Power module, motor controller, motor and vehicle

Abstract

The utility model relates to a power module, a motor controller, a motor and a vehicle, the power module comprises a substrate, a cold plate and a heat conduction member, the substrate is provided with a connecting layer, the cold plate is provided with a mounting groove, the heat conduction member is fixed in the mounting groove and is connected with the connecting layer, and the connecting layer is connected with the heat conduction member. The heat conduction piece and the connecting layer are made of the same metal material. Through the technical scheme, the power module provided by the utility model can reduce the warping risk of the power module, and the stability of the power module is relatively good.

Description

Technical Field

[0001] The present disclosure relates to the technical field of power modules, and in particular to a power module, a motor controller, a motor and a vehicle. Background Art

[0002] In the related art, for a power module, when the power module is working, the chip inside the power module will generate heat. Therefore, a cold plate is generally provided on the substrate of the power module to dissipate heat. Currently, when the substrate and the cold plate are connected, for example, when the substrate and the cold plate are welded, the power module may be at risk of warping due to the large difference in thermal expansion coefficients between the two. Utility Model Content

[0003] In order to overcome the problems existing in the related art, the present disclosure provides a power module, which can reduce its own warping risk and has good stability.

[0004] According to a first aspect of an embodiment of the present disclosure, a power module is provided, comprising a substrate, a cold plate and a heat conductor, wherein a connecting layer is provided on the substrate, a mounting groove is provided on the cold plate, the heat conductor is fixed in the mounting groove and connected to the connecting layer, wherein the heat conductor and the connecting layer are made of the same metal material.

[0005] Optionally, the heat conducting member has a first heat conducting portion and a second heat conducting portion connected to each other, the first heat conducting portion is fixed in the mounting slot, the second heat conducting portion extends out of the mounting slot, and a portion of the second heat conducting portion offset from the mounting slot is connected to the cold plate via a fastener.

[0006] Optionally, the second heat conducting portion has a connecting surface and a connecting hole, the connecting surface is connected to the connecting layer, and the fastener is arranged in the connecting hole through the connecting surface and is arranged lower than the connecting surface.

[0007] Optionally, there are multiple fasteners, and the multiple fasteners are arranged around the circumference of the second heat conducting portion.

[0008] Optionally, the heat conducting member is configured as an I-shaped block, the mounting groove is configured as a T-shaped groove, and the first heat conducting portion is interference fit in the mounting groove.

[0009] Optionally, the heat conducting member is configured as a rectangular block, a silver sintering layer is provided in the mounting groove, and the heat conducting member is fixed in the mounting groove through the silver sintering layer.

[0010] Optionally, the heat conducting member extends out of the mounting slot.

[0011] Optionally, the heat conducting member has a thickness in a plate thickness direction of the cold plate, and the thickness of the heat conducting member is 0.5 mm to 2.5 mm.

[0012] Optionally, there are multiple heat-conducting members, and the multiple heat-conducting members are arranged in sequence and at intervals.

[0013] Optionally, the heat conductor and the connection layer are both made of copper, and the cold plate is made of aluminum.

[0014] According to a second aspect of an embodiment of the present disclosure, there is provided a motor controller, comprising the power module as described above.

[0015] According to a third aspect of an embodiment of the present disclosure, there is provided a motor, comprising the motor controller as described above.

[0016] According to a fourth aspect of an embodiment of the present disclosure, a vehicle is provided, comprising the motor as described above.

[0017] The technical solution provided by the embodiments of the present disclosure may include the following beneficial effects: in the power module provided by the present disclosure, since the heat conductor and the connecting layer are made of the same metal material, the thermal expansion coefficients of the heat conductor and the connecting layer are substantially the same. Thus, when the heat conductor and the connecting layer are connected, for example, when the two are welded, the risk of warping of the power module can be effectively reduced, and the void ratio when the two are connected can be reduced. In addition, by providing an installation groove on the cold plate, the heat conductor can be fixed in the installation groove. Thus, on the one hand, the stability of the two after connection can be improved, and on the other hand, the heat conductor can be prevented from being offset, thereby improving the stability of the heat dissipation module.

[0018] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0020] Figure 1 is a schematic diagram of the structure of a power module provided according to an embodiment of the present disclosure;

[0021] Figure 2 is a front view of an implementation of a power module provided according to an embodiment of the present disclosure, wherein the heat conducting member is configured as an I-shaped block;

[0022] Figure 3 is a top view of a partial structure of a power module provided according to an embodiment of the present disclosure;

[0023] Figure 4 is a schematic structural diagram of another implementation of a power module provided according to an embodiment of the present disclosure, wherein the heat conducting member is configured as a T-block;

[0024] Figure 5 It is a schematic structural diagram of another implementation manner of a power module provided according to an embodiment of the present disclosure, wherein the heat conducting member is constructed as a rectangular block.

[0025] Description of Reference Numerals

[0026] 1-substrate; 11-connection layer; 2-cold plate; 21-mounting groove; 3-heat conducting member; 31-first heat conducting part; 32-second heat conducting part; 321-connection surface; 322-connection hole; 33-fastener; 34-rectangular block; 35-T-block; 4-silver sintering layer. DETAILED DESCRIPTION

[0027] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0028] In the present disclosure, the terms "first", "second", etc. used in the present disclosure are used to distinguish one element from another element, and do not have order and importance. In the following description, when referring to the drawings, unless otherwise explained, the same reference numerals in different drawings represent the same or similar elements. The above definitions are only used to explain and illustrate the present disclosure and should not be understood as limiting the present disclosure.

[0029] According to some embodiments of the present disclosure, a power module is provided, referring to Figures 1 to 5 As shown, the power module includes a substrate 1, a cold plate 2 and a heat conductor 3, a connecting layer 11 is provided on the substrate 1, a mounting groove 21 is provided on the cold plate 2, the heat conductor 3 is fixed in the mounting groove 21 and connected to the connecting layer 11, wherein the heat conductor 3 and the connecting layer 11 are made of the same metal material.

[0030] Through the above technical scheme, in the power module provided by the present invention, since the heat conductor 3 and the connecting layer 11 are made of the same metal material, the thermal expansion coefficients of the heat conductor 3 and the connecting layer 11 are substantially the same. Thus, when the heat conductor 3 and the connecting layer 11 are connected, for example, when the two are welded, the risk of warping of the power module can be effectively reduced, and the void ratio when the two are connected can be reduced. In addition, by providing a mounting groove 21 on the cold plate 2, the heat conductor 3 can be fixed in the mounting groove 21. Thus, on the one hand, the stability of the two after connection can be improved, and on the other hand, the heat conductor 3 can be prevented from being offset, thereby improving the stability of the heat dissipation module.

[0031] It should be noted that the chip of the power module is arranged on the substrate 1, wherein the heat generated by the chip is transferred to the heat conductor 3 through the substrate 1, and then the heat is transferred to the cold plate 2 through the heat conductor 3, so as to achieve heat dissipation of the chip, avoid affecting the performance of the chip, and reduce the service life of the chip.

[0032] In addition, the cold plate 2 in the present disclosure can be an air-cooled cold plate, a liquid-cooled cold plate, a heat storage cold plate, a heat pipe cold plate or a semiconductor cold plate. Among them, the air-cooled cold plate is usually combined with a heat dissipation fan to increase the flow speed of the airflow through the heat dissipation fan, thereby accelerating the heat exchange between the cold plate and the air, so that the temperature of the cold plate is maintained in a stable range, so that there is a continuous and stable heat exchange between the chip of the power module and the cold plate, so as to suppress the temperature rise of the chip of the power module.

[0033] The above-mentioned liquid-cooled cold plate is usually combined with a liquid with a higher specific heat capacity. The flow of the liquid accelerates the heat exchange between the cold plate and the liquid, so that the temperature of the cold plate is maintained in a stable range, thereby ensuring continuous and stable heat exchange between the chip of the power module and the cold plate to suppress the temperature rise of the power module chip. Exemplarily, the above-mentioned liquid can be water.

[0034] The above-mentioned heat storage cold plate is a phase change material with high melting heat applied or filled on the cold plate (or in the space). When it is heated and melted, it absorbs the heat dissipated by the chip of the heat dissipation module on the cold plate to control the temperature rise of the cold plate, so that there is a continuous and stable heat exchange between the chip of the power module and the cold plate, so as to play a role in cooling the chip of the power module. By way of example, the phase change material can be paraffin, and different additives are added to the paraffin to change the phase change temperature of the paraffin, so as to adapt to the heat dissipation requirements of different types of heat dissipation modules.

[0035] The heat pipe cold plate is combined with a liquid wick tube, which uses the evaporation and condensation of the working fluid to transfer heat. When the cold plate absorbs the heat generated by the chip of the power module, the liquid in the liquid wick tube boils and turns into steam. The steam with heat moves from the evaporation section of the liquid wick tube to the cooling section. When the steam transfers the heat to the cooling section, the steam condenses into liquid. The condensed liquid returns to the cold plate through the capillary action of the liquid wick in the liquid wick tube, and the above cycle is repeated to continuously dissipate heat.

[0036] The semiconductor cold plate mentioned above utilizes the characteristics of semiconductor materials to convert electronic energy into heat energy or cold energy to achieve cooling of objects. When using the semiconductor cold plate, the cold surface of the semiconductor cold plate needs to correspond to the chip of the power module.

[0037] The heat conducting member 3 mentioned above plays a role in transferring heat, and can conduct the heat generated by the chip of the power module to the cold plate 2 in time, so as to avoid the heat being concentrated on the chip of the power module.

[0038] In some embodiments of the present disclosure, the heat conductor 3 and the connecting layer 11 can be made of copper. Copper has good thermal conductivity, so that the heat conductor 3 has a good heat transfer effect, so that the chip of the power module can dissipate heat faster. Compared with other thermal conductive materials, copper has a lower density. Therefore, the copper heat conductor 3 will be lighter, reducing the load-bearing burden of the power module. In addition, copper has good corrosion resistance, so that the heat conductor 3 and the connecting layer 11 have good corrosion resistance, thereby ensuring the service life of the power module.

[0039] In the present disclosure, the cold plate 2 may be made of aluminum. Since aluminum has a lower density, the cold plate 2 made of aluminum is lighter than when the cold plate 2 is made of copper. Therefore, it is beneficial to realize a lightweight design of the power module.

[0040] In some embodiments of the present disclosure, reference Figure 2 and Figure 3 As shown in , the heat conducting member 3 may have a first heat conducting portion 31 and a second heat conducting portion 32 connected to each other, the first heat conducting portion 31 is fixed in the mounting groove 21, the second heat conducting portion 32 extends out of the mounting groove 21, and the portion of the second heat conducting portion 32 staggered from the mounting groove 21 may be connected to the cold plate 2 by a fastener 33. In the above technical solution, by providing the second heat conducting portion 32, on the one hand, the thickness of the heat conducting member 3 can be increased by using the second heat conducting portion 32 to further reduce the warping of the power module when the heat conducting member 3 is welded to the connecting layer 11, and on the other hand, extending the second heat conducting portion 32 out of the mounting groove 21 also facilitates the welding of the second heat conducting portion 32 to the connecting layer 11. In addition, by fixing the second heat conducting portion 32 to the cold plate 2 by the fastener 33, the stability of the heat conducting member 3 after being connected to the cold plate 2 can be further improved.

[0041] It should be noted that the first heat conducting part 31 and the second heat conducting part 32 can be formed in one piece to avoid affecting the heat conducting performance due to the connection gap.

[0042] In some embodiments of the present disclosure, reference Figure 3 As shown, the second heat conducting part 32 may have a connecting surface 321 and a connecting hole 322, the connecting surface 321 is connected to the connecting layer 11, and the fastener 33 is arranged in the connecting hole 322 via the connecting surface 321 and is arranged lower than the connecting surface 321, that is, the fastener 33 does not protrude from the connecting surface 321, so that the fastener 33 can be prevented from contacting the connecting layer 11, thereby preventing the fastener 33 from interfering with the welding of the heat conducting member 3 and the connecting layer 11.

[0043] In some embodiments, the fastener 33 can be riveted into the connection hole 322, in which case the fastener 33 is a rivet. Alternatively, the fastener 33 can be threadedly connected into the connection hole 322, in which case the fastener 33 is a screw.

[0044] In order to further improve the stability of the connection between the heat conducting member 3 and the cold plate 2, in some embodiments of the present disclosure, reference Figure 3 As shown, there may be a plurality of fasteners 33 , and the plurality of fasteners 33 may be arranged around the circumference of the second heat conducting portion 32 .

[0045] In some embodiments of the present disclosure, reference Figure 1 and Figure 2 As shown, the heat conducting member 3 can be constructed as an I-shaped block, the mounting groove 21 is constructed as a T-shaped groove, and the first heat conducting portion 31 is interference fit in the mounting groove 21. At this time, the first heat conducting portion 31 is constructed as a T-shaped block adapted to the mounting groove 21. Here, the mounting groove 21 and the first heat conducting portion 31 are both constructed as an inverted T-shaped structure, so that the heat conducting member 3 can be prevented from accidentally detaching from the mounting groove 21. In addition, the first heat conducting portion 31 is interference fit in the mounting groove 21, so that the first heat conducting portion 31 can be fixed in the mounting groove 21, which is simple and easy to operate.

[0046] In other embodiments of the present disclosure, reference Figure 4 As shown, the heat conducting member 3 can also be constructed as a T-shaped block. In this case, the mounting groove 21 is constructed as a T-shaped groove, the first heat conducting portion 31 is interference fit in the mounting groove 21, and the second heat conducting portion 32 is connected to the cold plate 2 via a fastener 33 at a portion offset from the mounting groove 21, wherein the arrangement of the fastener 33 can refer to the above arrangement, and will not be repeated here. It should be noted that a silver sintering layer 4 can also be arranged in the mounting groove 21, and the first heat conducting portion 31 can be fixed in the mounting groove 21 by welding through the silver sintering layer 4.

[0047] In some further embodiments of the present disclosure, reference Figure 5 As shown, the heat conductor 3 can be constructed as a rectangular block 34, a silver sintered layer 4 is provided in the mounting groove 21, and the heat conductor 3 is fixed in the mounting groove 21 through the silver sintered layer 4. Here, the heat conductor 3 is welded to the mounting groove 21 through the silver sintered layer 4, ensuring that the heat conductor 3 can be firmly set in the mounting groove.

[0048] In some embodiments of the present disclosure, reference Figure 5 As shown, in the embodiment where the heat conductor 3 is constructed as a rectangular block 34, the heat conductor 3 can extend out of the mounting groove 21. In this way, the thickness of the heat conductor 3 can be increased to further reduce the warping of the power module when the heat conductor 3 is welded to the connecting layer 11. On the other hand, it also facilitates the welding of the heat conductor 3 to the connecting layer 11.

[0049] In some embodiments of the present disclosure, reference Figures 1 to 5 As shown, the number of heat-conducting members 3 can be multiple, and multiple heat-conducting members 3 are arranged in sequence. Exemplarily, the number of heat-conducting members 3 can be three or more, and the present disclosure does not limit this. By arranging multiple heat-conducting members 3 at intervals, an insulating gap can be formed between adjacent heat-conducting members 3, which is conducive to achieving insulation between two adjacent heat-conducting members 3.

[0050] In some embodiments of the present disclosure, the heat conductor 3 has a thickness in the plate thickness direction of the cold plate 2, and the thickness of the heat conductor 3 can be 0.5 mm to 2.5 mm. Exemplarily, the thickness of the heat conductor 3 can be 0.5 mm, 1 mm, 2 mm or 2.5 mm, so that the heat conductor 3 can be prevented from being too thin, and the warping that occurs when the heat conductor 3 is welded to the connecting layer 11 can be reduced, thereby reducing the void rate generated when the heat conductor 3 is welded to the connecting layer 11.

[0051] On the basis of the above technical solution, in the power module provided by the present invention, a mounting layer can be provided on the side of the substrate 1 opposite to the connecting layer 11, and the chip is mounted on the mounting layer, wherein the etching pattern of the connecting layer 11 can be substantially the same as the etching pattern of the mounting layer, so that when the connecting layer 11 is welded to the heat conductor 3, the above arrangement can reduce the deformation of the substrate 1, thereby reducing the warping of the substrate 1 and thus reducing the warping of the power module.

[0052] According to a second aspect of the present disclosure, there is provided a motor controller, comprising the power module as described above. The motor controller has all the beneficial effects of the power module as described above, which will not be elaborated in detail in the present disclosure.

[0053] According to a third aspect of the present disclosure, there is provided a motor, comprising the motor controller as described above. The motor has all the beneficial effects of the motor controller described above, which will not be elaborated in detail in the present disclosure.

[0054] According to a fourth aspect of the present disclosure, there is provided a vehicle, comprising the motor as described above, the vehicle having all the beneficial effects of the motor as described above, which will not be elaborated in detail in the present disclosure.

[0055] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0056] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

Claims

1. A power module, characterized in that: It includes a substrate, a cold plate and a heat conductor, wherein a connecting layer is arranged on the substrate, a mounting groove is arranged on the cold plate, the heat conductor is fixed in the mounting groove and connected to the connecting layer, wherein the heat conductor and the connecting layer are made of the same metal material.

2. The power module according to claim 1, characterized in that: The heat conducting member comprises a first heat conducting part and a second heat conducting part connected to each other, wherein the first heat conducting part is fixed in the mounting groove, the second heat conducting part extends out of the mounting groove, and a portion of the second heat conducting part staggered from the mounting groove is connected to the cold plate via a fastener.

3. The power module according to claim 2, characterized in that: The second heat conducting part has a connecting surface and a connecting hole, the connecting surface is connected to the connecting layer, and the fastener is arranged in the connecting hole through the connecting surface and is arranged lower than the connecting surface.

4. The power module according to claim 2, characterized in that: There are multiple fasteners, and the multiple fasteners are arranged around the circumference of the second heat conducting part.

5. The power module according to claim 2, characterized in that: The heat conducting member is configured as an I-shaped block, the mounting groove is configured as a T-shaped groove, and the first heat conducting portion is interference-fitted in the mounting groove.

6. The power module according to claim 1, characterized in that: The heat conducting member is configured as a rectangular block, a silver sintering layer is arranged in the mounting groove, and the heat conducting member is fixed in the mounting groove through the silver sintering layer.

7. The power module according to claim 6, characterized in that: The heat conducting member extends out of the mounting slot.

8. The power module according to claim 1, characterized in that: The heat conducting member has a thickness in a plate thickness direction of the cold plate, and the thickness of the heat conducting member is 0.5 mm to 2.5 mm.

9. The power module according to claim 1, characterized in that: There are multiple heat-conducting members, and the multiple heat-conducting members are arranged in sequence and at intervals.

10. The power module according to claim 1, characterized in that: The heat conducting member and the connecting layer are both made of copper, and the cold plate is made of aluminum.

11. A motor controller, characterized in that: A power module comprising any one of claims 1 to 10.

12. A motor, characterized in that: Includes the motor controller as claimed in claim 11.

13. A vehicle, characterized in that: Including the motor as claimed in claim 12.

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