fixedly connected to the upper side of the base plate (1), a downward pressing device (3) is provided on the upper side of the base plate (1), a polishing liquid box (8) is fixedly connected to one end of the upper side of the base plate (1) away from the downward pressing device (3), a liquid infusion tube (9) is fixedly connected to the upper side of the polishing liquid box (8), a liquid pump (10) is connected to the liquid infusion tube (9), and a nozzle (11) is fixedly connected to the other end of the liquid infusion tube (9); The fixed clamping device (7) comprises a second drive motor (701), the bottom of the second drive motor (701) is fixedly connected to the top of the baffle (4), the output shaft of the second drive motor (701) is fixedly connected to a pulley 1 (702) and the end is rotatably connected to a round table (703), one side of the pulley 1 (702) is connected to a pulley 2 (704) via a belt, the top of the pulley 2 (704) is fixedly connected to a gear 1 (705), the gear 1 (705) is rotatably connected to the bottom of the round table (703), and the bottom of the round table (703) is provided with a gear 2 (706) meshing with the gear 1 (705).

2. The wafer grinding and polishing structure according to claim 1, characterized in that: The bottom of the truncated table (703) is evenly provided with a plurality of grooves, and a T-shaped clamping plate (707) is slidably connected in each groove, and a sliding rod (708) is fixedly connected at one end of the T-shaped clamping plate (707). The gear 2 (706) is provided with arc grooves corresponding to the number of the grooves, and the sliding rod (708) is slidably connected in the corresponding arc grooves.

3. The wafer grinding and polishing structure according to claim 1, characterized in that: A connecting plate (709) is rotatably connected to the output shaft of the driving motor (701).

4. The wafer grinding and polishing structure according to claim 1, characterized in that: The pressing device (3) comprises a mounting plate (12), wherein the mounting plate (12) is fixedly connected to the upper side of the base plate (1), a motor seat (13) is fixedly connected to one side of the mounting plate (12), a third driving motor (14) is fixedly connected to one side of the motor seat (13), an output end of the third driving motor (14) is connected to a connecting rod 1 (15), one end of the connecting rod 1 (15) is rotatably connected to a connecting rod 2 (16), one end of the connecting rod 2 (16) is rotatably connected to a connecting rod 3 (17), one end of the connecting rod 3 (17) is connected to a connecting rod 4 (19), one side of the connecting rod 3 (17) is rotatably connected to a fixed connecting rod (20), the other end of the fixed connecting rod (20) is fixedly connected to one side of the mounting plate (12), and the connecting rod 4 (19) is slidably connected to a sliding groove on the mounting plate (12).

5. The wafer grinding and polishing structure according to claim 4, characterized in that: A grinding and polishing disc (18) is fixedly connected to the lower side of the connecting rod four (19).

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