Conveying device for chip semiconductor packaging

Abstract

The utility model relates to a conveying device for chip semiconductor packaging, which comprises a conveyor belt and two side plates, the two side plates are mounted on two sides of the conveyor belt, a first guide rod and a second guide rod are mounted on the outer wall above the conveyor belt in an attached manner, a fixing plate is fixedly mounted on the outer wall of the top of one side plate, and a second guide rod is mounted on the outer wall of the top of the other side plate. The bottom of the fixing plate is rotationally connected with the end of the first guide rod, a first motor is fixedly installed on the outer wall of the top of the other side plate, the output end of the first motor faces downwards and is fixedly connected with the second guide rod, a lead screw is arranged above the end of the conveying belt, and a weighing device is installed in the end, away from the lead screw, of the conveying belt. By arranging the weighing device, chips of different batches and the same number can be placed on the positions, corresponding to the weighing device, of the conveying belt, after weighing is conducted, the guiding piece and the second guiding rod can automatically conduct adjustment, and the chips are conveyed into the corresponding recycling devices.

Description

Technical Field

[0001] The utility model relates to the technical field of chip production, in particular to a transmission device for chip semiconductor packaging. Background Art

[0002] Semiconductor chips have different shapes and weights because of their different functions, but the chips are small and the differences are not obvious. When it is necessary to distinguish the chips, operators may make mistakes by visual identification, and they cannot make accurate judgments by feeling the weight with their hands. This will cause different types of chips to be packaged together. Utility Model Content

[0003] The purpose of the present application is to provide a chip semiconductor packaging transmission device to solve the problems raised in the above background technology.

[0004] To achieve the above objectives, this application provides the following technical solutions:

[0005] A transmission device for chip semiconductor packaging comprises a conveyor belt and two side plates, wherein the two side plates are mounted on both sides of the conveyor belt, and a guide rod 1 and a guide rod 2 are fittedly mounted on the upper outer wall of the conveyor belt, wherein a fixing plate is fixedly mounted on the top outer wall of one of the side plates, and the bottom of the fixing plate is rotatably connected to the end of the guide rod 1, and a motor 1 is fixedly mounted on the top outer wall of the other side plate, and the output end of the motor 1 faces downward and is fixedly connected to the guide rod 2.

[0006] Preferably, a lead screw is provided above the end of the conveyor belt, one end of the lead screw is installed with a second motor, the second motor is fixedly installed on the top outer wall of one of the side panels, and the other end of the lead screw is rotatably connected to the top outer wall of the other side panel. A guide is installed below the lead screw, a matching block is fixedly installed above the guide, the matching block is threadedly connected to the lead screw, and the bottom of the guide fits the top outer wall of the conveyor belt. The guide is a metal part in the shape of a channel steel, with an opening facing downward to fit the top outer wall of the conveyor belt, and the outer wall of the guide is sprayed with antistatic paint.

[0007] Preferably, a weighing device is installed inside the end of the conveyor belt away from the screw, the top surface sensing end of the weighing device is in contact with the upper bottom surface of the conveyor belt, and both ends of the weighing device are fixedly connected to the outer wall of the side plate.

[0008] The beneficial effect of the utility model is that by providing a weighing device, chips of different batches but the same quantity can be placed on the position of the conveyor belt corresponding to the weighing device. After weighing, the guide member and the guide rod 2 will automatically make adjustments to convey the chips into the corresponding recovery device. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0010] Figure 2 This is a schematic diagram of the installation structure of the weighing device in the utility model;

[0011] Figure 3 For the utility model Figure 1 A local enlarged view of area A;

[0012] Figure 4 For the utility model Figure 1 A local enlarged view of area B;

[0013] In the figure: 1. conveyor belt; 2. side plate; 3. guide rod 1; 4. guide rod 2; 5. motor 1; 6. motor 2; 7. lead screw; 8. guide piece; 9. fixing plate; 10. weighing device. DETAILED DESCRIPTION

[0014] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more specific definition of the protection scope of the present invention. The directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "top", "bottom", etc., are only for reference to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, rather than to limit the present invention.

[0015] like Figure 1-4 A transmission device for chip semiconductor packaging is shown, comprising a conveyor belt 1 and two side plates 2, the two side plates 2 are installed on both sides of the conveyor belt 1, and a guide rod 1 3 and a guide rod 2 4 are fitted on the upper outer wall of the conveyor belt 1, a fixing plate 9 is fixedly installed on the top outer wall of one of the side plates 2, and the bottom of the fixing plate 9 is rotatably connected to the end of the guide rod 1 3, and a motor 1 5 is fixedly installed on the top outer wall of the other side plate 2, and the output end of the motor 1 5 faces downward and is fixedly connected to the guide rod 2 4.

[0016] A lead screw 7 is provided above the end of the conveyor belt 1, and a motor 26 is installed at one end of the lead screw 7, and the motor 26 is fixedly installed on the top outer wall of one of the side panels 2, and the other end of the lead screw 7 is rotatably connected to the top outer wall of the other side panel 2. A guide member 8 is installed below the lead screw 7, and a matching block is fixedly installed above the guide member 8, and the matching block is threadedly connected to the lead screw 7, and the bottom of the guide member 8 is in contact with the top outer wall of the conveyor belt 1. The guide member 8 is a metal member in the shape of a channel steel, and the opening faces downward to be in contact with the top outer wall of the conveyor belt 1, and the outer wall of the guide member 8 is sprayed with antistatic paint.

[0017] A weighing device 10 is installed inside the end of the conveyor belt 1 away from the screw 7. The top sensing end of the weighing device 10 is in contact with the upper and lower surfaces of the conveyor belt 1, and both ends of the weighing device 10 are fixedly connected to the outer wall of the side plate 2.

[0018] Embodiment: semiconductor chips are placed on the conveyor belt 1, and then the chips that are not neatly placed are transported forward by the conveyor belt 1. Some chips will contact the guide rod 1 3, and some will contact the guide rod 2 4. The guide rod 1 3 and the guide rod 2 4 will adjust the flip angle in advance. After the chip contacts the guide rod 1 3 and the guide rod 2 4, the conveyor belt 1 continues to drive the chip, so that the chip is guided by the guide rod 1 3 and the guide rod 2 4, and the end of the guide rod 1 3 faces the guide rod 2 4. The chip on the guide rod 1 3 moves in the direction of the guide rod 2 4, and the chip on the guide rod 2 4 slides against the outer wall of the guide rod 2 4. After sliding out of the guide rod 2 4, it is driven forward in a straight line by the conveyor belt 1, and the chip passes through the inside of the guide member 8, and then slides to the collection device at the bottom of the conveyor belt 1.

[0019] When chips of different weights are placed on the conveyor belt 1, the operator will place the chips on the conveyor belt 1 above the weighing device 10. The number of chips placed on the conveyor belt 1 each time is the same. Therefore, if the weight of a single chip is different, the weighing device 10 can judge based on the weight. Collection devices for chips of different specifications will also be placed under the conveyor belt 1. Motor 1 5 will drive guide rod 2 4 to rotate a certain angle, and motor 2 6 will drive the screw rod to rotate, so that the guide member 8 moves to the corresponding position. The position of the guide member 8 corresponds to the chip collection device below. As the conveyor belt 1 is conveyed, the chip will fall from the inside of the guide member 8 to the corresponding collection device.

[0020] It should be noted that the parts not covered in the present invention are the same as the prior art or can be implemented by the prior art; the various drives in the present invention can be implemented by corresponding power structures such as cylinders, oil cylinders, electric cylinders, motors, etc. in combination with connecting rods, guide rods, etc., and are not limited to the description in the specification and the structures in the drawings.

[0021] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model.

Claims

1. A conveying device for chip semiconductor packaging, comprising a conveyor belt (1) and two side plates (2), characterized in that: The two side panels (2) are mounted on both sides of the conveyor belt (1), and the upper outer wall of the conveyor belt (1) is fitted with a guide rod 1 (3) and a guide rod 2 (4), a fixing plate (9) is fixedly mounted on the top outer wall of one of the side panels (2), and the bottom of the fixing plate (9) is rotatably connected to the end of the guide rod 1 (3), and a motor 1 (5) is fixedly mounted on the top outer wall of the other side panel (2), the output end of the motor 1 (5) faces downward and is fixedly connected to the guide rod 2 (4), a lead screw (7) is arranged above the end of the conveyor belt (1), and a motor 2 (6) is mounted on one end of the lead screw (7), and the motor 2 (6) is fixedly mounted on the top outer wall of one of the side panels (2), and the lead screw (7) The other end is rotatably connected to the top outer wall of the other side plate (2); a guide member (8) is installed below the lead screw (7); a matching block is fixedly installed above the guide member (8); the matching block is threadedly connected to the lead screw (7); the bottom of the guide member (8) is in contact with the upper outer wall of the conveyor belt (1); the guide member (8) is a metal member in the shape of a channel steel, with an opening facing downward and in contact with the top outer wall of the conveyor belt (1); the outer wall of the guide member (8) is sprayed with anti-static paint; a weighing device (10) is installed inside the end of the conveyor belt (1) away from the lead screw (7); the top surface sensing end of the weighing device (10) is in contact with the upper bottom surface of the conveyor belt (1); and both ends of the weighing device (10) are fixedly connected to the outer wall of the side plate (2).

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