Transfer mechanism of semiconductor substrate wafer

Abstract

The utility model relates to the technical field of substrate wafer transfer, and discloses a semiconductor substrate wafer transfer mechanism which comprises a supporting bottom frame, a vertical plate is fixedly connected to the front face of the supporting bottom frame, an installation plate is fixedly connected to the top of the front face of the vertical plate, and a transfer mechanism is arranged at the bottom of the installation plate. The free end of the electric push rod drives the suction cup to be tightly attached to the top of the substrate wafer body, air in the suction cup is exhausted through the one-way valve along with continuous descending of the electric push rod, so that vacuum is formed in the suction cup, the substrate wafer body is firmly adsorbed, and a user can move the limiting block to one end of the transferring track. And then the one-way valve is opened, the one-way valve enables the air pressure inside and outside the suction cup to be consistent, the suction cup does not adsorb the substrate wafer body at the moment, the substrate wafer body can be transferred to a proper position, the substrate wafer body can be safely and stably adsorbed and released, and risks in manual operation are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of transferring substrate wafers, in particular to a transferring mechanism for semiconductor substrate wafers. Background Art

[0002] The transfer mechanism of conductor substrate wafers is a key part in semiconductor manufacturing equipment. It is responsible for safely and accurately moving wafers between various processing stations of the equipment. These transfer mechanisms must be very precise and reliable to avoid damage to the wafers.

[0003] According to the Chinese patent authorization announcement: CN219759544U, the disclosed semiconductor wafer transfer mechanism includes at least one material platform and a horizontal manipulator structure to form a structure for clamping semiconductor wafers, which is specifically used to clamp semiconductor wafers to improve the efficiency of clamping. Specifically, the wafer box storing the wafers is positioned on the material platform, and the horizontal manipulator moves to the wafer box position. The manipulator structure is composed of a horizontal moving mechanism, a rotating mechanism and a lifting mechanism, as well as a clamping claw device arranged on the rotating mechanism. The horizontal moving mechanism and the lifting mechanism control the movement of the manipulator in the horizontal and vertical directions. After reaching the specified position, the rotating mechanism drives the clamping claw device to point to the wafer box position, and the moving bottom plate of the clamping claw device moves forward and stops at the limit block position. The cylinder on the connecting plate of the clamping device works, and the push rod of the cylinder pushes the clamping block forward and tightens the tray for storing the wafers. However, there are still some problems in the use of the transfer device. Although the robotic arms of some transfer mechanisms can clamp the wafers and move them, the robotic arms need to be calibrated frequently during long-term use. If the robotic arms are not calibrated in time, the clamping force is too large or the clamping method is improper, which may cause physical damage to the wafer, such as scratches or indentations, which will cause the yield of the wafer to decrease. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a transfer mechanism for semiconductor substrate wafers, which solves the problem that the clamping force of the mechanical arms of some transfer mechanisms is too large or the clamping method is improper, which may cause physical damage to the wafer.

[0005] To achieve the above purpose, the utility model is implemented through the following technical solutions: a transfer mechanism for semiconductor substrate wafers, including a supporting base frame, a vertical plate fixedly connected to the front of the supporting base frame, a mounting plate fixedly connected to the top of the front of the vertical plate, a transfer mechanism is provided at the bottom of the mounting plate, the transfer mechanism includes a motor, a tray, a slot, a screw rod, a limit plate, a limit slide rail, a limit slider, a connecting plate, a transfer rail, a limit block, an electric push rod, a one-way valve, a suction cup, a movable support and an extension plate, the output end of the motor passes through the mounting plate and is fixedly connected to the screw rod, the middle of the screw rod A movable support is threadedly connected, and both sides of the movable support are fixedly connected with extension plates, and both ends of the two extension plates are fixedly connected with limit sliders, and both sides of the front of the vertical plate are fixedly connected with limit slide rails, and the tops of the two extension plates are fixedly connected with connecting plates, and the front of the connecting plates is fixedly connected with a transfer track, and the middle part of the transfer track is slidably connected with a limit block, and the bottom end of the limit block is fixedly connected with an electric push rod, and the free end of the electric push rod is fixedly connected with a suction cup, and the front of the movable support is fixedly connected with a tray, and a substrate wafer body is placed inside the tray;

[0006] A counting mechanism is provided inside the tray, and the counting mechanism includes a support plate, a reset spring, a trigger rod and a push-type counter. A plurality of reset springs are fixedly connected to the bottom end of the support plate, and a push-type counter is snap-connected to the inner wall of the bottom end of the tray. A trigger rod is provided on the top of the push-type counter.

[0007] Preferably, the bottom end of the motor is fixedly connected to the top end of the mounting plate.

[0008] Preferably, the bottom end of the screw rod is rotatably connected to a limit plate, and the inner side of the limit plate is fixedly connected to the front side of the vertical plate.

[0009] Preferably, the two limit sliding blocks are slidably connected to the two limit sliding rails respectively.

[0010] Preferably, a one-way valve is provided at the top of the suction cup.

[0011] Preferably, the outer wall of the support plate is slidably connected to the inner wall of the tray.

[0012] Preferably, the bottom ends of the plurality of return springs are fixedly connected to the inner wall of the bottom end of the tray.

[0013] Preferably, the top end of the trigger rod is fixedly connected to the bottom end of the support plate, and the bottom end of the substrate wafer body is attached to the top end of the support plate.

[0014] Beneficial Effects

[0015] The utility model provides a semiconductor substrate wafer transfer mechanism. Compared with the prior art, it has the following beneficial effects:

[0016] 1. In the utility model, through the transfer mechanism, the free end of the electric push rod drives the suction cup to fit closely to the top of the substrate wafer body. As the electric push rod continues to descend, the air inside the suction cup is discharged through the one-way valve, thereby forming a vacuum inside, firmly adsorbing the substrate wafer body. The user can move the limit block to one end of the transfer track, and then open the one-way valve. The one-way valve makes the air pressure inside and outside the suction cup consistent. The suction cup no longer adsorbs the substrate wafer body at this time, and the substrate wafer body can be transferred to a suitable position. The substrate wafer body can be adsorbed and released safely and stably, reducing the risk of manual operation and facilitating subsequent processing.

[0017] 2. In the utility model, through the setting of the counting mechanism, when the user places the substrate wafer body on the pallet, the gravity of the substrate wafer body will drive the pallet to descend, and the descent of the substrate wafer body and the pallet squeezes multiple reset springs, which can provide a certain buffer for placing the substrate wafer body and avoid the bottom end of the substrate wafer body from colliding with the pallet and causing damage. The descending pallet can drive the trigger rod to squeeze the push-type counter, and the push-type counter can count once. The counting can help factory managers track the number of substrate wafer bodies in each processing step to ensure that no substrate wafer body is lost or processed repeatedly. When the user moves out the substrate wafer body, the multiple reset springs can drive the pallet to reset, and at this time the bottom end of the trigger rod is away from the top of the push-type counter. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a three-dimensional structural schematic diagram of a semiconductor substrate wafer transfer mechanism proposed by the utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the electric push rod part of a semiconductor substrate wafer transfer mechanism proposed by the utility model;

[0020] Figure 3 This is a structural cross-sectional view of a tray portion of a semiconductor substrate wafer transfer mechanism proposed by the utility model;

[0021] Figure 4 The utility model provides a semiconductor substrate wafer transfer mechanism Figure 3 Enlarged view of point A in the middle.

[0022] Legend:

[0023] 1. Support chassis; 2. Vertical plate; 3. Transfer mechanism; 301. Motor; 302. Slot; 303. Screw rod; 304. Limit plate; 305. Limit slide rail; 306. Limit slider; 307. Connecting plate; 308. Transfer track; 309. Limit block; 310. Electric push rod; 311. One-way valve; 312. Suction cup; 313. Mobile support; 314. Extension plate; 315. Tray; 4. Mounting plate; 5. Substrate wafer body; 6. Counting mechanism; 601. Support plate; 602. Reset spring; 603. Trigger rod; 604. Push-type counter. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] See also Figure 1 - Figure 4 The utility model provides two technical solutions, which specifically include the following embodiments:

[0026] Embodiment 1:

[0027] A transfer mechanism for semiconductor substrate wafers, comprising a support base frame 1, a vertical plate 2 is fixedly connected to the front of the support base frame 1, a mounting plate 4 is fixedly connected to the top of the front of the vertical plate 2, a transfer mechanism 3 is arranged at the bottom of the mounting plate 4, and the transfer mechanism 3 comprises a motor 301, a tray 315, a slot 302, a screw rod 303, a limit plate 304, a limit slide rail 305, a limit slider 306, a connecting plate 307, a transfer rail 308, a limit block 309, an electric push rod 310, a one-way valve 311, Suction cup 312, movable support 313 and extension plate 314, the output end of motor 301 passes through mounting plate 4 and is fixedly connected with screw rod 303, the middle part of screw rod 303 is threadedly connected with movable support 313, both sides of movable support 313 are fixedly connected with extension plates 314, both ends of two extension plates 314 are fixedly connected with limit slider 306, both sides of the front side of vertical plate 2 are fixedly connected with limit slide rail 305, the top ends of two extension plates 314 are fixedly connected with connecting plate 307, connecting plate 3 The front of 07 is fixedly connected with a transfer track 308, and the middle of the transfer track 308 is slidably connected with a limit block 309. There is a certain damping at the sliding connection between the limit block 309 and the transfer track 308. The limit block 309 will not move without human movement. The bottom end of the limit block 309 is fixedly connected with an electric push rod 310, and the free end of the electric push rod 310 is fixedly connected with a suction cup 312. The front of the mobile support 313 is fixedly connected with a tray 315, and the tray 315 is made of soft silicone material. The tray 315 is made of high quality to avoid damaging the substrate wafer body 5. The substrate wafer body 5 is placed inside the tray 315. The bottom end of the motor 301 is fixedly connected to the top of the mounting plate 4. The bottom end of the screw rod 303 is rotatably connected to the limit plate 304. The limit plate 304 is used to support and limit the screw rod 303. The inner side of the limit plate 304 is fixedly connected to the front side of the vertical plate 2. The two limit sliders 306 are slidably connected to the two limit rails 305 respectively. A one-way valve 311 is arranged on the top of the suction cup 312.

[0028] During operation, when the substrate wafer body 5 needs to be transferred, the substrate wafer body 5 is placed on the tray 315, and then the user starts the motor 301, and the output end of the motor 301 drives the lead screw 303 to rotate, and the lead screw 303 drives the movable support 313 to move vertically. The cooperation between the motor 301 and the lead screw can accurately control the lifting and movement of the substrate wafer body 5 to ensure the accuracy of the operation. The movable support 313 rises together with the extension plate 314 and the tray 315 and other components. When it rises to a suitable height, the user can push the limit block 309 and place the limit block 309 on the top of the substrate wafer body 5. The user starts the electric push rod 310, and the free end of the electric push rod 310 is The movable suction cup 312 fits tightly against the top of the substrate wafer body 5. As the electric push rod 310 continues to descend, the air inside the suction cup 312 is discharged through the one-way valve 311, thereby forming a vacuum inside and firmly adsorbing the substrate wafer body 5. The user can move the limit block 309 to one end of the transfer track 308, and then open the one-way valve 311. The one-way valve 311 makes the air pressure inside and outside the suction cup 312 consistent. The suction cup 312 no longer adsorbs the substrate wafer body 5 at this time, and the substrate wafer body 5 can be moved to a suitable position. The substrate wafer body 5 can be adsorbed and released safely and stably, reducing the risk of human operation and facilitating subsequent processing.

[0029] Embodiment 2:

[0030] On the basis of the first embodiment, a counting mechanism 6 is provided inside the tray 315, and the counting mechanism 6 includes a support plate 601, a reset spring 602, a trigger rod 603 and a push-type counter 604. The bottom end of the support plate 601 is fixedly connected with a plurality of reset springs 602, and the inner wall of the bottom end of the tray 315 is snap-connected with a push-type counter 604. The specific model of the push-type counter 604 is CometC2000. When the top of the push-type counter 604 is pressed, the push-type counter 604 can count once, and the push-type counter 604 can accumulate substrate wafers. The number of times the main body 5 is placed on the pallet 601 is recorded, thereby recording the number of times the current pallet 315 moves the substrate wafer main body 5. A trigger rod 603 is provided on the top of the push-type counter 604. The outer wall of the pallet 601 is slidably connected to the inner wall of the pallet 315. The bottom ends of multiple reset springs 602 are fixedly connected to the inner wall of the bottom end of the pallet 315. The elastic force of the reset spring 602 is relatively small, and its elastic force can only support the weight of the pallet 601. The top end of the trigger rod 603 is fixedly connected to the bottom end of the pallet 601, and the bottom end of the substrate wafer main body 5 is attached to the top end of the pallet 601.

[0031] When the user places the substrate wafer body 5 on the pallet 601, the gravity of the substrate wafer body 5 will drive the pallet 601 to descend. The descent of the substrate wafer body 5 and the pallet 601 will squeeze the multiple reset springs 602, which can provide a certain buffer for placing the substrate wafer body 5 to avoid the bottom end of the substrate wafer body 5 colliding with the pallet 601 and causing damage. The descending pallet 601 can drive the trigger rod 603 to squeeze the push-type counter 604, and the push-type counter 604 can count once. The counting can help factory managers track the number of substrate wafer bodies 5 in each processing step to ensure that no substrate wafer body 5 is lost or processed repeatedly. When the user moves out the substrate wafer body 5, the multiple reset springs 602 can drive the pallet 601 to reset. At this time, the bottom end of the trigger rod 603 is away from the top of the push-type counter 604.

[0032] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the application should be included in the protection scope of the present application.

Claims

1. A semiconductor substrate wafer transfer mechanism, comprising a supporting frame (1), characterized in that: The front of the support base frame (1) is fixedly connected to a vertical plate (2), the top of the front of the vertical plate (2) is fixedly connected to a mounting plate (4), the bottom of the mounting plate (4) is provided with a transfer mechanism (3), the transfer mechanism (3) comprises a motor (301), a tray (315), a slot (302), a screw rod (303), a limit plate (304), a limit slide rail (305), a limit slider (306), a connecting plate (307), a transfer rail (308), a limit block (309), an electric push rod (310), a one-way valve (311), a suction cup (312), a movable support (313) and an extension plate (314), the output end of the motor (301) passes through the mounting plate (4) and is fixedly connected to the screw rod (303), the middle part of the screw rod (303) is threadedly connected to the movable support (313), and the movable support (313) is connected to the movable support (313). Both sides of the movable support (313) are fixedly connected with extension plates (314), both ends of the two extension plates (314) are fixedly connected with limit sliders (306), both sides of the front of the vertical plate (2) are fixedly connected with limit slide rails (305), the top ends of the two extension plates (314) are fixedly connected with connecting plates (307), the front of the connecting plates (307) is fixedly connected with a transfer track (308), the middle of the transfer track (308) is slidably connected with a limit block (309), the bottom end of the limit block (309) is fixedly connected with an electric push rod (310), the free end of the electric push rod (310) is fixedly connected with a suction cup (312), the front of the movable support (313) is fixedly connected with a tray (315), and the substrate wafer body (5) is placed inside the tray (315); A counting mechanism (6) is provided inside the tray (315), and the counting mechanism (6) comprises a support plate (601), a reset spring (602), a trigger rod (603) and a push-type counter (604); a plurality of reset springs (602) are fixedly connected to the bottom end of the support plate (601); a push-type counter (604) is snap-connected to the inner wall of the bottom end of the tray (315); and a trigger rod (603) is provided on the top of the push-type counter (604).

2. The semiconductor substrate wafer transfer mechanism according to claim 1, characterized in that: The bottom end of the motor (301) is fixedly connected to the top end of the mounting plate (4).

3. The semiconductor substrate wafer transfer mechanism according to claim 1, characterized in that: The bottom end of the screw rod (303) is rotatably connected to a limiting plate (304), and the inner side of the limiting plate (304) is fixedly connected to the front side of the vertical plate (2).

4. The semiconductor substrate wafer transfer mechanism according to claim 1, characterized in that: The two limiting sliding blocks (306) are respectively slidably connected to the two limiting sliding rails (305).

5. The semiconductor substrate wafer transfer mechanism according to claim 1, characterized in that: A one-way valve (311) is provided at the top end of the suction cup (312).

6. The semiconductor substrate wafer transfer mechanism according to claim 1, characterized in that: The outer wall of the support plate (601) is slidably connected to the inner wall of the tray (315).

7. The semiconductor substrate wafer transfer mechanism according to claim 1, characterized in that: The bottom ends of the plurality of return springs (602) are fixedly connected to the inner wall of the bottom end of the tray (315).

8. The semiconductor substrate wafer transfer mechanism according to claim 1, characterized in that: The top end of the trigger rod (603) is fixedly connected to the bottom end of the support plate (601), and the bottom end of the substrate wafer body (5) is attached to the top end of the support plate (601).

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