Driving and control all-in-one machine with heat dissipation structure

Abstract

The utility model relates to a drive and control all-in-one machine with a heat dissipation structure, which belongs to the field of drive and control all-in-one machines and comprises a heat dissipation plate, a heat dissipation box is arranged at the top of the heat dissipation plate, an IO board is arranged in the heat dissipation box, a supporting assembly used for supporting the IO board is arranged at the bottom of the IO board, and a PCB is arranged at the bottom in the supporting assembly. The bottom of the PCB abuts against a heat transfer block, and the bottom of the heat transfer block and the top of the heat dissipation plate are integrally formed. According to the invention, the internal heat dissipation capability can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of integrated drive and control machines, and in particular to an integrated drive and control machine with a heat dissipation structure. Background Art

[0002] In the design and manufacture of modern electronic devices, heat dissipation has always been one of the key technical challenges. Especially in high-performance electronic devices, such as industrial control equipment, servers, gaming devices, etc., the internal PCB boards (printed circuit boards) and IO boards (input / output boards) generate a lot of heat when performing complex tasks. If this heat cannot be dissipated in a timely and effective manner, it will lead to a decline in device performance and may even cause failures or safety accidents.

[0003] At present, the integrated drive and control machine consists of a bottom shell, an upper cover, and a PCB board and an IO board installed between the bottom shell and the upper cover. During the assembly process, the IO board is set at the bottom of the upper cover, and the PCB board is fixed on the top of the bottom shell. Terminals are set on both sides of the PCB board. The IO board and the PCB board communicate and control through electrical connection.

[0004] However, when the existing integrated driver and control machine dissipates heat, the PCB board and the IO board are arranged compactly. When the PCB board and the IO board generate heat during operation, the heat is concentrated around the PCB board and the IO board, resulting in poor heat dissipation effect in the integrated driver and control machine. Utility Model Content

[0005] In order to address the deficiencies in the prior art, the present application provides an all-in-one drive and control machine with a heat dissipation structure, which can improve the internal heat dissipation capacity.

[0006] The present application provides a drive-control integrated machine with a heat dissipation structure adopting the following technical solution:

[0007] A drive-control integrated machine with a heat dissipation structure comprises a heat dissipation plate, a heat dissipation box is arranged on the top of the heat dissipation plate, an IO board is arranged in the heat dissipation box, a support assembly for supporting the IO board is arranged at the bottom of the IO board, a PCB board is arranged at the bottom of the support assembly, a heat transfer block is abutted at the bottom of the PCB board, and the bottom of the heat transfer block is integrally formed with the top of the heat dissipation plate.

[0008] By adopting the above technical solution, the heat transfer block, the heat sink and the heat sink box made of metal materials have good thermal conductivity. The heat of the PCB board can be absorbed by the heat transfer block and then dissipated through the heat sink formed integrally with the heat transfer block. The PCB board and the IO board are separated by the supporting assembly, and the IO board is cooled through the top of the heat sink box, thereby realizing multi-directional heat dissipation, thereby improving the internal heat dissipation capacity.

[0009] The present application further provides: the support assembly includes a support frame, the PCB board is located inside the support frame, and the diagonal of the IO board is fixedly connected to the top of the support frame through a first screw.

[0010] By adopting the above technical solution, the first screw rod and the support frame separate the bottom of the IO board from the top of the PCB board, thereby reducing the heat concentration between the IO board and the PCB board.

[0011] The present application further provides that: an air outlet is provided on one side of the heat dissipation box, and an air inlet is provided on a side of the heat dissipation box away from the air outlet.

[0012] By adopting the above technical solution, the heat generated by the IO board and the PCB board can be discharged from the air outlet and the air inlet, and the natural circulation of air can improve the internal heat dissipation capacity.

[0013] The present application further arranges: a cooling fan is arranged at the air outlet on the inner side of the heat dissipation box, and the cooling fan always allows natural wind to enter from the outside of the air inlet of the heat dissipation box and then be discharged from the air outlet of the heat dissipation box.

[0014] By adopting the above technical solution, the heat dissipation fan utilizes external wind and discharges the external wind through the interior of the integrated drive and control machine, so that the air in the integrated drive and control machine can circulate quickly, thereby improving the heat dissipation rate.

[0015] The present application further provides that: heat dissipation holes are opened on both sides of the support frame, and one side of the heat dissipation holes of the support frame faces the connection terminals on both sides of the PCB board.

[0016] By adopting the above technical solution, the heat at the wiring terminal can be transferred to the outside of the air outlet by the cooling fan and / or natural wind through the heat dissipation holes, thereby improving the heat dissipation capacity of the wiring terminal.

[0017] The present application further configures: the support assembly also includes a second screw, a support column is arranged on the top of the heat dissipation plate, a screw hole is opened diagonally at the PCB board, the second screw passes through the screw hole and is threadedly connected to the support column, a first flow channel is formed between the heat dissipation plate and the PCB board, and the air inlet is connected to the first flow channel.

[0018] By adopting the above technical solution, the second screw threadedly connected in the support column can form a first flow channel between the PCB board and the heat sink, and the wind entering the drive and control integrated machine from the outside can pass through the first flow channel, thereby improving the heat dissipation efficiency at the bottom of the PCB board.

[0019] The present application further arranges: a sleeve column is arranged at the top of the support frame, the rod end of the first screw is threadedly connected in the sleeve column, the top of the sleeve column abuts against the bottom of the IO plate, and the bottom of the IO plate and the top of the support frame form a second flow channel.

[0020] By adopting the above technical solution, the threaded connection of the first screw in the sleeve column can enhance the stability of the connection between the IO board and the support frame. At the same time, the heat of the IO board can be discharged through the second flow channel and discharged to the outside of the drive and control integrated machine through the circulation of natural air and / or the wind of the cooling fan.

[0021] The present application further provides that: fins are provided at the bottom of the heat sink, and a plurality of fins are provided.

[0022] By adopting the above technical solution, the fins increase the surface area of ​​the heat dissipation plate and improve the heat dissipation efficiency.

[0023] The present application further provides that: the weight of the heat sink is the same as the weight of the heat sink box.

[0024] By adopting the above technical solution, the center of gravity of the integrated drive and control machine can be leveled during installation, which can help improve the structural stability of the entire device and ensure that the internal components are not subjected to unnecessary stress during long-term operation.

[0025] In summary, this application has the following beneficial effects:

[0026] The heat transfer block, heat sink and heat sink box in the present application are made of metal and have good thermal conductivity. The heat of the PCB board is dissipated through the heat transfer block to the heat sink formed integrally with the heat transfer block, and the PCB board and the IO board are separated by the supporting assembly, and the IO board is dissipated through the top of the heat sink, thereby achieving multi-directional heat dissipation and improving the internal heat dissipation capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of this application.

[0028] Figure 2 It is a structural diagram of the entire application from another perspective.

[0029] Figure 3 It is a cross-sectional structural schematic diagram of the present application.

[0030] Figure 4 This application Figure 3 Schematic diagram of the locally enlarged structure of A in the middle.

[0031] Figure 5 It is a schematic diagram of the internal structure of this application.

[0032] Figure 6 This application Figure 3 Schematic diagram of the partially enlarged structure of B.

[0033] Figure 7 It is a structural diagram of the bottom of the entire application.

[0034] Figure numerals: 1. heat sink; 2. heat sink box; 21. air outlet; 22. air inlet; 3. IO board; 4. support assembly; 41. support frame; 42. second screw; 5. PCB board; 6. heat transfer block; 7. first screw; 8. cooling fan; 9. heat dissipation hole; 10. terminal block; 11. support column; 12. first flow channel; 13. sleeve column; 14. second flow channel; 15. fin. DETAILED DESCRIPTION

[0035] The following is combined with Figures 1 to 7 This application is described in further detail.

[0036] refer to Figures 1 to 3 In the present embodiment, a drive-control integrated machine with a heat dissipation structure includes a heat dissipation plate 1, a heat dissipation box 2 is fixedly connected to the top of the heat dissipation plate 1, an IO board 3 is arranged in the heat dissipation box 2, a support assembly 4 is arranged at the bottom of the IO board 3, the support assembly 4 is used to support the IO board 3, a PCB board 5 is arranged at the bottom of the support assembly 4, a heat transfer block 6 is abutted at the bottom of the PCB board 5, the bottom of the heat transfer block 6 is integrally formed with the top of the heat dissipation plate 1, the heat transfer block 6, the heat dissipation plate 1 and the heat dissipation box 2 are made of metal materials, in the present embodiment, the heat transfer block 6, the heat dissipation plate 1 and the heat dissipation box 2 are made of aluminum, which has a high thermal conductivity, is light, has a relatively low cost, and is easy to be processed into various shapes and sizes, the heat of the PCB board 5 can be absorbed by the heat transfer block 6 through the bottom of the PCB board 5, and then released to the outside of the drive-control integrated machine through the heat dissipation plate 1 integrally formed with the heat transfer block 6, thereby improving the internal heat dissipation capacity.

[0037] The PCB board 5 and the IO board 3 are separated by the support assembly 4, and the IO board 3 dissipates heat through the top of the heat dissipation box 2, reducing the heat concentration of the PCB board 5 and the IO board 3. The heat generated by the PCB board 5 and the IO board 3 can be dissipated in multiple directions, further improving the internal heat dissipation capacity.

[0038] refer to Figure 3 and Figure 4 In this embodiment, the support assembly 4 includes a support frame 41, the PCB board 5 is located inside the support frame 41, and the diagonal of the IO board 3 is fixedly connected to the top of the support frame 41 through the first screw 7. The first screw 7 separates the bottom of the IO board 3 from the top of the support frame 41. The bottom of the support frame 41 and the top of the PCB board 5 form a cavity, which increases the distance between the IO board 3 and the PCB board 5, thereby reducing the heat concentration between the IO board 3 and the PCB board 5.

[0039] refer to Figures 1 to 3In the present embodiment, an air outlet 21 is provided on one side of the heat dissipation box 2, and an air inlet 22 is provided on the side of the heat dissipation box 2 away from the air outlet 21. By relying on natural wind flow, the heat generated by the IO board 3 and the PCB board 5 can be discharged from the air outlet 21 and the air inlet 22, thereby improving the internal heat dissipation capacity.

[0040] Furthermore, a cooling fan 8 is fixedly connected to the air outlet 21 on the inner side of the heat dissipation box 2. The cooling fan 8 always allows natural wind to enter from the outside of the air inlet 22 of the heat dissipation box 2 and then be discharged from the air outlet 21 of the heat dissipation box 2. This increases the rate at which natural wind enters and passes through the IO board 3 and the PCB board 5, thereby increasing the air cooling effect and taking away more heat.

[0041] refer to Figure 2 , Figure 3 and Figure 5 In this embodiment, heat dissipation holes 9 are opened on both sides of the support frame 41. One side of the heat dissipation holes 9 of the support frame 41 faces the wiring terminals 10 on both sides of the PCB board 5. The wiring terminals 10 enable external devices to exchange information with the drive and control integrated machine, and the heat at the wiring terminals 10 can pass through the heat dissipation holes 9 and be transmitted to the air outlet 21 by the cooling fan 8 and / or natural wind, and then be transmitted to the outside of the drive and control integrated machine, thereby improving the heat dissipation capacity at the wiring terminals 10.

[0042] refer to Figure 2 , Figure 3 and Figure 6 In this embodiment, the support assembly 4 also includes a second screw 42, a support column 11 is provided on the top of the heat sink 1, a screw hole is provided at the diagonal of the PCB board 5, the second screw 42 passes through the screw hole and is threadedly connected to the support column 11, a first flow channel 12 is formed between the heat sink 1 and the PCB board 5, the air inlet 22 is connected to the first flow channel 12, and the wind can enter the first flow channel 12 from the air inlet 22 through natural flow or be sucked by the heat dissipation fan 8, and then discharge the heat at the bottom of the PCB board 5 from the air outlet 21, and can also discharge the heat sheet on the top of the heat sink 1, thereby improving the heat dissipation efficiency of the bottom of the PCB board 5 and the top of the heat sink 1.

[0043] refer to Figure 3 and Figure 4In this embodiment, the rod end of the first screw rod 7 is threadedly connected to the sleeve column 13, and the top of the sleeve column 13 abuts against the bottom of the IO board 3. The sleeve column 13 can increase the connection area between the IO board 3 and the support frame 41, thereby increasing the stability of the connection between the IO board 3 and the support frame 41. The bottom of the IO board 3 and the top of the support frame 41 form a second flow channel 14. The heat at the bottom of the IO board 3 and the heat at the top of the support frame 41 are discharged through the second flow channel 14 and discharged to the outside of the drive and control integrated machine through the circulation of natural air and / or the wind of the cooling fan 8, thereby enhancing the heat dissipation capacity of the bottom of the IO board 3 and the top of the support frame 41.

[0044] refer to Figure 7 In this embodiment, a fin 15 is integrally formed at the bottom of the heat sink 1, and a plurality of fins 15 are provided. The plurality of fins 15 are distributed in parallel. By adding a plurality of protruding portions to the heat sink 1, the total surface area of ​​the heat sink 1 is increased, and more surfaces can be used to dissipate heat to the outside of the drive and control integrated machine, thereby improving the heat dissipation efficiency.

[0045] Furthermore, the weight of the heat sink 1 is the same as that of the heat sink box 2, so the center of gravity of the integrated driver and controller can be leveled when the integrated driver and controller is installed, which helps to improve the structural stability of the entire device and reduce the stress on internal components.

[0046] The implementation principle of the embodiment of the present application is: when the cooling fan 8 is in operation, the heat at the top of the PCB board 5 and the heat at the bottom of the IO board 3 are transmitted to the outside of the drive and control all-in-one machine through the air outlet 21 by the wind entering the drive and control all-in-one machine from the air inlet 22. At the same time, the heat at the bottom of the PCB board 5 is discharged centrally through the wind of the first flow channel 12 and the heat dissipation plate 1 connected by the heat transfer block 6, the heat at the top of the IO board 3 is discharged centrally through the top of the heat dissipation box 2, and the heat of the terminal 10 enters the interior of the support frame 41 through the heat dissipation hole 9, and is then discharged through the air outlet 21.

[0047] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A drive-control integrated machine with a heat dissipation structure, characterized in that: The invention comprises a heat sink (1), a heat sink box (2) is arranged on the top of the heat sink (1), an IO board (3) is arranged in the heat sink box (2), a support assembly (4) for supporting the IO board (3) is arranged at the bottom of the IO board (3), a PCB board (5) is arranged at the bottom of the support assembly (4), a heat transfer block (6) is abutted against the bottom of the PCB board (5), and the bottom of the heat transfer block (6) is integrally formed with the top of the heat sink (1).

2. The integrated drive and control machine with a heat dissipation structure according to claim 1, characterized in that: The support assembly (4) comprises a support frame (41), the PCB board (5) is located inside the support frame (41), and the diagonal of the IO board (3) is fixedly connected to the top of the support frame (41) via a first screw rod (7).

3. The integrated drive and control machine with a heat dissipation structure according to claim 2, characterized in that: The heat dissipation box (2) has an air outlet (21) on one side thereof, and an air inlet (22) on the side of the heat dissipation box (2) away from the air outlet (21).

4. The integrated drive and control machine with a heat dissipation structure according to claim 3, characterized in that: A heat dissipation fan (8) is arranged at the air outlet (21) inside the heat dissipation box (2), and the heat dissipation fan (8) always allows natural wind to enter from the outside of the air inlet (22) of the heat dissipation box (2) and then be discharged from the air outlet (21) of the heat dissipation box (2).

5. The integrated drive and control machine with a heat dissipation structure according to claim 2, characterized in that: Heat dissipation holes (9) are provided on both sides of the support frame (41), and one side of the heat dissipation hole (9) of the support frame (41) faces the connection terminals (10) on both sides of the PCB board (5).

6. The integrated drive and control machine with a heat dissipation structure according to claim 3, characterized in that: The support assembly (4) further comprises a second screw rod (42); a support column (11) is arranged on the top of the heat dissipation plate (1); screw holes are provided at diagonals of the PCB board (5); the second screw rod (42) passes through the screw holes and is threadedly connected to the support column (11); a first flow channel (12) is formed between the heat dissipation plate (1) and the PCB board (5); and the air inlet (22) is connected to the first flow channel (12).

7. The integrated driver and controller with a heat dissipation structure according to claim 3, characterized in that: A sleeve column (13) is arranged at the top of the support frame (41); the rod end of the first screw rod (7) is threadedly connected in the sleeve column (13); the top of the sleeve column (13) abuts against the bottom of the IO plate (3); and the bottom of the IO plate (3) and the top of the support frame (41) form a second flow channel (14).

8. The integrated driver-control machine with a heat dissipation structure according to claim 1, characterized in that: The bottom of the heat dissipation plate (1) is provided with fins (15), and a plurality of fins (15) are provided.

9. The integrated drive and control machine with a heat dissipation structure according to claim 1, characterized in that: The weight of the heat dissipation plate (1) is the same as the weight of the heat dissipation box (2).

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