Wafer coating machine

Abstract

The utility model relates to the technical field of wafer coating machines, and discloses a wafer coating machine which comprises a box body, a fixing frame is fixedly connected to the bottom end in the box body, a first electric push rod is fixedly connected to the interior of the fixing frame, a fixing plate is fixedly connected to the output end of the first electric push rod, and a connecting frame is fixedly connected to the top end of the box body. A fixing plate is arranged at the top end of the fixing frame, a connecting frame is arranged in the fixing plate, a sliding plate is rotatably connected into the connecting frame, the outer wall of the sliding plate is slidably connected with the connecting frame, and a fan is fixedly connected to the left side of the outer wall of the box body. The wafer coating device has the advantages that a wafer needing to be coated is placed at the top end of the fixing frame, and a first electric push rod is started to push the fixing plate to slide along a sliding rod; according to the wafer coating device, the wafer can be conveniently clamped, the diameter of the wafer can be adjusted, the fan is started to blow outside air into the box body for dust removal, impurity removal can be conveniently carried out on the surface of the wafer needing to be coated, and incomplete coating caused by impurities on the surface of the wafer is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer coating machines, in particular to a wafer coating machine. Background Art

[0002] Microelectronic devices are becoming increasingly miniaturized, and packaging technology is gradually transitioning to WLCSP. In the wafer-level chip size packaging of microelectronic devices, such as CMOS image sensors, MEMS and other micro devices, it is necessary to seal and protect their functional parts. The general practice is to first use photoresist to photolithography on a glass wafer of the same size as the silicon wafer to create a cavity with a certain height and the same size as the chip's outer contour, and then coat a very thin layer of epoxy resin film on the thin wall of the cavity, and then accurately align the coated glass wafer and silicon wafer in the alignment machine, and finally bond them in the bonding machine to complete the packaging.

[0003] According to the description in the Wafer-Level Chip Packaging Epoxy Resin Film Coating Station (authorization announcement number: CN201374317Y) disclosed on the patent website, "The utility model discloses a wafer-level chip packaging epoxy resin film coating station, including a lifting mechanism, which is movably arranged in the coating station, and based on the use direction: a plurality of ejector pins are formed on the upper part of the lifting mechanism, and the ejector pins can be arranged through the upper end surface of the coating station; a group of guide rails are arranged on the coating station, and the ejector pins are located between the guide rails. When in use, the wafer is placed on the coating station. On the coating table, the roller coated with glue slides along the guide rail to coat the epoxy resin on the surface of the wafer; after the wafer is coated with glue, the wafer can be easily rotated or removed by lifting the wafer with the help of the lifting mechanism. The loading table may also include an area greater than or equal to the area of ​​the wafer-level chip to be coated, the loading table is movably positioned in the upper part of the coating table, the lifting mechanism is movably arranged in the coating table and the loading table, the lifting pin can be arranged through the loading table, the loading table is located between the guide rails, and when in use, the wafer is placed on the loading table.

[0004] In view of the above description, the applicant believes that there are the following problems:

[0005] The existing wafer coating machine is not convenient for removing impurities from the wafers to be coated, resulting in uneven coating, and is not convenient for adjusting the fixed clamping according to the size of the wafer. Therefore, it is necessary to improve a wafer coating machine to solve the above problems. Utility Model Content

[0006] In view of the above-mentioned deficiencies in the prior art, the utility model provides a wafer coating machine, which has a stable structure and can stably clamp the wafers to be processed, thereby facilitating the cleaning of the wafers to be coated.

[0007] In order to achieve the above utility model purpose, the technical solution adopted by the utility model is:

[0008] A wafer coating machine comprises a box body, wherein the bottom end of the box body is fixedly connected to a fixing frame, the fixing frame is fixedly connected to a first electric push rod, the output end of the first electric push rod is fixedly connected to a fixing plate, the top end of the box body is fixedly connected to a connecting frame, a slide is rotatably connected to the connecting frame, the outer wall of the slide is slidably connected to the connecting frame, a fan is fixedly connected to the left side of the outer wall of the box body, the output end of the fan is fixedly connected to an air pipe, the top end of the fan is fixedly connected to a material box, the box body is fixedly connected to a material pump, the output end of the material pump is fixedly connected to a material pump, the output end of the material pump is fixedly connected to a material pipe, and one end of the material pipe is fixedly penetrated by a spray head.

[0009] As an improvement, a slide groove is provided inside the fixing frame, a sliding block is slidably connected inside the slide groove, and a fixing plate is fixedly connected to the outer wall of the sliding block.

[0010] As an improvement, a sliding rod is fixedly connected inside the fixing frame, and a fixing plate is slidably connected to the outer wall of the sliding rod.

[0011] As an improvement, a trachea is fixedly connected to the left side of the top end of the fixing frame.

[0012] As an improvement, a motor is fixedly connected to the right side of the outer wall of the box body, and a lead screw is fixedly connected to the output end of the motor.

[0013] As an improvement, a rotating shaft is fixedly connected to the top of the material box, and a box cover is rotatably connected to the outer wall of the rotating shaft.

[0014] As an improvement, the bottom end of the slide plate is fixedly connected to a second electric push rod, and the output end of the second electric push rod is rotatably connected to a coating roller.

[0015] Compared with the prior art, the utility model has the following advantages: by placing the wafer to be coated on the top of the fixing frame, the fixing plate is pushed to slide along the sliding rod by starting the first electric push rod, so that the wafer can be clamped conveniently, and the adjustment can be made according to the diameter of the wafer, and the outside air is blown into the box body for dust removal by starting the fan, so that the surface of the wafer to be coated can be cleaned of impurities, and incomplete coating caused by the presence of impurities on the wafer surface can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a main perspective schematic diagram of a wafer coating machine of the utility model;

[0017] Figure 2 This is a schematic diagram of the internal cross-sectional structure of a wafer coating machine of the utility model;

[0018] Figure 3 The utility model is a wafer coating machine Figure 2 Schematic diagram of the local enlarged structure at point A in the middle.

[0019] Reference table of reference numerals:

[0020] 1. Box body; 2. Fixed frame; 3. First electric push rod; 4. Fixed plate; 5. Slide rod; 6. Sliding block; 7. Rubber pad; 8. Fan; 9. Material box; 10. Material pump; 11. Material pipe; 12. Spray head; 13. Rotating shaft; 14. Box cover; 15. Air pipe; 16. Connecting frame; 17. Screw rod; 18. Slide plate; 19. Second electric push rod; 20. Coating roller; 21. Motor; 22. Slide chute. DETAILED DESCRIPTION

[0021] The specific implementation of the utility model is further described below in conjunction with the accompanying drawings.

[0022] like Figure 1-3 As shown, a wafer coating machine comprises a box body 1, wherein a fixing frame 2 is fixedly connected to the bottom end of the box body 1, a first electric push rod 3 is fixedly connected to the inside of the fixing frame 2, a fixing plate 4 is fixedly connected to the output end of the first electric push rod 3, a connecting frame 16 is fixedly connected to the top of the box body 1, a slide plate 18 is rotatably connected to the connecting frame 16, an outer wall of the slide plate 18 is slidably connected to the connecting frame 16, a fan 8 is fixedly connected to the left side of the outer wall of the box body 1, an air pipe 15 is fixedly connected to the output end of the fan 8, a material box 9 is fixedly connected to the top of the fan 8, and the box A material pump 10 is fixedly connected to the inside of the box 1, and a material pump 10 is fixedly connected to the output end of the material pump 10, and a material pipe 11 is fixedly connected to the output end of the material pump 10, and a spray head 12 is fixedly passed through one end of the material pipe 11. By placing the wafer to be coated on the top of the fixed frame 2, the first electric push rod 3 is started to push the fixed plate 4 to slide along the slide rod 5, so as to facilitate clamping the wafer, and by starting the fan 8 to blow the outside air into the inside of the box 1 for dust removal, it is convenient to remove impurities on the surface of the wafer to be coated, so as to avoid incomplete coating caused by the appearance of debris on the surface of the wafer.

[0023] The fixing frame 2 is provided with a slide groove 22 inside, a slider 6 is slidably connected inside the slide groove 22, a fixing plate 4 is fixedly connected to the outer wall of the slider 6, a sliding rod 5 is fixedly connected inside the fixing frame 2, and a fixing plate is slidably connected to the outer wall of the sliding rod 5. By placing the wafer to be coated on the top of the fixing frame 2, the first electric push rod 3 is started to push the fixing plate 4 to slide along the sliding rod 5, so that the wafer can be clamped easily, and it can be adjusted according to the diameter of the wafer 4.

[0024] An air pipe 15 is fixedly connected to the left side of the top of the fixed frame 2, a motor 21 is fixedly connected to the right side of the outer wall of the box body 1, a screw rod 17 is fixedly connected to the output end of the motor 21, a rotating shaft 13 is fixedly connected to the top of the material box 9, a box cover 14 is rotatably connected to the outer wall of the rotating shaft 13, a second electric push rod 19 is fixedly connected to the bottom end of the slide plate 18, a coating roller 20 is rotatably connected to the output end of the second electric push rod 19, the motor 21 is started to drive the screw rod 17 to rotate, the screw rod 17 pushes the slide plate 18 to slide inside the connecting frame 16 and pushes the coating roller 20 to move, the second electric push rod 19 is started to push the coating roller 20 to move downward to contact the wafer to be coated, and the coating roller 20 is electrically pushed to move, so that the wafer can be coated repeatedly.

[0025] When the utility model is working, the wafer to be coated is first placed on the top of the fixing frame 2, and the fixing plate 4 is pushed to slide along the sliding rod 5 by starting the first electric push rod 3, so that the wafer can be clamped and can be adjusted according to the diameter of the wafer. The outside air is blown into the box body 1 by starting the fan 8 to remove dust, so that the surface of the wafer to be coated can be cleaned and impurities can be removed to avoid the appearance of impurities on the surface of the wafer causing incomplete coating. The material inside the material box 9 is introduced into the material pipe 11 and the spray head 12 by starting the material pump 10, so as to load the coating roller 20. The screw rod 17 is driven to rotate by starting the motor 21, and the screw rod 17 pushes the slide plate 18 to slide inside the connecting frame 16 and pushes the coating roller 20 to move. The coating roller 20 is pushed downward to contact the wafer to be coated by starting the second electric push rod 19, and the coating roller 20 is pushed to move electrically, so that the wafer can be coated repeatedly.

[0026] The above description is only a preferred embodiment of the present utility model patent and is not intended to limit the present utility model patent. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model patent shall be included in the protection scope of the present utility model patent.

Claims

1. A wafer coating machine, comprising a housing (1), characterized in that: The bottom end of the box body (1) is fixedly connected to a fixing frame (2), the fixing frame (2) is fixedly connected to a first electric push rod (3), the output end of the first electric push rod (3) is fixedly connected to a fixing plate (4), the top end of the box body (1) is fixedly connected to a connecting frame (16), a slide plate (18) is rotatably connected to the connecting frame (16), the outer wall of the slide plate (18) is slidably connected to the connecting frame (16), a fan (8) is fixedly connected to the left side of the outer wall of the box body (1), the output end of the fan (8) is fixedly connected to an air pipe (15), the top end of the fan (8) is fixedly connected to a material box (9), the box body (1) is fixedly connected to a material pump (10), the output end of the material pump (10) is fixedly connected to the material pump (10), the output end of the material pump (10) is fixedly connected to a material pipe (11), and one end of the material pipe (11) is fixedly penetrated by a spray head (12).

2. A wafer coating machine according to claim 1, characterized in that: A sliding groove (22) is provided inside the fixing frame (2), a sliding block (6) is slidably connected inside the sliding groove (22), and a fixing plate (4) is fixedly connected to the outer wall of the sliding block (6).

3. A wafer coating machine according to claim 1, characterized in that: The interior of the fixed frame (2) is fixedly connected with a sliding rod (5), and the outer wall of the sliding rod (5) is slidably connected with a fixing plate (4).

4. The wafer coating machine according to claim 1, characterized in that: The left side of the top end of the fixing frame (2) is fixedly connected with an air pipe (15).

5. The wafer coating machine according to claim 1, characterized in that: A motor (21) is fixedly connected to the right side of the outer wall of the box body (1), and a lead screw (17) is fixedly connected to the output end of the motor (21).

6. The wafer coating machine according to claim 1, characterized in that: The top of the material box (9) is fixedly connected to a rotating shaft (13), and the outer wall of the rotating shaft (13) is rotatably connected to a box cover (14).

7. The wafer coating machine according to claim 1, characterized in that: The bottom end of the slide plate (18) is fixedly connected to a second electric push rod (19), and the output end of the second electric push rod (19) is rotatably connected to a coating roller (20).

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