Intelligent detection and treatment system for chemical copper plating solution of PCB (Printed Circuit Board)

Abstract

The invention provides an intelligent chemical copper plating solution detection and treatment system for a PCB, and relates to the technical field of chemical copper plating solution detection, and the system comprises a solution detection unit which is used for generating copper plating solution parameters; the data processing unit is used for carrying out quality index calculation on the parameters of the copper plating solution to obtain an initial quality index of the copper plating solution; the control unit is used for adjusting components and process parameters of the chemical copper plating solution, calculating to obtain a copper plating solution quality index change trend for adjusting the parameters of the copper plating solution, generating a predicted copper plating solution quality index, and performing feedback control to obtain feedback control copper plating solution parameters; and the alarm unit is used for carrying out threshold value anomaly analysis and generating an alarm signal. According to the method and the device, the technical problems of low control precision and low efficiency caused by the fact that a traditional PCB chemical copper plating process mainly depends on artificial experience for control in the prior art can be solved, the technical target of intelligent detection treatment is achieved, and the technical effect of improving the control precision and efficiency is achieved.

Description

Technical Field

[0001] This application relates to the technical field of electroless copper plating solution detection, and particularly to an intelligent detection and processing system for electroless copper plating solution used in PCB. Background Art

[0002] Intelligent detection of electroless copper plating solution is mainly applied in fields such as PCB manufacturing, electronic component manufacturing, and surface treatment. In PCB manufacturing, real-time monitoring and control of electroless copper plating solution parameters are carried out to ensure the stability of the copper plating layer quality and improve the yield and reliability of PCB products. In electronic component manufacturing and surface treatment, it is used to monitor and control the composition and process parameters of the solution, improving product quality and production efficiency.

[0003] Currently, the existing PCB electroless copper plating process mainly relies on manual experience for control. It is difficult for manual operation to accurately control the composition and process parameters of the copper plating solution, resulting in unstable product quality. Manual control requires frequent sampling and analysis, which is time-consuming and laborious. The copper plating solution contains corrosive chemicals, and manual operation poses safety hazards.

[0004] In summary, there are technical problems in the prior art that due to the traditional PCB electroless copper plating process mainly relying on manual experience for control, the control accuracy is low and the efficiency is low, further affecting safety. Summary of the Invention

[0005] The purpose of this application is to provide an intelligent detection and processing system for electroless copper plating solution used in PCB, so as to solve the technical problems in the prior art that due to the traditional PCB electroless copper plating process mainly relying on manual experience for control, the control accuracy is low and the efficiency is low, further affecting safety.

[0006] In view of the above problems, this application provides an intelligent detection and processing system for electroless copper plating solution used in PCB.

[0007] This application provides an intelligent detection and processing system for electroless copper plating solution used in PCB, which includes: a solution detection unit for collecting multiple parameters of the electroless copper plating solution to generate copper plating solution parameters, including pH value, copper ion concentration, solution temperature, and redox potential; a data processing unit for receiving the copper plating solution parameters and calculating the quality index of the initial copper plating solution through a multivariate initial analysis function; a control unit for adjusting the composition and process parameters of the electroless copper plating solution, calculating the change trend of the quality index of the copper plating solution for adjusting the copper plating solution parameters, generating a predicted quality index of the copper plating solution, and performing feedback control to obtain the feedback control copper plating solution parameters; an alarm unit for performing threshold abnormality analysis based on the feedback control quality index of the copper plating solution, and generating an alarm signal if abnormal copper plating solution parameters are generated.

[0008] One or more technical solutions provided in this application have at least the following technical effects or advantages: There is a solution detection unit for collecting multiple parameters of the electroless copper plating solution to generate copper plating solution parameters, including pH value, copper ion concentration, solution temperature, and redox potential; a data processing unit for receiving the copper plating solution parameters and calculating the quality index of the initial copper plating solution through a multivariate initial analysis function; a control unit for adjusting the composition and process parameters of the electroless copper plating solution, calculating the change trend of the quality index of the copper plating solution for adjusting the copper plating solution parameters, generating a predicted copper plating solution quality index, and performing feedback control to obtain the feedback control copper plating solution parameters; and an alarm unit for performing threshold anomaly analysis based on the feedback control copper plating solution quality index. If abnormal copper plating solution parameters are generated, an alarm signal is generated. That is to say, through real-time monitoring and feedback control, the quality of the copper plating solution is ensured to be stable; through intelligent prediction and adjustment, production efficiency and product quality are improved; through the abnormal alarm function, problems can be discovered and processed in a timely manner, ultimately achieving the technical goal of intelligent detection and processing and achieving the technical effect of improving control accuracy and efficiency.

[0009] The above description is only an overview of the technical solutions of this application. In order to be able to more clearly understand the technical means of this application, it can be implemented in accordance with the content of the specification. And in order to make the above and other purposes, features, and advantages of this application more obvious and understandable, the following specific embodiments of this application are specifically given. It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of this application, nor is it used to limit the scope of this application. Other features of this application will become easily understandable through the following description. Brief Description of the Drawings

[0010] In order to more clearly illustrate the technical solutions in this application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings described below are only exemplary, and for those of ordinary skill in the art, other drawings can be obtained based on the provided drawings without creative efforts.

[0011] Figure 1 It is a schematic structural diagram of the intelligent detection and processing system for the electroless copper plating solution used in this application for PCB; Figure 2 It is a schematic flow diagram of the control unit in the intelligent detection and processing system for the electroless copper plating solution used in this application for PCB.

[0012] Description of the Reference Numerals: Solution detection unit 11, data processing unit 12, control unit 13, alarm unit 14. Detailed Description of the Embodiments

[0013] By providing an intelligent detection and processing system for electroless copper plating solution for PCB, the present application solves the technical problem in the prior art that due to the traditional PCB electroless copper plating process mainly relying on manual experience for control, the control accuracy is low and the efficiency is low, further affecting safety. The technical goal of intelligent detection and processing is achieved, and the technical effect of improving control accuracy and efficiency is achieved.

[0014] Next, the technical solutions in the present application will be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. It should be understood that the present application is not limited by the example embodiments described herein. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application. Additionally, it should be noted that for the sake of description, only the parts related to the present application are shown in the accompanying drawings rather than all of them.

[0015] Embodiment, please refer to the attached Figure 1 , the present application provides an intelligent detection and processing system for electroless copper plating solution for PCB, which specifically includes: A solution detection unit 11 for collecting multiple parameters of the electroless copper plating solution and generating copper plating solution parameters, including pH value, copper ion concentration, solution temperature, and redox potential.

[0016] Specifically, the intelligent detection and processing system for electroless copper plating solution for PCB is an integrated intelligent detection and processing system for detecting electroless copper plating solution in the PCB industry. The solution detection unit in the intelligent detection and processing system for electroless copper plating solution for PCB is responsible for real-time monitoring of the state of the electroless copper plating solution, and continuously collecting parameters such as the pH value, copper ion concentration, solution temperature, and redox potential of the solution through sensors and multiple instruments.

[0017] A data processing unit 12 for receiving the copper plating solution parameters and calculating a quality index of the copper plating solution through a multivariate initial analysis function to obtain an initial quality index of the copper plating solution.

[0018] Specifically, through in-depth analysis of the collected data by the data processing unit, the quality index of the copper plating solution is calculated, and the current state of the copper plating solution is quantitatively evaluated, reflecting the health status of the copper plating process.

[0019] A control unit 13 for adjusting the composition and process parameters of the electroless copper plating solution, calculating a change trend of the quality index of the copper plating solution for adjusting the copper plating solution parameters, generating a predicted quality index of the copper plating solution, and performing feedback control to obtain feedback control copper plating solution parameters.

[0020] Specifically, the control unit automatically adjusts the composition and key process parameters of the electroless copper plating solution according to the received parameter adjustment instructions, such as the amount of additives, temperature, stirring speed, etc., to optimize the copper plating process. The control unit can also predict and calculate the change trend of the adjusted solution parameters, and implement the feedback control strategy to feedback control the parameters of the copper plating solution, ensuring that the copper plating solution is always maintained within the optimal working range.

[0021] An alarm unit 14, which is used to perform threshold anomaly analysis based on the feedback control of the quality index of the copper plating solution, and generate an alarm signal if abnormal copper plating solution parameters are generated.

[0022] Specifically, the alarm unit continuously monitors the quality index of the copper plating solution after feedback control. When it is found that the quality index exceeds the preset normal range, it indicates that the solution parameters are abnormal, and then an alarm signal is triggered, ensuring that the operator can quickly take measures to prevent the production of unqualified products and guarantee the stable operation of the production line and product quality.

[0023] The intelligent detection and processing system for the electroless copper plating solution for PCB includes a solution detection unit for collecting multiple parameters of the electroless copper plating solution to generate copper plating solution parameters, including pH value, copper ion concentration, solution temperature, and redox potential; a data processing unit for receiving the copper plating solution parameters and calculating the quality index of the initial copper plating solution through a multivariate initial analysis function; a control unit for adjusting the composition and process parameters of the electroless copper plating solution, calculating the change trend of the quality index of the copper plating solution with the adjusted copper plating solution parameters, generating a predicted copper plating solution quality index, and performing feedback control to obtain the feedback control copper plating solution parameters; an alarm unit for performing threshold anomaly analysis based on the feedback control copper plating solution quality index, and generating an alarm signal if abnormal copper plating solution parameters are generated. That is to say, through real-time monitoring and feedback control, the quality of the copper plating solution is ensured to be stable. Through intelligent prediction and adjustment, the production efficiency and product quality are improved. Through the abnormal alarm function, problems can be discovered and processed in a timely manner, and the technical goal of intelligent detection and processing can be achieved, and the technical effect of improving the control accuracy and efficiency can be achieved.

[0024] Furthermore, this application also includes: A pH sensor for detecting the pH value; an ion-selective electrode for detecting the copper ion concentration; a temperature sensor for detecting the solution temperature; and a redox potentiometer for detecting the redox potential.

[0025] Specifically, in the intelligent detection and processing system for electroless copper plating solution used in PCB, the acidity and alkalinity of the solution, that is, the pH value, is measured by a pH sensor. The pH sensor consists of a glass electrode and a reference electrode, which can convert the pH value of the solution into an electrical signal for processing and analysis. The copper ion concentration in the solution is determined by an ion-selective electrode. The ion-selective electrode is selective to some ions and can accurately measure the concentration of copper ions. The potential difference between two electrodes is measured by the ion-selective electrode to determine the copper ion concentration. The temperature sensor is used to monitor the temperature of the copper plating solution in real time. Temperature is an important factor affecting the chemical reaction rate and the quality of copper plating, so precise control is required. The temperature sensor can convert the temperature change into an electrical signal for the intelligent detection and processing of the electroless copper plating solution used in PCB to read and process. The redox potentiometer is used to measure the redox potential of the solution and measure the redox state of the chemical substances in the solution. The redox potentiometer includes a working electrode and a reference electrode, and the redox potential of the solution is determined by measuring the potential difference between the two electrodes.

[0026] The stability of the copper plating process and the quality of the plated parts are ensured through sensors and measuring devices. By integrating multiple sensors, the state of the solution is monitored in real time, and the process parameters are automatically adjusted according to the monitoring data to maintain the best state of the copper plating process.

[0027] Furthermore, this application also includes: The multi-variable initial analysis function is as follows: ; where characterizes the quality index of the initial electroless copper plating solution, and a, b, c, d, and e respectively characterize the pH value regression coefficient, copper ion concentration regression coefficient, temperature regression coefficient, redox potential regression coefficient, and constant term.

[0028] Specifically, when the quality index of the initial electroless copper plating solution is the output result, it represents the comprehensive quality score of the copper plating solution. a, b, c, and d are regression coefficients, corresponding to the weights of the pH value, copper ion concentration, temperature, and redox potential respectively. The pH value regression coefficient, copper ion concentration regression coefficient, temperature regression coefficient, and redox potential regression coefficient are obtained through data analysis, reflecting the influence degree of each parameter on the quality of the copper plating solution. e is the constant term, representing the baseline value of the quality index of the electroless copper plating solution even in the case of no measured parameter changes.

[0029] By quantifying the influence of each parameter on the quality of the copper plating solution, real-time monitoring and adjustment are carried out to ensure the efficiency and stability of the copper plating process.

[0030] Furthermore, as Figure 2 shown, this application also includes: Receive an adjustment instruction, add reagents to the electroless copper plating solution, adjust the temperature of the electroless copper plating solution, and generate an adjusted copper plating solution; collect multiple parameters of the adjusted copper plating solution, use the Kalman filtering algorithm to denoise the parameters of the adjusted copper plating solution, and standardize the denoised copper plating solution parameters through a standardization formula to generate the standardized value of the copper plating solution parameters; calculate the quality index for the standardized value through a multivariate standard analysis function, analyze the change trend of the quality index, and generate predicted solution parameters; perform feedback control based on the predicted solution parameters to generate the feedback control copper plating solution parameters.

[0031] Specifically, in an intelligent detection and processing system for electroless copper plating solution used in PCB, when an adjustment instruction is received, reagents are automatically added to the electroless copper plating solution and the temperature is adjusted, such as adding acid or alkali to adjust the pH value or increasing the copper salt concentration, etc., to generate an adjusted copper plating solution.

[0032] Next, multiple parameters of the adjusted copper plating solution will be collected, and the Kalman filtering algorithm will be used to denoise the multiple parameters. Kalman filtering is an effective signal processing technique that can estimate the state of a dynamic system from data containing noise. Through denoising, the accuracy of the parameters and the stability of the system can be improved. The denoised copper plating solution parameters will then be standardized through a standardization formula to generate standardized values. Standardization helps to eliminate the dimensional influence between different parameters, enabling comparison and analysis on the same scale.

[0033] Then, a multivariate standard analysis function is used to calculate the quality index for the standardized value, which is used to process the standardized data. By analyzing the change trend of the quality index, the future state of the solution is predicted, and predicted solution parameters are generated.

[0034] Finally, based on the predicted solution parameters, feedback control is performed to automatically adjust the composition and process parameters of the electroless copper plating solution, so as to achieve precise control of the copper plating solution, ensure that the copper plating process can proceed continuously and stably, and thus improve the product quality and production efficiency.

[0035] Furthermore, this application also includes: The standardization formula is as follows: ; where represents the standardized value of the i-th copper plating solution parameter, represents the measured value of the i-th copper plating solution parameter, represents the mean value of the i-th copper plating solution parameter, represents the standard deviation of the i-th copper plating solution parameter.

[0036] Specifically, the standardized value It is the result after the standardization process of the copper plating solution parameters, representing the degree of deviation of the copper plating solution parameters from the average value, expressed as a multiple of the standard deviation. The measured value of the i-th copper plating solution parameter is the actual measurement result of the copper plating solution parameters. The mean value of the i-th copper plating solution parameter is the average measured value of the copper plating solution parameters over a period of time, representing the normal level of the parameters. The standard deviation of the i-th copper plating solution parameter is a statistical measure of the distribution of the measured values of the copper plating solution parameters over a period of time, reflecting the degree of fluctuation of the parameter values.

[0037] By converting the measured value of each copper plating solution parameter into a dimensionless standardized value, it becomes easier to compare and analyze. The standardization process helps to eliminate the dimensional effects between different parameters, ensuring that each parameter is treated fairly in multivariate analysis, thereby improving the accuracy and reliability of the analysis results.

[0038] Furthermore, this application also includes: The multivariate standard analysis function is as follows: ; where represents the copper plating solution quality index, n represents the number of copper plating solution parameters, represents the standardization coefficient of the i-th copper plating solution parameter, and k represents the bias term.

[0039] Specifically, the multivariate standard analysis function is used to calculate the copper plating solution quality index, converting the standardized copper plating solution parameters into a quality index for better understanding and control of the copper plating process. In the multivariate standard analysis function, the copper plating solution quality index is the output result, used to evaluate the overall performance and health status of the copper plating solution. The standardization coefficient is the weight of the i-th copper plating solution parameter, representing the degree of influence of the copper plating solution parameter on the copper plating solution quality index, reflecting the relative importance of different parameters in the copper plating process. k is the bias term, used to adjust the baseline value of the quality index.

[0040] The multivariate standard analysis function evaluates and predicts the quality of the copper plating solution based on the standardized values of the copper plating solution parameters. By means of the quality index, it ensures the stability of the copper plating process and the quality of the plated parts, providing a more comprehensive quality assessment.

[0041] Furthermore, this application also includes: Based on the set of sample copper plating solution quality indices, a prediction model for copper plating solution parameters is constructed using a long short-term memory network; the initial copper plating solution quality index and the standardized value are analyzed and predicted through the copper plating solution parameter prediction model to generate the predicted copper plating solution quality index; according to the output accuracy rate of the copper plating solution parameter prediction model, the backpropagation algorithm is used to optimize the copper plating solution parameter prediction model.

[0042] Specifically, in order to more accurately predict the quality index of the copper plating solution, a prediction model based on a long short-term memory network is adopted. The long short-term memory network is a type of recurrent neural network that can learn long-term dependency information and is suitable for processing and predicting time series data.

[0043] First, a prediction model for copper plating solution parameters is constructed according to the collected set of sample copper plating solution quality indices. The set of sample copper plating solution quality indices contains historical data and is used to train the copper plating solution parameter prediction model, enabling the copper plating solution parameter prediction model to capture the law of change of copper plating solution parameters over time.

[0044] Next, the copper plating solution parameter prediction model is used to analyze and predict the initial copper plating solution quality index and the standardized value, generating the predicted copper plating solution quality index, which is used to predict the future state of the copper plating solution, helping the operator to make timely adjustments to ensure the stability of the copper plating process.

[0045] To improve the accuracy of the copper plating solution parameter prediction model, the model is optimized according to the output accuracy rate of the model. The backpropagation algorithm is a neural network training algorithm that reduces the prediction error by calculating the prediction error and updating the weights of the network in reverse. Through continuous training and optimization, the copper plating solution parameter prediction model can better learn and adapt to the changes in the copper plating process, improving the prediction accuracy.

[0046] Through intelligent means, not only the production efficiency and product quality are improved, but also human errors and resource waste are reduced, realizing the intelligentization and automation of industrial production.

[0047] Furthermore, this application also includes: An anomaly analysis unit for judging the quality index of the feedback-controlled copper plating solution. If the copper plating solution quality index threshold is not met, abnormal copper plating solution parameters are extracted and an alarm signal is generated; a display unit for displaying the normal copper plating solution parameters that meet the copper plating solution quality index threshold.

[0048] Specifically, the anomaly analysis unit judges the quality index of the copper plating solution after feedback control to determine whether the state of the solution meets the preset quality index threshold. If the quality index is lower or higher than the specified threshold range, the anomaly analysis unit will determine that there is an anomaly in the copper plating solution and take immediate action.

[0049] When an anomaly is detected, the anomaly analysis unit extracts relevant abnormal copper plating solution parameters, including pH value, copper ion concentration, solution temperature, redox potential, etc. The abnormal changes in the parameters may be caused by various factors, such as the instability of chemical reactions, changes in the external environment, or equipment failures.

[0050] Once the abnormal copper plating solution parameters are extracted, an alarm signal is generated. The alarm signal is promptly notified to the operator or the maintenance team through the display unit or other communication means, so that they can respond quickly and take necessary measures, including adjusting the solution composition, checking the equipment status, or changing the process parameters, etc., to ensure the normal progress of the copper plating process and the quality of the product.

[0051] Meanwhile, the display unit is also used to display the normal copper plating solution parameters that meet the copper plating solution quality index threshold, which helps the operator monitor the copper plating process and ensure that the solution is in a normal working state. The display unit not only provides real-time data feedback but also enhances the interactivity and user-friendliness of the system.

[0052] Through the real-time monitoring, data analysis, alarm prompting, and visual display of the anomaly analysis unit and the display unit, the management efficiency of the copper plating process and the product quality are improved.

[0053] In summary, the intelligent detection and processing system for electroless copper plating solution for PCB provided by this application has the following technical effects: Through the solution detection unit, which is used to collect multiple parameters of the electroless copper plating solution and generate copper plating solution parameters, including pH value, copper ion concentration, solution temperature, and redox potential; the data processing unit, which is used to receive the copper plating solution parameters and calculate the quality index of the initial copper plating solution through a multivariate initial analysis function; the control unit, which is used to adjust the composition and process parameters of the electroless copper plating solution, calculate the changing trend of the quality index of the adjusted copper plating solution parameters, generate a predicted copper plating solution quality index, and perform feedback control to obtain the feedback control copper plating solution parameters; the alarm unit, which is used to perform threshold anomaly analysis based on the feedback control copper plating solution quality index. If abnormal copper plating solution parameters are generated, an alarm signal is generated. That is to say, through real-time monitoring and feedback control, the quality of the copper plating solution is ensured to be stable. Through intelligent prediction and adjustment, the production efficiency and product quality are improved. Through the abnormal alarm function, problems can be discovered and handled in a timely manner, and finally the technical goal of intelligent detection and processing is achieved, and the technical effect of improving the control accuracy and efficiency is achieved.

[0054] The foregoing description of the disclosed embodiments enables those skilled in the art to practice or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Thus, the present application is not intended to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0055] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the present application and its equivalent technologies, the present application is also intended to include these changes and modifications.

Claims

1. Intelligent detection and processing system for chemical copper plating solution for PCB, characterized in that: include: A solution detection unit is used to collect multiple parameters of the chemical copper plating solution and generate copper plating solution parameters, including pH value, copper ion concentration, solution temperature and redox potential; A data processing unit, configured to receive the copper plating solution parameters, and calculate the quality index of the copper plating solution parameters by using a multivariate initial analysis function to obtain an initial copper plating solution quality index; A control unit is used to adjust the composition and process parameters of the chemical copper plating solution, calculate and obtain the change trend of the copper plating solution quality index for adjusting the copper plating solution parameters, generate a predicted copper plating solution quality index, and perform feedback control to obtain feedback-controlled copper plating solution parameters; An alarm unit is used to perform threshold abnormality analysis according to the feedback control copper plating solution quality index, and generate an alarm signal if an abnormal copper plating solution parameter is generated.

2. The intelligent detection and processing system for chemical copper plating solution for PCB according to claim 1, characterized in that: The solution detection unit comprises: A pH sensor, used to detect the pH value; An ion selective electrode, used for detecting the copper ion concentration; A temperature sensor, used to detect the temperature of the solution; The redox potential meter is used to detect the redox potential.

3. The intelligent detection and processing system for chemical copper plating solution for PCB according to claim 1, characterized in that: The multivariate initial analysis function is as follows: ； in, Characterize the quality index of the initial copper plating solution, a, b, c, d and e represent the pH regression coefficient, copper ion concentration regression coefficient, temperature regression coefficient, redox potential regression coefficient and constant term respectively.

4. The intelligent detection and processing system for chemical copper plating solution for PCB according to claim 1, characterized in that: The control unit is used for: receiving an adjustment instruction, adding reagents to the chemical copper plating solution, adjusting the temperature of the chemical copper plating solution, and generating an adjusted copper plating solution; Collecting a plurality of parameters of the copper plating solution for adjustment, performing denoising processing on the parameters of the copper plating solution by using a Kalman filter algorithm, and performing standardization processing on the denoised copper plating solution parameters by using a standardization formula to generate standardized values ​​of the copper plating solution parameters; Calculate the quality index of the standardized value by a multivariate standard analysis function, analyze the quality index change trend, and generate predicted solution parameters; Feedback control is performed according to the predicted solution parameters to generate the feedback-controlled copper plating solution parameters.

5. The intelligent detection and processing system for chemical copper plating solution for PCB according to claim 4, characterized in that: The normalization formula is as follows: ； in, Characterizes the standardized value of the i-th copper plating solution parameter, The measured value characterizing the parameters of the i-th copper plating solution, Characterizes the mean value of the i-th copper plating solution parameter, Characterizes the standard deviation of the i-th copper plating solution parameter.

6. The intelligent detection and processing system for chemical copper plating solution for PCB according to claim 5, characterized in that: The multivariate standard analysis function is as follows: ； in, Characterizes the quality index of copper plating solution, n characterizes the number of copper plating solution parameters, Characterizes the standardized coefficient of the i-th copper plating solution parameter, and k characterizes the bias term.

7. The intelligent detection and processing system for chemical copper plating solution for PCB according to claim 6, characterized in that: The control unit is also used for: According to the sample copper plating solution quality index set, a copper plating solution parameter prediction model is constructed based on the long short-term memory network; Analyzing and predicting the initial copper plating solution quality index and the standardized value by using the copper plating solution parameter prediction model to generate the predicted copper plating solution quality index; According to the output accuracy of the copper plating solution parameter prediction model, a back propagation algorithm is used to optimize the copper plating solution parameter prediction model.

8. The intelligent detection and processing system for chemical copper plating solution for PCB according to claim 1, characterized in that: The alarm unit comprises: an abnormality analysis unit, used to determine the quality index of the feedback-controlled copper plating solution, and if the copper plating solution quality index threshold is not met, extract abnormal copper plating solution parameters and generate an alarm signal; The display unit is used to display normal copper plating solution parameters that meet the copper plating solution quality index threshold.

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