Direction-dividing sieve tray for GPP chips

Abstract

The utility model relates to the technical field of direction separation of GPP chips, in particular to a direction separation sieve tray for GPP chips, which is characterized in that a surrounding frame is arranged on the periphery of the upper end face of a sieve tray body, screening holes are formed in the upper end face of the sieve tray body, a rotating shaft is arranged in the middle of the sieve tray body in a penetrating manner, the sieve tray body is rotatably connected with the rotating shaft, and two ends of the rotating shaft are fixedly mounted on a base. The sieve tray body can slide on the rotating shaft, and an air hole group is formed in the bottom of the screening hole and connected with a vacuum pump; the sieve tray body is rotatably mounted on the rotating shaft and can slide on the rotating shaft, chips to be divided are placed on the sieve tray body, the sieve tray body is pulled to slide on the rotating shaft and rotate at a small angle, the chips slide and fall into the screening holes, the air hole group is connected with the vacuum pump to adsorb the chips, and then the sieve tray body is turned over. When the chip is adsorbed, the chip which is not adsorbed can be separated from the sieve tray body, so that the direction separation operation is completed, the efficiency is improved, and the damage to the chip can be avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of GPP chip separation, in particular to a GPP chip separation screen. Background Art

[0002] Chips are a very important part of modern electronic technology. They are the core for storing and processing information. Among them, the GPP chip can adapt to various application requirements through its highly flexible and programmable characteristics. It also has the characteristics of high performance, multi-core, scalability and low power consumption, and is widely used in equipment and systems in various fields. The N-end face and P-end face of the chip are the main components of the chip. They have different functions respectively. During the packaging process, the chip needs to be operated in different directions. The existing direction-dividing operation mostly relies on manual operation with tweezers to make the chip uniform in direction. Not only is the operation complicated, inefficient and error-prone, but it is also easy to damage the chip. Summary of the invention

[0003] In order to overcome the technical problems that manual chip separation is complicated, inefficient, error-prone, and easily causes damage to the chip, the utility model provides a GPP chip separation sieve plate.

[0004] The utility model provides a directional sieve disc for a GPP chip adopts the following technical solution:

[0005] A directional sieve plate for a GPP chip comprises a sieve plate body, wherein a surrounding frame is arranged around the upper end surface of the sieve plate body, screening holes are arranged on the upper end surface of the sieve plate body, a rotating shaft is arranged through the middle of the sieve plate body, the sieve plate body is rotatably connected to the rotating shaft, both ends of the rotating shaft are fixedly mounted on a base, the sieve plate body can slide on the rotating shaft, an air hole group is arranged at the bottom of the screening hole, and the air hole group is connected to a vacuum pump.

[0006] By adopting the above technical scheme, the sieve plate body is rotatably installed on the rotating shaft, and the sieve plate body can slide on the rotating shaft. When the chips to be separated are placed on the sieve plate body, the sieve plate body is pulled to slide back and forth and rotate at a small angle on the rotating shaft, and the chips to be separated slide and fall into the screening holes. The air hole group is connected to the vacuum pump to adsorb the chips, and then the sieve plate body is flipped over. The chips that have not fallen into the screening holes and the chips with the wrong directions can be detached from the sieve plate body, thereby completing the chip separation operation. It is not only simple to operate and improves efficiency, but also can avoid damage to the chips.

[0007] Preferably, the size of the bottom surface of the screening hole is the same as the N surface of the screened chip, and the screening hole is configured as a concave platform with a gradually increasing opening.

[0008] Preferably, the air hole group includes an exhaust hole arranged at the bottom of the screening hole and an intake hole opened at the bottom of the sieve plate body, the two groups of exhaust holes are respectively arranged at the diagonals of the screening hole, the two groups of exhaust holes are connected, the intake holes are connected to the exhaust holes, and the intake holes are connected to the vacuum pump.

[0009] By adopting the above technical solution, by setting the exhaust hole at the diagonal of the screening hole, since the size of the N side is larger than the P side, when the P side of the chip falls into the screening hole, the screening hole cannot be completely filled, that is, the exhaust hole cannot be completely covered, so that there is air leakage when the suction hole and the vacuum pump adsorb the chip, so that the chip with the P side falling into the screening hole cannot be sucked, and when the sieve plate body is turned over, the chip with the wrong direction will fall out of the screening hole, and the chip with the N side falling into the screening hole will be completely sucked, thereby improving the accuracy of the separation.

[0010] Preferably, a collecting tray is provided below the sieve tray body.

[0011] By adopting the above technical solution and arranging a collecting tray below the sieve tray body, the chips that have not correctly fallen into the screening holes can be caught after the sieve tray body is turned over so as to be processed separately again.

[0012] Preferably, a handle is provided on the side of the sieve plate body.

[0013] By adopting the above technical solution, by providing a handle on the side of the sieve plate body, not only the sliding and rotating operations of the sieve plate body on the rotating shaft can be facilitated, but also the flipping operation of the sieve plate body can be facilitated, making the directional operation simpler and more efficient.

[0014] Preferably, the area of ​​the collecting tray is larger than the area of ​​the sieve tray body.

[0015] In summary, the utility model has the following beneficial effects:

[0016] 1. The utility model provides a GPP chip separation sieve plate, which is achieved by rotating the sieve plate body on a rotating shaft, and the sieve plate body can slide on the rotating shaft. When the chips to be separated are placed on the sieve plate body, the sieve plate body is pulled to slide back and forth and rotate at a small angle on the rotating shaft, and the chips to be separated slide and fall into the screening holes. The air hole group is connected to the vacuum pump to adsorb the chips, and then the sieve plate body is turned over. The chips that have not fallen into the screening holes and the chips that are not facing the right direction can be detached from the sieve plate body, thereby completing the chip separation operation. It is not only simple to operate and improves efficiency, but also can avoid damage to the chips.

[0017] 2. The utility model provides a directional sieve plate for GPP chips, in which the exhaust holes are arranged at the diagonal positions of the screening holes. Since the size of the N side is larger than that of the P side, when the P side of the chip falls into the screening hole, the screening hole cannot be completely filled, that is, the exhaust holes cannot be completely covered, so that there is leakage when the suction hole and the vacuum pump adsorb the chip, and the chip with the P side falling into the screening hole cannot be adsorbed. When the sieve plate body is turned over, the chip with the wrong direction will fall out of the screening hole, and the chip with the N side falling into the screening hole will be completely adsorbed, thereby improving the accuracy of the directional separation.

[0018] 3. The utility model provides a GPP chip separation sieve plate, which, by arranging a collecting plate under the sieve plate body, can catch the chips that have not correctly fallen into the screening holes after the sieve plate body is flipped over, so as to perform separation processing on them again; by arranging a handle on the side of the sieve plate body, it is not only convenient for the sliding and rotating operations of the sieve plate body on the rotating shaft, but also convenient for the flipping operation of the sieve plate body, making the separation operation simpler and more efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of a directional sieve plate of a GPP chip of the utility model;

[0020] Figure 2 A top view of the sieve plate body of the directional sieve plate of the GPP chip;

[0021] Figure 3 for Figure 2 Enlarged view at A in the middle;

[0022] Figure 4 It is a front view of the sieve plate body of the directional sieve plate of the GPP chip;

[0023] Figure 5 for Figure 4 Enlarged view of point B in the middle.

[0024] Explanation of the accompanying reference numerals: 1. sieve plate body; 2. frame; 3. screening hole; 4. rotating shaft; 5. base; 6. air hole group; 61. exhaust hole; 62. suction hole; 7. collecting plate; 8. handle. DETAILED DESCRIPTION

[0025] The following is combined with Figure 1-Figure 5 The utility model is described in further detail.

[0026] This embodiment discloses a directional sieve plate for a GPP chip. Figure 1-Figure 3, including a sieve plate body 1, a surrounding frame 2 is arranged around the upper end surface of the sieve plate body 1, and a plurality of screening holes 3 are arranged on the upper end surface of the sieve plate body 1. The surrounding frame 2 surrounds the chips to be separated in the screening hole 3 area. The size of the bottom surface of the screening hole 3 is the same as the N surface of the screened chip. The screening hole 3 is set as a concave platform with a gradually larger opening to prevent the chip from being placed horizontally on the step and causing damage to the chip. A rotating shaft 4 is set through the middle of the sieve plate body 1, and both ends of the rotating shaft 4 are fixedly installed on the base 5. The sieve plate body 1 is rotatably connected with the rotating shaft 4, and the sieve plate The main body 1 can slide on the rotating shaft 4. When the chips to be separated are placed on the sieve plate main body 1, the sieve plate main body 1 is pulled to slide back and forth and rotate at a small angle on the rotating shaft 4, and the chips to be separated slide and fall into the screening hole 3. The bottom of the screening hole 3 is provided with an air hole group 6, which is connected to the vacuum pump. The air hole group 6 is connected to the vacuum pump to adsorb the chips, and then the sieve plate main body 1 is turned over, and the chips that have not fallen into the screening hole 3 and the chips with the wrong direction can be detached from the sieve plate main body 1, thereby completing the chip separation operation.

[0027] Among them, Figure 2-Figure 5 As shown, the pore group 6 includes an exhaust hole 61 arranged at the bottom of the screening hole 3 and an air suction hole 62 opened at the bottom of the sieve plate body 1, and the two groups of exhaust holes 61 are respectively arranged at the diagonals of the screening hole 3, and the two groups of exhaust holes 61 are connected. At the same time, the air suction hole 62 is also connected to the exhaust hole 61, and the air suction hole 62 is connected to the vacuum pump; since the N-side size of the chip is larger than the P-side, when the P-side of the chip falls into the screening hole 3, the screening hole 3 cannot be completely filled, that is, the exhaust hole 61 cannot be completely covered, so that there is air leakage when the air suction hole 62 and the vacuum pump adsorb the chip, so that the chip with the P-side falling into the screening hole 3 cannot be sucked, and when the sieve plate body 1 is turned over, the chip with the wrong direction will fall out of the screening hole 3, and the chip with the N-side falling into the screening hole 3 will be completely sucked, thereby improving the accuracy of the separation.

[0028] Among them, Figure 1 As shown, a collecting tray 7 is arranged below the sieve plate body 1, and the area of ​​the collecting tray 7 is larger than that of the sieve plate body 1, so that the chips that have not correctly fallen into the screening holes 3 can be caught after the sieve plate body 1 is flipped over, so as to be separated and processed again; a handle 8 is also arranged on the side of the sieve plate body 1, which not only facilitates the sliding and rotating operation of the sieve plate body 1 on the rotating shaft 4, but also facilitates the flipping operation of the sieve plate body 1, making the separation operation more convenient and efficient.

[0029] The above description is only a preferred embodiment of the present invention and does not constitute any other form of limitation to the present invention. Any technician familiar with the profession may use the technical contents disclosed above to change or modify them into equivalent embodiments with equivalent changes for application in other fields. However, any simple modification or equivalent change made to the above embodiments based on the technical essence of the present invention without departing from the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. A directional sieve plate for a GPP chip, characterized in that: The invention comprises a sieve plate body (1), wherein a surrounding frame (2) is arranged around the upper end surface of the sieve plate body (1), a screening hole (3) is arranged on the upper end surface of the sieve plate body (1), a rotating shaft (4) is arranged through the middle of the sieve plate body (1), the sieve plate body (1) is rotatably connected to the rotating shaft (4), the two ends of the rotating shaft (4) are fixedly mounted on a base (5), the sieve plate body (1) can slide on the rotating shaft (4), and an air hole group (6) is arranged at the bottom of the screening hole (3), and the air hole group (6) is connected to a vacuum pump.

2. A directional sieve plate for a GPP chip according to claim 1, characterized in that: The size of the bottom surface of the screening hole (3) is the same as the N surface of the screened chip, and the screening hole (3) is configured as a concave platform with a gradually increasing opening.

3. A directional sieve plate for a GPP chip according to claim 2, characterized in that: The air hole group (6) comprises an exhaust hole (61) arranged at the bottom of the screening hole (3) and an air suction hole (62) opened at the bottom of the sieve plate body (1); the two groups of exhaust holes (61) are respectively arranged at the diagonal positions of the screening hole (3); the two groups of exhaust holes (61) are connected to each other; the air suction hole (62) is connected to the exhaust hole (61); and the air suction hole (62) is connected to a vacuum pump.

4. The directional sieve plate of a GPP chip according to claim 1, characterized in that: A collecting tray (7) is provided below the sieve tray body (1).

5. The directional sieve plate of a GPP chip according to claim 1, characterized in that: A handle (8) is provided on the side of the sieve plate body (1).

6. A directional sieve plate for a GPP chip according to claim 4, characterized in that: The area of ​​the collecting tray (7) is larger than the area of ​​the sieve tray body (1).

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