Heat dissipation structure of circuit board

Abstract

The utility model discloses a heat dissipation structure of a circuit board, which relates to the technical field of circuit boards, and comprises a shell, a main circuit board, a chip circuit board, a chip heat dissipation structure and a shell heat dissipation assembly, the chip heat dissipation structure comprises a radiator, a graphene patch and silica gel, and the shell heat dissipation assembly comprises an air outlet and an air inlet. According to the utility model, the circuit board consists of the main circuit board and the chip circuit board which are detachable, so that the maintenance convenience is improved, and the cost is saved; through cooperative use of the silica gel and the graphene patch, the heat dissipation efficiency is improved, the silica gel can protect the chip and prevent the chip from being damaged, and air circulation is guaranteed through the arranged air outlets so as to achieve heat exchange.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a heat dissipation structure of a circuit board. Background Art

[0002] NAS, which stands for Network Attached Storage in English, is a mechanism that uses special devices directly connected to network media to achieve data storage. With the development of technology, users' demand for data storage has increased, and the requirements for NAS have also increased accordingly, especially the heat dissipation performance.

[0003] In the prior art, the circuit board is one of the core components of NAS. When the NAS is in high computing power mode or the circuit board is powered on for a long time, the circuit board will generate high temperature, which may cause the circuit board to burn. Therefore, a heat dissipation structure of the circuit board has become a problem that technicians in this field need to solve urgently. Utility Model Content

[0004] The purpose of the embodiments of the present utility model is to provide a heat dissipation structure of a circuit board to solve the problems raised in the above-mentioned background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A heat dissipation structure of a circuit board comprises a housing, a circuit board and a heat dissipation structure, wherein the circuit board and the heat dissipation structure are both arranged inside the housing, and the heat dissipation structure comprises:

[0007] A chip heat dissipation structure is arranged inside the housing, and the chip heat dissipation structure is connected to the circuit board to dissipate heat from the circuit board;

[0008] The shell heat dissipation component is connected to the shell and is used to dissipate heat for the chip heat dissipation structure and the circuit board.

[0009] As a further solution of the utility model: the circuit board includes: a main circuit board and a chip circuit board, the main circuit board and the chip circuit board are both arranged inside the shell, and the chip circuit board and the main circuit board can be detachably connected.

[0010] As a further solution of the utility model: the chip heat dissipation structure includes:

[0011] A heat sink, the bottom end of which is detachably connected to the front side of the main circuit board, and the heat sink is located on the top of the front side of the chip circuit board;

[0012] The heat conducting component has one end connected to the heat sink and the other end connected to the chip circuit board, and is used to conduct the heat generated by the chip circuit board.

[0013] As a further solution of the utility model: the heat conducting component comprises:

[0014] The graphene patch is attached to the back of the chip circuit board;

[0015] Silicone, one side is attached to the front of the chip circuit board, and the other side is attached to the bottom of the heat sink.

[0016] As a further solution of the utility model: the housing heat dissipation assembly includes:

[0017] An air outlet is provided at one end of the shell, and the air outlet is composed of a plurality of groups of small through holes;

[0018] The air inlet is opened at the other end of the shell, and the air inlet is composed of a plurality of groups of small through holes.

[0019] As a further solution of the utility model: the main circuit board includes: a substrate and a conductive layer, the conductive layer is coated on the substrate, and the substrate is connected to the shell.

[0020] As a further solution of the utility model: the chip circuit board includes: a chip board, a chip and a shielding cover, the chip is provided in several groups, the shielding cover is detachably connected to the chip board, and several groups of the chips are detachably arranged in the shielding cover and connected to the chip board.

[0021] As a further solution of the utility model: the radiator includes: a fixed base, fins and fixed protrusions, the bottom of the fixed base is attached to the silicone, a plurality of groups of fixed protrusions are provided at the bottom of the fixed base, the plurality of groups of fixed protrusions are detachably connected to the main circuit board, and the fins are installed on the top of the fixed base.

[0022] As a further solution of the utility model: a cooling fan is provided at the air outlet, and the cooling fan is connected to the housing.

[0023] As a further solution of the utility model: an attaching protrusion is provided at the bottom of the fixed base, and the silicone is attached to the attaching protrusion.

[0024] As a further solution of the utility model: a cooling fan is provided at the air outlet, and the cooling fan is connected to the housing.

[0025] Compared with the prior art, the beneficial effects of the utility model are:

[0026] 1. The circuit board consists of two parts: the main circuit board and the chip circuit board, and the two parts can be separated, which improves the convenience of maintenance and saves costs;

[0027] 2. The combined use of silicone and graphene patches improves heat dissipation efficiency, and silicone can also protect the chip to prevent chip damage;

[0028] 3. The utility model has a reasonable structural layout, which ensures the rationality of the spatial layout of the heat dissipation structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 The figure is a schematic structural diagram of a heat dissipation structure of a circuit board in an embodiment of the utility model.

[0030] Figure 2 The figure is a schematic diagram of the internal structure of a heat dissipation structure of a circuit board in an embodiment of the utility model.

[0031] Figure 3 It is a schematic diagram of the structure explosion of the chip heat dissipation structure in the embodiment of the utility model.

[0032] Figure 4 It is a schematic diagram of the structure of the chip circuit board in the embodiment of the utility model.

[0033] In the figure: 1. shell; 2. air outlet; 3. air inlet; 4. cooling fan; 5. main circuit board; 6. chip circuit board; 61. chip board; 62. shielding cover; 63. chip; 7. chip heat dissipation structure; 71. radiator; 72. graphene patch; 73. silica gel; 711. fixed base; 712. fin; 713. fixed protrusion. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0035] In the present utility model embodiment, please refer to Figures 1 to 4 A heat dissipation structure of a circuit board comprises: a housing 1, a circuit board and a heat dissipation structure, wherein the circuit board and the heat dissipation structure are both arranged inside the housing 1, and the heat dissipation structure comprises:

[0036] The chip heat dissipation structure 7 is arranged inside the housing 1, and the chip heat dissipation structure 7 is connected to the circuit board to dissipate heat from the circuit board;

[0037] A shell heat dissipation component, connected to the shell 1, for dissipating heat for the chip heat dissipation structure 7 and the circuit board;

[0038] The circuit board includes: a main circuit board 5 and a chip circuit board 6. The main circuit board 5 and the chip circuit board 6 are both arranged inside the housing 1. The chip circuit board 6 and the main circuit board 5 can be detachably connected.

[0039] The chip heat dissipation structure 7 dissipates heat for the chip circuit board 6 , and the shell heat dissipation component dissipates heat for the chip circuit board 6 and the main circuit board 5 , further improving the heat dissipation effect.

[0040] In the embodiment of the utility model, the chip circuit board 6 and the main circuit board 5 are detachably connected, and the detachable connection can be achieved by welding, pin connection, etc. Preferably, the chip circuit board 6 and the main circuit board 5 are welded. When the chip circuit board 6 and / or the main circuit board 5 need to be maintained, the two can be detached, which improves the convenience of maintenance and saves costs.

[0041] As an embodiment of the present invention, please refer to Figure 1 , the chip heat dissipation structure 7 includes:

[0042] A heat sink 71, the bottom end of which is detachably connected to the front side of the main circuit board 5, and the heat sink 71 is located at the top of the front side of the chip circuit board 6;

[0043] A heat conducting component, one end of which is connected to the heat sink 71 and the other end of which is connected to the chip circuit board 6, for conducting the heat generated by the chip circuit board 6;

[0044] The heat conducting component comprises:

[0045] The graphene patch 72 is attached to the back surface of the chip circuit board 6;

[0046] Silicone gel 73, one side of which is attached to the front of the chip circuit board 6, and the other side of which is attached to the bottom of the heat sink 71;

[0047] The radiator 71 includes: a fixed base 711, fins 712 and fixed protrusions 713. The bottom of the fixed base 711 is attached to the silicone 73. A plurality of groups of fixed protrusions 713 are provided at the bottom of the fixed base 711. The plurality of groups of fixed protrusions 713 are detachably connected to the main circuit board 5. The fins 712 are installed on the top of the fixed base 711.

[0048] The heat of the chip 63 can be quickly transferred to the fins 712 on the radiator 71 for heat dissipation through the silica gel 73, thereby protecting the chip 63. The fins 712 increase the contact area with the air, thereby improving the heat dissipation efficiency. The graphene patch 72 can disperse the heat of the chip 63 to protect the chip 63. The silica gel 73 is elastic and can protect the chip 63 and prevent the force of the radiator 71 from directly acting on the chip 63 and causing damage to the chip 63. The fixed base 711 is fixedly installed on the main circuit board 5 through the fixing protrusions 713, thereby satisfying the heat dissipation performance through the fins 712 while improving the stability of the radiator 71.

[0049] In the embodiment of the utility model, the bottom of the fixed base 711 is provided with an attachment protrusion, and the silicone 73 is attached to the attachment protrusion. The silicone 73 is positioned by the attachment protrusion so that the radiator 71 will not be skewed, ensuring the rationality of the spatial layout of the heat dissipation structure.

[0050] In the embodiment of the utility model, the heat sink 71 can be made of aluminum alloy, copper and other materials.

[0051] In the embodiment of the utility model, the fixing protrusion 713 is detachably connected to the main circuit board 5, and the detachable connection is connected to the main circuit board 5 by screws, or by springs + glue nails; preferably, in this embodiment, the fixing protrusion 713 is connected to the main circuit board 5 by springs + glue nails.

[0052] As an embodiment of the present invention, please refer to Figure 1 , the housing heat dissipation assembly comprises:

[0053] The air outlet 2 is opened at one end of the housing 1, and the air outlet 2 is composed of a plurality of groups of small through holes;

[0054] The air inlet 3 is opened at the other end of the housing 1, and the air inlet 3 is composed of a plurality of groups of small through holes;

[0055] A heat dissipation fan 4 is provided at the air outlet 2 , and the heat dissipation fan 4 is connected to the housing 1 .

[0056] The air circulation is ensured by setting the air outlet 2 and the air outlet 3 to realize the heat exchange, dissipate the heat of the chip circuit board 6 and the main circuit board 5, and protect the circuit board. When the circuit board is powered on, the cooling fan 4 rotates forward, thereby accelerating the air flow speed and maximizing the heat dissipation of the chip heat dissipation structure 7. When the circuit board receives a shutdown command, the cooling fan 4 reverses, thereby changing the wind direction, blowing away the dust at the air inlet 3, and preventing dust accumulation on the circuit board.

[0057] As an embodiment of the present invention, please refer to Figure 1 The main circuit board 5 includes: a substrate and a conductive layer, the conductive layer is coated on the substrate, and the substrate is connected to the shell 1; the chip circuit board 6 includes: a chip board 61, a chip 63 and a shielding cover 62, the chip 63 is provided in several groups, the shielding cover 62 is detachably connected to the chip board 61, and several groups of the chips 63 are detachably arranged in the shielding cover 62 and connected to the chip board 61.

[0058] The shielding cover 62 can effectively ensure that the chip 63 is shielded from interference from other noises. The chip circuit board 6 can be an integrated structure or a detachable structure. The detachable structure is easy to maintain and saves costs.

[0059] In the embodiment of the utility model, the shielding cover 62 can be made of materials such as nickel silver or tinplate. Preferably, the shielding cover 62 is made of nickel silver, which has a better shielding effect.

[0060] The working principle of the utility model is: the heat of the chip 63 can be quickly transferred to the fins 712 on the radiator 71 through the silica gel 73 for heat dissipation, so as to protect the chip 63. The fins 712 increase the contact area with the air, thereby improving the heat dissipation efficiency. The graphene patch 72 can disperse the heat of the chip 63 to protect the chip 63. The air circulation is ensured by setting the air outlet 2 and the air outlet 3 to achieve heat exchange, and the chip circuit board 6 and the main circuit board 5 are cooled to protect the circuit board. When the circuit board is powered on, the cooling fan 4 rotates forward to speed up the air flow speed and maximize the heat dissipation of the chip heat dissipation structure 7. When the circuit board receives a shutdown command, the cooling fan 4 reverses, thereby changing the wind direction, blowing away the dust at the air inlet 3, and preventing dust accumulation on the circuit board.

[0061] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0062] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A heat dissipation structure of a circuit board, comprising a housing, a circuit board and a heat dissipation structure, wherein the circuit board and the heat dissipation structure are both arranged inside the housing, characterized in that: The heat dissipation structure comprises: A chip heat dissipation structure is arranged inside the housing, and the chip heat dissipation structure is connected to the circuit board to dissipate heat from the circuit board; The shell heat dissipation component is connected to the shell and is used to dissipate heat for the chip heat dissipation structure and the circuit board.

2. The heat dissipation structure of a circuit board according to claim 1, characterized in that: The circuit board comprises: a main circuit board and a chip circuit board. The main circuit board and the chip circuit board are both arranged inside the shell. The chip circuit board and the main circuit board can be detachably connected.

3. The heat dissipation structure of a circuit board according to claim 2, characterized in that: The chip heat dissipation structure comprises: A heat sink, the bottom end of which is detachably connected to the front side of the main circuit board, and the heat sink is located on the top of the front side of the chip circuit board; The heat conducting component has one end connected to the heat sink and the other end connected to the chip circuit board, and is used to conduct the heat generated by the chip circuit board.

4. The heat dissipation structure of a circuit board according to claim 3, characterized in that: The heat conducting component comprises: The graphene patch is attached to the back of the chip circuit board; Silicone, one side is attached to the front of the chip circuit board, and the other side is attached to the bottom of the heat sink.

5. The heat dissipation structure of a circuit board according to claim 1, characterized in that: The housing heat dissipation assembly comprises: An air outlet is provided at one end of the shell, and the air outlet is composed of a plurality of groups of small through holes; The air inlet is opened at the other end of the shell, and the air inlet is composed of a plurality of groups of small through holes.

6. The heat dissipation structure of a circuit board according to claim 2, characterized in that: The main circuit board comprises: a substrate and a conductive layer, wherein the conductive layer is coated on the substrate, and the substrate is connected to the housing.

7. The heat dissipation structure of a circuit board according to claim 2, characterized in that: The chip circuit board comprises: a chip board, a chip and a shielding cover. The chip is provided in several groups. The shielding cover is detachably connected to the chip board. Several groups of the chips are detachably arranged in the shielding cover and connected to the chip board.

8. The heat dissipation structure of a circuit board according to claim 4, characterized in that: The radiator comprises: a fixed base, fins and fixed protrusions, the bottom of the fixed base is attached to the silica gel, a plurality of groups of fixed protrusions are arranged at the bottom of the fixed base, the plurality of groups of fixed protrusions are detachably connected to the main circuit board, and the fins are installed on the top of the fixed base.

9. The heat dissipation structure of a circuit board according to claim 5, characterized in that: A heat dissipation fan is provided at the air outlet, and the heat dissipation fan is connected to the shell.

10. The heat dissipation structure of a circuit board according to claim 8, characterized in that: An attachment protrusion is provided at the bottom of the fixing base, and the silica gel is attached to the attachment protrusion.

Images