Semiconductor chip packaging lead glue sealing device

Abstract

The utility model discloses a semiconductor chip packaging lead glue sealing device which comprises a bottom plate, a stepping motor is fixedly arranged at the upper end of the bottom plate, the stepping motor is in power connection with a rotating shaft, the rotating shaft is fixedly connected with a rotating disc, four mounting grooves are formed in the side wall of the rotating disc, connecting rods can be connected and mounted in the mounting grooves, and the connecting rods are fixedly connected with a connecting plate. A plurality of lifters are fixedly arranged at the lower end of the connecting plate and are in power connection with lifting rods, the lifting rods are fixedly connected with a glue sealing shell, a glue sealing cavity is formed in the glue sealing shell, four mounting plates are fixedly connected to the upper end face of the glue sealing shell, expansion pieces are fixedly arranged on the mounting plates and are in power connection with telescopic rods, and the telescopic rods are in threaded connection with fixed arc-shaped blocks. The glue shell is arranged on the upper side of the bottom plate, the glue cavity is formed in the glue shell, the semiconductor lead enters the glue cavity and can be sealed, the electric heater is arranged on the upper side of the bottom plate and can be dried, and then lead sealing work before semiconductor chip packaging is completed.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor chip packaging, in particular to a semiconductor chip packaging lead wire sealing device. Background Art

[0002] Before semiconductor chip packaging, the diode leads that make up the semiconductor need to be sealed with glue. In the existing sealing process, the leads are often repeatedly contacted between multiple sealing teeth on the sealing rack, so that the glue located on the sealing teeth is applied to the leads. However, in the above-mentioned sealing process, the leads will also produce friction with the sealing teeth while being glued, which may cause the leads to bend; at the same time, since the uniformity of the glue distribution on the sealing teeth is difficult to ensure, and since the diode leads need to be heated and dried after sealing, during the sealing and heating process, the leads and the glue are easily affected by external dust. If multiple leads are sealed at the same time, they are easy to interfere with each other, resulting in insufficient glue adhesion, and the use of the glue is also relatively wasteful. During the drying process, it is also difficult to dry evenly. Utility Model Content

[0003] The utility model aims to provide a semiconductor chip packaging lead sealing device to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor chip packaging lead sealing device, comprising a bottom plate, a stepper motor is fixedly provided on the upper end of the bottom plate, the stepper motor is powered by a rotating shaft, the rotating shaft is fixedly connected to a rotating disk, the rotating disk side wall is provided with four circumferentially distributed mounting grooves, the mounting grooves can be connected with mounting connecting rods, the connecting rods are fixedly connected to a connecting plate, a plurality of lifters are fixedly provided at the lower end of the connecting plate, the lifters are powered by a lifting rod, the lifting rods are fixedly connected to a sealing shell, a sealing cavity with a lower opening is provided in the sealing shell, a through groove is provided in the upper end wall of the sealing cavity, four circumferentially distributed mounting plates are fixedly connected to the upper end surface of the sealing shell, the mounting plate is fixedly provided with a telescope, the telescope is powered by a telescopic rod, the telescopic rod is threadedly connected to a fixed arc block, the fixed arc block can fix the semiconductor, and then keep the semiconductor leads in the sealing cavity;

[0005] A glue shell is provided on the upper side of the bottom plate, and a glue cavity with an upper opening is provided in the glue shell. The sealing cavity and the semiconductor leads in the sealing cavity enter the glue cavity, and can be sealed with the glue in the glue cavity. An electric heater is provided on the upper side of the bottom plate, and the semiconductor leads stained with glue can be dried by entering the sealing cavity through the electric heater, thereby completing the lead sealing work before semiconductor chip packaging.

[0006] A connecting ring is fixedly connected to the upper end of the bottom plate, and the connecting ring can be threadedly connected to a liquid receiving shell, and a storage cavity for storing excess glue is provided in the liquid receiving shell.

[0007] The upper end surface of the liquid receiving shell is detachably fixedly connected to the electric heater.

[0008] A vacuum pump is fixedly arranged on the upper surface of the bottom plate, and the vacuum pump is connected to the electric heater through an extraction pipe. The vacuum pump is connected to an exhaust pipe, and water vapor can be extracted through the extraction pipe by the vacuum pump and discharged through the exhaust pipe, thereby accelerating the drying of semiconductor leads.

[0009] Compared with the prior art, the beneficial effects of the utility model are:

[0010] The utility model is provided with:

[0011] The upper side of the semiconductor chip can be fixed by the provided sealing shell, and the telescopic device, telescopic rod and fixed arc block provided at the upper end of the sealing shell, so as to fix the semiconductor chip and limit the position, so that the lead wires at the lower side of the semiconductor chip are in the sealing cavity, and the subsequent sealing work can be carried out;

[0012] The electric heater is provided to dry the leads of the semiconductor chip stained with glue. By drying in the sealing chamber, the influence of dust is avoided and the sealing effect is good. The vacuum pump and extraction pipe are provided to extract and discharge the water vapor generated during drying, thereby speeding up the sealing work and better encapsulating the semiconductor chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is an overall three-dimensional schematic diagram of a semiconductor chip packaging lead sealing device proposed in the utility model;

[0014] Figure 2 A three-dimensional schematic diagram of a semiconductor chip packaging lead sealing device proposed in the utility model from the right side;

[0015] Figure 3 A three-dimensional top view schematic diagram of a semiconductor chip packaging lead sealing device proposed in the utility model;

[0016] Figure 4 This is a schematic structural diagram of a sealing shell part in a semiconductor chip packaging lead sealing device proposed in the utility model;

[0017] Figure 5 for Figure 4 A top view of

[0018] In the figure: 101, bottom plate; 102, stepper motor; 103, rotating shaft; 104, rotating disk; 105, mounting groove; 106, connecting rod; 107, connecting plate; 108, lifter; 109, lifter; 111, glue sealing shell; 112, glue sealing cavity; 113, mounting plate; 114, telescopic device; 115, telescopic rod; 116, fixed arc block; 117, connecting ring; 118, liquid receiving shell; 119, electric heater; 122, extraction tube; 123, vacuum pump; 124, exhaust pipe; 125, glue shell; 126, glue cavity. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. Example

[0020] See also Figure 1-5 The utility model provides a technical solution: a semiconductor chip packaging lead sealing device, comprising a bottom plate 101, a stepper motor 102 is fixedly provided at the upper end of the bottom plate 101, the stepper motor 102 is connected to a rotating shaft 103, the rotating shaft 103 is fixedly connected to a rotating disk 104, the side wall of the rotating disk 104 is provided with four circumferentially distributed mounting grooves 105, the mounting grooves 105 can be connected to the mounting connecting rod 106, the connecting rod 106 is fixedly connected to a connecting plate 107, the lower end of the connecting plate 107 is fixedly provided with a plurality of lifters 108, the lifters 108 The lifting rod 109 is connected to the power, and the lifting rod 109 is fixedly connected to the sealing shell 111. The sealing shell 111 is provided with a sealing cavity 112 with a lower opening, and the upper end wall of the sealing cavity 112 is provided with a through groove. The upper end surface of the sealing shell 111 is fixedly connected with four circumferentially distributed mounting plates 113, and the mounting plate 113 is fixedly provided with a telescope 114. The telescope 114 is connected to the power with a telescopic rod 115, and the telescopic rod 115 is threadedly connected with a fixed arc block 116. The fixed arc block 116 can fix the semiconductor, and then keep the semiconductor lead in the sealing cavity 112;

[0021] A glue shell 125 is provided on the upper side of the base plate 101, and a glue cavity 126 with an upper opening is provided in the glue shell 125. The sealing cavity 112 and the semiconductor leads in the sealing cavity 112 enter the glue cavity 126, and can be sealed with the glue in the glue cavity 126. An electric heater 119 is provided on the upper side of the base plate 101, and the semiconductor leads covered with glue can be dried by entering the sealing cavity 112 through the electric heater 119, thereby completing the lead sealing work before semiconductor chip packaging.

[0022] A connecting ring 117 is fixedly connected to the upper end of the bottom plate 101 , and a liquid receiving shell 118 can be threadedly connected to the connecting ring 117 . A storage cavity for storing excess glue is provided in the liquid receiving shell 118 .

[0023] The upper end surface of the liquid receiving shell 118 is detachably fixedly connected to the electric heater 119 .

[0024] An exhaust pump 123 is fixedly provided on the upper end surface of the base plate 101. The exhaust pump 123 is connected to the electric heater 119 via an extraction pipe 122. The exhaust pump 123 is connected to an exhaust pipe 124. The exhaust pump 123 can extract water vapor through the extraction pipe 122 and discharge it through the exhaust pipe 124, thereby accelerating the drying of the semiconductor leads.

[0025] Working principle:

[0026] When in use, the upper end of the semiconductor chip to be packaged is placed into the sealing cavity 112, so that the upper end of the semiconductor passes through the upper through hole of the sealing cavity 112, and then the telescopic device 114 is started to drive the telescopic rod 115 to extend, thereby driving the four fixed arc blocks 116 to move toward the axis direction of the sealing cavity 112, thereby fixing the upper side of the semiconductor chip;

[0027] When the lead is sealed with glue, the rotating shaft 103 is started to drive the rotating disk 104 to rotate a quarter of a turn, thereby driving the connecting rod 106, the connecting plate 107 and the sealing shell 111 to rotate to the top of the glue cavity 126. At this time, the lifting device 108 is started to drive the lifting rod 109 to extend, thereby driving the sealing shell 111 and the leads of the semiconductor chip into the glue cavity 126, and the leads are stained with the glue in the glue cavity 126;

[0028] Then, the lifter 108 is started to drive the lifter rod 109 to retract, and the sealing shell 111 and the semiconductor chip leads are removed from the glue cavity 126. At this time, the stepper motor 102 is started to drive the rotating shaft 103 to rotate a quarter of a circle, and the connecting rod 106, the connecting plate 107 and the sealing shell 111 are driven to rotate to the top of the electric heater 119. At this time, the lifter 108 is started to drive the lifter rod 109 to extend, and then the sealing shell 111 and the semiconductor chip leads are driven to move downward, so that the electric heater 119 is located between the side wall of the sealing cavity 112 and the leads. At this time, the electric heater 119 is started to heat and dry the semiconductor leads and glue;

[0029] At the same time, the vacuum pump 123 is started to extract the water vapor generated by the electric heater 119 through the extraction pipe 122 and discharge it through the exhaust pipe 124 to speed up the drying speed, and the excess glue drips into the liquid receiving shell 118 for collection.

[0030] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip packaging lead sealing device, comprising a base plate (101), characterized in that: A stepper motor (102) is fixedly provided at the upper end of the bottom plate (101); the stepper motor (102) is motively connected to a rotating shaft (103); the rotating shaft (103) is fixedly connected to a rotating disk (104); a side wall of the rotating disk (104) is provided with four circumferentially distributed mounting grooves (105); a connecting rod (106) can be connected and installed in the mounting groove (105); the connecting rod (106) is fixedly connected to a connecting plate (107); a plurality of lifters (108) are fixedly provided at the lower end of the connecting plate (107); the lifters (108) are ) is dynamically connected to a lifting rod (109), the lifting rod (109) is fixedly connected to a sealing shell (111), a sealing cavity (112) with a lower opening is provided in the sealing shell (111), a through groove is provided in the upper end wall of the sealing cavity (112), the upper end surface of the sealing shell (111) is fixedly connected to four circumferentially distributed mounting plates (113), the mounting plate (113) is fixedly provided with a telescopic device (114), the telescopic device (114) is dynamically connected to a telescopic rod (115), and the telescopic rod (115) is threadedly connected to a fixed arc block (116); A glue shell (125) is provided on the upper side of the bottom plate (101), a glue cavity (126) with an upper opening is provided in the glue shell (125), and an electric heater (119) is provided on the upper side of the bottom plate (101).

2. A semiconductor chip packaging lead sealing device according to claim 1, characterized in that: A connecting ring (117) is fixedly connected to the upper end of the bottom plate (101); the connecting ring (117) can be threadedly connected to a liquid receiving shell (118); a storage cavity is provided in the liquid receiving shell (118).

3. A semiconductor chip packaging lead sealing device according to claim 2, characterized in that: The upper end surface of the liquid receiving shell (118) is detachably fixedly connected to the electric heater (119).

4. A semiconductor chip packaging lead sealing device according to claim 3, characterized in that: An air extraction pump (123) is fixedly provided on the upper end surface of the bottom plate (101); the air extraction pump (123) is connected to the electric heater (119) via an extraction pipe (122); and an exhaust pipe (124) is provided in communication with the air extraction pump (123).

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