Speed reducer box body convenient to dissipate heat

Abstract

The utility model discloses a speed reducer box body convenient for heat dissipation. The speed reducer box body comprises a box body, a speed reducer assembly, a heat dissipation structure I, a heat dissipation structure II, a cold water structure and a heat dissipation structure III, a cavity is formed in the box body, the speed reducer assembly is arranged in the cavity, the first heat dissipation structure is arranged at the top and the bottom of the box body, the second heat dissipation structure is arranged on the left side of the box body, the cold water structure is arranged at the bottom of the water tank, and the third heat dissipation structure is arranged on the right side of the box body. Compared with the prior art, the cooling device has the advantages that when the heat of the speed reducer body is too high, cold water in the water tank flows through the cooling coil through the water pump to absorb heat of the heat conducting pad, and then the heating part of the speed reducer body is rapidly cooled; and meanwhile, the second cooling fan on the right side of the box body can replace and discharge waste heat, and therefore rapid cooling and heat dissipation treatment can be conveniently conducted on the speed reducer.

Description

Technical Field

[0001] The utility model relates to the technical field of reducers, in particular to a reducer housing which is convenient for heat dissipation. Background Art

[0002] The reducer housing is the basic component for installing each transmission shaft; since each shaft will generate a relatively large reaction force when transmitting torque when the reducer is working, and it will act on the housing, the housing is required to have sufficient rigidity to ensure the relative position accuracy of each transmission shaft. The use of metal structural housing can obtain greater strength and rigidity, and the structure is compact and light. The reducer housing has various structural forms. When manufacturing in small batches, it is more reasonable to use welded reducer housing.

[0003] The patent document with announcement number CN217301546U discloses a reducer housing, wherein a shell is fixedly mounted on the base, a bottom plate is detachably mounted on the shell, a plurality of heat sinks arranged at equal intervals in a straight line direction are fixedly mounted on the upper surface of the bottom plate, a cleaning module is also fixedly mounted on the bottom plate, and the cleaning module is used to clean the gaps between the heat sinks; the cleaning module includes a scraper and a linear reciprocating motion mechanism, a scraper is arranged between every two adjacent heat sinks, the scrapers are fixedly connected to the linear reciprocating motion mechanism, and the linear reciprocating motion mechanism is used to drive the scraper to perform linear reciprocating motion. The utility model can realize the cleaning of dust attached to the surface of the heat sink, so that the heat sink on the surface of the housing can always maintain a good heat dissipation effect, but the prior art still has defects:

[0004] The reducer case in the prior art is only provided with heat sinks for heat dissipation and cooling on the outer wall of the case. During the heat dissipation process, the heat on the surface of the case is only absorbed by the heat sink. When the machine power is increased and runs faster, the internal temperature will increase accordingly. The heat sink is a natural heat dissipation and cannot adjust the heat dissipation amount, so the internal temperature cannot be quickly dissipated, and the heat absorption effect needs to be further improved. Utility Model Content

[0005] The technical problem to be solved by the utility model is to overcome the above-mentioned defects and provide a reducer housing which is convenient for heat dissipation.

[0006] In order to solve the above technical problems, the technical solution provided by the utility model is: a reducer housing that is convenient for heat dissipation, comprising:

[0007] A box body, wherein a cavity is provided inside the box body;

[0008] A reducer assembly, wherein the reducer assembly is arranged inside the cavity;

[0009] Heat dissipation structure 1, the heat dissipation structure 1 is arranged at the top and bottom of the box;

[0010] Heat dissipation structure 2, the heat dissipation structure 2 is arranged on the left side of the box body, the heat dissipation structure 2 comprises a water tank fixedly installed on the left side of the box body, a water pump is fixedly installed at the rear end of the top of the water tank, the input end of the water pump extends into the water tank, the output end of the water pump is connected with a water inlet pipe, one end of the water inlet pipe passes through the inner wall of the box body and the end is fixedly connected with a cooling coil, the other end of the cooling coil is connected with a return pipe, and the other end of the return pipe is connected to the inside of the water tank;

[0011] A cold water structure, the cold water structure is arranged at the bottom of the water tank, the cold water structure includes a heat conduction cavity opened at the bottom of the water tank, a heat conduction block is fixedly connected to the top of the inner wall of the heat conduction cavity, the top of the heat conduction block penetrates into the water tank, a semiconductor refrigeration sheet is fixedly connected to the bottom of the heat conduction block, a heat dissipation fan is fixedly installed at the front end of the inner wall of the heat conduction cavity, an air outlet hole is opened at the rear end of the inner wall of the heat conduction cavity, and a dustproof net is installed in the air outlet hole;

[0012] The heat dissipation structure three is arranged on the right side of the box body. The heat dissipation structure three includes a plurality of heat dissipation holes opened on the right side of the box body. A dustproof net two is installed in the heat dissipation holes. A heat dissipation fan two is fixedly installed on the right side of the inner wall of the box body.

[0013] Furthermore, the reducer assembly comprises:

[0014] A fixing seat, the fixing seat is fixedly connected to two sides of the bottom of the cavity;

[0015] A fixing ring, the fixing ring is fixedly mounted on the top of the fixing seat;

[0016] A reducer body, wherein the reducer body is installed inside the fixing ring;

[0017] A thermally conductive pad is fixedly connected to one end of the reducer body.

[0018] Furthermore, the heat dissipation structure 1 includes:

[0019] A bottom plate, which is detachably mounted on the top and bottom of the box body, and a heat-conducting material is applied between the bottom plate and the box body;

[0020] Heat sinks, a plurality of the heat sinks are fixedly connected to the surface of the bottom plate, and the heat sinks are distributed at equal intervals;

[0021] A dust cover is fixedly mounted on the outer side of the bottom plate surface.

[0022] Furthermore, the cooling coil is in contact with a thermally conductive pad.

[0023] Furthermore, a first circular hole is opened on the left side of the bottom of the box body, and a second circular hole is opened on the right side of the top of the box body.

[0024] Furthermore, an output shaft is fixedly installed on the left side of the bottom of the reducer body, and one end of the output shaft is inserted into the first circular hole. An input shaft is fixedly installed on the right side of the top of the reducer body, and one end of the input shaft is inserted into the second circular hole.

[0025] The advantages of the utility model compared with the prior art are:

[0026] In the utility model, a heat dissipation structure 2, a cold water structure and a heat dissipation structure 3 are arranged. A thermal conductive pad is arranged at the heating end of the reducer body to fit with the cooling coil. When the temperature of the reducer body is too high, the water pump is started, so that the cold water in the water tank returns to the water tank through the water inlet pipe, the cooling coil and the return pipe in sequence to form a cycle. The temperature conductive block can be lowered by the semiconductor refrigeration sheet, and the water inside the water tank is cooled by the temperature conductive block. Then, the heat is dissipated by the hot surface of the semiconductor refrigeration sheet through a pair of heat dissipation fans, which can continuously cool the water inside the water tank. When the cold water in the water tank flows through the cooling coil, the thermal conductive pad absorbs heat, and then the heating part of the reducer body can be quickly cooled. At the same time, the heat dissipation fan 2 on the right side of the box body can replace the waste heat and discharge it externally, thereby facilitating rapid cooling and heat dissipation of the reducer and improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 The utility model is a three-dimensional reducer housing that is convenient for heat dissipation. Figure 1 .

[0028] Figure 2 The utility model is a three-dimensional reducer housing that is convenient for heat dissipation. Figure 2 .

[0029] Figure 3 It is a front sectional view of a reducer housing which is convenient for heat dissipation according to the utility model.

[0030] Figure 4 This is a side section view of a reducer housing that is convenient for heat dissipation. Figure 1 .

[0031] Figure 5 This is a side section view of a reducer housing that is convenient for heat dissipation. Figure 2 .

[0032] Markings in the figure: 1. Box body; 2. Reducer assembly; 21. Fixed seat; 22. Fixed ring; 23. Reducer body; 24. Thermal pad; 3. Heat dissipation structure one; 31. Bottom plate; 32. Heat sink; 33. Dust cover; 4. Heat dissipation structure two; 41. Water tank; 42. Water pump; 43. Water inlet pipe; 44. Cooling coil; 45. Return pipe; 5. Cold water structure; 51. Heat conduction cavity; 52. Temperature conduction block; 53. Semiconductor refrigeration sheet; 54. Heat dissipation fan one; 55. Dustproof net one; 6. Heat dissipation structure three; 61. Heat dissipation through hole; 62. Dustproof net two; 63. Heat dissipation fan two; 7. Output shaft; 8. Input shaft. DETAILED DESCRIPTION

[0033] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices consistent with some aspects of the present disclosure as detailed in the appended claims.

[0034] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0035] like Figures 1 to 5 As shown, the present embodiment proposes a reducer housing that is convenient for heat dissipation, including a housing 1, a cavity is provided inside the housing 1, a reducer assembly 2 is provided inside the cavity, the reducer assembly 2 includes a fixing seat 21 fixedly connected to both sides of the bottom of the cavity, a fixing ring 22 is fixedly installed on the top of the fixing seat 21, a reducer body 23 is installed inside the fixing ring 22, one end of the reducer body 23 is fixedly connected to a thermal pad 24, a circular hole 1 is opened on the left side of the bottom of the housing 1, a circular hole 2 is opened on the right side of the top of the housing 1, an output shaft 7 is fixedly installed on the left side of the bottom of the reducer body 23, one end of the output shaft 7 is inserted into the circular hole 1, an input shaft 8 is fixedly installed on the right side of the top of the reducer body 23, one end of the input shaft 8 is inserted into the circular hole 2.

[0036] A heat dissipation structure 3 is provided on the top and bottom of the box body 1. The heat dissipation structure 3 includes a bottom plate 31 detachably mounted on the top and bottom of the box body 1. A heat-conducting material is applied between the bottom plate 31 and the box body 1. A plurality of heat sinks 32 are fixedly connected to the surface of the bottom plate 31. The heat sinks 32 are evenly spaced. A dust cover 33 is fixedly mounted on the outer side of the surface of the bottom plate 31. When the reducer is working, a large amount of heat is generated inside the reducer. The heat is transferred to the bottom plate 31 through the box body 1, and finally transferred to the heat sinks 32 arranged on the bottom plate 31. The heat sinks 32 can greatly increase the heat dissipation area of ​​the reducer, so that the heat generated by the reducer can be transferred to the outside air faster. The setting of the dust cover 33 can prevent dust and other foreign matter from falling into the gaps between the heat sinks 32.

[0037] A heat dissipation structure 24 is provided on the left side of the box body 1. The heat dissipation structure 24 includes a water tank 41 fixedly installed on the left side of the box body 1, a water pump 42 is fixedly installed at the rear end of the top of the water tank 41, the input end of the water pump 42 extends into the interior of the water tank 41, and the output end of the water pump 42 is connected with a water inlet pipe 43, one end of the water inlet pipe 43 passes through the inner wall of the box body 1 and the end is fixedly connected with a cooling coil 44, the other end of the cooling coil 44 is connected with a return pipe 45, and the other end of the return pipe 45 is connected to the interior of the water tank 41, wherein the thermal pad 24 is fitted with the cooling coil 44, and the cold water in the water tank 41 absorbs heat from the thermal pad 24 when flowing through the cooling coil 44, and the water pump 42 is used to make the cold water in the water tank 41 return to the water tank 41 through the water inlet pipe 43, the cooling coil 44 and the return pipe 45 in turn, forming a cycle.

[0038] A cold water structure 5 is provided at the bottom of the water tank 41, and the cold water structure 5 includes a heat conduction cavity 51 opened at the bottom of the water tank 41, a temperature conduction block 52 is fixedly connected to the top of the inner wall of the heat conduction cavity 51, the top of the temperature conduction block 52 penetrates into the water tank 41, a semiconductor refrigeration plate 53 is fixedly connected to the bottom of the temperature conduction block 52, a heat dissipation fan 54 is fixedly installed at the front end of the inner wall of the heat conduction cavity 51, an air outlet hole is opened at the rear end of the inner wall of the heat conduction cavity 51, and a dustproof net 55 is installed in the air outlet hole, the temperature conduction block 52 can be lowered by the semiconductor refrigeration plate 53, the water inside the water tank 41 is cooled by the temperature conduction block 52, and then the hot surface of the semiconductor refrigeration plate 53 is cooled by the heat dissipation fan 54, so that the water inside the water tank 41 can be continuously cooled.

[0039] A heat dissipation structure 3 6 is provided on the right side of the box body 1. The heat dissipation structure 3 6 includes a plurality of heat dissipation holes 61 opened on the right side of the box body 1. A dustproof net 2 62 is installed in the heat dissipation hole 61. A heat dissipation fan 2 63 is fixedly installed on the right side of the inner wall of the box body 1. The heat dissipation fan 2 63 on the right side of the box body 1 can replace and discharge the waste heat, thereby facilitating rapid cooling and heat dissipation of the reducer.

[0040] During the specific implementation of the utility model, when the reducer is working, a large amount of heat will be generated inside the reducer. This heat will be conducted to the bottom plate 31 through the box body 1, and finally conducted to the heat sink 32 arranged on the bottom plate 31. These heat sinks 32 can greatly increase the heat dissipation area of ​​the reducer, so that the heat generated by the reducer can be conducted to the outside air more quickly. When the temperature of the reducer body 23 is too high, the water pump 42 is started, so that the cold water in the water tank 41 returns to the water tank 41 through the water inlet pipe 43, the cooling coil 44 and the return pipe 45 in turn, forming a cycle, and the water pump 42 is started at the same time. The semiconductor refrigeration sheet 53 lowers the temperature conductive block 52, and the temperature conductive block 52 cools the water inside the water tank 41. Then, the heat dissipation fan 54 is started to dissipate the heat from the hot surface of the semiconductor refrigeration sheet 53, which can continuously cool the water inside the water tank 41. When the cold water in the water tank 41 flows through the cooling coil 44, it absorbs heat from the thermal pad 24, and then the heating part of the reducer body 23 can be quickly cooled. At the same time, the heat dissipation fan 2 63 on the right side of the box body 1 can be started to replace the waste heat and discharge it externally, thereby facilitating rapid cooling and heat dissipation of the reducer and improving the heat dissipation efficiency.

[0041] The electrical components appearing in this article are all connected to an external main controller and 220V AC power, and the main controller can be a conventional known device that controls a computer, etc. The specific implementation method of the present disclosure omits the detailed description of known functions and known components. To ensure the compatibility of the equipment, the operating methods used are consistent with the parameters of marketed equipment.

[0042] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A reducer housing that is convenient for heat dissipation, characterized in that: include: A box body (1), wherein a cavity is provided inside the box body (1); A reducer assembly (2), wherein the reducer assembly (2) is arranged inside the cavity; A heat dissipation structure (3), wherein the heat dissipation structure (3) is arranged at the top and bottom of the box body (1); A heat dissipation structure (4) is provided on the left side of the housing (1), and comprises a water tank (41) fixedly mounted on the left side of the housing (1); a water pump (42) is fixedly mounted at the rear end of the top of the water tank (41); an input end of the water pump (42) extends into the interior of the water tank (41); an output end of the water pump (42) is connected to a water inlet pipe (43); one end of the water inlet pipe (43) passes through the inner wall of the housing (1) and a cooling coil (44) is fixedly connected to the end thereof; the other end of the cooling coil (44) is connected to a return pipe (45); the other end of the return pipe (45) is connected to the interior of the water tank (41); A cold water structure (5), the cold water structure (5) being arranged at the bottom of the water tank (41), the cold water structure (5) comprising a heat conduction cavity (51) opened at the bottom of the water tank (41), a heat conduction block (52) being fixedly connected to the top of the inner wall of the heat conduction cavity (51), the top of the heat conduction block (52) penetrating into the interior of the water tank (41), a semiconductor refrigeration sheet (53) being fixedly connected to the bottom of the heat conduction block (52), a heat dissipation fan (54) being fixedly installed at the front end of the inner wall of the heat conduction cavity (51), an air outlet hole being opened at the rear end of the inner wall of the heat conduction cavity (51), and a dustproof net (55) being installed in the air outlet hole; A heat dissipation structure three (6), the heat dissipation structure three (6) is arranged on the right side of the box body (1), the heat dissipation structure three (6) comprises a plurality of heat dissipation through holes (61) opened on the right side of the box body (1), a dustproof net two (62) is installed in the heat dissipation through holes (61), and a heat dissipation fan two (63) is fixedly installed on the right side of the inner wall of the box body (1).

2. A reducer housing for facilitating heat dissipation according to claim 1, characterized in that: The reducer assembly (2) comprises: A fixing seat (21), wherein the fixing seat (21) is fixedly connected to two sides of the bottom of the cavity; A fixing ring (22), wherein the fixing ring (22) is fixedly mounted on the top of the fixing seat (21); A reducer body (23), wherein the reducer body (23) is installed inside the fixing ring (22); A heat-conducting pad (24) is fixedly connected to one end of the reducer body (23).

3. A reducer housing for facilitating heat dissipation according to claim 1, characterized in that: The heat dissipation structure 1 (3) comprises: A bottom plate (31), the bottom plate (31) being detachably mounted on the top and bottom of the box body (1), and a heat-conducting material being applied between the bottom plate (31) and the box body (1); Heat sinks (32), a plurality of the heat sinks (32) are fixedly connected to the surface of the bottom plate (31), and the heat sinks (32) are distributed at equal intervals; A dust cover (33) is fixedly mounted on the outer side of the surface of the bottom plate (31).

4. A speed reducer housing for facilitating heat dissipation according to claim 2, characterized in that: The cooling coil (44) is in contact with the thermal conductive pad (24).

5. The reducer housing for facilitating heat dissipation according to claim 1, characterized in that: A first circular hole is opened on the left side of the bottom of the box body (1), and a second circular hole is opened on the right side of the top of the box body (1).

6. A speed reducer housing for facilitating heat dissipation according to claim 4, characterized in that: An output shaft (7) is fixedly installed on the left side of the bottom of the reducer body (23), and one end of the output shaft (7) is inserted into the first circular hole. An input shaft (8) is fixedly installed on the right side of the top of the reducer body (23), and one end of the input shaft (8) is inserted into the second circular hole.

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