Heat dissipation shell and electronic equipment
By designing a heat dissipation shell including inner and outer shells, the cooling liquid circulation takes away heat, solving the problem of short service life and low reliability of the fan in the air-cooled cooling system, achieving a more efficient and stable heat dissipation effect.
Patent Information
- Application Number
- CN202420820056.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-19
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-04-19
AI Technical Summary
The existing air-cooled cooling systems have problems such as short fan service life, large noise and vibration, low reliability and poor natural wind reliability, which are difficult to meet the long-term stable and effective heat dissipation of electronic components.
A heat dissipation shell is designed, including an inner shell and an outer shell. The inner shell is arranged in the outer shell, and the gap is used as a cooling channel for the cooling liquid to flow. A liquid inlet and liquid outlet are arranged on the outer shell, and the cooling liquid circulation takes away the heat of the inner shell.
Through liquid-cooled heat dissipation method, the heat dissipation effect of electronic components is significantly improved, the contact area between the coolant and the heat dissipation shell is increased, the cooling structure is simplified, and the space utilization is improved. It has the advantages of high reliability, stable heat dissipation and long service life.
Smart Images

Figure CN222672736U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic components, and more specifically to a heat dissipation housing and an electronic device. Background Art
[0002] Conventional heat dissipation methods for electronic components such as inductors and transformers are mainly air-cooled, which uses a metal shell and heat dissipation fins, and uses fans or natural wind to remove heat. The disadvantages are obvious: as the core component of the air-cooled heat dissipation system, the fan often has a short service life. Due to long-term operation and the influence of the external environment, the fan blades and motors are prone to wear and aging, resulting in reduced heat dissipation effect or even complete failure. In addition, the reliability of the fan is also affected by its manufacturing quality and working environment. Once the fan fails, the entire heat dissipation system will be paralyzed and unable to effectively discharge heat. At the same time, there are some other problems with air-cooled heat dissipation. For example, when the fan is running, it will generate noise and vibration, which will have a certain impact on the stability and service life of electronic products. The reliability of natural wind is even more difficult to guarantee.
[0003] In summary, air cooling has many shortcomings and cannot meet the needs of electronic components for long-term stable, effective and low-cost heat dissipation. Especially for electronic components such as inductors and transformers in aluminum shells, since they generate a lot of heat during operation, if the heat dissipation effect is not good, it will not only affect their working effect, but also may cause downtime or even burnout.
[0004] Therefore, how to achieve reliable heat dissipation of electronic components has become a technical problem that needs to be solved urgently by those skilled in the art. Utility Model Content
[0005] In view of this, an object of the present invention is to provide a heat dissipation housing to achieve reliable heat dissipation of electronic components.
[0006] Another object of the present invention is to provide an electronic device comprising the heat dissipation housing.
[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0008] A heat dissipation housing, comprising:
[0009] An inner shell, in which the heat dissipation component is arranged;
[0010] The outer shell is provided with the inner shell inside the outer shell, and a gap is provided between the inner shell and the outer shell for serving as a cooling channel for circulating coolant. The outer shell is provided with a liquid inlet and a liquid outlet connected with the cooling channel.
[0011] Optionally, in the above heat dissipation shell, a first dividing rib is provided on one of the outer bottom wall of the inner shell and the inner bottom wall of the outer shell, and a first positioning groove for embedding the first dividing rib is provided on the other.
[0012] Optionally, in the above-mentioned heat dissipation housing, the cooling channel includes a first cooling channel, and the first cooling channel is connected to the liquid inlet and the liquid outlet;
[0013] The first dividing ribs include a plurality of first bottom ribs and a plurality of second bottom ribs, the first bottom ribs and the second bottom ribs are arranged alternately and at intervals so that the first cooling channel is formed between two adjacent first bottom ribs and the second bottom ribs, and the first bottom ribs and the second bottom ribs are staggered so that two adjacent first cooling channels are connected.
[0014] Optionally, in the above-mentioned heat dissipation shell, a second dividing rib is provided on one of the outer wall of the inner shell and the inner wall of the outer shell, and a second positioning groove for embedding the second dividing rib is provided on the other.
[0015] Optionally, in the above-mentioned heat dissipation housing, the cooling channel includes a second cooling channel, and the second cooling channel is communicated with the first cooling channel;
[0016] The second dividing ribs include a plurality of first side ribs and a plurality of second side ribs, the first side ribs and the second side ribs are arranged alternately and at intervals so that the second cooling channel is formed between two adjacent first side ribs and the second side ribs, and the first side ribs and the second side ribs are staggered so that two adjacent second cooling channels are connected.
[0017] Optionally, in the above-mentioned heat dissipation shell, the first dividing rib and the second dividing rib are both arranged on the inner shell.
[0018] Optionally, in the above-mentioned heat dissipation shell, a turbulent flow piece is provided on at least one of the outer wall of the inner shell and the inner wall of the outer shell, and the turbulent flow piece is located in the cooling channel.
[0019] Optionally, in the above-mentioned heat dissipation housing, the inner shell is made of metal, and the component to be heat-dissipated is arranged in the inner shell through an insulating member; or,
[0020] The material of the inner shell is an insulating material, and the heat dissipation component is arranged in the inner shell.
[0021] Optionally, in the above-mentioned heat dissipation housing, the component to be dissipated is used to be potted in the inner shell through thermal conductive silicone.
[0022] An electronic device comprises the above-mentioned heat dissipation housing.
[0023] The heat dissipation housing provided by the utility model comprises an inner shell and an outer shell, the heat dissipation component is used to be arranged in the inner shell, and the inner shell is arranged in the outer shell, a gap is formed between the inner shell and the outer shell, which is used as a cooling channel for the circulation of coolant, and the outer shell is provided with a liquid inlet and a liquid outlet connected to the cooling channel. The coolant can enter the cooling channel from the liquid inlet and flow out from the liquid outlet to realize the circulation of the coolant, the heat of the heat dissipation component can be conducted to the inner shell, and the heat of the inner shell can be taken away by the coolant during the circulation of the coolant, thereby playing the role of heat dissipation and cooling of the heat dissipation component.
[0024] The heat dissipation shell provided by the utility model realizes overall liquid cooling of the heat dissipation components by introducing coolant into the gap between the inner shell and the outer shell, which greatly increases the contact area between the heat dissipation shell and the coolant, and does not need to add additional coolant pipelines, simplifies the cooling structure of the product, improves space utilization, and has the advantages of high reliability, stable heat dissipation and long service life; compared with the existing air-cooled heat dissipation system, it can significantly improve the heat dissipation effect of the heat dissipation components, thereby allowing electronic components such as inductors to generate higher loss heat, and can allow the electrical density to be improved by reducing the cross-sectional area of the coils of electronic components such as inductors and transformers, reducing the volume of the magnetic core, so that the overall volume of the product is reduced, which is conducive to the miniaturization of the product and can reduce the product cost.
[0025] The electronic device provided by the utility model includes any one of the above-mentioned heat dissipation housings, so it also has the above-mentioned structure and beneficial effects. Other structures refer to the prior art and will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0027] Figure 1 The structure of the heat dissipation housing disclosed in the embodiment of the utility model is shown in FIG. Figure 1 ;
[0028] Figure 2 The structure of the heat dissipation housing disclosed in the embodiment of the utility model is shown in FIG. Figure 2 ;
[0029] Figure 3This is a schematic diagram of the structure of the outer shell disclosed in the embodiment of the utility model;
[0030] Figure 4 This is a schematic diagram of the structure of the inner shell disclosed in the embodiment of the utility model;
[0031] Figure 5 The cross-sectional structure of the heat dissipation housing disclosed in the embodiment of the utility model is shown in FIG. Figure 1 ;
[0032] Figure 6 The cross-sectional structure of the heat dissipation housing disclosed in the embodiment of the utility model is shown in FIG. Figure 2 .
[0033] Figure annotation:
[0034] 100 - outer shell; 101 - first side slot; 102 - second side slot; 103 - outer shell rib; 110 - liquid inlet pipe; 120 - liquid outlet pipe;
[0035] 200 - inner shell; 201 - first side rib; 202 - second side rib; 203 - turbulent element; 204 - partition; 205 - inner shell rib; 206 is the first dividing rib. DETAILED DESCRIPTION
[0036] The core of the utility model is to disclose a heat dissipation housing to achieve reliable heat dissipation of electronic components.
[0037] Another object of the present invention is to provide an electronic device comprising the heat dissipation housing.
[0038] The following describes the embodiments with reference to the accompanying drawings. In addition, the embodiments shown below do not limit the contents of the utility model described in the claims. In addition, the entire contents of the structures represented by the following embodiments are not limited to those necessary as solutions of the utility model described in the claims. It should be noted that, for ease of description, only the parts related to the utility model are shown in the accompanying drawings. In the absence of conflict, the embodiments in the utility model and the features in the embodiments can be combined with each other.
[0039] Combination Figure 1-Figure 6 The heat dissipation shell disclosed in the embodiment of the utility model includes an inner shell 200 and an outer shell 100. The heat dissipation component is used to be arranged in the inner shell 200, and the inner shell 200 is arranged in the outer shell 100. A gap is formed between the inner shell 200 and the outer shell 100, which is used as a cooling channel for the circulation of coolant. The outer shell 100 is provided with a liquid inlet and a liquid outlet connected to the cooling channel.
[0040] The coolant can enter the cooling channel from the liquid inlet and flow out from the liquid outlet to realize the circulation of the coolant. The heat of the heat dissipation component can be conducted to the inner shell 200. The heat of the inner shell 200 can be taken away by the coolant during the circulation of the coolant, thereby playing a role in dissipating heat and cooling the heat dissipation component.
[0041] The heat dissipation shell disclosed in the embodiment of the utility model realizes overall liquid cooling of the heat dissipation components by introducing coolant into the gap between the inner shell 200 and the outer shell 100, which greatly increases the contact area between the heat dissipation shell and the coolant, and does not need to add additional coolant pipelines, simplifies the cooling structure of the product, improves space utilization, and has the advantages of high reliability, stable heat dissipation, and long service life; compared with the existing air-cooled heat dissipation system, it can significantly improve the heat dissipation effect of the heat dissipation components, thereby allowing electronic components such as inductors to generate higher loss heat, and can allow the electrical density to be improved by reducing the cross-sectional area of the coils of electronic components such as inductors and transformers, reducing the volume of the magnetic core, so that the overall volume of the product is reduced, which is conducive to the miniaturization of the product and can reduce the product cost.
[0042] The material of the inner shell 200 can be metal or insulating material. When the inner shell 200 is made of metal materials such as copper, aluminum, and iron, it has the advantages of high strength and high thermal conductivity, which can enhance the heat dissipation effect. However, it needs to be insulated from electronic components such as inductors and transformers, that is, it is necessary to achieve insulation isolation between the components to be dissipated and the inner shell 200. Therefore, the components to be dissipated need to be arranged in the inner shell 200 through insulating parts (such as rubber gaskets, thermal interface materials, etc.). It can be understood that since some electronic components have packaging shells made of insulating materials such as plastic, the setting of insulating parts can be cancelled at this time.
[0043] When the inner shell 200 is made of insulating materials such as plastic, rubber, thermally conductive ceramics, etc., the heat dissipation components can be directly disposed in the inner shell 200 without additional insulating components. The outer shell 100 can be made of the same or different materials as the inner shell 200.
[0044] The components to be cooled are preferably potted in the inner shell 200 by thermally conductive silicone. The thermal conductivity of thermally conductive silicone is higher than that of air, and can effectively increase the heat exchange area between the inner shell 200 and the components to be cooled. Correspondingly, the effective heat dissipation area between the coolant and the inner shell 200 can be increased, thereby improving the heat exchange efficiency and greatly enhancing the heat dissipation effect.
[0045] According to a further optimization scheme, the heat dissipation shell disclosed in the embodiment of the utility model also includes a temperature averaging plate arranged on the inner bottom wall of the inner shell 200 (that is, the bottom wall inside the inner shell 200), and the components to be dissipated are arranged on the temperature averaging plate. The temperature averaging plate can effectively improve the thermal conductivity between the components to be dissipated and the inner shell 200.
[0046] In some embodiments, the above-mentioned temperature equalizing plate is an insulating temperature equalizing plate with its own insulation function, which can insulate and isolate the heat dissipation component and the inner shell 200 during the process of achieving efficient heat conduction, thereby eliminating the setting of the insulating part.
[0047] See also Figure 3 and Figure 4 In one embodiment, the main body of the inner shell 200 and the main body of the outer shell 100 are both open-topped, regular cubic structures to facilitate production and assembly, and the size of the outer shell 100 is larger than that of the inner shell 200, so that the inner shell 200 can be assembled into the outer shell 100, and the above-mentioned gap is left between the inner shell 200 and the outer shell 100 to form a cooling channel. An inner shell rib 205 is arranged around the outer periphery of the top opening of the inner shell 200, and an outer shell rib 103 is arranged around the outer periphery of the top of the outer shell 100. After the inner shell 200 and the outer shell 100 are assembled, the inner shell rib 205 and the outer shell rib 103 can be attached to each other and sealed to prevent leakage in the cooling channel.
[0048] A first dividing rib 206 is provided on one of the outer bottom wall (external side wall) of the inner shell 200 and the inner bottom wall (internal side wall) of the outer shell 100, and a first positioning slot for the first dividing rib 206 to be inserted is provided on the other. The inner shell 200 and the outer shell 100 can be positioned and matched by the first dividing rib 206 and the second positioning slot.
[0049] In order to allow the coolant to pass through the outer surface of the inner shell 200 with the maximum distance, that is, to allow the coolant to pass around the components to be dissipated with the maximum distance, the specific cooling path of the cooling channel can be planned by adjusting the position and structure of the first dividing rib 206, so as to improve the heat exchange effect by extending the length of the cooling channel. Specifically, a continuous closed loop can be formed through the tight snap-fitting of the first dividing rib 206 and the first positioning slot to allow the coolant to flow, thereby simplifying the cooling structure of the product and improving space utilization.
[0050] In one embodiment, the cooling channel includes a first cooling channel, the first cooling channel is connected to the liquid inlet and the liquid outlet, the first dividing rib 206 includes a plurality of first bottom ribs and a plurality of second bottom ribs, the first bottom ribs and the second bottom ribs are arranged alternately and at intervals, so that a first cooling channel is formed between two adjacent first bottom ribs and the second bottom ribs, and the first bottom ribs and the second bottom ribs are arranged in a staggered manner so that two adjacent first cooling channels are connected. The bottom of the inner shell 200 is a part with a larger contact area with the heat dissipation component and more heat conduction. The arrangement of the first dividing rib 206 forms a serpentine channel at the bottom of the heat dissipation shell, which enables the coolant to fully exchange heat with the bottom position of the inner shell 200, thereby enhancing the heat exchange effect.
[0051] Specifically, the liquid inlet and the liquid outlet are respectively communicated with the head end and the tail end of the serpentine channel.
[0052] Furthermore, combined with Figure 3 and Figure 4 A second dividing rib is provided on one of the outer wall of the inner shell 200 and the inner wall of the outer shell 100, and a second positioning slot for embedding the second dividing rib is provided on the other. The inner shell 200 and the outer shell 100 can be positioned and matched by the snap connection between the second dividing rib and the second positioning slot, and the specific cooling path of the cooling channel on the side wall of the heat dissipation shell can be planned by setting the position and structure of the second dividing rib.
[0053] Specifically, in one embodiment, the cooling channel includes a second cooling channel, and the second cooling channel is connected to the first cooling channel; the second dividing rib includes a plurality of first side ribs 201 and a plurality of second side ribs 202, and the first side ribs 201 and the second side ribs 202 are arranged alternately and at intervals, so that a second cooling channel is formed between two adjacent first side ribs 201 and the second side ribs 202, and the first side ribs 201 and the second side ribs 202 are staggered so that two adjacent second cooling channels are connected, see Figure 4 By disposing the first side ribs 201 and the second side ribs 202, the second cooling channel presents a serpentine channel structure, which greatly extends the cooling path of the coolant.
[0054] In order to correspond to the first side rib 201 and the second side rib 202 respectively, the second positioning slot 101 includes a first side slot 101 and a second side slot 102, so as to respectively allow the first side rib 201 and the second side rib 202 to be embedded. It can be understood that if the first side rib 201 and the second side rib 202 are defined to have the same extension length, and one end of the first side rib 201 is in contact with the inner shell rib 205, and the other end has a first gap with the bottom wall of the outer shell 100, one end of the second side rib 202 has a second gap with the inner shell rib 205, and the other end has a second gap with the outer shell 10 0, the first gap and the second gap are used to connect two adjacent second cooling channels, then the first side slot 101 and the second side slot 102 are both through-set at one end close to the shell retaining edge 103, the extension length of the second side slot 102 is greater than the first side slot 101, and the distance difference between the first side slot 101 and the second side slot 102 is the offset distance of the first side rib 201 and the second side rib 202, so as to ensure that the first side rib 201 and the second side rib 202 can be respectively inserted into the first side slot 101 and the second side slot 102 during installation and slidably installed to the preset positions.
[0055] The liquid inlet and the liquid outlet are usually arranged on the side wall of the outer shell 100. The liquid inlet and the liquid outlet can be arranged on the same side wall or different side walls of the outer shell 100. Figure 1 The same side wall shown can reduce space occupancy while facilitating the layout of the heat dissipation housing, and facilitates communication with the second cooling channel. At the same time, the second cooling channel can be arranged around the circumference of the heat dissipation housing, so that the coolant has a longer heat exchange path.
[0056] It is understandable that the number of the first bottom rib, the second bottom rib, the first side rib 201 and the second side rib 202 or the width of the first cooling channel and the second cooling channel can be adjusted according to actual conditions to adjust the overall length of the cooling channel.
[0057] It is understandable that the order in which the first cooling channels and the second cooling channels are connected in sequence is not limited, see Figure 4 In one embodiment, the side of the heat dissipation shell on which the liquid inlet is provided is defined as the first side, the side of the heat dissipation shell opposite to the first side is defined as the second side, and the other two opposite sides are defined as the third side and the fourth side, respectively. The liquid outlet is provided on the first side of the liquid inlet, and the cooling channel on the first side of the heat dissipation shell corresponding to the liquid inlet and the liquid outlet is completely separated by a partition 204 to avoid mutual influence between the inlet and outlet of the coolant.
[0058] After the coolant enters through the liquid inlet, it first flows in the second cooling channel on the first side of the heat dissipation shell connected to the liquid inlet, and sequentially enters the second cooling channel on the third side of the heat dissipation shell, a part of the second cooling channel on the second side of the heat dissipation shell, and the first cooling channel located at the bottom of the heat dissipation shell. After heat exchange, it flows out from another part of the second cooling channel on the second side of the heat dissipation shell, and then sequentially passes through the second cooling channel on the fourth side of the heat dissipation shell, and the second cooling channel on the first side of the heat dissipation shell connected to the liquid outlet, until it flows out from the liquid outlet, completing a cooling cycle.
[0059] The arrangement of the cooling channels enables the coolant to fully exchange heat with all side surfaces and the bottom surface of the inner shell 200, thereby ensuring the heat exchange effect.
[0060] According to the actual arrangement of the cooling channel, the number of the liquid inlet and the liquid outlet can also be multiple. The liquid inlet and the liquid outlet can be connected to the liquid inlet and the liquid outlet, respectively, so as to facilitate the connection with the coolant supply device through the pipeline. The heat dissipation housing disclosed in this embodiment is not only compact in structure, but also has high reliability, good heat dissipation effect, can be used for a long time, and can effectively reduce costs.
[0061] It can be understood that, compared with being arranged on the inner wall of the outer shell 100, the second dividing rib and the first dividing rib 206 are preferably arranged on the inner shell 200, which is easier to install and produce.
[0062] Further, see Figure 5 and Figure 6 A turbulent element 203 is provided on at least one of the outer wall of the inner shell 200 and the inner wall of the outer shell 100, and the turbulent element 203 is located in the cooling channel, which can disturb the coolant in the cooling channel and enhance the heat dissipation effect.
[0063] Specifically, the turbulence piece 203 can be a raised block-shaped structural piece, and is arranged on the inner shell 200 or the outer shell 100 by welding, bonding, integral molding, etc. Those skilled in the art can understand that the turbulence piece 203 can also be a groove arranged on the inner shell 200 or the outer shell 100, which can also have the effect of turbulence, but for the inner shell 200, in order to facilitate heat conduction, it is usually a thin-walled piece, and for the outer shell 100, in order to reduce the structural weight, it is usually also a thin-walled piece. Therefore, it is a more preferred solution to set a raised block-shaped structural piece on the inner shell 200 or the outer shell 100 to perform turbulence.
[0064] There are usually multiple turbulence pieces 203, which are preferably arranged on the inner shell 200 to increase the heat exchange area between the inner shell 200 and the refrigerant and improve the heat dissipation effect. At the same time, the turbulence pieces 203 are arranged on the inner shell 200 to facilitate the demoulding production of the inner shell 200, and because the bottom wall of the inner shell 200 is the main heat-conducting part in contact with the heat-dissipating component, the turbulence pieces 203 are preferably arranged on the bottom wall of the inner shell 200 to facilitate heat conduction.
[0065] The utility model also discloses an electronic device, which includes any one of the above-mentioned heat dissipation housings, and thus also has the above-mentioned structure and beneficial effects. Other structures refer to the prior art and are not described in detail herein.
[0066] In one embodiment, the electronic device has a plurality of functional modules, each of which is disposed in a different heat dissipation housing in a one-to-one correspondence, and the cooling channels of each heat dissipation housing are connected in parallel to the same coolant supply circuit.
[0067] The above description of the disclosed embodiments enables professionals and technicians in the field to implement or use the utility model. Various modifications to these embodiments will be obvious to professionals and technicians in the field, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the utility model. The specific technical means in some embodiments can be combined in part or in whole into another embodiment without being explicitly excluded by another embodiment. Therefore, the utility model will not be limited to the embodiments shown in this article, but will conform to the widest range consistent with the principles and novel features disclosed herein.
Claims
1. A heat dissipation housing, characterized in that: include: An inner shell (200), wherein the heat dissipation component is arranged in the inner shell (200); An outer shell (100), the inner shell (200) being arranged inside the outer shell (100), and a gap being provided between the inner shell (200) and the outer shell (100) for serving as a cooling channel for the circulation of cooling liquid, and a liquid inlet and a liquid outlet being provided on the outer shell (100) and communicating with the cooling channel.
2. The heat dissipation housing according to claim 1, characterized in that: A first dividing rib (206) is provided on one of the outer bottom wall of the inner shell (200) and the inner bottom wall of the outer shell (100), and a first positioning slot for embedding the first dividing rib (206) is provided on the other.
3. The heat dissipation housing according to claim 2, characterized in that: The cooling channel comprises a first cooling channel, wherein the first cooling channel is in communication with the liquid inlet and the liquid outlet; The first separation ribs (206) include a plurality of first bottom ribs and a plurality of second bottom ribs, the first bottom ribs and the second bottom ribs are arranged alternately and at intervals, so that the first cooling channel is formed between two adjacent first bottom ribs and the second bottom ribs, and the first bottom ribs and the second bottom ribs are arranged in a staggered manner so that two adjacent first cooling channels are connected.
4. The heat dissipation housing according to claim 3, characterized in that: A second dividing rib is provided on one of the outer side wall of the inner shell (200) and the inner side wall of the outer shell (100), and a second positioning slot for embedding the second dividing rib is provided on the other.
5. The heat dissipation housing according to claim 4, characterized in that: The cooling channel includes a second cooling channel, the second cooling channel is in communication with the first cooling channel; The second dividing ribs include a plurality of first side ribs (201) and a plurality of second side ribs (202); the first side ribs (201) and the second side ribs (202) are arranged alternately and at intervals, so that the second cooling channel is formed between two adjacent first side ribs (201) and second side ribs (202); the first side ribs (201) and the second side ribs (202) are arranged in a staggered manner, so that two adjacent second cooling channels are connected.
6. The heat dissipation housing according to claim 5, characterized in that: The first dividing rib (206) and the second dividing rib are both arranged on the inner shell (200).
7. The heat dissipation housing according to any one of claims 1 to 6, characterized in that: A turbulent flow piece (203) is provided on at least one of the outer wall of the inner shell (200) and the inner wall of the outer shell (100), and the turbulent flow piece (203) is located in the cooling channel.
8. The heat dissipation housing according to any one of claims 1 to 6, characterized in that: The material of the inner shell (200) is metal, and the component to be heat-dissipated is arranged in the inner shell (200) via an insulating member; or, The material of the inner shell (200) is an insulating material, and the component to be cooled is arranged in the inner shell (200).
9. The heat dissipation housing according to claim 8, characterized in that: The component to be cooled is used to be potted in the inner shell (200) by means of heat-conducting silica gel.
10. An electronic device, characterized in that: It comprises a heat dissipation housing as described in any one of claims 1 to 9.