High-thermal-conductivity integrated partially-solid uniform-temperature plate
Through stamping and diffusion welding technology, combined with the vacuum cavity structure, the existing material waste and high cost problems of solid temperature uniform plates in the processing process of high thermal conductivity are solved, and more efficient heat dissipation and temperature uniformity are achieved.
Patent Information
- Application Number
- CN202421073329.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-16
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-05-16
AI Technical Summary
The existing solid temperature uniform plates with high thermal conductivity are problematic of waste of materials and high costs during the processing process. At the same time, due to the contact thermal resistance and welding complexity caused by multi-part welding, the heat dissipation effect is poor.
The lower cover and upper cover of the temperature equalization plate are processed by stamping, and the first and second protrusions are provided, and the solid block is welded to the upper end of the second protrusion by diffusion welding to form a vacuum cavity to improve thermal conductivity.
It reduces material waste and processing costs, reduces contact thermal resistance, improves heat dissipation effect, and ensures seamless gaps between parts and enhances temperature uniformity through the combination of vacuum cavity and diffusion welding.
Smart Images
Figure CN222670788U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of temperature averaging plates, and in particular to a high thermal conductivity integrated partially solid temperature averaging plate. Background Art
[0002] Thermal resistance reflects the ability to prevent heat transfer. In the engineering application of heat transfer, in order to meet the requirements of the production process, sometimes the thermal resistance is reduced to enhance heat transfer, and sometimes the thermal resistance is increased to inhibit heat transfer. The product can be a vacuum chamber heat sink.
[0003] Vacuum chamber heat spreader technology is similar to heat pipe in principle, but differs in the conduction method. Heat pipe is a one-dimensional linear heat conduction, while the heat in the vacuum chamber heat spreader is conducted on a two-dimensional surface, so it is more efficient.
[0004] However, when using ordinary high thermal conductivity integrated partially solid temperature equalizer boards, a whole piece of material is used to be molded into one piece using a machining center. This solution wastes a lot of raw materials, and the processing cost of using a machining center is high, and the production capacity is limited. The use of solder (tin paste) for secondary welding to increase the height of the parts and the boss, the use of solder (tin paste) for secondary welding to increase the height of the parts and the boss, there is contact thermal resistance and solder thermal resistance between the welding parts, resulting in poor heat dissipation effect. Therefore, we proposed a high thermal conductivity integrated partially solid temperature equalizer board. Utility Model Content
[0005] The present application provides a high thermal conductivity integrated partially solid temperature homogenizing plate to solve the above-mentioned problems.
[0006] The present application provides a high thermal conductivity integrated partially solid temperature homogenizing plate, comprising:
[0007] A lower cover of the temperature averaging plate, wherein a first convex portion is provided in the middle of the lower cover of the temperature averaging plate, and a second convex portion is provided in the middle of the first convex portion;
[0008] A solid block is welded and arranged on the upper end of the second raised portion.
[0009] Preferably, a temperature averaging plate upper cover is provided at the lower end of the temperature averaging plate lower cover, and the cavity between the temperature averaging plate lower cover and the temperature averaging plate upper cover is set as a vacuum cavity.
[0010] Preferably, the upper cover and the lower cover of the temperature averaging plate are both formed by stamping.
[0011] Preferably, the shapes of the first protrusion and the second protrusion are set according to the heat conduction area.
[0012] Preferably, the shape of the solid block is the same as that of the second protrusion.
[0013] Preferably, the lower end surface of the solid block and the upper end surface of the second raised portion are welded together without any gap by diffusion welding.
[0014] Preferably, outer surfaces of the lower cover of the temperature homogenizing plate and the upper cover of the temperature homogenizing plate are both smooth and level.
[0015] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art:
[0016] In the structure provided in the embodiment of the present application, both the lower cover of the temperature equalizing plate and the upper cover of the temperature equalizing plate are processed by stamping to reduce costs and improve production capacity, and can reduce the contact thermal resistance generated by welding multiple parts. There is no risk of leakage of the first protrusion and the second protrusion, and the solid block is welded to the lower cover of the temperature equalizing plate by diffusion welding. No medium is used between the high-temperature diffusion welding components, and there is no gap between the components after welding is completed. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.
[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.
[0019] Figure 1 This is an overall structural diagram provided for an embodiment of the present application.
[0020] In the figure: 1. upper cover of the temperature averaging plate; 2. lower cover of the temperature averaging plate; 3. first raised portion; 4. second raised portion; 5. solid block. DETAILED DESCRIPTION
[0021] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.
[0022] Various embodiments of the present application may exist in the form of a range. It should be understood that the description in the form of a range is only for convenience and simplicity and should not be understood as a hard limit to the scope of the present application; therefore, it should be considered that the range description has specifically disclosed all possible sub-ranges and single values within the range. For example, it should be considered that the range description from 1 to 6 has specifically disclosed sub-ranges, such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., as well as single numbers within the range, such as 1, 2, 3, 4, 5 and 6, which are applicable regardless of the range. In addition, whenever a numerical range is indicated in the present application, it is meant to include any quoted numbers (fractions or integers) within the indicated range. Unless otherwise specified, various raw materials, reagents, instruments and equipment used in the present application, etc., can be purchased from the market or can be prepared by existing equipment.
[0023] In the present application, in the absence of any contrary description, the directional words used, such as "upper" and "lower", are specifically the directions of the drawings in the accompanying drawings. In addition, in the present application, the terms "include", "comprise", etc. refer to "including but not limited to". In the present application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. In the present application, "and / or" describes the association relationship of the associated objects, indicating that three relationships may exist, for example, A and / or B, which can represent: A exists alone, A and B exist at the same time, and B exists alone. Wherein A, B can be singular or plural. In the present application, "at least one" refers to one or more, and "plural" refers to two or more. "At least one", "at least one of the following" or similar expressions refer to any combination of these items, including any combination of singular items or plural items. For example, "at least one of a, b, or c" or "at least one of a, b and c" can both mean: a, b, c, ab, i.e. a and b, ac, bc or abc, where a, b, c can be single or plural, respectively.
[0024] Figure 1 This is an overall structural diagram provided for an embodiment of the present application.
[0025] like Figure 1 As shown, the embodiment of the present application provides a high thermal conductivity integrated partially solid temperature homogenizing plate, comprising:
[0026] A temperature averaging plate lower cover 2, wherein a first convex portion 3 is provided in the middle of the temperature averaging plate lower cover 2, and a second convex portion 4 is provided in the middle of the first convex portion;
[0027] A solid block 5 is welded on the upper end of the second raised portion 4 .
[0028] Specifically: both the lower cover 2 of the temperature equalizing plate and the upper cover 1 of the temperature equalizing plate are processed by stamping to reduce costs and improve production capacity, which can reduce the contact thermal resistance generated by welding multiple parts, and the first protrusion 3 and the second protrusion 4 have no leakage risk.
[0029] like Figure 1 As shown: a temperature averaging plate upper cover 1 is provided at the lower end of the temperature averaging plate lower cover 2, and a cavity between the temperature averaging plate lower cover 2 and the temperature averaging plate upper cover 1 is set as a vacuum cavity.
[0030] Specifically, the lower cover 2 of the temperature equalizing plate and the upper cover 1 of the temperature equalizing plate are sealed and connected by welding, and the internal space is evacuated by a vacuum pumping device.
[0031] like Figure 1 As shown: the temperature averaging plate upper cover 1 and the temperature averaging plate lower cover 2 are both formed by stamping.
[0032] like Figure 1 As shown: the shapes of the first protrusion 3 and the second protrusion 4 are set according to the heat conduction area.
[0033] Specifically, the shapes of the first protrusion 3 and the second protrusion 4 can be set according to the heating area of the product.
[0034] like Figure 1 As shown in FIG. 1 , the shape of the solid block 5 is the same as the shape of the second protrusion 4 .
[0035] Specifically, the second raised portion 4 is the core position of the heat source, and the solid block 5 can increase the temperature-averaging effect of the second raised portion 4 and prevent the second raised portion 4 from being deformed due to excessive heat.
[0036] like Figure 1 As shown: the lower end surface of the solid block 5 and the upper end surface of the second protruding portion 4 are welded together without any gap by diffusion welding.
[0037] Specifically, the solid block 5 is welded to the lower cover 2 of the temperature homogenizing plate by diffusion welding. No medium is used between the components in high-temperature diffusion welding, and there is no gap between the components after welding.
[0038] To be more specific: Diffusion welding is a welding method that closely fits the weldments and keeps them at a certain temperature and pressure for a period of time, so that the atoms between the contact surfaces diffuse into each other to form a connection. Since welding is generally completed in a high-temperature environment, vacuum protection is generally used to avoid oxidation of the weldments at high temperatures. Therefore, it is also called "vacuum diffusion welding."
[0039] like Figure 1As shown: the outer surfaces of the temperature averaging plate lower cover 2 and the temperature averaging plate upper cover 1 are both smooth and level.
[0040] Specifically, the lower cover 2 of the temperature averaging board and the upper cover 1 of the temperature averaging board are both processed by stamping, and the outer surfaces are smooth and level, which can increase the temperature averaging performance of the overall structure of the temperature averaging board.
[0041] The above is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. It will be apparent to those skilled in the art that various modifications to these embodiments are possible, and the general principles defined in the present application can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments shown in the present application, but will conform to the widest scope consistent with the principles and novel features applied for by the present application.
Claims
1. A high thermal conductivity integrated partially solid temperature equalizing plate, characterized in that: include: A temperature equalizing plate lower cover (2), wherein a first protrusion (3) is provided in the middle of the temperature equalizing plate lower cover (2), and a second protrusion (4) is provided in the middle of the first protrusion; A solid block (5), wherein the solid block (5) is welded and arranged on the upper end of the second raised portion (4).
2. The high thermal conductivity integrated partially solid temperature homogenizing plate according to claim 1, characterized in that: The lower end of the temperature averaging plate lower cover (2) is provided with a temperature averaging plate upper cover (1), and the cavity between the temperature averaging plate lower cover (2) and the temperature averaging plate upper cover (1) is configured as a vacuum cavity.
3. The high thermal conductivity integrated partially solid temperature homogenizing plate according to claim 2, characterized in that: The temperature balancing plate upper cover (1) and the temperature balancing plate lower cover (2) are both formed by stamping.
4. The high thermal conductivity integrated partially solid temperature homogenizing plate according to claim 1, characterized in that: The shapes of the first protrusion (3) and the second protrusion (4) are set according to the heat conduction area.
5. The high thermal conductivity integrated partially solid temperature homogenizing plate according to claim 1, characterized in that: The shape of the solid block (5) is the same as the shape of the second protruding portion (4).
6. The high thermal conductivity integrated partially solid temperature homogenizing plate according to claim 1, characterized in that: The lower end surface of the solid block (5) and the upper end surface of the second raised portion (4) are welded together without any gap by diffusion welding.
7. The high thermal conductivity integrated partially solid temperature homogenizing plate according to claim 2, characterized in that: The outer surfaces of the lower cover (2) of the temperature equalizing plate and the upper cover (1) of the temperature equalizing plate are both smooth and level.