Wafer feeding and discharging device and chemical plating equipment

Abstract

The utility model relates to a wafer feeding and discharging device and chemical plating equipment. The wafer feeding and discharging device comprises a first bearing part used for bearing a wafer box used for loading wafers; the second bearing part is used for bearing the flower basket; the overturning assembly can be controlled to move between the overturning station and the feeding and discharging station; the first transferring mechanical arm is used for transferring the flower basket between the second bearing part and the overturning assembly when the overturning assembly is located at the overturning station, and the overturning assembly is used for overturning the flower basket loaded on the overturning assembly so that an opening of the flower basket on the overturning assembly can face upwards or face the first bearing part; and the second transfer manipulator is arranged between the first bearing piece and the overturning station and is used for transferring the wafer between the basket on the overturning assembly and the wafer box on the first bearing piece when the overturning assembly is located at the overturning station.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a wafer loading and unloading device and chemical plating equipment. Background Art

[0002] Wafer chemical plating refers to a chemical plating process with wafers as workpieces. It is mainly used in the semiconductor industry as a pre-plating process for thin film deposition in subsequent manufacturing processes. Wafer is a basic material, and coating is a basic process used to build various circuits, chips, and component structures on wafers. In the actual production process, wafers to be plated need to be loaded, and wafers after wafer plating need to be unloaded. However, the degree of automation of the loading and unloading devices in the prior art is not high, manual participation is required, there are major safety hazards, and the cleanliness requirements of the wafers cannot be guaranteed. Utility Model Content

[0003] Based on this, it is necessary to provide a wafer loading and unloading device chemical plating equipment that improves the above defects, in order to address the problems in the prior art that the loading and unloading devices have low automation levels, require manual participation, have major safety hazards, and cannot guarantee the cleanliness requirements of the wafers.

[0004] A wafer loading and unloading device, comprising:

[0005] A first carrier, used for carrying a wafer box, wherein the wafer box is used for loading wafers;

[0006] The second bearing member is used to bear the flower basket;

[0007] A turning assembly, which can be moved between the turning station and the loading and unloading station in a controlled manner;

[0008] a first transfer robot, used for transferring the flower basket between the second carrier and the flip assembly when the flip assembly is located at the flip station, the flip assembly being used for flipping the flower basket loaded therein so that the opening of the flower basket on the flip assembly faces upward or toward the first carrier; and

[0009] The second transfer robot is arranged between the first carrier and the flipping station, and is used for transferring wafers between the flower basket on the flipping assembly and the wafer box on the first carrier when the flipping assembly is located at the flipping station.

[0010] In one embodiment, the wafer loading and unloading device further comprises a first baffle, the first carrier is located on one side of the first baffle, a first feed port is provided on the first baffle, and an opening of a wafer box carried on the first carrier is opposite to the first feed port;

[0011] The second transfer robot is located on the side of the first baffle away from the first carrier, and is used to deliver the wafer from the first feed port into the wafer box on the first carrier, or to grab the wafer in the wafer box on the first carrier from the first feed port.

[0012] In one of the embodiments, the wafer loading and unloading device also includes a cover opening assembly, which includes a cover opening drive mechanism and a cover plate connected to the driving end of the cover opening drive mechanism, and the cover opening drive mechanism can controllably drive the cover plate to move to a covering position that blocks the first feed port or an opening position that opens the first feed port.

[0013] In one embodiment, the first feed port is provided in plurality, the plurality of the first feed ports are arranged at intervals along the second direction, the first carrier has a plurality of carrying positions each for carrying a wafer box, each of the carrying positions corresponds to each of the first feed ports one by one, and each of the first feed ports is opposite to an opening of a wafer box on a corresponding one of the carrying positions;

[0014] The second transfer robot includes a second mobile drive mechanism and a second gripping mechanism installed at the driving end of the second mobile drive mechanism. The second mobile drive mechanism drives the second gripping mechanism to move along the second direction to drive the second gripping mechanism to pass through each of the first feed ports.

[0015] In one embodiment, the wafer loading and unloading device further includes a second baffle, which is arranged on a side of the second transfer robot away from the first baffle; the second carrier, the first transfer robot and the flip station are all located on a side of the second baffle away from the first baffle;

[0016] A second feed inlet is provided on the second baffle plate. When the flip assembly is located at the flip station, the flip assembly can drive the flower basket loaded therein to flip until the opening of the flower basket is opposite to the second feed inlet.

[0017] In one embodiment, the wafer loading and unloading device further includes a third baffle, which is arranged on a side of the second baffle away from the first baffle, and the second carrier, the first transfer robot and the flip station are all located between the second baffle and the third baffle;

[0018] The loading and unloading station is located on a side of the third baffle away from the second baffle, and a through opening for the turnover assembly to pass through is provided on the third baffle.

[0019] In one embodiment, the second carrier is provided in plurality, and the plurality of second carriers are arranged at intervals along the first direction on a side of the second baffle plate facing the third baffle plate, each of the second carriers has a plurality of loading positions arranged along the second direction, each of the loading positions is used to carry a flower basket, and the first direction and the second direction intersect;

[0020] The first transfer robot includes a first mobile driving mechanism and a first grasping mechanism, the first mobile driving mechanism is installed on the side of the third baffle plate facing the second baffle plate, and the first grasping mechanism is installed at the driving end of the first mobile driving mechanism; the first mobile driving mechanism can controllably drive the first grasping mechanism to move along the first direction and the second direction to drive the first grasping mechanism to pass through each of the loading positions and the flipping stations.

[0021] In one embodiment, the flip assembly includes a third mobile drive mechanism, a mobile seat and a flip frame, the mobile seat is installed on the third mobile drive mechanism, and the flip frame is arranged on the mobile seat and is used to carry the flower basket;

[0022] The third moving drive mechanism is used to drive the moving seat to move between the turning station and the loading and unloading station. The turning frame can be controlled to rotate relative to the moving seat, thereby driving the flower basket carried on the turning frame to turn over.

[0023] In one embodiment, the flip frame can be controlled to rotate relative to the moving base to a first state or a second state;

[0024] When the turning frame rotates to the first state, the opening of the flower basket on the turning frame faces upward, and when the turning frame rotates to the second state, the opening of the flower basket on the turning frame faces the first supporting member.

[0025] A chemical plating device comprises a wafer transfer device, a chemical plating device and a wafer loading and unloading device as described in any of the above embodiments, wherein the wafer transfer device is used to transfer a flower basket on the flip assembly located at the loading and unloading station to the chemical plating device, and the chemical plating device is used to perform wafer chemical plating on the wafers in the flower basket. The wafer transfer device is also used to transfer the flower basket to the flip assembly located at the loading and unloading station after completing the wafer chemical plating.

[0026] A wafer loading and unloading method using the wafer loading and unloading device as described in any of the above embodiments includes a loading step, wherein the loading step includes:

[0027] The flip assembly moves to the flip station;

[0028] The first transfer robot transfers the flower basket on the second carrier to the flip assembly;

[0029] The flipping assembly flips the flower basket loaded therein so that the opening of the flower basket on the flipping assembly faces the first bearing member;

[0030] The second transfer robot transfers the wafers in the wafer box on the first carrier to the basket on the flip assembly one by one;

[0031] The turning assembly turns over and restores the flower basket loaded by itself, and moves to the loading and unloading station.

[0032] In one embodiment, the wafer loading and unloading method further includes a loading step, and the loading step includes:

[0033] The flip assembly receives the flower basket and the wafers loaded in the flower basket at the loading and unloading station;

[0034] The flip assembly moves from the loading and unloading station to the flip station, and flips the flower basket carried by the flip assembly so that the opening of the flower basket on the flip assembly faces the first supporting member;

[0035] The second transfer robot transfers the wafers in the basket on the flip assembly to the wafer box on the first carrier one by one;

[0036] The flipping assembly flips and restores the flower basket loaded on it, and the first transfer robot transfers the flower basket on the flipping assembly to the second carrier.

[0037] The above-mentioned wafer loading and unloading device, chemical plating equipment and wafer loading and unloading method can complete the loading action (i.e., providing a flower basket loaded with wafers to the downstream chemical plating device) and the unloading action (i.e., receiving the flower basket and the wafers loaded in the flower basket and completed with wafer chemical plating, cleaning and drying) during actual use. When the loading action is required, first, the flip assembly moves to the flip station, and the first transfer robot transfers the empty flower basket on the second carrier to the flip assembly. Then, the flip assembly drives the flower basket on it to flip 90° so that the opening of the flower basket faces the first carrier. Then, the second transfer robot transfers the wafers in the wafer box on the first carrier one by one to the flower basket on the flip assembly. After the flower basket on the flip assembly is full of wafers, the flip assembly drives the flower basket on it to flip 90° in the opposite direction and restore (i.e., the opening of the flower basket faces upward). Then, the flip assembly moves from the flip station to the loading and unloading station, so that the wafer transfer device can take away the flower basket and the wafers loaded in the flower basket at the loading and unloading station, that is, the loading action is realized.

[0038] When unloading is required, first, the flip assembly moves to the unloading and unloading station to receive the flower basket transferred by the wafer circulation device and the multiple wafers loaded in the flower basket. Then, the flip assembly moves to the flip station and drives the flower basket on it to flip 90° so that the opening of the flower basket faces the first carrier. Then, the second transfer robot transfers the wafers in the flower basket on the flip assembly to the wafer box on the first carrier one by one. When all the wafers in the flower basket on the flip assembly are transferred, the flip assembly drives the flower basket on it to flip 90° in the opposite direction, and the first transfer robot transfers the flower basket on the flip assembly to the second carrier, completing the unloading operation.

[0039] In this way, the wafer loading and unloading device of the present application realizes automatic loading and unloading of wafers, greatly improves the degree of automation, avoids manual participation, eliminates safety hazards, and is conducive to ensuring the high cleanliness requirements of wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 This is a schematic structural diagram of a wafer loading and unloading device in one embodiment of the utility model;

[0041] Figure 2 for Figure 1 A front view of the wafer loading and unloading device shown;

[0042] Figure 3 for Figure 1 A top view of the wafer loading and unloading device shown;

[0043] Figure 4 for Figure 1 A side view of a wafer loading and unloading device is shown;

[0044] Figure 5 This is a flow chart of the steps of a wafer loading and unloading method in one embodiment of the utility model;

[0045] Figure 6 for Figure 5 A flow chart of the steps of loading and unloading the wafer shown in the figure;

[0046] Figure 7 for Figure 5 The flowchart of the unloading steps of the wafer unloading method is shown. DETAILED DESCRIPTION

[0047] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.

[0048] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0049] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0050] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0051] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0052] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0053] An embodiment of the utility model provides a chemical plating device, including a wafer transfer device, a chemical plating device and a wafer loading and unloading device. The wafer loading and unloading device provides a flower basket and a plurality of wafers loaded in the flower basket. The wafer transfer device is used to transfer the flower basket provided by the wafer loading and unloading device and the plurality of wafers loaded in the flower basket as a whole to the chemical plating device. The chemical plating device performs wafer chemical plating on each wafer in the flower basket.

[0054] Furthermore, the chemical plating equipment also includes a cleaning device and a drying device. After the wafers in the flower basket are chemically plated in the chemical plating device, the wafer transfer device transfers the flower basket and each wafer in the flower basket as a whole to the cleaning device. The cleaning device cleans the flower basket and each wafer in the flower basket, and after the cleaning is completed, the wafer transfer device transfers the flower basket and each wafer in the flower basket as a whole to the drying device. The drying device dries the flower basket and each wafer in the flower basket, and after the drying is completed, the wafer transfer device transfers the flower basket and each wafer in the flower basket as a whole to the wafer loading and unloading device for recycling.

[0055] It should be noted that the wafer transfer device can be composed of a conveying mechanism and a handling robot, etc., as long as the flower basket and the wafers loaded in the flower basket can be transferred as a whole between various devices, and no limitation is made here.

[0056] See also Figures 1 to 4In an embodiment of the present application, the wafer loading and unloading device includes a first carrier 10, a second carrier 20, a flip assembly 30, a first transfer robot 40 and a second transfer robot 50. The first carrier 10 is used to carry a wafer box (not shown), and the wafer box is used to load a plurality of wafers B. The second carrier 20 is used to load a plurality of flower baskets A, and the flower basket A on the second carrier 20 is an empty flower basket without wafers B. The flip assembly 30 can be controlled to move between the flip station a1 and the loading and unloading station a2. The first transfer robot 40 is used to transfer the flower basket A between the second carrier 20 and the flip assembly 30 when the flip assembly 30 is located at the flip station a1. The flip assembly 30 is used to flip the flower basket A loaded by itself so that the opening of the flower basket A on the flip assembly 30 faces upward or toward the first carrier 10. When the opening of the flower basket A faces upward, it is convenient to transfer; when the opening of the flower basket A faces the first carrier 10, it is convenient to put the wafer B into the flower basket A or take the wafer B out of the flower basket A. The second transfer robot 50 is arranged between the first carrier 10 and the flipping station a1, and is used to transfer the wafer B between the flower basket A on the flipping assembly 30 and the wafer box on the first carrier 10 when the flipping assembly 30 is located at the flipping station a1.

[0057] The above-mentioned wafer loading and unloading device can complete the loading action (i.e., providing the downstream chemical plating device with the flower basket A loaded with wafers B) and the unloading action (i.e., receiving the flower basket A and the wafers B loaded in the flower basket A and completed with wafer chemical plating, cleaning and drying) during actual use. When the loading action is required, first, the flip assembly 30 moves to the flip station a1, and the first transfer robot 40 transfers the empty flower basket on the second carrier 20 to the flip assembly 30. Then, the flip assembly 30 drives the flower basket A on it to flip 90°, so that the opening of the flower basket A faces the first carrier 10. Then, the second transfer robot 50 transfers the wafers B in the wafer box on the first carrier 10 one by one to the flower basket A on the flip assembly 30. After the flower basket A on the flip assembly 30 is filled with wafers B, the flip assembly 30 drives the flower basket A on it to flip 90° in the opposite direction and restore (i.e., the opening of the flower basket A faces upward). Then, the flip assembly 30 moves from the flip station a1 to the loading and unloading station a2, so that the wafer transfer device can take away the flower basket A and the wafers B loaded in the flower basket A as a whole at the loading and unloading station a2, that is, realize the loading action.

[0058] When unloading is required, first, the flip assembly 30 moves to the unloading and unloading station a2 to receive the flower basket A transferred by the wafer circulation device and the multiple wafers B loaded in the flower basket A. Then, the flip assembly 30 moves to the flip station a1 and drives the flower basket on it to flip 90°, so that the opening of the flower basket A faces the first carrier 10. Then, the second transfer robot 50 transfers the wafers B in the flower basket A on the flip assembly 30 one by one to the wafer box on the first carrier 10. When all the wafers B in the flower basket A on the flip assembly 30 are transferred, the flip assembly 30 drives the flower basket A on it to flip 90° in the opposite direction, and the first transfer robot 40 transfers the flower basket A on the flip assembly 30 to the second carrier 20, and the unloading is completed.

[0059] In this way, the wafer loading and unloading device of the present application realizes automatic loading and unloading of wafer B, greatly improves the degree of automation, avoids manual participation, eliminates safety hazards, and is conducive to ensuring the high cleanliness requirements of wafer B.

[0060] In an embodiment of the present application, the wafer loading and unloading device further includes a first baffle 70, and the above-mentioned first carrier 10 is located on one side of the first baffle 70. A first feed port (not shown) is provided on the first baffle 70, and the opening of the wafer box carried on the first carrier 10 is opposite to the first feed port. The second transfer robot 50 is located on the side of the first baffle 70 away from the first carrier 10, and is used to deliver the wafer B from the first feed port into the wafer box on the first carrier 10, or to grab the wafer B in the wafer box on the first carrier 10 from the first feed port. In this way, the first baffle 70 is used to separate the second transfer robot 50 from the first carrier 10, so that the operation of placing the wafer box on the first carrier 10 and the action of the second transfer robot 50 transferring the wafer B will not affect each other, further reducing safety hazards.

[0061] Specifically in the embodiment, the wafer loading and unloading device also includes an opening cover assembly 60, which includes an opening cover drive mechanism and a cover plate 61 connected to the driving end of the opening cover drive mechanism. The opening cover drive mechanism can controllably drive the cover plate 61 to move to a covering position that blocks the above-mentioned first feed port or an opening cover position that opens the first feed port. In this way, when the second transfer robot 50 needs to grab the wafer B in the wafer box or needs to put the wafer B into the wafer box, the opening cover drive mechanism drives the cover plate 61 to move to the opening cover position that opens the first feed port. When it is not necessary to grab the wafer B in the wafer box or to put the wafer B into the wafer box, the opening cover drive mechanism drives the cover plate 61 to move to the covering position that blocks the first feed port. Optionally, the opening cover drive mechanism can be installed on the side of the first baffle 70 away from the first carrier 10.

[0062] Optionally, a plurality of first feed ports may be provided, and the plurality of first feed ports are arranged at intervals along the second direction X2. The first carrier 10 has a plurality of carrying positions 11 each for carrying a wafer box, each carrying position 11 corresponds to each first feed port one by one, and each first feed port is opposite to an opening of a wafer box on a corresponding carrying position 11. The second transfer robot 50 can selectively grab the wafer B in the corresponding wafer box from any first feed port or place the wafer B into the corresponding wafer box.

[0063] Further, the second transfer robot 50 includes a second mobile drive mechanism 51 and a second gripping mechanism 53 installed at the driving end of the second mobile drive mechanism 51. The second mobile drive mechanism 51 drives the second gripping mechanism 53 to move along the second direction X2 to drive the second gripping mechanism 53 to pass through each first feed port, so that the second gripping mechanism 53 can selectively put the wafer B into the corresponding wafer box or grab the wafer B in the corresponding wafer box. It should be noted that the second mobile drive mechanism 51 can adopt a linear drive module, as long as it can drive the second gripping mechanism 53 to move along the second direction X2 and pass through each first feed port, and grab and release the wafer B, and it is not limited here.

[0064] Specifically in the embodiment, the wafer loading and unloading device also includes a second baffle 71, which is arranged on the side of the second transfer robot 50 away from the first baffle 70. The second carrier 20, the first transfer robot 40 and the flip station a1 are all located on the side of the second baffle 71 away from the first baffle 70. A second feed port (not shown) is provided on the second baffle 71. When the flip assembly 30 is located at the flip station a1, the flip assembly 30 can drive the flower basket A loaded by itself to flip so that the opening of the flower basket A is opposite to the second feed port, so as to facilitate the second transfer robot 50 to put the wafer B into the flower basket A from the second feed port or to grab the wafer B in the flower basket A from the second feed port. Optionally, the second mobile drive mechanism 51 can be installed on the side of the second baffle 71 facing the first baffle 70.

[0065] It should be noted that the second transfer robot 50 is arranged between the second baffle 71 and the first baffle 70, and the first transfer robot 40, the second carrier 20 and the flip assembly 30 are arranged on the side of the second baffle 71 away from the first baffle 70, so as to avoid the mutual influence between the action of the first transfer robot 40 transferring the flower basket A and the action of the flip assembly 30 transferring and flipping the flower basket A and the action of the second transfer robot 50 transferring the wafer B.

[0066] It should also be noted that the second grabbing mechanism 53 can pass through the second feed port when the second mobile drive mechanism 51 drives the second grabbing mechanism 53 to move along the second direction X2. In other words, the second mobile drive mechanism 51 can drive the second grabbing mechanism 53 to move along the second direction X2 to the second feed port, so that the second grabbing mechanism 53 can put the wafer B into the flower basket A from the second feed port or grab the wafer B in the flower basket A from the second feed port.

[0067] Specifically in the embodiment, the wafer loading and unloading device further includes a third baffle 72, which is arranged on the side of the second baffle 71 away from the first baffle 70. The second carrier 20, the first transfer robot 40 and the flipping station a1 are all located between the second baffle 71 and the third baffle 72. The loading and unloading station a2 is located on the side of the third baffle 72 away from the second baffle 71, and the third baffle 72 is provided with a through hole (not shown) for the flip assembly 30 to pass through. In this way, the loading and unloading station a2 is separated from the flipping station a1 by the third baffle 72, so as to avoid the actions completed at the loading and unloading station a2 and the actions completed at the flipping station a1 from affecting each other.

[0068] Optionally, a plurality of second bearing members 20 are provided, and the plurality of second bearing members 20 are arranged at intervals along the first direction X1 on the side of the second baffle plate 71 facing the third baffle plate 72. Each second bearing member 20 has a plurality of loading positions (not marked in the figure) arranged along the second direction X2, and each loading position is used to carry the flower basket A. The first baffle plate 70, the second baffle plate 71 and the third baffle plate 72 are arranged at intervals along the third direction X3 in sequence. The first direction X1, the second direction X2 and the third direction X3 intersect each other.

[0069] The first transfer robot 40 includes a first mobile driving mechanism 41 and a first grabbing mechanism 43. The first mobile driving mechanism 41 is installed on the side of the third baffle plate 72 facing the second baffle plate 71. The first grabbing mechanism 43 is installed at the driving end of the first mobile driving mechanism 41. The first mobile driving mechanism 41 can controllably drive the first grabbing mechanism 43 to move along the first direction X1 and the second direction X2, so as to drive the first grabbing mechanism 43 to pass through each loading position and the flipping station a1, so that the first grabbing mechanism 43 can grab the flower basket A on any loading position and transfer the grabbed flower basket A to the flipping assembly 30 at the flipping station a1; or, the first grabbing mechanism 43 can grab the flower basket A on the flipping assembly 30 at the flipping station a1 and transfer the grabbed flower basket A to any loading position.

[0070] It should be noted that the first mobile driving mechanism 41 can adopt a two-axis or three-axis linear driving module, as long as it can drive the first grasping mechanism 43 to move along the first direction X1 and the second direction X2 and complete the grasping and releasing of the flower basket A, and is not limited here.

[0071] See also Figure 4 As shown, in the embodiment of the present application, the flip assembly 30 includes a third mobile drive mechanism 31, a mobile seat 32 and a flip frame 33. The mobile seat 32 is mounted on the third mobile drive mechanism 31. The flip frame 33 is arranged on the mobile seat 32 and is used to carry the flower basket A. The third mobile drive mechanism 31 is used to drive the mobile seat 32 to move between the flip station a1 and the loading and unloading station a2. The flip frame 33 can be controlled to rotate relative to the mobile seat 32, thereby driving the flower basket A carried on the flip frame 33 to flip. In this way, the third mobile drive mechanism 31 is used to drive the mobile seat 32 to move, thereby realizing the movement of the flip assembly 30 between the flip station a1 and the loading and unloading station a2. By controlling the flip frame 33 to rotate relative to the mobile seat 32, the flower basket A on the flip frame 33 is driven to flip.

[0072] It should be noted that the third mobile drive mechanism 31 can use a linear drive module, as long as it can drive the mobile seat 32 to move between the loading and unloading station a2 and the flipping station a1, and is not limited here. A driving member such as a cylinder can be used to drive the flip frame 33 to flip relative to the mobile seat 32, and is not limited here.

[0073] Furthermore, the flip frame 33 can be controlled to rotate relative to the movable seat 32 to a first state or a second state. When the flip frame 33 rotates to the first state, the opening of the flower basket A on the flip frame 33 faces upward, and the wafers loaded in the flower basket A are arranged vertically. When the flip frame 33 rotates to the second state, the flower basket A on the flip frame 33 faces the first carrier 10, and the wafers B loaded in the flower basket A are arranged horizontally. In this way, when the flip assembly 30 moves to the flip station a1, the flip frame 33 is controlled to flip relative to the movable seat 32 to the second state, at which time the opening of the flower basket A on the flip frame 33 is opposite to the above-mentioned second feed port, and the wafers B enter the flower basket A in a horizontal state. When the flower basket A on the flip assembly 30 is filled with wafers B, the flip frame 33 is controlled to flip relative to the movable seat 32 to the first state, at which time the opening of the flower basket A on the flip frame 33 faces upward.

[0074] Based on the above wafer loading and unloading device, the present application also provides a wafer loading and unloading method. Figure 5 and Figure 6 As shown, the wafer loading and unloading method includes a loading step S10, and the loading step S10 is used to provide a flower basket A and a plurality of wafers B loaded in the flower basket A.

[0075] The loading step S10 includes:

[0076] S101, the flip assembly 30 moves to the flip station a1. Specifically, the third moving drive mechanism 31 drives the moving seat 32 to move to the flip station a1.

[0077] S102, the first transfer robot 40 transfers the flower basket A on the second carrier 20 to the flip assembly 30. Specifically, first, the first mobile drive mechanism 41 drives the first grabbing mechanism 43 to move along the first direction X1 and the second direction X2 until the first grabbing mechanism 43 reaches a certain loading position. Then, the first grabbing mechanism 43 grabs the flower basket A on the loading position. Then, the first mobile drive mechanism 41 drives the first grabbing mechanism 43 to move along the first direction X1 and the second direction X2 until the first grabbing mechanism 43 reaches the flip station a1. Then, the first grabbing mechanism 43 releases the grabbed flower basket A to the flip frame 33 of the flip assembly 30.

[0078] S103, the turning assembly 30 turns over the flower basket A loaded therein, so that the opening of the flower basket A on the turning assembly 30 faces the first carrier 10. Specifically, the turning frame 33 is controlled to turn 90° relative to the moving seat 32, thereby driving the flower basket A on the turning frame 33 to turn 90°, so that the opening of the flower basket A faces the first carrier 10 and faces the second feed opening on the second baffle 71.

[0079] S104, the second transfer robot 50 transfers the wafers B in the wafer box on the first carrier 10 to the flower basket A on the flip assembly 30 one by one. Specifically, first, the second mobile drive mechanism 51 drives the second grasping mechanism 53 to move to a first feed port along the second direction X2 (at this time, the cover opening drive mechanism drives the cover plate 61 to open the first feed port). Then, the second grasping mechanism 53 grasps the wafer B in the wafer box corresponding to the first feed port from the first feed port. Then, the second mobile drive mechanism 51 drives the second grasping mechanism 53 to move to the second feed port along the second direction X2. Then, the second grasping mechanism 53 puts the grasped wafer B into the flower basket A on the flip assembly 30 from the second feed port. This is repeated many times until the flower basket A on the flip assembly 30 is full of wafers B.

[0080] S105, the flip assembly 30 reverses the flower basket A loaded on it and restores it, and moves it to the loading and unloading station a2. Specifically, first, the flip frame 33 is controlled to reversely flip 90° relative to the moving seat 32, thereby driving the flower basket A on the flip frame 33 to reversely flip 90°, so that the opening of the flower basket A faces upward. Then, the third moving drive mechanism 31 drives the moving seat 32 to move to the loading and unloading station a2, so that the moving seat 32 drives the flower basket A on the flip frame 33 and each wafer B loaded in the flower basket A to arrive at the loading and unloading station a2, so that the wafer circulation device can take it away.

[0081] See also Figure 5 and Figure 7As shown, further, the wafer loading and unloading method also includes a loading and unloading step S20, and the loading and unloading step S20 is used to unload the received flower basket A and the multiple wafers B loaded in the flower basket A.

[0082] The material unloading step S20 includes:

[0083] S201, the flip assembly 30 receives the flower basket A and the plurality of wafers B loaded in the flower basket A at the loading and unloading station a2. Specifically, the wafer transfer device transfers the dried flower basket A and the wafers B loaded in the flower basket A as a whole to the flip assembly 30 located at the loading and unloading station a2.

[0084] S202, the flip assembly 30 moves from the loading and unloading station a2 to the flip station a1, and flips the flower basket A carried by itself, so that the opening of the flower basket A on the flip assembly 30 faces the first carrier 10. Specifically, first, the third moving drive mechanism 31 drives the moving seat 32 to move to the flip station a1. Then, the flip frame 33 is controlled to flip 90° relative to the moving seat 32, thereby driving the flower basket on the flip frame 33 to flip 90°, so that the opening of the flower basket A faces the first carrier 10 and is opposite to the second feed opening on the second baffle 71.

[0085] S203, the second transfer robot 50 transfers the wafers B in the flower basket A on the flip assembly 30 to the wafer box on the first carrier 10 one by one. Specifically, first, the second mobile drive mechanism 51 drives the second gripping mechanism 53 to move to the second feed port along the second direction X2. Then, the second gripping mechanism 53 grabs the wafers B in the flower basket A on the flip assembly 30 from the second feed port. Then, the second mobile drive mechanism 51 drives the second gripping mechanism 53 to move to a first feed port along the second direction X2 (at this time, the cover opening drive mechanism drives the cover plate 61 to open the first feed port). Then, the second gripping mechanism 53 puts the grabbed wafers B from the first feed port into the wafer box corresponding to the first feed port. This is repeated many times until all the wafers B in the flower basket A on the flip assembly 30 are transferred to the wafer box.

[0086] S204, the flip assembly 30 reversely flips the flower basket A loaded on it and restores, and the first transfer robot 40 transfers the flower basket A on the flip assembly 30 to the second carrier 20. In this way, first, the flip frame 33 is controlled to reversely flip 90° relative to the moving seat 32, thereby driving the flower basket A on the flip frame 33 to reversely flip 90°, so that the opening of the flower basket A faces upward. Then, the first moving drive mechanism 41 drives the first grabbing mechanism 43 to move along the first direction X1 and the second direction X2 until the first grabbing mechanism 43 reaches the flipping station a1. Then, the first grabbing mechanism 43 grabs the flower basket A on the flip assembly 30. Then, the first moving drive mechanism 41 drives the first grabbing mechanism 43 to move along the first direction X1 and the second direction X2 until the first grabbing mechanism 43 reaches a certain loading position of the second carrier 20. Then, the first grabbing mechanism 43 releases the grabbed flower basket A to the loading position of the second carrier 20.

[0087] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0088] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A wafer loading and unloading device, characterized in that: include: A first carrier (10) for carrying a wafer box, wherein the wafer box is used to load a wafer (B); A second bearing member (20) for bearing the flower basket (A); A turning assembly (30) can be controlled to move between a turning station (a1) and a loading and unloading station (a2); a first transfer robot (40), used for transferring the flower basket (A) between the second carrier (20) and the flip assembly (30) when the flip assembly (30) is located at the flip station (a1); the flip assembly (30) is used for flipping the flower basket (A) loaded therein so that the opening of the flower basket (A) on the flip assembly (30) faces upward or toward the first carrier (10); and A second transfer robot (50) is arranged between the first carrier (10) and the flipping station (a1), and is used for transferring the wafer (B) between the flower basket (A) on the flipping assembly (30) and the wafer box on the first carrier (10) when the flipping assembly (30) is located at the flipping station (a1).

2. The wafer loading and unloading device according to claim 1, characterized in that: The wafer loading and unloading device further comprises a first baffle (70), the first carrier (10) is located on one side of the first baffle (70), a first feed port is provided on the first baffle (70), and an opening of a wafer box carried on the first carrier (10) is opposite to the first feed port; The second transfer robot (50) is located on the side of the first baffle (70) facing away from the first carrier (10), and is used to deliver the wafer (B) from the first feed port into the wafer box on the first carrier (10), or to grab the wafer (B) in the wafer box on the first carrier (10) from the first feed port.

3. The wafer loading and unloading device according to claim 2, characterized in that: The wafer loading and unloading device also includes a cover opening assembly (60), which includes a cover opening drive mechanism and a cover plate (61) connected to the drive end of the cover opening drive mechanism. The cover opening drive mechanism can controllably drive the cover plate (61) to move to a covering position that blocks the first feed port or to an opening position that opens the first feed port.

4. The wafer loading and unloading device according to claim 2, characterized in that: The first feed ports are arranged in plurality, and the plurality of first feed ports are arranged at intervals along the second direction (X2); the first carrier (10) has a plurality of carrying positions (11) each for carrying a wafer box, each of the carrying positions (11) corresponds one-to-one to each of the first feed ports, and each of the first feed ports is opposite to an opening of a wafer box on a corresponding one of the carrying positions (11); The second transfer robot (50) includes a second mobile drive mechanism (51) and a second gripping mechanism (53) installed at the driving end of the second mobile drive mechanism (51), and the second mobile drive mechanism (51) drives the second gripping mechanism (53) to move along the second direction (X2) to drive the second gripping mechanism (53) to pass through each of the first feed ports.

5. The wafer loading and unloading device according to claim 2, characterized in that: The wafer loading and unloading device further comprises a second baffle (71), and the second baffle (71) is arranged on a side of the second transfer robot (50) away from the first baffle (70); the second carrier (20), the first transfer robot (40) and the flipping station (a1) are all located on a side of the second baffle (71) away from the first baffle (70); A second feed inlet is provided on the second baffle (71). When the flip assembly (30) is located at the flip station (a1), the flip assembly (30) can drive the flower basket (A) loaded therein to flip until the opening of the flower basket (A) is opposite to the second feed inlet.

6. The wafer loading and unloading device according to claim 5, characterized in that: The wafer loading and unloading device further comprises a third baffle (72), the third baffle (72) being arranged on a side of the second baffle (71) away from the first baffle (70), and the second carrier (20), the first transfer robot (40) and the flipping station (a1) are all located between the second baffle (71) and the third baffle (72); The loading and unloading station (a2) is located on a side of the third baffle (72) away from the second baffle (71), and the third baffle (72) is provided with a through opening for the turning assembly (30) to pass through.

7. The wafer loading and unloading device according to claim 6, characterized in that: The second carrier (20) is provided in plurality, and the plurality of second carriers (20) are arranged at intervals along the first direction (X1) on a side of the second baffle (71) facing the third baffle (72), each of the second carriers (20) having a plurality of loading positions arranged along the second direction (X2), each of the loading positions being used to carry a flower basket (A), and the first direction (X1) and the second direction (X2) intersect each other; The first transfer robot (40) includes a first mobile drive mechanism (41) and a first gripping mechanism (43), wherein the first mobile drive mechanism (41) is installed on the side of the third baffle (72) facing the second baffle (71), and the first gripping mechanism (43) is installed at the driving end of the first mobile drive mechanism (41); the first mobile drive mechanism (41) can controllably drive the first gripping mechanism (43) to move along the first direction (X1) and the second direction (X2) to drive the first gripping mechanism (43) to pass through each of the loading positions and the flipping station (a1).

8. The wafer loading and unloading device according to any one of claims 1 to 7, characterized in that: The turning assembly (30) comprises a third moving drive mechanism (31), a moving seat (32) and a turning frame (33), wherein the moving seat (32) is mounted on the third moving drive mechanism (31), and the turning frame (33) is arranged on the moving seat (32) and is used to carry the flower basket (A); The third moving drive mechanism (31) is used to drive the moving seat (32) to move between the turning station (a1) and the loading and unloading station (a2), and the turning frame (33) can be controlled to rotate relative to the moving seat (32), thereby driving the flower basket (A) carried on the turning frame (33) to turn over.

9. The wafer loading and unloading device according to claim 8, characterized in that: The turning frame (33) can be controlled to rotate relative to the moving seat (32) to a first state or a second state; When the turning frame (33) rotates to the first state, the opening of the flower basket (A) on the turning frame (33) faces upward; when the turning frame (33) rotates to the second state, the opening of the flower basket (A) on the turning frame (33) faces the first supporting member (10).

10. A chemical plating device, characterized in that: It comprises a wafer transfer device, a chemical plating device and a wafer loading and unloading device as claimed in any one of claims 1 to 9, wherein the wafer transfer device is used to transfer a flower basket (A) on the flip assembly (30) located at the loading and unloading station (a2) to the chemical plating device, and the chemical plating device is used to perform wafer chemical plating on the wafers (B) in the flower basket (A). The wafer transfer device is also used to transfer the flower basket (A) to the flip assembly (30) located at the loading and unloading station (a2) after completing the wafer chemical plating.

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