Full-automatic ball mounting and laminating all-in-one machine

Abstract

The utility model discloses a full-automatic ball mounting and laminating all-in-one machine which comprises a feeding machine, a ball mounting and laminating machine and a printing machine arranged between the feeding machine and the ball mounting and laminating machine, and the feeding machine comprises a tray stock bin, a jig stock bin, a feeding transmission mechanism, a feeding transfer device and a product transmission track; a charging tray is stored in the charging tray bin, and a device to be subjected to ball mounting is loaded in the charging tray; a tray conveying rail is arranged at one end of the tray bin, and a tray push-pull mechanism is mounted on the tray conveying rail; the charging tray push-pull mechanism is at least used for pulling the charging tray out of the charging tray bin to the charging tray conveying track; the jig stock bin is arranged on one side of the tray stock bin, and jigs are stored in the jig stock bin. According to the utility model, the ball mounting process of the BGA chip and the bonding process of the BGA chip are integrated, one-stop ball mounting and bonding work of the BGA chip can be realized, the automation degree is high, and the working efficiency is high.

Description

Technical Field

[0001] The utility model relates to the technical field of BGA chip ball planting, in particular to a BGA chip ball planting and bonding device. Background Art

[0002] In recent years, the electronic information industry has developed rapidly around the world, and electronic information products have become necessities of people's lives. The development of the electronic information industry has brought a lot of convenience to human life. At the same time, with the increasingly accelerated process of intelligence in all walks of life, the demand for chip BGA is also increasing. Due to the complex manufacturing process of the chip itself, different production links of high-end chips are completed by different manufacturers around the world. As long as one of the links is affected, it will not be able to operate normally, and the entire chip manufacturing process will stagnate, resulting in a decline in overall production capacity and a reduction in the supply of chips. However, market demand is still increasing, and this naturally leads to a shortage of chips in the global electronics industry. Therefore, the current market gap for automated intelligent equipment required for each production link is huge, and the technical requirements for equipment in the BGA ball planting process production are also increasing. However, the current BGA ball planting equipment and bonding equipment (bonding the BGA chip with ball planting to the PCB) are separate. After the BGA is planted, it needs to be transferred to the bonding machine manually or by an assembly line. The operation is cumbersome and the work efficiency is low. Therefore, a ball planting and bonding machine integrating ball planting and bonding functions has been developed. Utility Model Content

[0003] The purpose of the utility model is to provide a fully automatic ball planting and bonding all-in-one machine, which integrates the ball planting process of the BGA chip and the bonding process of the BGA chip into one, and can realize one-stop BGA chip ball planting and bonding work, with high automation and high work efficiency. At the same time, the ball-planted BGA chip and the bonded products can be automatically visually inspected, and the automatic sorting of good and defective products can be realized, so as to ensure the accuracy of ball planting and bonding.

[0004] In order to achieve the above purpose, the following technical solutions are adopted:

[0005] A fully automatic ball planting and laminating machine comprises a feeder, a ball planting and laminating machine, and a printing machine arranged between the feeder and the ball planting and laminating machine, wherein the feeder comprises a tray bin, a jig bin, a feeding transmission mechanism, a feeding transfer device, and a product transmission track; a tray is stored in the tray bin, and the tray carries a device to be ball-planted; a tray transmission track is arranged at one end of the tray bin, and a tray push-pull mechanism is installed on the tray transmission track; the tray push-pull mechanism is at least used to pull the tray out of the tray bin to the tray transmission track; the jig bin is arranged at one side of the tray bin, and a jig is stored in the jig bin; a transfer transmission mechanism is also provided at one end of the jig bin; The transfer transmission mechanism is also equipped with a jig push-pull mechanism, which is at least used to pull the jig out of the jig silo and onto the transfer transmission mechanism; the loading transmission mechanism is arranged at one end of the transfer transmission mechanism, and the transfer transmission mechanism is at least used to transfer the jig to the loading transmission mechanism; the loading transfer device is arranged above the tray transmission track and the loading transmission mechanism, and the loading transfer device is at least used to transfer the device on the tray to the jig located on the loading transmission mechanism; the loading transmission mechanism is at least used to transfer the jig carrying the device to be implanted into the printing machine; the product transmission track is arranged close to one end of the transfer transmission mechanism, and the product transmission track is used to transfer the product to be bonded into the ball implant bonding machine.

[0006] Furthermore, the tray transmission track includes a first transmission frame; a transmission fixed plate is installed on each side of the top of the first transmission frame, and a first guide track is installed on the top of each transmission fixed plate; the tray push-pull mechanism includes a first push-pull translation mechanism installed on the first transmission frame, a first push-pull slide plate slidably arranged on the top of the first transmission frame and connected to the first push-pull translation mechanism, a first vertical frame installed on the first push-pull slide plate, and a first clamping cylinder installed on one side of the first vertical frame; the first clamping cylinder also drives and connects two first clamping claws.

[0007] Furthermore, the transfer transmission mechanism includes a transfer Y-axis translation mechanism arranged in the transmission direction of the feeding transmission mechanism, a transfer translation plate connected to the transfer Y-axis translation mechanism, and two transfer translation frames arranged at intervals on the transfer translation plate; the two transfer translation frames are arranged along the transmission direction of the feeding transmission mechanism, and a transfer transmission belt module is installed on each of the two transfer translation frames; a transfer transmission motor for driving the transfer transmission belt module to operate is also installed on the transfer translation plate; the jig push-pull mechanism includes a second push-pull translation mechanism installed on the transfer translation plate, a second vertical frame connected to the second push-pull translation mechanism, and a push-pull hook installed on the second vertical frame.

[0008] Furthermore, the feeding machine also includes a reflux transmission mechanism; the reflux transmission mechanism is arranged on one side of the feeding transmission mechanism.

[0009] Furthermore, the ball planting and bonding machine includes a first gantry, a jig inflow track, a ball shaking platform device, and a first transmission mechanism; a ball planting device is installed on one side of the first gantry, and a bonding device is also installed on the other side of the first gantry; the jig inflow track is at least used to connect with a printing press; the jig inflow track is arranged below the first gantry, and a first push-pull mechanism is installed on the jig inflow track; a jig outflow track is also arranged on one side of the jig inflow track, and a second push-pull mechanism is also installed on the jig outflow track, and the jig outflow track is at least used to connect with a return transmission mechanism; the ball shaking platform device is installed below the ball planting device, and is arranged close to one end of the jig inflow track and the jig outflow track; the first transmission mechanism is installed below the bonding device, and is arranged close to one side of the jig outflow track; the first transmission mechanism is at least used to connect with a product transmission track.

[0010] Furthermore, the bonding device includes a bonding Y-axis translation mechanism installed on the first gantry, a bonding X-axis translation mechanism connected to the bonding Y-axis translation mechanism, a bonding Z-axis lifting mechanism connected to the bonding X-axis translation mechanism, a bonding lifting seat connected to the bonding Z-axis lifting mechanism, a bonding R-axis rotation mechanism installed on the bonding lifting seat, and a bonding rotating seat connected to the bonding R-axis rotation mechanism; an electric clamp is also installed at the bottom of the bonding rotating seat, and the electric clamp also drives and connects two bonding claws; a bonding upper visual module is also installed on the bonding lifting seat; and a plurality of ion fans are also installed at the bottom of the first gantry.

[0011] Furthermore, a first jig recovery mechanism is arranged between the jig inflow track and the jig outflow track, and a lower bonding vision module is arranged between the jig outflow track and the first transmission mechanism; and an upper ball planting vision module is arranged on the side of the first gantry where the ball planting device is installed.

[0012] Furthermore, a first transfer mechanism is arranged at one end of the first transmission mechanism, and the first transfer mechanism is also drivingly connected to a second transmission mechanism; a third transmission mechanism is arranged at one end of the first transfer mechanism away from the first transmission mechanism.

[0013] Furthermore, the first gantry frame is provided with a first fixing frame connected to one side of the ball planting device; the first fixing frame is arranged above the first transfer mechanism; and the patch visual module is also installed on the first fixing frame.

[0014] Furthermore, a defective chip recovery box is arranged on one side of the rocking ball platform device, and a defective chip transfer mechanism is arranged above the defective chip recovery box.

[0015] By adopting the above scheme, the beneficial effects of the utility model are:

[0016] The all-in-one machine of the present application integrates the BGA chip ball planting process and the BGA chip bonding process into one, and can realize one-stop BGA chip ball planting and bonding work with a high degree of automation and high work efficiency. At the same time, it can perform automated visual inspection on the ball-planted BGA chips and bonded products, and can realize automated sorting of good and defective products, thereby ensuring the accuracy of ball planting and bonding. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the structure of the utility model;

[0018] Figure 2 It is a structural schematic diagram of the feeding machine of the utility model;

[0019] Figure 3 It is a structural schematic diagram of the material tray transmission track of the utility model;

[0020] Figure 4 It is a structural schematic diagram of the transfer transmission mechanism of the utility model;

[0021] Figure 5 It is a structural schematic diagram of the ball planting and bonding machine of the utility model;

[0022] Figure 6 for Figure 5 A schematic diagram of the structure from another perspective;

[0023] Figure 7 It is a structural schematic diagram of the laminating device of the utility model;

[0024] The accompanying drawings illustrate:

[0025] 1. Loading machine; 2. Ball planting and laminating machine; 3. Printing machine; 11. Material tray silo; 12. Fixture silo; 13. Loading transmission mechanism; 14. Loading transfer device; 15. Product transmission track; 16. Material tray transmission track; 17. Material tray push-pull mechanism; 18. Transfer transmission mechanism; 19. Fixture push-pull mechanism; 10. Reflux transmission mechanism; 21. First gantry; 22. Fixture inflow track; 23. Shaking ball platform device; 24. First transmission mechanism; 25. Ball planting device; 26. Laminating device; 27. First push-pull mechanism; 28. Fixture outflow track; 29. ​​Second push-pull mechanism; 161. First transmission frame; 162. Transmission fixed plate; 163. First guide track; 171. First push-pull translation mechanism; 172. First push-pull slide plate; 173. First stand; 174. First clamping air Cylinder; 175, first clamp; 181, transfer Y-axis translation mechanism; 182, transfer translation plate; 183, transfer translation frame; 191, second push-pull translation mechanism; 192, second stand; 193, push-pull hook; 211, first fixture recovery mechanism; 212, bonding lower visual module; 213, ball planting upper visual module; 214, first transfer mechanism; 215, second transmission mechanism; 216, third transmission mechanism; 217, patch upper visual module; 218, bad chip recovery box; 219, bad chip transfer mechanism; 261, bonding Y-axis translation mechanism; 262, bonding X-axis translation mechanism; 263, bonding Z-axis lifting mechanism; 264, bonding lifting seat; 265, bonding R-axis rotation mechanism; 266, electric clamp; 267, bonding upper visual module; 268, ion fan. DETAILED DESCRIPTION

[0026] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0027] Reference Figures 1 to 7As shown, the utility model provides a fully automatic ball planting and laminating machine, including a feeder 1, a ball planting and laminating machine 2, and a printing machine 3 arranged between the feeder 1 and the ball planting and laminating machine 2. In one embodiment, the feeder 1 includes a tray bin 11, a fixture bin 12, a feed transmission mechanism 13, a feed transfer device 14, and a product transmission track 15; the tray bin 11 contains a tray, and the tray carries the device to be ball planted; a tray transmission track 16 is arranged at one end of the tray bin 11, and a tray push-pull mechanism 17 is installed on the tray transmission track 16; the tray push-pull mechanism 17 is at least used to pull the tray out of the tray bin 11 to the tray transmission track 16; the fixture bin 12 is arranged on one side of the tray bin 11, and the fixture bin 12 stores the fixture; one end of the fixture bin 12 is also provided with a transfer The transfer mechanism 18 is provided with a jig push-pull mechanism 19, which is at least used to pull the jig out of the jig bin 12 and onto the transfer mechanism 18; the loading transmission mechanism 13 is arranged at one end of the transfer transmission mechanism 18, and the transfer transmission mechanism 18 is at least used to transfer the jig to the loading transmission mechanism 13; the loading transfer device 14 is arranged above the tray transmission track 16 and the loading transmission mechanism 13, and the loading transfer device 14 is at least used to transfer the device on the tray to the jig located on the loading transmission mechanism 13; the loading transmission mechanism 13 is at least used to transfer the jig carrying the device to be implanted into the printing machine 3; the product transmission track 15 is arranged close to one end of the transfer transmission mechanism 18, and the product transmission track 15 is used to transfer the product to be bonded into the ball implant bonding machine 2.

[0028] Continue to refer to Figures 1 to 7 As shown, in this embodiment, the material tray silo 11 and the fixture silo 12 both include a silo body and a silo lifting mechanism for driving the silo body to rise and fall. The material trays or fixtures are stacked in the silo body. The silo lifting mechanism can directly adopt a linear motor module to drive the silo body to rise and fall, so that the material tray push-pull mechanism 17 and the fixture push-pull mechanism 19 can pull out the material tray and the fixture or push them back into the silo body for recycling. In this embodiment, the device to be implanted is a BGA chip, and the product to be bonded is a PCB board.

[0029] During operation, the staff will first place the tray and jig carrying the BGA chip in the tray bin 11 and the jig bin 12 respectively; then, the tray push-pull mechanism 17 will pull the tray out of the tray bin 11 to the tray transmission track 16, and the jig push-pull mechanism 19 will pull the jig out of the jig bin 12 to the transfer transmission mechanism 18; the PCB board will flow to the product transmission track 15 through the upstream assembly line; then, the transfer transmission mechanism 18 will transfer the jig to the feeding transmission mechanism 13, which adopts the transmission mode of conveyor belt and motor, and the feeding transmission mechanism 13 is also equipped with a blocking cylinder, an end clamping cylinder, and a side clamping cylinder. Cylinder, after the jig is transferred to the feeding transmission mechanism 13, the jig can be stopped by the blocking cylinder, and then the end clamping cylinder and the side clamping cylinder clamp the jig; then, the feeding transfer device 14 transfers the BGA chips in the material tray to the jig one by one, and after the jig is full of BGA chips, the feeding transmission mechanism 13 transfers them to the printer 3 to print the flux. The printer 3 can use existing equipment. After printing the flux, the jig is transferred to the ball planting and bonding machine 2. At the same time, the product transmission track 15 (using the transmission method of the motor conveyor belt) will also synchronously transfer the PCB board to the ball planting and bonding machine 2 for ball planting and bonding work.

[0030] In one embodiment, the tray transmission track 16 includes a first transmission frame 161; a transmission fixed plate 162 is installed on both sides of the top of the first transmission frame 161, and a first guide track 163 is installed on the top of each transmission fixed plate 162; the tray push-pull mechanism 17 includes a first push-pull translation mechanism 171 installed on the first transmission frame 161, a first push-pull slide plate 172 slidably arranged on the top of the first transmission frame 161 and connected to the first push-pull translation mechanism 171, a first stand 173 installed on the first push-pull slide plate 172, and a first clamping cylinder 174 installed on one side of the first stand 173; the first clamping cylinder 174 also drives and connects two first clamping claws 175. The first push-pull translation mechanism 171 adopts a transmission method of a motor and a conveyor belt, which can drive the first push-pull slide plate 172 to translate, and the first clamping cylinder 174 can drive the two first clamping claws 175 to move closer or farther from each other to clamp or release the fixture.

[0031] At the same time, the transfer transmission mechanism 18 includes a transfer Y-axis translation mechanism 181 arranged in the transmission direction of the feeding transmission mechanism 13, a transfer translation plate 182 connected to the transfer Y-axis translation mechanism 181, and two transfer translation frames 183 arranged at intervals on the transfer translation plate 182; the two transfer translation frames 183 are arranged along the transmission direction of the feeding transmission mechanism 13, and a transfer transmission belt module is installed on each of the two transfer translation frames 183; the transfer translation plate 182 is also equipped with a transfer transmission motor for driving the transfer transmission belt module to operate; the jig push-pull mechanism 19 includes a second push-pull translation mechanism 191 installed on the transfer translation plate 182, a second vertical frame 192 connected to the second push-pull translation mechanism 191, and a push-pull hook 193 installed on the second vertical frame 192.

[0032] The transfer Y-axis translation mechanism 181 adopts a linear motor module, which can drive the transfer translation plate 182 to translate, so that the transfer conveyor belt module can be docked with the fixture silo 12 and the feeding conveyor mechanism 13, thereby realizing the transfer function. At the same time, a reflux transmission mechanism 10 is also provided, and the reflux transmission mechanism 10 is arranged on one side of the feeding conveyor mechanism 13; the reflux transmission mechanism 10 is docked with the ball implant bonding machine 2 for connecting the empty fixture. The transfer conveyor belt module is also driven by the transfer Y-axis translation mechanism 181, and is docked with the reflux transmission mechanism 10, so that the fixture push-pull mechanism 19 can push the empty fixture back into the fixture silo 12; the second push-pull translation mechanism 191 adopts a transmission method of a motor and a screw rod, which can drive the push-pull hook 193 to move, thereby facilitating the push-pull fixture.

[0033] In one embodiment, the ball planting and bonding machine 2 includes a first gantry 21, a fixture inflow track 22, a ball shaking platform device 23, and a first transmission mechanism 24; a ball planting device 25 is installed on one side of the first gantry 21, and a bonding device 26 is also installed on the other side of the first gantry 21; the fixture inflow track 22 is at least used to connect with the printing machine 3; the fixture inflow track 22 is arranged below the first gantry 21, and a first push-pull mechanism 27 is installed on the fixture inflow track 22; one side of the fixture inflow track 22 A jig outflow track 28 is also arranged on the side, and a second push-pull mechanism 29 is also installed on the jig outflow track 28. The jig outflow track 28 is at least used to connect with the return transmission mechanism 10; the ball shaking platform device 23 is installed below the ball planting device 25, and is arranged close to the jig inflow track 22 and one end of the jig outflow track 28; the first transmission mechanism 24 is installed below the fitting device 26, and is arranged close to one side of the jig outflow track 28; the first transmission mechanism 24 is at least used to connect with the product transmission track 15.

[0034] In this embodiment, the jig inflow track 22 is used to connect the jig coming out of the printer 3, and the BGA chip in the jig has been printed with solder flux; the first transmission mechanism 24 is used to connect the product to be bonded, that is, the PCB board; the jig inflow track 22 will transfer the jig carrying the BGA chip to one end close to the shaking ball platform device 23, and the first push-pull mechanism 27 will push the jig onto the shaking ball platform device 23; then, the shaking ball platform device 23 moves the jig to the bottom of the ball planting device 25, and the ball planting device 25 plants the BGA chip on the jig. After the ball planting is completed, the shaking ball platform The platform device 23 then moves the jig to one end of the jig outflow track 28; then, the second push-pull mechanism 29 pulls the jig from the rocking ball platform device 23 to the jig outflow track 28, and the jig outflow track 28 then moves the jig to the bottom of the bonding device 26 and clamps the jig. At this time, the first transmission mechanism 24 connects the PCB board to be bonded and clamps it; then, the bonding device 26 transfers the BGA chip in the jig and bonds it to the PCB board. After the bonding is completed, the first transmission mechanism 24 transfers the bonded PCB board to the next process.

[0035] In this embodiment, the ball planting device 25 and the ball shaking platform device 23 directly adopt existing devices. At the same time, a first jig recovery mechanism 211 is arranged between the jig inflow track 22 and the jig outflow track 28, and a lower fitting visual module 212 is arranged between the jig outflow track 28 and the first transmission mechanism 24; a ball planting upper visual module 213 is also arranged on the side of the first gantry 21 where the ball planting device 25 is installed. The upper ball planting visual module 213 includes a camera and a light source, which is used to identify BGA chip ball planting defects, such as multiple balls, fewer balls and ball deviation, as well as to identify the QR code information of the BGA chip and bind the information output. The first fixture recovery mechanism 211 adopts the structure of a palletizer, which is used to recover NG fixtures (fixtures for placing unqualified BGA chips after ball planting) and NG BGA chips (after ball planting, for BGA chips that fail to pass the test, the bonding device 26 can transfer them to the first fixture recovery mechanism 211 and bond the qualified BGA chips to the PCB board). The lower bonding visual module 212 includes a camera and a light source to realize the bonding guiding function of the bonding device 26.

[0036] In addition, a first transfer mechanism 214 is also arranged at one end of the first transmission mechanism 24, and the first transfer mechanism 214 is also driven and connected to a second transmission mechanism 215; a third transmission mechanism 216 is also arranged at one end of the first transfer mechanism 214 away from the first transmission mechanism 24. The structure and principle of the second transmission mechanism 215 and the third transmission mechanism 216 are similar to those of the first transmission mechanism 24, and the following description of the working principle of the first transmission mechanism 24 can be referred to, and no further description is given here. The first transfer mechanism 214 can directly adopt a linear motor module; at the same time, the first gantry 21 is provided with a side of the ball planting device 25 and is also connected to a first fixed frame; the first fixed frame is arranged above the first transfer mechanism 214; the first fixed frame is also installed with a patch visual module 217. The visual module 217 on the patch includes a 3D line scan camera and a patch detection camera. After the PCB board is bonded, the first transmission mechanism 24 can transfer the bonded PCB board to the second transmission mechanism 215. Then, the first transfer mechanism 214 drives the second transmission mechanism 215 to move so that the PCB board passes under the 3D line scan camera and the patch detection camera respectively to perform 3D line scan identification of overlapping balls and large and small ball defects, and patch misalignment defect detection. After the inspection is completed, the second transmission mechanism 215 moves to the third transmission mechanism 216 and docks with the third transmission mechanism 216. Subsequently, the second transmission mechanism 215 transfers the PCB board to the third transmission mechanism 216.

[0037] Meanwhile, a bad chip recovery box 218 is arranged on one side of the ball shaking platform device 23, and a bad chip transfer mechanism 219 is arranged above the bad chip recovery box 218. The bad chip transfer mechanism 219 includes a manipulator, which can transfer the unqualified PCB board to the bad chip recovery box 218 for recycling, and at the same time, the third transmission mechanism 216 will transfer the qualified PCB board to the next process.

[0038] In one embodiment, the bonding device 26 includes a bonding Y-axis translation mechanism 261 installed on the first gantry 21, a bonding X-axis translation mechanism 262 connected to the bonding Y-axis translation mechanism 261, a bonding Z-axis lifting mechanism 263 connected to the bonding X-axis translation mechanism 262, a bonding lifting seat 264 connected to the bonding Z-axis lifting mechanism 263, a bonding R-axis rotation mechanism 265 installed on the bonding lifting seat 264, and a bonding rotating seat connected to the bonding R-axis rotation mechanism 265; an electric clamp 266 is also installed at the bottom of the bonding rotating seat, and the electric clamp 266 also drives and connects two bonding claws; a bonding upper visual module 267 is also installed on the bonding lifting seat 264; and a plurality of ion fans 268 are also installed at the bottom of the first gantry 21.

[0039] In this embodiment, the Y-axis translation mechanism 261, the X-axis translation mechanism 262 and the Z-axis lifting mechanism 263 are all directly linear motor modules, and the R-axis rotation mechanism 265 includes a rotary motor. With the cooperation of the above devices, the laminating claws can be driven to perform translation, lifting and rotation movements, so that the electric clamping claws 266 drive the laminating claws to clamp or laminating the BGA chip. The laminating lifting seat 264 is also equipped with a laminating upper visual module 267; the bottom of the first gantry 21 is also equipped with a plurality of ion fans 268. The laminating upper visual module 267 includes a camera and a light source, and can cooperate with the laminating lower visual module 212 to guide the laminating device 26 to laminating the BGA chip. At the same time, the ion fan 268 can remove static electricity.

[0040] The structure and working principle of the jig inflow track 22 and the jig outflow track 28 can refer to the above-mentioned feeding and conveying device, which will not be repeated here. The structure and working principle of the first push-pull mechanism 27 and the second push-pull mechanism 29 can refer to the above-mentioned jig push-pull mechanism 19, which will not be repeated here.

[0041] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A fully automatic ball planting and laminating machine, comprising a feeder, a ball planting and laminating machine, and a printer arranged between the feeder and the ball planting and laminating machine, characterized in that: The loading machine includes a tray silo, a jig silo, a loading transmission mechanism, a loading transfer device, and a product transmission track; a tray is stored in the tray silo, and the tray carries the device to be implanted; a tray transmission track is arranged at one end of the tray silo, and a tray push-pull mechanism is installed on the tray transmission track; the tray push-pull mechanism is at least used to pull the tray out of the tray silo to the tray transmission track; the jig silo is arranged on one side of the tray silo, and jigs are stored in the jig silo; a transfer transmission mechanism is also provided at one end of the jig silo; a jig push-pull mechanism is also installed on the transfer transmission mechanism, and the jig push-pull mechanism At least used to pull the jig out of the jig silo to the transfer transmission mechanism; the loading transmission mechanism is arranged at one end of the transfer transmission mechanism, and the transfer transmission mechanism is at least used to transfer the jig to the loading transmission mechanism; the loading transfer device is arranged above the tray transmission track and the loading transmission mechanism, and the loading transfer device is at least used to transfer the device on the tray to the jig located on the loading transmission mechanism; the loading transmission mechanism is at least used to transfer the jig carrying the device to be implanted into the printing machine; the product transmission track is arranged close to one end of the transfer transmission mechanism, and the product transmission track is used to transfer the product to be bonded into the ball implant bonding machine.

2. The fully automatic ball implantation and bonding machine according to claim 1, characterized in that: The tray transmission track includes a first transmission frame; a transmission fixed plate is installed on each side of the top of the first transmission frame, and a first guide track is installed on the top of each transmission fixed plate; the tray push-pull mechanism includes a first push-pull translation mechanism installed on the first transmission frame, a first push-pull slide plate slidably arranged on the top of the first transmission frame and connected to the first push-pull translation mechanism, a first vertical frame installed on the first push-pull slide plate, and a first clamping cylinder installed on one side of the first vertical frame; the first clamping cylinder also drives and connects two first clamping claws.

3. The fully automatic ball implantation and bonding machine according to claim 1, characterized in that: The transfer transmission mechanism includes a transfer Y-axis translation mechanism arranged in the transmission direction of the feeding transmission mechanism, a transfer translation plate connected to the transfer Y-axis translation mechanism, and two transfer translation frames arranged at intervals on the transfer translation plate; the two transfer translation frames are arranged along the transmission direction of the feeding transmission mechanism, and a transfer transmission belt module is installed on each of the two transfer translation frames; a transfer transmission motor for driving the transfer transmission belt module to operate is also installed on the transfer translation plate; the jig push-pull mechanism includes a second push-pull translation mechanism installed on the transfer translation plate, a second vertical frame connected to the second push-pull translation mechanism, and a push-pull hook installed on the second vertical frame.

4. The fully automatic ball implantation and bonding machine according to claim 1, characterized in that: The feeding machine also includes a reflux transmission mechanism; the reflux transmission mechanism is arranged on one side of the feeding transmission mechanism.

5. The fully automatic ball implantation and bonding machine according to claim 4, characterized in that: The ball planting and bonding machine comprises a first gantry, a jig inflow track, a ball shaking platform device, and a first transmission mechanism; a ball planting device is installed on one side of the first gantry, and a bonding device is also installed on the other side of the first gantry; the jig inflow track is at least used for connecting with a printing machine; the jig inflow track is arranged below the first gantry, and a first push-pull mechanism is installed on the jig inflow track; a jig outflow track is also arranged on one side of the jig inflow track, and a second push-pull mechanism is also installed on the jig outflow track, and the jig outflow track is at least used for connecting with a return transmission mechanism; the ball shaking platform device is installed below the ball planting device, and is arranged close to one end of the jig inflow track and the jig outflow track; the first transmission mechanism is installed below the bonding device, and is arranged close to one side of the jig outflow track; The first transmission mechanism is at least used for connecting with a product transmission track.

6. The fully automatic ball implantation and bonding machine according to claim 5, characterized in that: The bonding device includes a bonding Y-axis translation mechanism installed on the first gantry, a bonding X-axis translation mechanism connected to the bonding Y-axis translation mechanism, a bonding Z-axis lifting mechanism connected to the bonding X-axis translation mechanism, a bonding lifting seat connected to the bonding Z-axis lifting mechanism, a bonding R-axis rotation mechanism installed on the bonding lifting seat, and a bonding rotating seat connected to the bonding R-axis rotation mechanism; an electric clamp is also installed at the bottom of the bonding rotating seat, and the electric clamp also drives and connects two bonding claws; a bonding upper visual module is also installed on the bonding lifting seat; and a plurality of ion fans are also installed at the bottom of the first gantry.

7. The fully automatic ball implantation and bonding machine according to claim 5, characterized in that: A first jig recovery mechanism is arranged between the jig inflow track and the jig outflow track, and a lower bonding vision module is arranged between the jig outflow track and the first transmission mechanism; and an upper ball planting vision module is arranged on the side of the first gantry where the ball planting device is installed.

8. The fully automatic ball implantation and bonding machine according to claim 5, characterized in that: A first transfer mechanism is also arranged at one end of the first transmission mechanism, and the first transfer mechanism is also drivingly connected to a second transmission mechanism; a third transmission mechanism is also arranged at one end of the first transfer mechanism away from the first transmission mechanism.

9. The fully automatic ball implantation and bonding machine according to claim 8, characterized in that: The first gantry frame is provided with a first fixing frame connected to one side of the ball planting device; the first fixing frame is arranged above the first transfer mechanism; and the patch visual module is also installed on the first fixing frame.

10. The fully automatic ball implantation and bonding machine according to claim 5, characterized in that: A bad chip recovery box is arranged on one side of the rocking ball platform device, and a bad chip transfer mechanism is arranged above the bad chip recovery box.

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