Heat dissipation support and electronic equipment

Abstract

The utility model provides a heat dissipation support and electronic equipment, and the heat dissipation support comprises a first heat dissipation structure which is used for being connected with a temperature equalizing structure of the electronic equipment to transmit heat; the second heat dissipation structure is connected with the first heat dissipation structure and used for transmitting heat to the second heat dissipation structure through the first heat dissipation structure; the second heat dissipation structure can support the electronic device in the first direction relative to the first heat dissipation structure.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electronic equipment, and in particular to a heat dissipation bracket and electronic equipment. Background Art

[0002] Laptops are becoming thinner and lighter with higher energy consumption. When using a laptop, it will generate heat, which will cause the temperature to rise. Excessive temperature will affect the performance of the CPU and even reduce the service life of the CPU. Therefore, the laptop needs to be cooled.

[0003] There are two types of heat dissipation methods at present. One is to set up a heat dissipation system of a temperature averaging module and a fan combination inside the notebook. The heat dissipation system of the temperature averaging module and a fan combination is limited by the limited space inside the notebook, resulting in limited heat dissipation effect. The other is an external heat dissipation bracket. When in use, the laptop is placed on an air-cooled heat dissipation bracket for heat dissipation. The heat dissipation capacity through air volume is limited and the bracket is inconvenient to carry. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a heat dissipation bracket and an electronic device.

[0005] In order to solve the above technical problems, the embodiments of the present application provide the following technical solutions:

[0006] A first aspect of the present application provides a heat dissipation bracket, comprising:

[0007] The first heat dissipation structure is used to connect with the temperature-averaging structure of the electronic device to transfer heat;

[0008] A second heat dissipation structure, the second heat dissipation structure is connected to the first heat dissipation structure for transferring heat to the second heat dissipation structure through the first heat dissipation structure; the second heat dissipation structure can support the electronic device along a first direction relative to the first heat dissipation structure.

[0009] In some embodiments, the first heat dissipation structure has a first pipe; the second heat dissipation structure has a second pipe connected to the first pipe; the first pipe and the second pipe are both used to accommodate heat dissipation medium.

[0010] In some embodiments, further comprising a drive assembly;

[0011] The first pipeline is connected to the second pipeline through the driving component, and the driving component provides power for the internal circulation of the heat dissipation medium.

[0012] In some embodiments, the second heat dissipation structure has a plurality of second pipes, the plurality of second pipes are spaced apart along the first direction, one end of the plurality of second pipes are connected to the driving assembly, and the other end of the plurality of second pipes are connected to the first pipe.

[0013] In some embodiments, a fan assembly is also included;

[0014] The fan assembly is located at the first side of the second heat dissipation structure, and is used to cool the second heat dissipation structure so as to cool the heat dissipation medium inside the second heat dissipation structure.

[0015] In some embodiments, further comprising a support frame;

[0016] The supporting frame is used to support the fan assembly and the driving assembly.

[0017] In some embodiments, further comprising a flexible portion;

[0018] The first pipe is connected to the second pipe through the flexible portion. The second heat dissipation structure is used to be connected to the electronic device in a rotational manner around a second direction. The second direction has an angle with the first direction.

[0019] A second aspect of the present application provides an electronic device, including:

[0020] case;

[0021] A heat generating component is arranged in the housing;

[0022] A temperature-averaging structure, connected to the heat-generating component, for evenly averaging the heat of the heat-generating component;

[0023] A heat dissipation bracket, the heat dissipation bracket comprising:

[0024] A first heat dissipation structure connected to the temperature-averaging structure to transfer heat;

[0025] A second heat dissipation structure is connected to the first heat dissipation structure for transferring heat to the second heat dissipation structure, and the second heat dissipation structure can move along a first direction relative to the first heat dissipation structure and support the electronic device.

[0026] In some embodiments, further comprising a flexible component and a connecting shaft;

[0027] The second heat dissipation structure is connected to the first heat dissipation structure through the flexible component, and the heat dissipation bracket is rotatably connected to the shell around a second direction through the connecting shaft.

[0028] In some embodiments, the housing has a receiving cavity, and at least a portion of the receiving cavity receives the second heat dissipation structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become easy to understand. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0030] Figure 1 The schematic diagram of the structure of the heat dissipation bracket of the present application from a first viewing angle is schematically shown;

[0031] Figure 2 The schematic diagram of the structure of the heat dissipation bracket of the present application from a second viewing angle is schematically shown;

[0032] Figure 3 The schematic diagram of the structure of the heat dissipation bracket of the present application from a third viewing angle is schematically shown;

[0033] Figure 4 The structure diagram of the electronic device of the present application is schematically shown in the first viewing angle;

[0034] Figure 5 The structure diagram of the electronic device of the present application from a second viewing angle is schematically shown;

[0035] Description of Figure Numbers:

[0036] 1. First heat dissipation structure; 11. First pipeline; 2. Second heat dissipation structure; 21. Second pipeline; 3. Driving assembly; 4. Fan assembly; 5. Support frame; 6. Flexible part; 100. Heat dissipation bracket; 200. Shell; 201. Accommodating cavity. DETAILED DESCRIPTION

[0037] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0038] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which this application belongs.

[0039] Example 1

[0040] like Figures 1 to 5As shown, Embodiment 1 of the present application provides a heat dissipation bracket, comprising:

[0041] The first heat dissipation structure 1 is used to connect with the temperature-averaging structure of the electronic device to transfer heat;

[0042] The second heat dissipation structure 2 is connected to the first heat dissipation structure 1 and is used to transfer heat to the second heat dissipation structure 2 through the first heat dissipation structure 1; the second heat dissipation structure 2 can support the electronic device along a first direction relative to the first heat dissipation structure 1.

[0043] Specifically, the first heat dissipation structure 1 is used to effectively transfer the heat generated inside the electronic device. As a medium for heat transmission, it can be directly connected to the temperature equalization structure of the electronic device.

[0044] The first heat dissipation structure 1 can be made of copper or aluminum with high thermal conductivity, or the first heat dissipation structure 1 can also be made of heat pipes, temperature equalizing plates or water-cooled plates, wherein the first heat dissipation structure 1 is preferably a water-cooled plate, and the flow of coolant inside the water-cooled plate is used to quickly absorb and transfer the heat generated by the electronic device. The first heat dissipation structure 1 can be connected to the temperature equalizing structure by welding, or connected to the temperature equalizing structure by mechanical fixing means such as screws and buckles. In order to enhance portability, the first heat dissipation structure 1 is preferably connected to the temperature equalizing structure by buckles, which facilitates the installation and disassembly of the first heat dissipation structure 1. The first heat dissipation structure 1 is connected to the temperature equalizing structure, and the temperature equalizing structure is a heat pipe or a temperature equalizing plate, which maximizes the use of the existing space resources of the electronic equipment and breaks through the limitation that the traditional heat dissipation method is difficult to dissipate heat efficiently in a limited space.

[0045] The second heat dissipation structure 2 serves as an external heat dissipation, which expands the heat dissipation area, so that the heat dissipation bracket 100 is no longer limited by the space inside the electronic device. The second heat dissipation structure 2 also has the functions of heat receiving, transferring, dissipating and supporting the electronic device. The second heat dissipation structure 2 can be composed of multiple heat dissipation fins, and the multiple heat dissipation fins are all connected to the first heat dissipation structure 1. The multiple heat dissipation fins can increase the heat dissipation surface area, facilitate the air flow to take away the heat, and improve the heat dissipation efficiency. The heat dissipation fins can be made of copper or aluminum with high thermal conductivity; or, the second heat dissipation structure 2 can choose a water cooling radiator. The coolant inside the water cooling radiator has a large heat capacity and good thermal conductivity, and can quickly absorb and transfer heat. The second heat dissipation structure 2 and the first heat dissipation structure 1 can be fixedly connected by welding or integral molding.

[0046] The heat dissipation bracket of the present application integrates the internal temperature equalization structure of the electronic device and the external heat dissipation mechanism, and successfully breaks through the constraint of the limited space of the electronic device. The first heat dissipation structure 1 connected to the built-in temperature equalization structure of the electronic device can effectively transfer the heat generated inside the electronic device. The first heat dissipation structure 1 can transfer the heat to the second heat dissipation structure 2 connected thereto, which expands the dispersion area of ​​heat dissipation and improves the overall heat dissipation efficiency; and because the heat dissipation bracket 100 is connected to the temperature equalization structure, an integrated design with the electronic device is realized, making it easier to carry and use while maintaining strong heat dissipation performance, and not limited to the size of the electronic device space; the second heat dissipation structure 2 can support the electronic device along the first direction relative to the first heat dissipation structure 1, which can not only provide stable support for the electronic device and ensure the comfort of the user, but also optimize the air flow path and enhance the heat dissipation effect.

[0047] like Figure 1 and Figure 2 As shown, in some embodiments, the first heat dissipation structure 1 has a first pipe 11; the second heat dissipation structure 2 has a second pipe 21 connected to the first pipe 11; the first pipe 11 and the second pipe 21 are both used to accommodate heat dissipation medium.

[0048] Specifically, the first heat dissipation structure 1 can be plate-shaped as a whole, and part of the first heat dissipation structure 1 protrudes outward to form a first pipe 11, thereby increasing the heat dissipation area of ​​the first heat dissipation structure 1 and improving the heat dissipation efficiency of the first heat dissipation structure 1. At this time, the first pipe 11 may or may not contain a heat dissipation medium; or, part of the first heat dissipation structure 1 may be hollow inside to form the first pipe 11, and the first pipe 11 may contain a heat dissipation medium.

[0049] The second heat dissipation structure 2 may be plate-shaped, and part of the second heat dissipation structure 2 may protrude outward to form a second pipe 21, thereby increasing the heat dissipation area of ​​the second heat dissipation structure 2 and improving the heat dissipation efficiency of the second heat dissipation structure 2. At this time, the second pipe 21 may or may not contain a heat dissipation medium; or, the plate-shaped second heat dissipation structure 2 may have a second pipe 21 inside, and the second pipe 21 contains a heat dissipation medium; or, the second heat dissipation bracket 2 is composed of a frame and a second pipe 21, and the second pipe 21 is arranged on the frame, and the frame can support the electronic device along a first direction relative to the first heat dissipation structure 1.

[0050] By providing a connecting pipe between the first heat dissipation structure 1 and the second heat dissipation structure 2, a continuous heat dissipation path is formed to improve the heat dissipation efficiency. The heat dissipation medium can effectively transfer heat when flowing in the pipe, thereby avoiding local overheating and ensuring that the temperature of each part of the electronic device is kept within a safe range.

[0051] The heat dissipation medium can be a gaseous heat dissipation medium (such as air, helium, nitrogen or argon, etc.), or a liquid heat dissipation medium (such as water, oil or other coolants, etc.), among which liquid heat dissipation media with better heat capacity and thermal conductivity are preferred.

[0052] The first pipe 11 may be linear, serpentine, honeycomb, U-shaped, etc. The specific shape of the first pipe 11 may be reasonably designed in combination with heat dissipation requirements, space limitations, fluid resistance, and noise control. The shape of the second pipe 21 may refer to the shape of the first pipe 11. The shapes of the first pipe 11 and the second pipe 21 may be the same, or the shapes of the first pipe 11 and the second pipe 21 may be different, for example, the first pipe 11 is serpentine and the second pipe 21 is linear.

[0053] like Figure 1 As shown, in some embodiments, a driving component 3 is also included;

[0054] The first pipeline 11 is connected to the second pipeline 21 through the driving component 3, and the driving component 3 provides power for the internal circulation of the heat dissipation medium.

[0055] Specifically, the driving component 3 is used to drive the heat dissipation medium to circulate, so that the heat dissipation medium can circulate between the first pipe 11 and the second pipe 21 in a shorter time, thereby achieving an effective heat dissipation effect.

[0056] The driving component 3 is disposed on the first heat dissipation structure 1 , or the driving component 3 is disposed on the second heat dissipation structure 2 .

[0057] There may be one driving assembly 3, in which case the driving assembly 3 is connected to the first pipe 11 and the second pipe 12 respectively; or, there may be multiple driving assemblies 3, and the multiple driving assemblies 3 are arranged at intervals, and the first pipe 11 and the second pipe 21 are connected by the multiple driving assemblies 3, so as to enhance the flow speed and circulation efficiency of the heat dissipation medium in the first pipe 11 and the second pipe 21, thereby improving the overall heat dissipation performance; in this case, the first heat dissipation structure 1 and the second heat dissipation structure 2 may both be provided with driving assemblies 3, or the multiple driving assemblies 3 are all arranged on the first heat dissipation structure 1, or the multiple driving assemblies 3 are all arranged on the second heat dissipation structure 2; or,

[0058] In order to ensure the driving force of the driving component 3 and optimize the heat dissipation performance, multiple driving components are arranged at intervals along the second direction, and each second pipe 21 includes multiple sub-pipes arranged at intervals along the second direction; multiple first pipes 11 are arranged at intervals along the second direction on the first heat dissipation structure 1, and the number of driving components 3 and first pipes 11 is the same as the number of sub-pipes; each sub-pipe is connected to a first pipe through a driving component 3, ensuring uniform distribution of the heat dissipation medium in the system and efficient heat exchange, while ensuring that the driving component 3 can provide sufficient driving force to maintain the stable operation of the entire heat dissipation system.

[0059] The first pipeline 11 is connected to the second pipeline 21 through the driving assembly 3

[0060] When the heat dissipation medium is a gaseous heat dissipation medium, the driving component 3 can use an air pump or a turbo blower, etc. When the heat dissipation medium is a liquid heat dissipation medium, the driving component 3 can use a centrifugal pump, an axial flow pump, a gear pump or a peristaltic pump, etc., among which a centrifugal pump that is compatible with a liquid heat dissipation medium with better heat capacity and thermal conductivity is preferred.

[0061] In order to further improve the heat dissipation effect of the second heat dissipation structure 2, as Figure 1 As shown, in some embodiments, the second heat dissipation structure 2 has a plurality of second pipes 21, and the plurality of second pipes 21 are spaced apart along the first direction, one ends of the plurality of second pipes 21 are connected to the driving assembly 3, and the other ends of the plurality of second pipes 21 are connected to the first pipe 11.

[0062] Specifically, the provision of multiple second pipes 21 not only increases the capacity of the heat dissipation medium, thereby increasing the heat dissipation efficiency, but also forms air channels between the spaced second pipes 21, so that part of the heat of the first heat dissipation structure 1 can be dissipated through the air channels, further enhancing the heat dissipation effect.

[0063] In order to improve the efficiency and performance of the pump and ensure sufficient mixing and uniform distribution of the liquid, a diverter may be provided on the second heat dissipation structure 2, the other ends of the plurality of second pipes 21 are connected to the first pipe 11 through the diverter, and the drive component 3 is connected to one end of the plurality of second pipes 21 and the first pipe 11; or, a confluence may be provided on the second heat dissipation structure 2, the drive component 3 is connected to the confluence and the first pipe 11, and one ends of the plurality of second pipes 21 are connected to the confluence; or, a diverter and a confluence are provided on the second heat dissipation structure 2 at the same time, one end of the plurality of second pipes 21 is connected to the confluence, the other ends of the plurality of second pipes 21 are connected to the diverter, and the drive component 3 is connected to the confluence and the first pipe 11.

[0064] The first heat dissipation structure 1 may also have multiple first pipes 11, and the multiple first pipes 11 are arranged at intervals; when there is one second pipe 21, one end of the multiple first pipes 11 is connected to the other end of the second pipe 21, and the other end of the multiple first pipes 11 is connected to the driving component 3, and the multiple first pipes 11 and the one second pipe 21 contain heat dissipation medium, and the driving component 3 drives the heat dissipation medium to circulate in one second pipe 21 and the multiple first pipes 11; or, when the number of second pipes 21 and first pipes 11 is equal, each second pipe 21 is connected to a first pipe 11, and each connected first pipe 11 and second pipe 21 contains heat dissipation medium, one end of the multiple second pipes 21 is connected to the driving component 3, and the other end of the multiple first pipes 11 is connected to the driving component 3, and the driving component 2 drives the heat dissipation medium in each connected first pipe 11 and second pipe 21 to circulate.

[0065] like Figure 1 As shown, in some embodiments, a fan assembly 4 is also included;

[0066] The fan assembly 4 is located at the first side of the second heat dissipation structure 2 , and is used to cool the second heat dissipation structure 2 , so as to cool the heat dissipation medium inside the second heat dissipation structure 2 .

[0067] like Figure 1 and Figure 3 As shown, in some embodiments, a support frame 5 is also included;

[0068] The supporting frame 5 is used to support the fan assembly 4 and the driving assembly 3 .

[0069] Specifically, the side of the support frame 5 close to the first heat dissipation structure 1 is the first side of the second heat dissipation structure 2. The support frame 5 can be connected to the water cooling radiator or the second pipe 2, and the support frame 5 can support the electronic device along the first direction relative to the first heat dissipation structure 1. The fan assembly 4 has at least one fan, for example, it can be one, two, three, four, five, six or even more fans, and each fan can be fixedly set on the support frame 5 by bolt connection or clamping. The fan has an air inlet and an air outlet. Since the first heat dissipation structure 1 is connected to the temperature equalization structure of the electronic device, that is, the first heat dissipation structure is the source of heat in the heat dissipation bracket, the air inlet of each fan can be oriented toward the first heat dissipation structure 1. When the fan rotates, an airflow from the air inlet to the air outlet will be formed, taking away part of the heat emitted by the first heat dissipation structure 1, and at the same time taking away part of the heat of the heat dissipation medium in the second pipe 21, thereby improving the heat dissipation efficiency.

[0070] like Figure 1 and Figure 3 As shown, in some embodiments, a flexible portion 6 is also included;

[0071] The first pipe 11 is connected to the second pipe 12 through the flexible portion 6 . The second heat dissipation structure 2 is used to be rotatably connected to the electronic device around a second direction. The second direction has an angle with the first direction.

[0072] Specifically, the second heat dissipation structure 2 is connected to the electronic device for rotation around the second direction, and the second heat dissipation structure 2 can be in a first state and a second state during the rotation process: when the second heat dissipation structure 2 is in the first state, the second heat dissipation structure 2 can be buckled with the first heat dissipation structure 1, thereby reducing the space of the entire heat dissipation bracket 100, which is more conducive to storage and carrying; when the second heat dissipation structure 2 is in the second state, the second heat dissipation structure 2 can support the electronic device along the first direction; wherein, the first direction refers to the direction in which the heat dissipation bracket 100 provides support for the electronic device, and the first direction has a certain angle with the operating surface of the electronic device; the second direction refers to the direction in which the second heat dissipation structure 2 can be rotated or flipped relative to the electronic device and the first heat dissipation structure 1, and the second direction can be parallel to the operating surface of the electronic device to make the overall structure more compact.

[0073] The flexible part 6 can be made of metal material, such as stainless steel, aluminum or antimony copper, or made of plastic material, rubber material, silicone material, etc. Among them, it is preferably made of antimony copper material with advantages in corrosion resistance, electrical conductivity, elasticity and fatigue resistance. The flexible part 6 can be a bellows made of antimony copper, which is used to connect the first pipe 11 and the second pipe 21; or, the flexible part 6, the first heat dissipation structure 1 and the second heat dissipation structure 2 have the same size along the second direction, the flexible part 6 made of antimony copper is connected to the first heat dissipation structure 1 and the second heat dissipation structure 2 respectively, and part of the flexible part 6 is hollow to form a third pipe, which is used to connect the first pipe 11 and the second pipe 21.

[0074] Example 2

[0075] like Figures 1 to 5 As shown, Embodiment 2 of the present application provides an electronic device, including:

[0076] Housing 200;

[0077] A heat generating component, disposed in the housing 200;

[0078] A temperature-averaging structure, connected to the heat-generating component, for evenly averaging the heat of the heat-generating component;

[0079] The heat dissipation support 100 includes:

[0080] A first heat dissipation structure 1, connected to the temperature-averaging structure to transfer heat;

[0081] The second heat dissipation structure 2 is connected to the first heat dissipation structure 1 to transfer heat to the second heat dissipation structure 2. The second heat dissipation structure 2 can move along a first direction relative to the first heat dissipation structure 1 and support the electronic device.

[0082] Specifically, the electronic device may be a laptop or a tablet computer, etc. The second heat dissipation structure 2 can move along the first direction relative to the first heat dissipation structure 1 and support the electronic device, which is more conducive to the storage of the heat dissipation bracket 100 and the carrying of the electronic device.

[0083] The electronic device of the present application integrates the internal temperature equalization structure of the electronic device and the external heat dissipation mechanism, and successfully breaks through the constraint of the limited space of the electronic device. The first heat dissipation structure 1 of the heat dissipation bracket 100 connected to the built-in temperature equalization structure of the electronic device can effectively transfer the heat generated inside the electronic device. The first heat dissipation structure 1 can transfer the heat to the second heat dissipation structure 2 connected thereto, which expands the dispersion area of ​​heat dissipation and improves the overall heat dissipation efficiency; and because the heat dissipation bracket 100 is connected to the temperature equalization structure, it is easier to carry and use while maintaining strong heat dissipation performance; the second heat dissipation structure 2 can support the electronic device along the first direction relative to the first heat dissipation structure 1, which can not only provide stable support for the electronic device and ensure the comfort of the user, but also optimize the fluid flow path and enhance the heat dissipation effect.

[0084] In some embodiments, further comprising a flexible component and a connecting shaft;

[0085] The second heat dissipation structure 2 is connected to the first heat dissipation structure 1 through the flexible component, and the heat dissipation bracket 100 is rotatably connected to the housing 200 around a second direction through the connecting shaft.

[0086] Specifically, the specific structure and selection of the flexible component can refer to the flexible part 6.

[0087] The connecting shaft can extend from one end of the heat dissipation bracket 100 to the other end along the second direction, or there can be two connecting shafts, one end of the two connecting shafts is fixedly connected to the end of the heat dissipation bracket 100, and the other end of the two connecting shafts is respectively connected to the shell 200 for rotation around the second direction.

[0088] When the flexible component is made of antimony copper, the connecting shaft can be connected to the flexible component by welding or key connection, or the connecting shaft can be fixedly connected to the supporting frame 5.

[0089] like Figure 4 As shown, in some embodiments, the housing 200 has a receiving cavity 201 , and at least a portion of the receiving cavity 201 receives the second heat dissipation structure 2 .

[0090] Specifically, the arrangement of the accommodating cavity 201 is more conducive to the storage of the second heat dissipation structure 2 , more conducive to the carrying of the electronic device, and optimizes the space utilization. At the same time, it can also make the electronic device have a better appearance.

[0091] When the electronic device of the present application is working, the heat generated by the components inside it is evenly distributed through the temperature-averaging structure, and the first heat dissipation structure 1 connected to the temperature-averaging structure receives and transfers the heat to the first pipe 11 inside it;

[0092] When the user opens the heat dissipation bracket 100, the driving component 3 and the fan component 4 are automatically started, and the driving component 3 drives the heat dissipation medium in the first pipe 11 and the second pipe 21 to circulate rapidly, forming a continuous heat dissipation process;

[0093] At the same time, the fan assembly 3 can take away part of the heat of the first heat dissipation structure 1 and cool the second pipe 21 at the same time. In this way, the temperature of the heated heat dissipation medium is reduced after being cooled by the fan assembly 4, and it can absorb and transfer heat more effectively when entering the circulation again; in addition, since the heat dissipation bracket 100 raises the bottom of the electronic device, the air circulation is greatly improved. The enhanced air circulation can improve the heat dissipation efficiency of the fan assembly 4, so that the fan assembly 4 can more effectively discharge hot air, thereby enhancing the overall heat dissipation effect.

[0094] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A heat dissipation bracket, characterized in that: include: The first heat dissipation structure is used to connect with the temperature-averaging structure of the electronic device to transfer heat; A second heat dissipation structure, the second heat dissipation structure is connected to the first heat dissipation structure for transferring heat to the second heat dissipation structure through the first heat dissipation structure; the second heat dissipation structure can support the electronic device along a first direction relative to the first heat dissipation structure.

2. The heat dissipation bracket according to claim 1, characterized in that: The first heat dissipation structure has a first pipeline; the second heat dissipation structure has a second pipeline connected to the first pipeline; the first pipeline and the second pipeline are both used to accommodate heat dissipation medium.

3. The heat dissipation bracket according to claim 2, characterized in that: Also included is a drive assembly; The first pipeline is connected to the second pipeline through the driving component, and the driving component provides power for the internal circulation of the heat dissipation medium.

4. The heat dissipation bracket according to claim 3, characterized in that: The second heat dissipation structure has a plurality of second pipes, the plurality of second pipes are spaced apart along the first direction, one end of the plurality of second pipes are connected to the driving assembly, and the other end of the plurality of second pipes are connected to the first pipe.

5. The heat dissipation bracket according to claim 3, characterized in that: Also included is a fan assembly; The fan assembly is located at the first side of the second heat dissipation structure, and is used to cool the second heat dissipation structure so as to cool the heat dissipation medium inside the second heat dissipation structure.

6. The heat dissipation bracket according to claim 5, characterized in that: Also included is a support frame; The supporting frame is used to support the fan assembly and the driving assembly.

7. The heat dissipation bracket according to claim 2, characterized in that: Also comprising a flexible portion; The first pipe is connected to the second pipe through the flexible portion. The second heat dissipation structure is used to be connected to the electronic device in a rotational manner around a second direction. The second direction has an angle with the first direction.

8. An electronic device, characterized in that: include; case; A heat generating component is arranged in the housing; A temperature-averaging structure, connected to the heat-generating component, for evenly averaging the heat of the heat-generating component; A heat dissipation bracket, the heat dissipation bracket comprising: A first heat dissipation structure connected to the temperature-averaging structure to transfer heat; A second heat dissipation structure is connected to the first heat dissipation structure for transferring heat to the second heat dissipation structure, and the second heat dissipation structure can move along a first direction relative to the first heat dissipation structure and support the electronic device.

9. The electronic device according to claim 8, characterized in that: Also included are a flexible assembly and a connecting shaft; The second heat dissipation structure is connected to the first heat dissipation structure through the flexible component, and the heat dissipation bracket is rotatably connected to the shell around a second direction through the connecting shaft.

10. The electronic device according to claim 8, characterized in that: The housing has a receiving cavity, and at least a portion of the receiving cavity receives the second heat dissipation structure.

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