Low-power-consumption computer mainboard

Abstract

The utility model discloses a low-power-consumption computer mainboard, relates to the field of computer mainboards, and solves the problems that an existing device is difficult to have a poor heat dissipation effect on a mainboard with an uneven bottom according to requirements, and the power consumption is high, the following scheme is adopted: the low-power-consumption computer mainboard comprises a mainboard, and the outer side of the mainboard is sleeved with a limiting assembly and a heat conduction assembly; the limiting assembly is composed of an upper clamping edge, a lower clamping edge and side sleeves on the outer sides of the clamping edges, and a heat conduction assembly is arranged at the bottom of the clamping edge on the bottom side. The heat conduction assembly comprises two sets of side plates opposite in position, and the tops of the side plates are fixedly connected to the bottom face of the clamping edge. According to the low-power-consumption computer mainboard, through the arrangement of the limiting assembly and the heat conduction assembly, the heat conduction assembly can be assembled on the bottom side of the mainboard through the limiting assembly, heat on the mainboard can be guided out to the heat conduction assembly through the clamping edge, and high-temperature heat generated by the peripheral side of the mainboard due to work can be adsorbed through the arrangement of the heat conduction pieces in the heat conduction assembly; and the contact area with the air flow is increased by the side plates and the heat-conducting fins.

Description

Technical Field

[0001] The utility model relates to the technical field of computer mainboards, in particular to a low-power consumption computer mainboard. Background Art

[0002] The motherboard is installed in the computer mainframe. It is one of the most basic and important components of the computer and plays a vital role in the entire computer system.

[0003] After searching, the application with patent application number CN202021567047.3 discloses a low-power computer motherboard, including a motherboard body, the left and right edges of the back of the motherboard body are both provided with fixing frames, the fixing frame is in the shape of a long strip as a whole and is provided with a T-shaped slot along the length direction on the non-fixed surface, and a fixing plate is also provided on the back of the motherboard body, and two T-shaped teeth are provided on the opposite surface of the fixing plate and the motherboard body in parallel, and the T-shaped teeth on both sides are respectively plugged into the inside of two T-shaped slots provided on both sides of the bottom, and a plurality of heat-conducting fins are equidistantly provided on the bottom surface of the fixing plate, and a heat-conducting plate is commonly connected to the bottom surfaces of the plurality of heat-conducting fins;

[0004] The above application document achieves efficient heat dissipation of the motherboard by setting up components such as thermal fins, thereby achieving the effect of reducing power consumption. However, the heat is dissipated by closely adhering to the bottom side of the motherboard. Due to the presence of multiple groups of interfaces on the motherboard, which are uneven and close contact, the heat conduction effect is poor and may affect the normal operation of the motherboard.

[0005] Therefore, we propose a low power consumption computer motherboard. Utility Model Content

[0006] In view of the deficiencies of the prior art, the utility model provides a low-power computer motherboard, which solves the problem that the prior device is difficult to dissipate heat for a motherboard with an uneven bottom according to demand, has poor heat dissipation effect and thus has high power consumption.

[0007] To achieve the above purpose, the utility model is implemented through the following technical solutions: a low-power computer motherboard, comprising a motherboard, a limit assembly is sleeved on the outer side of the motherboard, and a heat conduction assembly is arranged at the bottom of the limit assembly;

[0008] The limit assembly is composed of two sets of upper and lower clamping edges and side sleeves on their outer sides, and a heat conduction assembly is arranged at the bottom of the bottom clamping edge;

[0009] The heat-conducting assembly includes two sets of side panels located opposite to each other, the tops of the side panels are fixedly connected to the bottom surfaces of the card edges, a heat-conducting sheet is arranged between the two sets of card edges, and heat-conducting strips distributed at intervals are fixedly installed on the bottom sides of the two sets of side panels.

[0010] Preferably, the card edges are made of heat-conducting material, a board slot is provided between two groups of the card edges, and the main board is clamped between the board slots;

[0011] The setting of the card edge can directly contact the outer edge of the mainboard from both the top and bottom sides, thereby exporting the heat therein and achieving the effect of efficient heat dissipation.

[0012] Preferably, the side cover is made of soft plastic material;

[0013] Among them, the side cover can adjust the position of the two sets of card edges according to the required deformation, so as to facilitate it to be installed on the edge side of the mainboard to ensure the assembly effect.

[0014] Preferably, the thickness of the side panels gradually decreases from top to bottom;

[0015] Among them, the setting with thinner side panels has a lower weight and is suitable for assembly.

[0016] Preferably, the heat conducting sheet is a wavy sheet, and the top surface of the heat conducting sheet is arranged 1CM below the bottom surface of the main board;

[0017] Among them, the wavy setting of the heat conducting sheet can increase the top side area and achieve better heat conduction effect.

[0018] Preferably, the two ends of the heat-conducting assembly are fixedly connected to the left and right sets of side plates, and the heat-conducting strips are arranged as vertical strips and inclined strips;

[0019] Among them, the provision of the heat-conducting strip increases the contact area with the airflow, further increasing the heat dissipation effect.

[0020] The utility model provides a low-power computer mainboard, which has the following beneficial effects:

[0021] The low-power computer motherboard, through the arrangement of the limiting component and the heat-conducting component, can use the limiting component to assemble the heat-conducting component on the bottom side of the motherboard, and conduct the heat on the motherboard to the heat-conducting component through the clamping edge, and the arrangement of the heat-conducting sheet in the heat-conducting component can absorb the high-temperature heat generated by the peripheral side of the motherboard due to operation, and the contact area with the air flow is increased by the side plate and the heat-conducting sheet to ensure the heat dissipation effect, thereby solving the problem that the existing device is difficult to dissipate the heat of the motherboard with an uneven bottom according to the demand, and the heat dissipation effect is poor, thereby the power consumption is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the structure of the utility model;

[0023] Figure 2 It is a schematic diagram of the structure of the heat-conducting component of the utility model;

[0024] Figure 3It is a structural schematic diagram of the limit assembly of the utility model;

[0025] Figure 4 It is a structural schematic diagram of the bottom side of the heat conducting component of the utility model.

[0026] In the figure: 1. Main board; 2. Limiting assembly; 21. Card edge; 22. Side cover; 3. Heat conducting assembly; 31. Side panel; 32. Heat conducting sheet; 33. Heat conducting strip. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] See also Figure 1-4 The embodiment of the utility model provides a technical solution: a low-power computer motherboard, comprising a motherboard 1, a limit assembly 2 is sleeved on the outer side of the motherboard 1, and a heat-conducting assembly 3 is arranged at the bottom of the limit assembly 2; the limit assembly 2 is composed of two groups of upper and lower card edges 21 and side sleeves 22 on the outer side thereof, and a heat-conducting assembly 3 is arranged at the bottom of the bottom card edge 21; the heat-conducting assembly 3 comprises two groups of side panels 31 opposite to each other, the top of the side panels 31 is fixedly connected to the bottom surface of the card edge 21, a heat-conducting sheet 32 ​​is arranged between the two groups of card edges 21, and heat-conducting strips 33 distributed in an interval manner are fixedly installed on the bottom sides of the two groups of side panels 31;

[0029] Among them, the low-power computer motherboard, through the setting of the limiting component 2 and the heat-conducting component 3, can use the limiting component 2 to assemble the heat-conducting component 3 on the bottom side of the motherboard 1, and the heat on the motherboard 1 is conducted to the heat-conducting component 3 by the clamping edge 21, and the setting of the heat-conducting sheet 32 ​​in the heat-conducting component 3 can absorb the high-temperature heat generated by the side of the motherboard 1 due to work, and the side panel 31 and the heat-conducting sheet 32 ​​increase the contact area with the air flow to ensure the heat dissipation effect, which solves the problem that the existing device is difficult to dissipate the heat of the motherboard 1 with an uneven bottom according to the needs, and the heat dissipation effect is poor, resulting in high power consumption.

[0030] Embodiment 2:

[0031] The card edge 21 is made of heat-conducting material, a board slot is set between the two sets of card edges 21, and the main board 1 is clamped between the board slots; wherein, the card edge 21 is set to directly contact the outer edge of the main board 1 from both the top and bottom sides, thereby conducting heat therein and achieving the effect of efficient heat dissipation.

[0032] The side cover 22 is made of soft plastic material; wherein, the side cover 22 can be deformed to adjust the positions of the two sets of card edges 21 according to the needs, so as to facilitate the cover 22 to be mounted on the edge side of the mainboard 1 to ensure the assembly effect.

[0033] The thickness of the side panels 31 gradually decreases from top to bottom; the side panels 31 with a thinner thickness have a lower weight and are suitable for assembly.

[0034] The heat conducting sheet 32 ​​is a wavy sheet, and the top surface of the heat conducting sheet 32 ​​is arranged 1CM below the bottom surface of the mainboard 1; wherein, the wavy arrangement of the heat conducting sheet 32 ​​can increase the top side area, and the heat conducting effect is better.

[0035] Both ends of the heat-conducting assembly 3 are fixedly connected to the left and right side panels 31, and the heat-conducting strips 33 are arranged as vertical strips and inclined strips; wherein, the arrangement of the heat-conducting strips 33 increases the contact area with the airflow, further increasing the heat dissipation effect.

[0036] The working principle and use process of the utility model are as follows: when the device is required to work, the side sleeve 22 is twisted to clamp the board slot between the two sets of clamping edges 21 on the outer edge of the main board 1, so that the heat-conducting component 3 is on the bottom side of the main board 1, and the heat-conducting sheet 32 ​​in the heat-conducting component 3 absorbs the heat around the main board 1, and then the contact area between the heat-conducting strip 33 and the side plate 31 and the airflow is increased, thereby achieving the effect of efficient heat dissipation and reducing power consumption.

[0037] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0038] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A low-power computer motherboard, comprising a motherboard (1), characterized in that: A limiting component (2) is sleeved on the outer side of the main board (1), and a heat conducting component (3) is arranged at the bottom of the limiting component (2); The limiting component (2) is composed of two sets of upper and lower clamping edges (21) and side sleeves (22) on the outside thereof, and a heat conducting component (3) is arranged at the bottom of the bottom clamping edge (21); The heat-conducting assembly (3) comprises two sets of side panels (31) located opposite to each other, the top of each side panel (31) being fixedly connected to the bottom surface of the card edge (21), a heat-conducting sheet (32) being arranged between the two sets of card edges (21), and heat-conducting strips (33) distributed in an interval manner being fixedly installed on the bottom sides of the two sets of side panels (31).

2. A low-power computer motherboard according to claim 1, characterized in that: The card edges (21) are made of heat-conducting material, a board slot is provided between two groups of the card edges (21), and the main board (1) is clamped between the board slots.

3. A low power consumption computer motherboard according to claim 2, characterized in that: The side cover (22) is made of soft plastic material.

4. A low power consumption computer motherboard according to claim 1, characterized in that: The thickness of the side plate (31) gradually decreases from top to bottom.

5. A low power consumption computer motherboard according to claim 4, characterized in that: The heat conducting sheet (32) is a wavy sheet, and the top surface of the heat conducting sheet (32) is arranged 1 cm below the bottom surface of the main board (1).

6. A low power consumption computer motherboard according to claim 5, characterized in that: The two ends of the heat-conducting assembly (3) are fixedly connected to the left and right sets of side plates (31), and the heat-conducting strips (33) are arranged as vertical strips and inclined strips.

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