Process edge structure of PCB jointed board

Abstract

The utility model discloses a process edge structure of a PCB jointed board, which is applied to the PCB jointed board and comprises a process edge and a supplemented process edge, the supplemented process edge is used for supplementing an irregular circuit board body to be a regular square, and the supplemented process edge is used for connecting the circuit board body and the process edge. V-shaped parting lines are arranged between the complementary process edges and between the process edges and the circuit board body, and milling grooves are formed between the complementary process edges and the circuit board; a first copper foil is adhered to the surface of the substrate of the process edge, a second copper foil is adhered to the surface of the substrate of the supplemented process edge, a slit is formed in the second copper foil, and an included angle is formed between the slit and the length direction of the process edge. The second copper foil is hollowed out to be provided with the slits, when the copper foil is heated for a long time, volatile gas generated by an adhesive between the copper foil and the substrate can be smoothly discharged from the slits, heat can also be quickly dissipated through the slits, the copper foil is kept to be adhered to the substrate, and the phenomena of expansion and falling of the copper foil are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB production, in particular to a process edge structure of a PCB panel. Background Art

[0002] With the rapid development of electronic technology, product diversification has become the norm in the industry, which has also led to increasingly complex and personalized demands for PCBs (printed circuit boards). However, when the PCB size is too small or the shape is irregular, it often brings many challenges to subsequent production links such as board making and welding. These challenges not only affect production efficiency, but also greatly increase manufacturing costs and production difficulties.

[0003] In solving these problems, PCB panelization technology has shown its unique advantages. By combining multiple small-sized or irregular-shaped PCBs into a larger, regular-shaped panel, we can use machines and equipment more effectively and improve the utilization rate of boards, thereby significantly improving production efficiency and reducing unnecessary cost waste. The application of this technology not only meets production needs, but also adapts to the development trend of diversified electronic products.

[0004] In PCB panelization, the process edge plays a vital role. Although it is not a core component on the PCB board, it plays an irreplaceable role in ensuring production efficiency and circuit board quality. The main functions of the process edge include controlling size and shape, protecting the circuit board, improving strength and stability, assisting production and processing, ensuring dimensional stability and facilitating assembly, etc. The realization of these functions provides a solid guarantee for the normal operation of electronic equipment.

[0005] Especially when dealing with special-shaped substrates, the importance of process edges is more prominent. Due to the irregular shape of special-shaped substrates, it brings great difficulties to board making and welding. However, by adding process edges for auxiliary production, we can effectively solve these problems. The copper foil on the process edge not only helps to prevent lamination warping, but also plays a stabilizing role during the processing. However, as the lamination time increases and the temperature rises, the adhesive between the copper foil and the substrate may produce volatile gases, which are difficult to remove, resulting in heat that is not easy to dissipate. Long-term high temperature environment will cause the copper foil to expand and fall off, which in turn affects the quality and stability of the entire PCB panel. Utility Model Content

[0006] In order to overcome the disadvantages of the prior art PCB panel process edge structure that the adhesive between the copper foil on the process edge and the substrate may produce volatile gases, which are difficult to eliminate and may cause the copper foil to expand and fall off, the utility model provides a PCB panel process edge structure.

[0007] The technical solution of the utility model is as follows:

[0008] A process edge structure for a PCB panel is applied to a PCB panel, comprising a process edge and a filling process edge, wherein the filling process edge fills an irregular circuit board body into a regular square, the filling process edge is used to connect the circuit board body and the process edge, a V-shaped dividing line is provided between the filling process edge and the process edge, and between the process edge and the circuit board body, and a milling groove is provided between the filling process edge and the circuit board; a first copper foil is pasted on the surface of a substrate of the process edge, a second copper foil is pasted on the surface of the substrate of the filling process edge, a slit is provided on the second copper foil, and an angle is formed between the slit and the length direction of the process edge.

[0009] Furthermore, in the X direction, the angle value is 45°.

[0010] Furthermore, in one embodiment, the slits are distributed in an array on the second copper foil.

[0011] Furthermore, in one embodiment, the length of the slit is ≥1 mm, the distance between two adjacent slits in the X direction is ≥15 mm, the distance between two adjacent slits in the Y direction is ≥15 mm, and the distance from the edge of the slit to the edge of the second copper foil is ≥2 mm.

[0012] Furthermore, in one embodiment, there are multiple milling grooves, and a stamp hole is provided between two adjacent milling grooves.

[0013] Furthermore, in one embodiment, the width of the milling groove is ≥1 mm, and the distance between the edges of the first copper foil, the second copper foil, and the circuit board body and the edge of the milling groove is ≥1 mm.

[0014] Furthermore, in one embodiment, the size of the stamp holes is 0.5-1.0 mm, the distance between two adjacent holes is 0.3-0.6 mm, and the number of holes in a single row is greater than or equal to 3.

[0015] Furthermore, in one embodiment, the distance from the edge of the first copper foil to the V-shaped dividing line is ≥1 mm, the distance from the edge of the second copper foil to the V-shaped dividing line is ≥1 mm, and the distance from the edge of the circuit board body to the V-shaped dividing line is ≥1 mm.

[0016] Furthermore, in one embodiment, the width of the process edge is greater than or equal to 5 mm.

[0017] Furthermore, in one embodiment, a marking hole is provided on the process edge, and the marking hole is located in the middle of the process edge.

[0018] The utility model according to the above scheme has the beneficial effect that a slit is provided on the large area copper foil at the position of the filling process edge, that is, the second copper foil, and the copper foil is hollowed out to increase the slit. When heated for a long time, the volatile gas generated by the adhesive between the copper foil and the substrate is smoothly discharged from the slit position, and the heat can also be quickly dissipated through the slit, keeping the copper foil attached to the substrate, and preventing the copper foil from expanding and falling off, thereby ensuring the normal operation of the PCB panel production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the structure of the first embodiment of the utility model;

[0020] Figure 2 for Figure 1 An enlarged view of part A in FIG.

[0021] Figure 3 This is a schematic diagram of the structure of the second embodiment of the present utility model.

[0022] In the figure, 100, circuit board body; 210, first copper foil; 220, second copper foil; 2201, slit; 230, marking hole; 300, V-shaped dividing line; 400, milling groove; 500, stamp hole; 510, drilling hole. DETAILED DESCRIPTION

[0023] The utility model is further described below in conjunction with the accompanying drawings and embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on another element or there can be one or more centered elements therebetween. When an element is described as "connected" to another element, it can be directly connected to another element or there can be one or more centered elements therebetween. The terms "vertical", "horizontal", "left", "right", "inside", "outside" and similar expressions used in this specification are for illustrative purposes only. In the description of the utility model, the terms "first" and "second" are used only for descriptive purposes and cannot be understood as indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, unless otherwise specified, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; the meaning of "multiple" is two or more. The term "include" and any variation thereof means non-exclusive inclusion, and one or more other features, integers, steps, operations, units, components and / or combinations thereof may be present or added.

[0024] In addition, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or a connection between two components. All technical and scientific terms used in this specification have the same meaning as those generally understood by technicians in the technical field of the present utility model. The terms used in the specification of the present utility model are only for the purpose of describing specific embodiments and are not used to limit the present utility model. The term "and / or" used in this specification includes any and all combinations of one or more related listed items.

[0025] In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0026] In the process edge structure of a general PCB panel, the process edge structure includes a process edge and a filling process edge. The size of the filling process edge needs to be made according to the size of the gap of the substrate. The filling process edge fills the circuit board body into a regular shape, so that the circuit board body on a PCB substrate is arranged in an orderly manner, which is convenient for subsequent processing and production. After the production is completed, the process edge structure can be removed to obtain multiple circuit board bodies at one time, or a variety of different circuit board bodies. During the processing, copper foil will be set on the surface of the process edge, and copper foil will be set on the surface of the filling process edge and the circuit board body to prevent warping during pressing. Since the copper foil on the filling process edge has a large area, when it is heated for a long time during pressing, the volatile gas generated by the adhesive between the copper foil on the process edge and the substrate cannot be eliminated, and the heat is not easy to dissipate, so that the copper foil is very easy to expand and fall off.

[0027] In view of the above problems, the present application designs the following PCB panel process edge structure implementation example.

[0028] Embodiment 1

[0029] like Figure 1-2As shown, the present application provides an embodiment of the process edge structure of a PCB panel, which is applied to PCB panels. As shown in the figure, an XY coordinate system is established, and the process edge structure of the PCB panel includes a process edge and a filling process edge. The filling process edge fills the irregular circuit board body 100 into a regular square. The filling process edge is used to connect the circuit board body 100 and the process edge. A V-shaped dividing line 300 is provided between the filling process edge and the process edge, and between the process edge and the circuit board body 100. A milling groove 400 is provided between the filling process edge and the circuit board; the surface of the substrate of the process edge is pasted with a first copper foil 210, and the surface of the substrate of the filling process edge is pasted with a second copper foil 220. A slit 2201 is provided on the second copper foil 220, and an angle is formed between the slit 2201 and the length direction of the process edge. In this embodiment, the angle between the slit 2201 and the X reverse axis is 45°, that is, the angle between the slit 2201 and the length direction of the process edge is 45°. The present application sets slits 2201 on the second copper foil 220 at the position of the process edge and the circuit board body 100. When heated for a long time, the volatile gas generated by the adhesive between the copper foil and the substrate can be smoothly discharged from the multiple slits 2201 hollowed out inside the second copper foil 220 with a larger area. Heat can also be quickly dissipated through the slits 2201 to keep the copper foil attached to the substrate, and will not cause the copper foil to expand and fall off, and prevent the lamination warping, thereby ensuring the normal operation of the PCB panel production process. After the production is completed, the process edge structure is usually removed. Although it is not a component of the circuit board on the PCB board, it is of great significance to ensure production efficiency, the quality and performance of the circuit board, and the reliability and durability of electronic equipment.

[0030] like Figure 1 As shown, in this embodiment, the slits 2201 are distributed in an array on the copper foil of the filling process edge. The length of the slits 2201 is ≥1mm, the spacing between two adjacent slits 2201 in the X direction is ≥15mm, the spacing in the Y direction is ≥15mm, and the distance from the edge of the slit 2201 to the edge of the second copper foil 220 is ≥2mm.

[0031] In one embodiment, there are multiple milling grooves 400, and stamp holes 500 are provided on the substrate between two adjacent milling grooves 400. The width of the milling groove 400 is ≥1mm, and the distance between the edge of the first copper foil 210, the second copper foil 220 and the edge of the circuit board body 100 and the edge of the milling groove 400 is ≥1mm. Milling groove 400 refers to cutting out the required groove by a specific tool during the processing of PCB (printed circuit board). This process can be completed by a tool with a bottom blade to cut a groove. When PCB is assembled, the milling groove 400 is used for the cutting groove separation line between two single boards or the dividing line opened in a single PCB. The width of the milling groove 400 is generally not less than 1mm. For the slotting with electrical requirements, the width of the slotting is not less than 1.2mm. In addition, the process of milling groove 400 can also be used by combining a drill bit and a milling cutter. First, a hole penetrating the circuit board is drilled on the PCB board, and then a milling cutter is used to cut from the hole and mill along a specific path to form a micro groove or a through groove.

[0032] like Figure 2 As shown, in this embodiment, the size of the drilled holes 510 of the stamp holes 500 is 0.5-1.0 mm, the distance between two adjacent drilled holes 510 is 0.3-0.6 mm, and the number of drilled holes 510 in a single row is greater than or equal to 3. In order to ensure a smooth cross section and not cause damage to the single board, the stamp holes 500 in a single row are generally arranged parallel to the edge of the milling groove 400.

[0033] In this embodiment, the distance from the edge of the first copper foil 210 to the V-shaped dividing line 300 is ≥1mm, the distance from the edge of the second copper foil 220 to the V-shaped dividing line 300 is ≥1mm, and the distance from the edge of the circuit board body 100 to the V-shaped dividing line 300 is ≥1mm. The V-shaped dividing line 300 between the circuit board body 100 and the process edge is in a "V" shape. After the welding process is completed, the circuit board body 100 and the process edge can be broken and separated, and the separation is convenient and simple. The V-shaped dividing line 300 is also called Vcut, and the PCB board Vcut standard is a very important part in the PCB manufacturing industry. Vcut is the abbreviation of "Vertical Circuit Board", which is one of the more commonly used technologies in the PCB manufacturing industry. The most commonly used is the suspension and support on the divisible PCB board. Its main function is to divide the board into small separate units. Therefore, Vcut technology is widely used in the manufacture of complex high-end electronic products, especially multi-layer high-grade circuit boards.

[0034] like Figure 1 As shown, in this embodiment, the width of the process edge is greater than or equal to 5 mm. A marking hole 230 is provided on the process edge, and the marking hole 230 is located in the middle of the process edge. The marking hole 230 facilitates the fixing and positioning of the PCB panel.

[0035] Embodiment 2

[0036] like Figure 3 As shown, the present application also provides another embodiment of the process edge structure of a PCB panel, and the other structures are the same as those of the first embodiment. The angle between the slit 2201 and the positive X axis is 45°, that is, the angle between the slit 2201 and the process edge in the length direction is 45°.

[0037] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.

[0038] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. A process edge structure of a PCB panel, applied to a PCB panel, characterized in that: It includes a process edge and a filling process edge, wherein the filling process edge fills the irregular circuit board body into a regular square, the filling process edge is used to connect the circuit board body and the process edge, a V-shaped dividing line is provided between the filling process edge and the process edge, and between the process edge and the circuit board body, and a milling groove is provided between the filling process edge and the circuit board; a first copper foil is pasted on the surface of the substrate of the process edge, a second copper foil is pasted on the surface of the substrate of the filling process edge, a slit is provided on the second copper foil, and an angle is formed between the slit and the length direction of the process edge.

2. The process edge structure of the PCB panel according to claim 1 is characterized in that: In the X direction, the angle value is 45°.

3. The process edge structure of the PCB panel according to claim 2 is characterized in that: The slits are distributed in an array on the second copper foil.

4. The process edge structure of the PCB panel according to claim 3 is characterized in that: The length of the slit is ≥1 mm, the distance between two adjacent slits in the X direction is ≥15 mm, the distance between two adjacent slits in the Y direction is ≥15 mm, and the distance from the edge of the slit to the edge of the second copper foil is ≥2 mm.

5. The process edge structure of the PCB panel according to claim 1 is characterized in that: There are multiple milling grooves, and a stamp hole is arranged between two adjacent milling grooves.

6. The process edge structure of the PCB panel according to claim 5, characterized in that: The width of the milling groove is ≥1 mm, and the distance between the edges of the first copper foil, the second copper foil and the circuit board body and the edge of the milling groove is ≥1 mm.

7. The process edge structure of the PCB panel according to claim 5, characterized in that: The size of the stamp holes is 0.5-1.0 mm, the distance between two adjacent holes is 0.3-0.6 mm, and the number of holes in a single row is greater than or equal to 3.

8. The process edge structure of the PCB panel according to claim 1, characterized in that: The distance from the edge of the first copper foil to the V-shaped dividing line is ≥1 mm, the distance from the edge of the second copper foil to the V-shaped dividing line is ≥1 mm, and the distance from the edge of the circuit board body to the V-shaped dividing line is ≥1 mm.

9. The process edge structure of the PCB panel according to claim 1, characterized in that: The width of the process edge is greater than or equal to 5 mm.

10. The process edge structure of the PCB panel according to claim 9, characterized in that: A marking hole is provided on the process edge, and the marking hole is located in the middle position of the process edge.

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