Heat dissipation piece and electronic equipment

Abstract

The utility model discloses a heat dissipation piece and electronic equipment. The heat dissipation piece comprises a body, a capillary structure and a blocking structure. The body of the heat dissipation piece is hollow, and the capillary structure is connected with the inner wall of the body and used for containing medium liquid. The blocking structure is connected with the capillary structure and used for isolating contact between the medium gas and the medium liquid. The heat dissipation performance disclosed by the utility model has relatively high heat dissipation performance.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a heat sink and electronic equipment. Background Art

[0002] Currently, when heat pipes are used for heat dissipation, there will be resistance in the contact surface between the relative movement of the medium airflow and the medium liquid flow, and shear force will be generated at the contact surface between the medium airflow and the medium liquid flow, affecting each other's flow, resulting in lower heat dissipation performance of the heat pipe. Utility Model Content

[0003] This application provides the following technical solutions:

[0004] A heat sink, comprising:

[0005] A body, wherein the interior of the body is hollow;

[0006] A capillary structure connected to the inner wall of the body and used to contain a medium liquid;

[0007] The barrier structure is connected to the capillary structure and is used to isolate the contact between the medium gas and the medium liquid.

[0008] Optionally, in the above heat sink, the body comprises:

[0009] Evaporation section;

[0010] Condensation section;

[0011] a middle section, the middle section being located between the evaporation section and the condensation section;

[0012] The barrier structure at least partially covers the intermediate section.

[0013] Optionally, in the above heat sink, the capillary structure has a first flow channel for accommodating a dielectric liquid, the barrier structure forms a second flow channel for accommodating a dielectric gas, and the barrier structure is provided between the first flow channel and the second flow channel.

[0014] Optionally, in the above heat sink, the first flow channel and the second flow channel located in the evaporation section are connected to each other;

[0015] The first flow channel and the second flow channel located in the condensation section are connected to each other;

[0016] The first flow channel and the second flow channel located in the middle section are isolated from each other.

[0017] Optionally, in the above heat sink, the dielectric liquid flows in the first flow channel along a first direction;

[0018] The medium gas flows in the second flow channel along a second direction;

[0019] The first direction is opposite to the second direction.

[0020] Optionally, in the above heat sink, the capillary structure has a first capillary force, the barrier structure has a second capillary force, and the first capillary force is greater than the second capillary force.

[0021] Optionally, in the above heat sink, the capillary structure and the barrier structure are integrally formed; or

[0022] The capillary structure and the barrier structure are formed separately and connected.

[0023] Optionally, in the above heat sink, the barrier structure is a metal foil layer, a metal mesh layer or a graphene layer.

[0024] Optionally, in the above heat dissipation element, the thickness of the barrier structure is smaller than the thickness of the capillary structure.

[0025] An electronic device, comprising:

[0026] Heat generating components;

[0027] A heat sink connected to the heat generating component for dissipating heat from the heat generating component, the heat sink comprising:

[0028] A body, wherein the interior of the body is hollow;

[0029] A capillary structure connected to the inner wall of the body and used to contain a medium liquid;

[0030] The barrier structure is connected to the capillary structure and is used to isolate the contact between the medium gas and the medium liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0032] Figure 1 is a cross-sectional view of a heat sink provided in an embodiment of the present application;

[0033] Figure 2 This is a schematic diagram of a heat sink provided in an embodiment of the present application when making a barrier structure;

[0034] Figure 3 is a cross-sectional view perpendicular to the flow direction of the medium gas of the heat sink provided in an embodiment of the present application;

[0035] Figure 4 It is a cross-sectional view perpendicular to the flow direction of the medium gas of a heat sink provided in another embodiment of the present application.

[0036] The markings in the figure are:

[0037] 1. Main body; 2. Capillary structure; 3. Barrier structure; 4. Dielectric liquid; 5. Dielectric gas; 6. Center rod;

[0038] 11. Evaporation section; 12. Middle section; 13. Condensation section; 31. Second flow channel. DETAILED DESCRIPTION

[0039] The present application provides a heat dissipation device having a high heat dissipation performance.

[0040] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0041] See also Figure 1 The embodiment of the present application provides a heat sink, comprising a body 1, a capillary structure 2 and a barrier structure 3. The body 1 of the heat sink is hollow inside, and the capillary structure 2 is connected to the inner wall of the body 1 to accommodate a dielectric liquid 4. The barrier structure 3 is connected to the capillary structure 2 to isolate the contact between the dielectric gas 5 and the dielectric liquid 4.

[0042] Specifically, the heat sink can be a heat pipe, a heat spreader and other types. The heat sink is used to dissipate heat from heat-generating components, for example, it can be used to dissipate heat from components such as the CPU and GPU of a computer. The working principle of the heat sink is that after the heat from the heat-generating component is transferred to the dielectric liquid 4 (such as water) in the body 1 through the body 1, the dielectric liquid 4 is heated and becomes a dielectric gas 5. Under the action of the pressure difference, the dielectric gas 5 flows inside the body 1. After the dielectric gas 5 flows to a certain place, it condenses and releases heat. In this way, the dielectric gas 5 turns back into the dielectric liquid 4. After the dielectric liquid 4 enters the capillary structure 2, it flows back under the capillary action and returns to the place where it was originally heated by the heat. In this way, the heat of the heat-generating component is continuously taken away to achieve heat dissipation of the heat-generating component.

[0043] by Figure 1Taking the heat sink shown in the figure as an example, the dielectric liquid 4 absorbs heat at the left end and becomes dielectric gas 5, and then the dielectric gas 5 flows from left to right, condenses and releases heat after reaching the right end, and then the dielectric gas 5 becomes dielectric liquid 4, and the dielectric liquid 4 flows from right to left along the capillary structure 2, and then returns to the left end to absorb heat again. In this cycle, the heat from the heat-generating component (not shown in the figure) is continuously transferred by the medium in the heat sink, thereby achieving heat dissipation of the heat-generating component.

[0044] Since the heat sink is provided with a barrier structure 3 connected to the capillary structure 2, the barrier structure 3 can isolate the contact between the dielectric gas 5 and the dielectric liquid 4, so the dielectric gas 5 and the dielectric liquid 4 flowing in opposite directions will not affect each other's flow, that is, due to the existence of the barrier structure 3, the dielectric gas 5 and the dielectric liquid 4 are prevented from flowing slowly due to the strong shear force at the gas-liquid contact surface. In this way, the heat sink can dissipate heat from the heat-generating components with higher efficiency. Therefore, compared with traditional heat sinks, the heat dissipation of the present application has higher heat dissipation performance.

[0045] like Figure 1As shown, the body 1 includes an evaporation section 11, a condensation section 13 and an intermediate section 12, and the intermediate section 12 is located between the evaporation section 11 and the condensation section 13. In a preferred embodiment, the barrier structure 3 at least partially covers the intermediate section 12, including the case where the barrier structure 3 partially or completely covers the intermediate section 12, that is, the barrier structure 3 can be provided only in the intermediate section 12, or in the intermediate section 12 and the part outside the intermediate section 12, for example, the length of the barrier structure 3 in the flow direction of the medium gas 5 corresponds to the length of the intermediate section 12, and the barrier structure 3 completely covers the intermediate section 12. For another example, the length of the barrier structure 3 in the flow direction of the medium gas 5 is greater than the length of the intermediate section 12, the first part of the barrier structure 3 covers the intermediate section 12, and the second part of the barrier structure 3 exceeds the intermediate section 12 and covers the evaporation section 11 or the condensation section 13. For another example, the length of the barrier structure 3 in the flow direction of the dielectric gas 5 is greater than the length of the middle section 12, the first part of the barrier structure 3 covers the middle section 12, the second part of the barrier structure 3 exceeds the middle section 12 and covers the evaporation section 11, and the third part of the barrier structure 3 exceeds the middle section 12 and covers the condensation section 13. It should be noted that when a part of the barrier structure 3 is set to cover the evaporation section 11 and / or the condensation section 13, the part of the barrier structure 3 will not affect the dielectric liquid 4 flowing out of the capillary structure 2 after being heated to become the dielectric gas 5, and the dielectric gas 5 entering the capillary structure 2 after being condensed to become the dielectric liquid 4. For example, the barrier structure 3 can be set as a non-solid structure, as long as it can avoid direct contact between the dielectric gas 5 and the dielectric liquid 4 flowing in opposite directions. When the dielectric liquid 4 is heated to become the dielectric gas 5, or when the dielectric gas 5 is condensed to become the dielectric liquid 4, the dielectric gas 5 can pass through the barrier structure 3 and leave the capillary structure 2, and the dielectric liquid 4 can pass through the barrier structure 3 and enter the capillary structure 2.

[0046] In addition, the barrier structure 3 at least partially covers the middle section 12, and also includes the case where the barrier structure 3 only covers a part of the middle section 12, for example, the length of the barrier structure 3 in the flow direction of the medium gas 5 corresponds to the length of the middle section 12, but the barrier structure 3 has an incoherent coverage area, so that the first part of the middle section 12 is covered by the barrier structure 3, and the second part of the middle section 12 is not covered by the barrier structure 3. It is easy to understand that the incoherent part of the coverage area of ​​the barrier structure 3 can be called a spacing area. Specifically, there are many options for the arrangement of the spacing area. For example, the spacing area is set as a long strip extending along the flow direction of the medium gas 5, and a plurality of spacing areas are dispersedly arranged in the circumferential direction centered on the flow direction of the medium gas 5. For another example, the spacing area is set in a ring centered on the flow direction of the medium gas 5, and a plurality of spacing areas are dispersedly arranged in the flow direction of the medium gas 5. For another example, the spacing area is set in a circular, square or other shape, and a plurality of spacing areas are randomly or in a lattice arrangement on the entire area corresponding to the middle section 12.

[0047] In a preferred embodiment, the capillary structure 2 has a first flow channel for accommodating a medium liquid 4, the barrier structure 3 forms a second flow channel for accommodating a medium gas 5, and the barrier structure 3 is provided between the first flow channel and the second flow channel. Specifically, the second flow channel can be formed partially inside the barrier structure 3, or outside the barrier structure 3, or both outside and partially inside the barrier structure 3. For example, in Figure 3 In the structure shown, the barrier structure 3 is arranged in a channel shape, and the medium gas 5 flows along the channel surrounded by the barrier structure 3, that is, the second flow channel 31. At this time, the second flow channel 31 is the space surrounded by the barrier structure 3. For example, in Figure 4 In the structure shown, the barrier structure 3 is enclosed in the shape of a channel, and a groove extending parallel to the flow direction of the medium gas 5 is formed on one side of the barrier structure 3 close to the channel. A portion of the medium gas 5 flows along the groove, i.e., the second flow channel 31. At this time, the second flow channel 31 is a portion of the interior of the barrier structure 3, for example, only occupies half of the thickness of the barrier structure 3.

[0048] In a preferred embodiment, the barrier structure 3 has a portion that exceeds the middle section 12 and covers the evaporation section 11 and the condensation section 13, the first flow channel and the second flow channel located in the evaporation section 11 are interconnected, the first flow channel and the second flow channel located in the condensation section 13 are interconnected, and the first flow channel and the second flow channel located in the middle section 12 are mutually blocked. That is, the portion of the barrier structure 3 located in the evaporation section 11 and the portion located in the evaporation section 11 are both non-solid, the first flow channel and the second flow channel are spatially connected here through the non-solid portion of the barrier structure 3, the portion of the barrier structure 3 located in the middle section 12 is solid, and the first flow channel and the second flow channel are spatially disconnected here by the solid portion of the barrier structure 3. Since the first flow channel and the second flow channel located in the evaporation section 11 are interconnected, the medium liquid 4 in the first flow channel can enter the second flow channel after being heated to become the medium gas 5. Similarly, since the first flow channel and the second flow channel located in the condensation section 13 are interconnected, the medium gas 5 in the second flow channel can enter the first flow channel after being condensed to become the medium liquid 4.

[0049] Since the first flow channel and the second flow channel located in the middle section 12 are mutually blocked, the medium liquid 4 flowing along the first flow channel and the medium gas 5 flowing along the second flow channel do not come into contact, thus avoiding the flow rate being affected by the strong shear force generated at the gas-liquid contact surface. In a preferred embodiment, the medium liquid 4 flows in a first direction in the first flow channel, and the medium gas 5 flows in a second direction in the second flow channel, and the first direction is opposite to the second direction. It should be understood that the first direction is the direction from the condensation section 13 to the evaporation section 11, and the second direction is the direction from the evaporation section 11 to the condensation section 13. Figure 1Taking the heat sink shown as an example, the first direction is from right to left, and the second direction is from left to right.

[0050] In a preferred embodiment, the capillary structure 2 has a first capillary force, the barrier structure 3 has a second capillary force, and the first capillary force is greater than the second capillary force. That is, the barrier structure 3 is not a completely solid structure, but a non-solid structure that can produce a capillary effect, but the capillary effect produced by the barrier structure 3 is weaker than the capillary effect produced by the capillary structure 2. Since the first capillary force is greater than the second capillary force, the dielectric liquid 4 contained in the capillary structure 2 will not be sucked away by the capillary effect of the barrier structure 3, so that the barrier structure 3 can better ensure that the dielectric gas 5 and the dielectric liquid 4 are isolated from contact.

[0051] In specific practical applications, the capillary structure 2 and the barrier structure 3 can be integrally formed, or they can be separately formed and connected. In the case where the capillary structure 2 and the barrier structure 3 are separately formed, the two can be connected by, for example, melt welding, adhesive connection, or mechanical assembly connection. Moreover, the barrier structure 3 can be set in a variety of forms, for example, the barrier structure 3 is set as a metal foil layer, a metal mesh layer, a metal electroplating layer or a graphene layer, and for another example, the barrier structure 3 is set as a waterproof and breathable membrane, as long as it can avoid direct contact between the medium gas 5 and the medium liquid 4 flowing in opposite directions. Preferably, the thickness of the barrier structure 3 is smaller than the thickness of the capillary structure 2, that is, in the thickness direction, the size of the barrier structure 3 is smaller than the size of the capillary structure 2, so that the barrier structure 3 can be avoided as much as possible from occupying too much size in the cross section perpendicular to the flow direction of the medium gas 5, thereby reducing the influence of the thickness of the barrier structure 3 on the flow rate of the medium gas 5. When making the barrier structure 3, a suitable manufacturing method can be selected according to the form of the capillary structure 2. For example, when the capillary structure 2 is a copper powder sintered structure, the barrier structure 3 can be set as a copper foil layer. When making a heat sink, the copper foil and copper powder are sintered together at a high temperature. After the copper powder is sintered, the capillary structure 2 is formed, and the copper foil forms the barrier structure 3. For another example, when the capillary structure 2 is a groove structure, the barrier structure 3 can also be set as a copper foil layer. When making a heat sink, the copper foil is attached to the surface of the groove structure, and the copper foil and the groove structure are welded and fixed at high temperature. For another example, when the capillary structure 2 is a metal fabric structure, a metal electroplating layer can be formed on the capillary structure 2 by electroplating as the barrier structure 3. Alternatively, a graphene layer can be formed on the capillary structure 2 by using a graphene spraying process as the barrier structure 3.

[0052] When the barrier structure 3 is set as a metal foil layer, the metal foil can be copper foil, silver foil, gold foil, aluminum foil or other metal materials. Metal foil is light in weight, thin in thickness, and easy to form a smooth surface, which is conducive to ensuring that the medium gas 5 and the medium liquid 4 flowing in opposite directions can flow at a higher speed. When the barrier structure 3 is set as a metal electroplating layer, it is conducive to making the thickness of the barrier structure 3 smaller, and the material of the metal electroplating layer can be copper or other metals. When the barrier structure 3 is set as a spray layer formed by spraying graphene, due to the high thermal conductivity of graphene, it can transfer heat faster and reduce thermal resistance. When the barrier structure 3 is set as a metal mesh layer, the barrier structure 3 is pre-woven by metal wire, and then placed in the interior of the heat sink as a whole. The high temperature causes the part of the barrier structure 3 in contact with the capillary structure 2 to slightly enter a molten state, so that the barrier structure 3 is fixedly connected to the capillary structure 2 after cooling. When the barrier structure 3 is configured as a waterproof breathable film, the barrier structure 3 is pre-cut into a waterproof breathable film of a suitable size and then bonded to the capillary structure 2 by an adhesive. When the barrier structure 3 is configured as a metal mesh layer or a waterproof breathable film, the manufacturing process of the heat sink is relatively simple, the production efficiency is high, and it is beneficial to reduce the overall cost of the heat sink.

[0053] See also Figure 2 In a specific embodiment, when making a heat sink, the barrier structure 3 and the capillary structure 2 are sintered together. The internal structure of the heat sink during processing is: body 1-filled copper powder-metal foil-center rod 6, and then sintering is performed, wherein the metal foil, copper powder and the inner wall of the body 1 are molten and sintered together at the same high temperature of 900°C. The center rod 6 is made of high temperature resistant materials such as ceramics and titanium alloys. After sintering is completed, the center rod 6 is pulled out.

[0054] The present application also provides an electronic device, including a heat generating component and a heat sink as disclosed in the above embodiment, wherein the evaporation section 11 of the heat sink is connected to the heat generating component for dissipating heat from the heat generating component. Since the heat sink disclosed in the above embodiment has the above technical effects, the electronic device having the heat sink also has the above technical effects, which will not be described in detail herein. Specifically, the electronic device can be a laptop computer, a tablet computer, a mobile phone, a server, and other types.

[0055] In this specification, each part of the structure is described in a progressive manner, and the structure of each part focuses on the differences from the existing structure. The overall and partial structures of the heat sink and the electronic device can be obtained by combining the structures of the above multiple parts.

[0056] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat sink, comprising: A body, wherein the interior of the body is hollow, and the body comprises an evaporation section, a condensation section and a middle section, wherein the middle section is located between the evaporation section and the condensation section; A capillary structure connected to the inner wall of the body and used to contain a medium liquid; The barrier structure is connected to the capillary structure and is used to isolate the contact between the medium gas and the medium liquid. The barrier structure at least partially covers the middle section, and the part of the barrier structure covering the outside of the middle section is a non-solid structure.

2. The heat sink according to claim 1, characterized in that: The capillary structure has a first flow channel for accommodating a medium liquid, the barrier structure forms a second flow channel for accommodating a medium gas, and the barrier structure is disposed between the first flow channel and the second flow channel.

3. The heat sink according to claim 2, characterized in that: The first flow channel and the second flow channel located in the evaporation section are connected to each other; The first flow channel and the second flow channel located in the condensation section are connected to each other; The first flow channel and the second flow channel located in the middle section are isolated from each other.

4. The heat sink according to claim 3, characterized in that: The medium liquid flows in the first flow channel along a first direction; The medium gas flows in the second flow channel along a second direction; The first direction is opposite to the second direction.

5. The heat sink according to claim 1, characterized in that: The capillary structure has a first capillary force, the barrier structure has a second capillary force, and the first capillary force is greater than the second capillary force.

6. The heat sink according to claim 1, characterized in that: The capillary structure and the barrier structure are integrally formed; or The capillary structure and the barrier structure are formed separately and connected.

7. The heat sink according to claim 1, characterized in that: The barrier structure is a metal foil layer, a metal mesh layer or a graphene layer.

8. The heat sink according to claim 1, characterized in that: The thickness of the barrier structure is smaller than the thickness of the capillary structure.

9. An electronic device, comprising: Heat generating components; A heat sink connected to the heat generating component for dissipating heat from the heat generating component, the heat sink comprising: A body, wherein the interior of the body is hollow, and the body comprises an evaporation section, a condensation section and a middle section, wherein the middle section is located between the evaporation section and the condensation section; A capillary structure connected to the inner wall of the body and used to contain a medium liquid; The barrier structure is connected to the capillary structure and is used to isolate the contact between the medium gas and the medium liquid. The barrier structure at least partially covers the middle section, and the part of the barrier structure covering the outside of the middle section is a non-solid structure.

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