Electronic equipment

Abstract

The utility model provides electronic equipment, which comprises a shell, a substrate and a heat conduction assembly, and is characterized in that the shell is provided with an accommodating space; the substrate is arranged in the containing space and provided with a first surface and a second surface which are opposite to each other, the first surface is used for being connected with a first heating element, and the second surface is used for being connected with a second heating element; the heat conduction assembly comprises a first heat conduction structure and a second heat conduction structure, the first heat conduction structure is arranged on the first surface, and the second heat conduction structure is arranged on the second surface.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] Electronic devices (such as desktop computer hosts, servers, etc.) generate heat when working, especially when performing complex calculations such as video editing and AI calculations, more heat is generated.

[0003] At present, fans are usually installed in electronic devices to accelerate the air flow inside the electronic devices, so that the heat inside the electronic devices can be dissipated through the heat dissipation holes on the electronic devices. However, the fan will generate noise during operation, and in order to meet the complex calculations of electronic devices, the size of the fan is also increasing, and the larger the fan, the greater the noise. Utility Model Content

[0004] The present application provides an electronic device, and the technical solution is as follows:

[0005] To solve the above technical problems, an embodiment of the present application provides an electronic device, the electronic device comprising: a housing, a substrate and a heat-conducting component, the housing having a containing space; the substrate being arranged in the containing space, having a first surface and a second surface opposite to each other, the first surface being used to connect a first heating element, and the second surface being used to connect a second heating element; the heat-conducting component comprising: a first heat-conducting structure and a second heat-conducting structure, the first heat-conducting structure being arranged on the first surface, and the second heat-conducting structure being arranged on the second surface.

[0006] In some embodiments, at least a portion of the projection of the first heat-conducting structure onto the second heat-conducting structure does not completely overlap with the second heat-conducting structure; and / or, the heat-conducting assembly further includes: a third heat-conducting structure, which is respectively connected to the first heat-conducting structure and the second heat-conducting structure.

[0007] In some embodiments, the first heat-conducting structure includes: a first temperature averaging plate, a second temperature averaging plate and a first heat-conducting pipe; the first temperature averaging plate is arranged on the first surface and connected to the first heating element; the second temperature averaging plate is arranged on the first surface; the first heat-conducting pipe is arranged between the first temperature averaging plate and the second temperature averaging plate, and both ends of the first heat-conducting pipe are respectively connected to the first temperature averaging plate and the second temperature averaging plate.

[0008] In some embodiments, the first temperature averaging plate and the second temperature averaging plate are respectively disposed adjacent to two edges of the first surface that are opposite to each other; or, a plurality of the first heat pipes are disposed between the first temperature averaging plate and the second temperature averaging plate.

[0009] In some embodiments, the second heat-conducting structure includes: a third temperature averaging plate, a fourth temperature averaging plate and a second heat-conducting pipe; the third temperature averaging plate is arranged on the second surface and connected to the second heating element; the fourth temperature averaging plate is arranged on the second surface; the second heat-conducting pipe is located on the same side of the third temperature averaging plate and the fourth temperature averaging plate, and both ends of the second heat-conducting pipe are bent respectively to be connected to the third temperature averaging plate and the fourth temperature averaging plate respectively.

[0010] In some embodiments, the third temperature averaging plate and the fourth temperature averaging plate are respectively disposed adjacent to two opposite edges of the second surface; or, a plurality of the second heat pipes correspond to different sides of the third temperature averaging plate and the fourth temperature averaging plate.

[0011] In some embodiments, the outer shell has a first inner surface and a first outer surface opposite to each other, and the outer shell has thermal conductivity; the first inner surface is at least arranged opposite to the first surface, and the first inner surface is provided with at least one third heat pipe; the first outer surface is provided with at least one first protrusion.

[0012] In some embodiments, a first space is recessed on a side of the first inner surface facing the first surface, the third heat pipe is disposed in the first space, a graphene sheet is further disposed in the first space, the graphene sheet is located between the third heat pipe and the first heat-conducting structure, and the graphene sheet at least partially covers the third heat pipe.

[0013] In some embodiments, the housing has a second inner surface and a second outer surface opposite to each other; the second inner surface is arranged opposite to the second surface, and at least one fourth heat pipe is arranged on the second inner surface; and the second outer surface is provided with at least one second protrusion.

[0014] In some embodiments, a heat sink is further disposed on the second inner surface. The heat sink is located on a side of the fourth heat pipe close to the second heat conducting structure, and the heat sink and the contour of the structural member on the second surface are matched with each other.

[0015] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present application in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 Schematic diagram of the decomposition structure of the electronic device provided in the embodiment of the present application Figure 1 ;

[0018] Figure 2 Schematic diagram of the decomposition structure of the electronic device provided in the embodiment of the present application Figure 2 ;

[0019] Figure 3 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0020] Figure 4 A schematic diagram of a partial exploded structure of an electronic device provided in an embodiment of the present application;

[0021] Figure 5 A schematic structural diagram of a first surface of a substrate of an electronic device provided in an embodiment of the present application;

[0022] Figure 6 A schematic structural diagram of a first heat-conducting structure of an electronic device provided in an embodiment of the present application being connected to a first heating element;

[0023] Figure 7 A schematic diagram of the structure of the second surface of the substrate of the electronic device provided in an embodiment of the present application;

[0024] Figure 8 A schematic diagram of a structure in which a second heat-conducting structure of an electronic device provided in an embodiment of the present application is connected to a second heating element;

[0025] Fig. 9 A schematic diagram of a partial structure of an electronic device provided in an embodiment of the present application Figure 1 ;

[0026] Fig.10 A schematic diagram of a partial structure of an electronic device provided in an embodiment of the present application Figure 2 ;

[0027] Fig.11 A schematic diagram of a partial structure of an electronic device provided in an embodiment of the present application Figure 3 .

[0028] Description of reference numerals:

[0029] 100, electronic device; 10, housing; 101, accommodation space; 102, first outer surface; 1021, first protrusion; 103, third heat pipe; 104, first space; 105, graphene sheet; 106, second outer surface; 1061, second protrusion; 107, fourth heat pipe; 108, heat sink; 109, first housing; 110, first connecting plate; 111, second connecting plate; 112, second housing; 113, first extension Extension portion; 114, second extension portion; 20, substrate; 201, first surface; 202, second surface; 203, first heating element; 204, second heating element; 30, heat conduction component; 301, first heat conduction structure; 3011, first temperature averaging plate; 3012, second temperature averaging plate; 3013, first heat conduction pipe; 302, second heat conduction structure; 3021, third temperature averaging plate; 3022, fourth temperature averaging plate; 3023, second heat conduction pipe. DETAILED DESCRIPTION

[0030] The following is a further detailed description of the implementation methods of the present application in conjunction with the accompanying drawings and examples. The detailed descriptions of the following examples and the accompanying drawings are used to exemplarily illustrate the principles of the present application, but cannot be used to limit the scope of the present application. The present application can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

[0031] The present application provides these embodiments to make the present application thorough and complete, and to fully express the scope of the present application to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of the parts and steps, the composition of the materials, the numerical expressions and the numerical values ​​set forth in these embodiments should be interpreted as being merely exemplary, and not as limiting.

[0032] It should be noted that, in the description of this application, unless otherwise specified, the meaning of "multiple" is greater than or equal to two; the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating the orientation or positional relationship, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0033] In addition, the words "first", "second" and similar words used in this application do not indicate any order, quantity or importance, but are only used to distinguish different parts. "Vertical" does not mean vertical in the strict sense, but is within the tolerance range. "Parallel" does not mean parallel in the strict sense, but is within the tolerance range. "Include" or "comprising" and similar words mean that the elements before the word include the elements listed after the word, and do not exclude the possibility of including other elements.

[0034] It should also be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances. When a specific device is described as being located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device.

[0035] All terms used in this application have the same meaning as those understood by those of ordinary skill in the art to which this application belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries, such as general dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined herein.

[0036] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0037] The present application embodiment provides an electronic device 100, see Figures 1 to 11 As shown, the electronic device 100 includes: a housing 10, a substrate 20 and a heat-conducting component 30, the housing 10 has a containing space 101; the substrate 20 is arranged in the containing space 101, and has a first surface 201 and a second surface 202 opposite to each other, the first surface 201 is used to connect the first heating element 203, and the second surface 202 is used to connect the second heating element 204; the heat-conducting component 30 includes: a first heat-conducting structure 301 and a second heat-conducting structure 302, the first heat-conducting structure 301 is arranged on the first surface 201, and the second heat-conducting structure 302 is arranged on the second surface 202.

[0038] The housing 10 may be a structure having a receiving space 101 formed by enclosing a plurality of plates, for example, the housing 10 is a rectangular parallelepiped structure having a receiving space 101 formed by enclosing six plates; or a structure having a receiving space 101 formed by docking a plurality of parts having grooves, for example, the housing 10 includes two parts, two surfaces of the two parts facing each other are respectively recessed with grooves, so that after the two parts are docked, the grooves on the two parts dock with each other to form the receiving space 101. The housing 10 may be a structure made of a heat-conducting material such as aluminum, so that the heat in the receiving space 101 close to the housing 10 can be quickly conducted to the outside of the housing 10.

[0039] The substrate 20 is disposed in the accommodating space 101, and has a first surface 201 and a second surface 202 opposite to each other. The first surface 201 is used to connect the first heating element 203, and the second surface 202 is used to connect the second heating element 204. That is to say, the substrate 20 is disposed in the housing 10, and the first surface 201 and the second surface 202 opposite to each other on the substrate 20 are respectively provided with the first heating element 203 and the second heating element 204. The first heating element 203 and the second heating element 204 can be the same or different, for example, the first heating element 203 and the second heating element 204 are different, and the first heating element 203 is a central processing unit (CPU, Central Processing Unit), and the second heating element 204 is a graphics processing unit (GPU, graphics processing unit).

[0040] The heat-conducting assembly 30 includes: a first heat-conducting structure 301 and a second heat-conducting structure 302, wherein the first heat-conducting structure 301 is arranged on the first surface 201, and the second heat-conducting structure 302 is arranged on the second surface 202, so that the first heat-conducting structure 301 can guide the heat generated by the first heating element 203 of the first surface 201 to itself and then dissipate it to the surrounding colder area, and at the same time, the second heat-conducting structure 302 guides the heat generated by the second heating element 204 of the second surface 202 to itself and then dissipates it to the surrounding colder area, thereby realizing the cooling of the first heating element 203 and the second heating element 204. The first heat-conducting structure 301 / the second heat-conducting structure 302 can be a pipe, a plate, or an integrated body of a pipe and a plate, and the first heat-conducting structure 301 and the second heat-conducting structure 302 can be a completely symmetrical structure arrangement with respect to the substrate 20, or a partially symmetrical and partially asymmetrical structure arrangement, or a completely different structure arrangement from each other. The first heat-conducting structure 301 / the second heat-conducting structure 302 can be a heat-conducting structure arrangement of aluminum, copper or other materials.

[0041] In one example, a desktop computer includes a display, a host, and an adapter connecting the display and the host, and the electronic device 100 is the host. Figures 1 to 11 As shown, the electronic device 100 includes: a housing 10, a substrate 20 and a heat-conducting component 30, the housing 10 is a rectangular parallelepiped structure with an accommodating space 101; the substrate 20 is arranged in the accommodating space 101, and has a first surface 201 and a second surface 202 opposite to each other, the first heating element 203 connected to the first surface 201 is a CPU, and the second heating element 204 connected to the second surface 202 is a GPU; the heat-conducting component 30 includes: a first heat-conducting structure 301 and a second heat-conducting structure 302, the first heat-conducting structure 301 is arranged on the first surface 201 for connecting with the first heating element 203 to dissipate heat through heat conduction, the second heat-conducting structure 302 is arranged on the second surface 202 for connecting with the second heating element 204 to dissipate heat through heat conduction, and the structures of the first heat-conducting structure 301 and the second heat-conducting structure 302 are different.

[0042] In this embodiment, a substrate 20 is disposed in the housing 10 of the electronic device 100, and a first heating element 203 and a second heating element 204 are respectively disposed on a first surface 201 and a second surface 202 opposite to each other on the substrate 20, so that the heat generated by the first heating element 203 and the second heating element 204 are respectively dissipated in two spaces on the first surface 201 side and the second surface 202 side opposite to each other of the substrate 20, so as to perform two-way heat dissipation respectively, thereby reducing the heat generated by the first heating element 203 and the second heating element 204 from being accumulated in the same space, which may cause the first heating element 203 and the second heating element 204 to have excessively high temperatures or At the same time, the first surface 201 on which the first heating element 203 is provided on the substrate 20 is provided with a first heat-conducting structure 301 capable of directing the heat on the first heating element 203 to itself and then dissipating it to the surrounding colder area, and the second surface 202 on which the second heating element 204 is provided is provided with a second heat-conducting structure 302 capable of directing the heat generated by the second heating element 204 to itself and then dissipating it to the surrounding colder area, so that the temperature of the first surface 201 side and the second surface 202 side opposite to each other of the substrate 20 are uniformly dissipated, so as to improve the heat dissipation efficiency of the entire electronic device 100. In addition, in this embodiment, the heat dissipation of the electronic device 100 is performed by heat conduction, so that the electronic device 100 can be provided with a smaller fan or even no fan, so as to reduce the noise caused by the fan during the heat dissipation process of the electronic device 100.

[0043] In some embodiments, see Figure 1 and Figure 2 and Figures 5 to 8As shown, at least part of the projection of the first heat-conducting structure 301 onto the second heat-conducting structure 302 does not completely overlap with the second heat-conducting structure 302; and / or, the heat-conducting component 30 further includes: a third heat-conducting structure, which is connected to the first heat-conducting structure 301 and the second heat-conducting structure 302 respectively.

[0044] The first heat-conducting structure 301 and the second heat-conducting structure 302 are respectively located on the first surface 201 and the second surface 202 opposite to each other on the substrate 20, and at least a portion of the projection of the first heat-conducting structure 301 to the second heat-conducting structure 302 does not completely overlap with the second heat-conducting structure 302, that is, the projection of the first heat-conducting structure 301 to the second heat-conducting structure 302 is completely misaligned with the second heat-conducting structure 302, or a portion of the projection of the first heat-conducting structure 301 to the second heat-conducting structure 302 overlaps with the second heat-conducting structure 302 and another portion is misaligned with the second heat-conducting structure 302. When the projection of the first heat-conducting structure 301 onto the second heat-conducting structure 302 completely overlaps with the second heat-conducting structure 302, the heat directed to the first heat-conducting structure 301 and the heat directed to the second heat-conducting structure 302 will be accumulated, thereby affecting the heat dissipation. Therefore, here, at least a part of the projection of the first heat-conducting structure 301 onto the second heat-conducting structure 302 does not completely overlap with the second heat-conducting structure 302, so as to reduce the probability of heat accumulation between the first heat-conducting structure 301 and the second heat-conducting structure 302, thereby reducing the probability of excessive local temperature in the electronic device 100.

[0045] The third heat-conducting structure is connected to the first heat-conducting structure 301 and the second heat-conducting structure 302 respectively, so that the heat on the structure with a higher temperature of the first heat-conducting structure 301 and the second heat-conducting structure 302 can be guided to the structure with a lower temperature through the third heat-conducting structure, so that the heat is dispersed on the first heat-conducting structure 301 and the second heat-conducting structure 302 for heat dissipation respectively, thereby improving the heat dissipation rate and efficiency; for example: the first heating element 203 is working and the second heating element 204 is not working, so that the heat of the first heat-conducting structure 301 itself is higher than the heat of the second heat-conducting structure 302. At this time, the heat of the first heat-conducting structure 301 can be guided to the second heat-conducting structure 302 through the third heat-conducting structure, so that the heat is dispersed on the first heat-conducting structure 301 and the second heat-conducting structure 302 for heat dissipation respectively, thereby improving the heat dissipation rate and efficiency. The third heat-conducting structure may be disposed on the substrate 20, and its two ends are respectively connected to the first heat-conducting structure 301 and the second heat-conducting structure 302; the third heat-conducting structure may also be located on the side surface in the thickness direction of the substrate 20, and its two ends are bent to respectively connect to the first heat-conducting structure 301 and the second heat-conducting structure 302. The third heat-conducting structure may be a pipe, a plate, or an integrated body of a pipe and a plate.

[0046] In some embodiments, see Figure 5 and Figure 6 As shown, the first heat-conducting structure 301 includes: a first temperature averaging plate 3011, a second temperature averaging plate 3012 and a first heat-conducting pipe 3013; the first temperature averaging plate 3011 is arranged on the first surface 201 and connected to the first heating element 203; the second temperature averaging plate 3012 is arranged on the first surface 201; the first heat-conducting pipe 3013 is arranged between the first temperature averaging plate 3011 and the second temperature averaging plate 3012, and the two ends of the first heat-conducting pipe 3013 are respectively connected to the first temperature averaging plate 3011 and the second temperature averaging plate 3012.

[0047] The temperature equalizer, also known as the vapor chamber or superheat-conducting chamber, is composed of a metal shell and a capillary structure and a fluid arranged in the metal shell. The fluid circulates, evaporates, and condenses in the metal shell, so that the temperature equalizer has the functions of rapid temperature equalization, heat conduction, and heat diffusion. Compared with aluminum and copper materials, the temperature equalizer has a high thermal conductivity, so that it can conduct heat better. The first temperature equalizer 3011, the second temperature equalizer 3012, and the third temperature equalizer 3021 and the fourth temperature equalizer 3022 described below are all the temperature equalizer settings introduced here. The heat pipe can be a solid or hollow structure made of a heat-conducting material such as copper. The first heat pipe 3013, the second heat pipe 3023, the third heat pipe 103, and the fourth heat pipe 107 described below are all the heat pipe settings introduced here.

[0048] The first temperature averaging plate 3011 may be fixed to the first surface 201 of the substrate 20 by welding or other non-detachable means, or may be fixed to the first surface 201 of the substrate 20 by screwing or other detachable means. The first temperature averaging plate 3011 may be provided with a first accommodation space for accommodating the first heating element 203, and the first accommodation space may be in the form of a recess or a through hole, for example: Figure 5 and Figure 6 As shown, the surface of the first temperature equalizing plate 3011 facing away from the first surface 201 is recessed with a first accommodating space in the form of a recess, so that the first heating element 203 can be fixed in the first accommodating space by bonding, interference fit, etc.; for another example: the surface of the first temperature equalizing plate 3011 in the thickness direction is recessed with a first accommodating space in the form of a through hole, so that the first heating element 203 can be pushed into the first accommodating space; of course, the surface of the first temperature equalizing plate 3011 facing away from the first surface 201 can also be a plane, and the first heating element 203 is directly bonded to the plane.

[0049] The second temperature averaging plate 3012 may be fixed to the first surface 201 by a non-detachable method such as welding, or may be fixed to the first surface 201 by a detachable method such as screwing. The second temperature averaging plate 3012 may be consistent with the first temperature averaging plate 3011 in terms of area, thickness, shape, etc., or may be inconsistent.

[0050] The first heat pipe 3013 is arranged between the first temperature averaging plate 3011 and the second temperature averaging plate 3012, and the two ends of the first heat pipe 3013 are respectively connected to the first temperature averaging plate 3011 and the second temperature averaging plate 3012, so that the first heat pipe 3013 can guide the heat of the first heating element 203 collected by the first temperature averaging plate 3011 to the second temperature averaging plate 3012, and the heat on the side of the first surface 201 of the substrate 20 can be distributed on the first temperature averaging plate 3011, the second temperature averaging plate 3012 and the first heat pipe 3013, so that the heat distribution on the side of the first surface 201 of the substrate 20 is more dispersed, so as to further improve the heat dissipation rate of the electronic device 100. The first heat pipe 3013 can be connected to the first temperature averaging plate 3011 and the second temperature averaging plate 3012 respectively by a fixed connection method such as welding, and can also be connected to the first temperature averaging plate 3011 and the second temperature averaging plate 3012 by a detachable connection method such as plugging into the surface of the first temperature averaging plate 3011 in the thickness direction and the surface of the second temperature averaging plate 3012 in the thickness direction.

[0051] In some embodiments, see Figure 5 and Figure 6 As shown, the first temperature averaging plate 3011 and the second temperature averaging plate 3012 are respectively disposed adjacent to two opposite edges of the first surface 201 ; or, a plurality of first heat pipes 3013 are disposed between the first temperature averaging plate 3011 and the second temperature averaging plate 3012 .

[0052] The first temperature averaging plate 3011 and the second temperature averaging plate 3012 are respectively arranged near two edges of the first surface 201 opposite to each other, and the two edges of the first surface 201 are closer to the housing 10 of the electronic device 100, so that the heat on the first temperature averaging plate 3011 and the second temperature averaging plate 3012 can be more quickly dissipated to the housing 10 of the electronic device 100, and then dissipated to the outside of the electronic device 100, so as to further improve the heat dissipation efficiency of the electronic device 100. It can be understood that the first temperature averaging plate 3011 and the second temperature averaging plate 3012 are respectively arranged near two edges of the first surface 201 opposite to each other, so that the first temperature averaging plate 3011 and the second temperature averaging plate 3012 are respectively arranged near two surfaces in the thickness direction opposite to each other on the substrate 20, so that when the portion of the surface of the housing 10 corresponding to the thickness direction of the substrate 20 has thermal conductivity, the portion of the surface of the housing 10 corresponding to the thickness direction can quickly guide the heat on the first temperature averaging plate 3011 and the second temperature averaging plate 3012 to the outside of the electronic device 100, so as to further improve the heat dissipation rate of the electronic device 100.

[0053] The plurality of first heat conducting pipes 3013 are arranged between the first temperature averaging plate 3011 and the second temperature averaging plate 3012. In this way, the plurality of first heat conducting pipes 3013 can respectively guide the heat of the first temperature averaging plate 3011 to the second temperature averaging plate 3012, so that the heat on the first temperature averaging plate 3011 is transferred to the second temperature averaging plate 3012 faster, thereby making the heat of the first heating element 203 connected to the first temperature averaging plate 3011 lower. The plurality of first heat conducting pipes 3013 can be parallel or non-parallel to each other, and can also be evenly or unevenly distributed; for example: the plurality of first heat conducting pipes 3013 are arranged as follows: Figure 5 and Figure 6 As shown in the mutually parallel and evenly distributed arrangement, the multiple first heat pipes 3013 can relatively evenly guide the heat on the first temperature averaging plate 3011 to the second temperature averaging plate 3012, so that the heat of different areas of the first surface 201 of the substrate 20 corresponding to the positions of the multiple first heat pipes 3013 tends to be consistent.

[0054] In some embodiments, see Figure 7 and Figure 8 As shown, the second heat-conducting structure 302 includes: a third temperature averaging plate 3021, a fourth temperature averaging plate 3022 and a second heat-conducting pipe 3023; the third temperature averaging plate 3021 is arranged on the second surface 202 and is connected to the second heating element 204; the fourth temperature averaging plate 3022 is arranged on the second surface 202; the second heat-conducting pipe 3023 is located on the same side of the third temperature averaging plate 3021 and the fourth temperature averaging plate 3022, and both ends of the second heat-conducting pipe 3023 are respectively bent to be connected to the third temperature averaging plate 3021 and the fourth temperature averaging plate 3022 respectively.

[0055] The third temperature averaging plate 3021 may be fixed to the second surface 202 of the substrate 20 by welding or other non-detachable means, or may be fixed to the second surface 202 of the substrate 20 by screwing or other detachable means. The third temperature averaging plate 3021 may be provided with a second accommodation space for accommodating the second heating element 204, and the second accommodation space may be in the form of a recess or a through hole, for example: Figure 7 and Figure 8 As shown, the surface of the third temperature averaging plate 3021 facing away from the second surface 202 is recessed with a second accommodation space in the form of a recess, so that the second heating element 204 can be fixed in the second accommodation space by bonding, interference fit, etc.; for another example: the surface of the third temperature averaging plate 3021 in the thickness direction is recessed with a second accommodation space in the form of a through hole, so that the second heating element 204 can be pushed into the second accommodation space. The projection of the third temperature averaging plate 3021 onto the first surface 201 may partially overlap with the first temperature averaging plate 3011 and / or the second temperature averaging plate 3012, or may not overlap with the first temperature averaging plate 3011 and the second temperature averaging plate 3012 at all.

[0056] The fourth temperature averaging plate 3022 may be fixed to the second surface 202 of the substrate 20 by a non-detachable method such as welding, or may be fixed to the second surface 202 of the substrate 20 by a detachable method such as screw locking. The fourth temperature averaging plate 3022 may be consistent with or inconsistent with the third temperature averaging plate 3021 in terms of area, thickness, shape, etc. The projection of the fourth temperature averaging plate 3022 onto the first surface 201 may partially overlap with the first temperature averaging plate 3011 and / or the second temperature averaging plate 3012, or may not overlap with the first temperature averaging plate 3011 and the second temperature averaging plate 3012 at all.

[0057] The second heat pipe 3023 is located on the same side of the third temperature averaging plate 3021 and the fourth temperature averaging plate 3022, and both ends of the second heat pipe 3023 are bent to connect to the third temperature averaging plate 3021 and the fourth temperature averaging plate 3022 respectively, for example: Figure 7 and Figure 8 As shown, the second heat pipe 3023 is U-shaped, and the U-shaped second heat pipe 3023 is located on the same side of the third temperature averaging plate 3021 and the fourth temperature averaging plate 3022, and the two ends of the U-shaped second heat pipe 3023 are respectively connected to the third temperature averaging plate 3021 and the fourth temperature averaging plate 3022. The two ends of the second heat pipe 3023 are respectively connected to the third temperature averaging plate 3021 and the fourth temperature averaging plate 3022, so that the heat of the second heating element 204 collected by the third temperature averaging plate 3021 can be guided to the fourth temperature averaging plate 3022, and the heat on the second surface 202 side of the substrate 20 can be distributed on the third temperature averaging plate 3021, the fourth temperature averaging plate 3022 and the second heat pipe 3023, so that the heat distribution of the second surface 202 of the substrate 20 is more dispersed, so as to further improve the heat dissipation of the electronic device 100. heat rate; at the same time, the second heat pipe 3023 is located on the same side of the third temperature averaging plate 3021 and the fourth temperature averaging plate 3022 to avoid the area between the third temperature averaging plate 3021 and the fourth temperature averaging plate 3022. In this way, other electronic devices can be arranged between the third temperature averaging plate 3021 and the fourth temperature averaging plate 3022, and when these electronic devices generate heat, the third temperature averaging plate 3021, the fourth temperature averaging plate 3022 and the second heat pipe 3023 around these electronic devices can direct the heat to themselves for dissipation.

[0058] In some embodiments, see Figure 7 and Figure 8 As shown, the third temperature averaging plate 3021 and the fourth temperature averaging plate 3022 are respectively arranged adjacent to two opposite edges of the second surface 202 ; or, the plurality of second heat pipes 3023 correspond to different sides of the third temperature averaging plate 3021 and the fourth temperature averaging plate 3022 .

[0059] The third temperature averaging plate 3021 and the fourth temperature averaging plate 3022 are respectively arranged near two edges of the second surface 202 opposite to each other, and the two edges of the second surface 202 are closer to the housing 10, so that the heat on the third temperature averaging plate 3021 and the fourth temperature averaging plate 3022 can be more quickly dissipated to the housing 10 of the electronic device 100, and then dissipated to the outside of the electronic device 100, so as to further improve the heat dissipation efficiency of the electronic device 100. It can be understood that the third temperature averaging plate 3021 and the fourth temperature averaging plate 3022 are respectively arranged near two edges of the second surface 202 opposite to each other, so that the third temperature averaging plate 3021 and the fourth temperature averaging plate 3022 are respectively arranged near two surfaces in the thickness direction opposite to each other on the substrate 20, so that when the portion of the surface of the housing 10 corresponding to the thickness direction of the substrate 20 has thermal conductivity, the portion of the surface of the housing 10 corresponding to the thickness direction can quickly guide the heat on the third temperature averaging plate 3021 and the fourth temperature averaging plate 3022 to the outside of the electronic device 100, so as to further improve the heat dissipation rate of the electronic device 100.

[0060] The plurality of second heat pipes 3023 correspond to different sides of the third temperature averaging plate 3021 and the fourth temperature averaging plate 3022, respectively, so as to simultaneously guide the temperature on the third temperature averaging plate 3021 to the fourth temperature averaging plate 3022 from different directions, thereby improving the heat dissipation rate of the electronic device 100, for example: Figure 7 and Figure 8 As shown, the two second heat pipes 3023 correspond to the two sides of the third temperature averaging plate 3021 and the fourth temperature averaging plate 3022 respectively, so that the third temperature averaging plate 3021, the fourth temperature averaging plate 3022 and the two second heat pipes 3023 cooperate to form a circle of heat conduction structure.

[0061] In some embodiments, see Figures 1 to 3 and Fig. 9 and Fig.10 As shown, the housing 10 has a first inner surface and a first outer surface 102 facing each other, and the housing 10 has thermal conductivity; the first inner surface is at least arranged opposite to the first surface 201, and the first inner surface is provided with at least one third heat pipe 103; the first outer surface 102 is provided with at least one first protrusion 1021. In this way, the heat emitted by the first heating element 203, the first temperature plate 3011, the first heat pipe 3013, the second temperature plate 3012 and other electronic components on the first surface 201 can be quickly emitted to the first outer surface 102 of the electronic device 100 through the third heat pipe 103 and the housing 10, so as to further improve the heat dissipation efficiency of the electronic device 100; in addition, the first protrusion 1021 on the first outer surface 102 can increase the contact area between the first outer surface 102 and the air, that is, increase the heat dissipation area outside the electronic device 100, thereby accelerating the heat exchange between the electronic device 100 and the external environment, so as to further improve the heat dissipation efficiency of the electronic device 100.

[0062] The number of the third heat pipes 103 may be multiple, and the multiple third heat pipes 103 may be parallel to each other and evenly distributed on the first inner surface, or they may be connected end to end in sequence to go around a circle of the edge of the first inner surface; when the multiple third heat pipes 103 are connected end to end in sequence to go around a circle of the edge of the first inner surface, the heat emitted by the first heating element 203, the first temperature averaging plate 3011, the first heat pipe 3013, the second temperature averaging plate 3012 and other electronic components on the first surface 201 may be emitted to the first outer surface 102 through the area on the first inner surface opposite to the first surface 201, or may be emitted to the outside of the electronic device 100 through the multiple third heat pipes 103, so that the cooler position of the edge of the first inner surface can be used for heat dissipation, thereby further improving the heat dissipation efficiency of the electronic device 100. When the first outer surface 102 is provided with multiple first protrusions 1021, the multiple first protrusions 1021 may be as follows Figure 3 The parallel and uniform distribution shown may also be staggered, unequal in height or other distribution patterns.

[0063] In some embodiments, see Figures 1 to 3 and Fig. 9 and Fig.10 As shown, a first space 104 is recessed on one side of the first inner surface facing the first surface 201, a third heat pipe 103 is disposed in the first space 104, and a graphene sheet 105 is also disposed in the first space 104. The graphene sheet 105 is located between the third heat pipe 103 and the first heat-conducting structure 301, and the graphene sheet 105 at least partially covers the third heat pipe 103. In this way, the heat on the side of the first surface 201 of the substrate 20 can be quickly guided to the third heat pipe 103 and the housing 10 through the graphene sheet 105, and at the same time, the graphene sheet 105 can laterally guide the heat on the side of the first surface 201 of the substrate 20 to the portion of the housing 10 corresponding to the surface in the thickness direction of the graphene sheet 105, that is, the bottom and the surrounding side of the recessed first space 104 can simultaneously dissipate heat, so as to further improve the heat dissipation efficiency of the electronic device 100.

[0064] In some embodiments, see Figures 1 to 3 and Fig.11As shown, the housing 10 has a second inner surface and a second outer surface 106 facing each other; the second inner surface is arranged opposite to the second surface 202, and at least one fourth heat pipe 107 is arranged on the second inner surface; and at least one second protrusion 1061 is arranged on the second outer surface 106. In this way, the heat emitted by the second heating element 204, the third temperature plate 3021, the second heat pipe 3023, the fourth temperature plate 3022 and other electronic components on the second surface 202 can be quickly emitted to the second outer surface 106 of the electronic device 100 through the fourth heat pipe 107 and the housing 10, so as to further improve the heat dissipation efficiency of the electronic device 100; in addition, the second protrusion 1061 on the second outer surface 106 can increase the contact area between the second outer surface 106 side and the air, that is, increase the heat dissipation area outside the electronic device 100, so as to accelerate the heat exchange between the electronic device 100 and the external environment, so as to further improve the heat dissipation efficiency of the electronic device 100.

[0065] The number of the fourth heat pipes 107 can be multiple, and the multiple fourth heat pipes 107 can be parallel to each other and evenly distributed on the second inner surface, or can be connected end to end in sequence to go around a circle of the edge of the second inner surface; when the multiple fourth heat pipes 107 are connected end to end in sequence to go around a circle of the edge of the second inner surface, the heat dissipated by the second heating element 204, the third temperature equalizing plate 3021, the second heat pipe 3023, the fourth temperature equalizing plate 3022 and other electronic components on the second surface 202 can be dissipated to the outside of the electronic device 100 through the area on the second inner surface opposite to the second surface 202, or can be dissipated to the outside of the electronic device 100 through the multiple fourth heat pipes 107, so that the cooler position of the edge of the second inner surface can be used for heat dissipation, thereby further improving the heat dissipation efficiency of the electronic device 100.

[0066] In some embodiments, see Figure 1 , Figure 2 and Fig.11 As shown, the second inner surface is also provided with a heat sink 108, which is located on the side of the fourth heat pipe 107 close to the second heat conductive structure 302, and the heat sink 108 and the contours of the structural members on the second surface 202 are adapted to each other. In other words, the protruding portion of the heat sink 108 corresponding to the structural member on the second surface 202 will be concave accordingly, and the concave portion of the structural member on the second surface 202 will be convex accordingly, so that different positions of the structural member on the second surface 202 are as close to the heat sink 108 as possible, so that the heat sink 108 can guide more heat on the second surface 202 side to the second outer surface 106 through the heat sink 108, the fourth heat pipe 107 and the housing 10 for dissipation, thereby further improving the heat dissipation efficiency of the electronic device 100.

[0067] The heat sink 108 may be a structural member capable of absorbing and dissipating heat, for example, the heat sink 108 is a structural member made of aluminum, copper, etc. A thermally conductive silicone may be pressed between the heat sink 108 and the second inner surface to further improve the thermal conductivity.

[0068] In one example, the electronic device 100 is a host of a computer, see Figures 1 to 11 As shown, the electronic device 100 includes:

[0069] The shell 10 includes: a first shell 109, a first connecting plate 110, a second connecting plate 111 and a second shell 112, the first shell 109 has a first extension portion 113 and a second extension portion 114 opposite to each other, the two ends of the first connecting plate 110 are respectively connected to one end of the first extension portion 113 and one end of the second extension portion 114, the two ends of the second connecting plate 111 are respectively connected to the other end of the first extension portion 113 and the other end of the second extension portion 114, so that the first shell 109, the first connecting plate 110 and the second connecting plate 111 form a structure with a recessed space, and the second shell 112 is arranged opposite to the first shell 109, and is connected to the first extension portion 113 and the second extension portion 114 of the first shell 109 to close the opening of the recessed space, thereby forming the recessed space to form the accommodating space 101. The two surfaces of the first shell 109 and the second shell 112 facing each other are respectively the first inner surface and the second inner surface, and the two surfaces of the first shell 109 and the second shell 112 facing each other are respectively the first outer surface 102 and the second outer surface 106; the first inner surface is recessed with a first space 104, and the first space 104 is provided with a plurality of parallel third heat pipes 103 and a graphene sheet 105 covering the plurality of third heat pipes 103; the first outer surface 102 is evenly distributed with a plurality of strip-shaped first protrusions 1021; the second inner surface is provided with a plurality of parallel fourth heat pipes 107 and a heat sink 108 covering the fourth heat pipes 107; the second outer surface 106 is evenly distributed with a plurality of strip-shaped second protrusions 1061. Among them, the housing 10 as a whole has thermal conductivity.

[0070] The substrate 20 is disposed in the accommodating space 101 and has a first surface 201 and a second surface 202 opposite to each other. The first surface 201 is opposite to the first inner surface, and the second surface 202 is opposite to the second inner surface. The first heating element 203 connected to the first surface 201 is a CPU, and the second heating element 204 connected to the second surface 202 is a GPU.

[0071] The heat conducting assembly 30 includes: a first heat conducting structure 301 and a second heat conducting structure 302. The first heat conducting structure 301 is arranged on the first surface 201, and the second heat conducting structure 302 is arranged on the second surface 202. The first heat conducting structure 301 includes: a first temperature averaging plate 3011, a second temperature averaging plate 3012 and four first heat conducting pipes 3013. The first temperature averaging plate 3011 is arranged on the first surface 201 and connected to the first heating element 203; the second temperature averaging plate 3012 is arranged on the first surface 201; the four first heat conducting pipes 3013 are arranged in parallel and evenly between the first temperature averaging plate 3011 and the second temperature averaging plate 3012, and the two ends of each first heat conducting pipe 3013 are respectively connected to the first temperature averaging plate 3011 and the second temperature averaging plate 3012. The second heat-conducting structure 302 includes: a third temperature averaging plate 3021, a fourth temperature averaging plate 3022 and two second heat-conducting pipes 3023; the third temperature averaging plate 3021 is arranged on the second surface 202 and connected to the second heating element 204; the fourth temperature averaging plate 3022 is arranged on the second surface 202; the two second heat-conducting pipes 3023 are located on both sides of the third temperature averaging plate 3021 and the fourth temperature averaging plate 3022, and the two ends of the second heat-conducting pipes 3023 are respectively bent to be connected to the third temperature averaging plate 3021 and the fourth temperature averaging plate 3022, so that the third temperature averaging plate 3021, the fourth temperature averaging plate 3022 and the two second heat-conducting pipes 3023 cooperate to form a circle of heat-conducting structure. Among them, the contours of the parts of the structural components on the second surface 202 that are opposite to each other are consistent with the heat sink 108.

[0072] Here, the first temperature averaging plate 3011, the second temperature averaging plate 3012, the third temperature averaging plate 3021, the fourth temperature averaging plate 3022, the four first heat conducting pipes 3013 and the two second heat conducting pipes 3023 are connected to the first surface 201 and the second surface 202 of the substrate 20 opposite to each other, so that the heat of the first heating element 203 on the first surface 201 of the substrate 20 and the second heating element 204 on the second surface 202 can be bidirectionally conducted, thereby accelerating the heat conduction efficiency in the housing 10; and the first shell 109 corresponding to the first surface 201 A third heat pipe 103 and a graphene sheet 105 are provided, and a fourth heat pipe 107 and a heat sink 108 are provided on the second shell 112 corresponding to the second surface 202, so that the heat equalization efficiency of the first surface 201 side and the second surface 202 side opposite to each other of the substrate 20 is higher, and when the heat after equalization flows to the shell 10, since the shell 10 has a thermal conductivity, each outer surface of the shell 10 is interconnected and heat-conducted, which not only ensures the high efficiency of heat dissipation, but also achieves the uniformity of heat conduction of the whole machine, and at the same time realizes the maximization of the utilization rate of the heat dissipation area of ​​the whole machine. In addition, the multiple first protrusions 1021 and the multiple second protrusions 1061 on the outside of the shell 10 can increase the contact area between the outer surface of the electronic device 100 and the air, thereby accelerating the heat exchange between the electronic device 100 and the external environment, so as to further improve the heat dissipation efficiency of the electronic device 100.

[0073] It should be noted that Figure 3 The second connecting plate 111 is partially perspectively shown to be able to display the accommodating space 101 and part of the internal structure.

[0074] So far, the various embodiments of the present application have been described in detail. In order to avoid obscuring the concept of the present application, some details known in the art are not described. Based on the above description, those skilled in the art can fully understand how to implement the technical solution disclosed herein.

[0075] Although some specific embodiments of the present application have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified or some technical features may be replaced by equivalents without departing from the scope and spirit of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there is no structural conflict.

Claims

1. An electronic device, characterized in that: include: A housing having a receiving space; A substrate, arranged in the accommodating space, having a first surface and a second surface opposite to each other, wherein the first surface is used to connect the first heating element, and the second surface is used to connect the second heating element; The heat-conducting component comprises: a first heat-conducting structure and a second heat-conducting structure, wherein the first heat-conducting structure is arranged on the first surface, and the second heat-conducting structure is arranged on the second surface.

2. The electronic device according to claim 1, characterized in that: A projection of at least a portion of the first heat-conducting structure onto the second heat-conducting structure does not completely overlap with the second heat-conducting structure; and / or, The heat-conducting assembly further includes: a third heat-conducting structure, and the third heat-conducting structure is connected to the first heat-conducting structure and the second heat-conducting structure respectively.

3. The electronic device according to claim 1, characterized in that: The first heat conduction structure includes: a first temperature averaging plate, a second temperature averaging plate and a first heat conduction pipe; The first temperature equalizing plate is arranged on the first surface and connected to the first heating element; The second temperature equalizing plate is arranged on the first surface; The first heat conducting pipe is disposed between the first temperature averaging plate and the second temperature averaging plate, and two ends of the first heat conducting pipe are respectively connected to the first temperature averaging plate and the second temperature averaging plate.

4. The electronic device according to claim 3, characterized in that: The first temperature averaging plate and the second temperature averaging plate are respectively disposed adjacent to two edges of the first surface that are opposite to each other; or, The plurality of first heat conducting pipes are arranged between the first temperature averaging plate and the second temperature averaging plate.

5. The electronic device according to claim 1, characterized in that: The second heat conducting structure comprises: a third temperature averaging plate, a fourth temperature averaging plate and a second heat conducting pipe; The third temperature-averaging plate is disposed on the second surface and connected to the second heating element; The fourth temperature homogenizing plate is arranged on the second surface; The second heat conducting pipe is located on the same side of the third temperature averaging plate and the fourth temperature averaging plate, and two ends of the second heat conducting pipe are respectively bent to be connected to the third temperature averaging plate and the fourth temperature averaging plate respectively.

6. The electronic device according to claim 5, characterized in that: The third temperature averaging plate and the fourth temperature averaging plate are respectively disposed adjacent to two edges of the second surface that are opposite to each other; or, The plurality of second heat conducting pipes correspond to different sides of the third temperature averaging plate and the fourth temperature averaging plate respectively.

7. The electronic device according to claim 1, characterized in that: The shell has a first inner surface and a first outer surface facing each other, and the shell has thermal conductivity; The first inner surface is at least arranged opposite to the first surface, and at least one third heat conducting pipe is arranged on the first inner surface; The first outer surface is provided with at least one first protrusion.

8. The electronic device according to claim 7, characterized in that: A first space is recessed on one side of the first inner surface facing the first surface, the third heat pipe is arranged in the first space, a graphene sheet is further arranged in the first space, the graphene sheet is located between the third heat pipe and the first heat conductive structure, and the graphene sheet at least partially covers the third heat pipe.

9. The electronic device according to claim 7 or 8, characterized in that: The housing has a second inner surface and a second outer surface facing away from each other; The second inner surface is arranged opposite to the second surface, and at least one fourth heat conducting pipe is arranged on the second inner surface; The second outer surface is provided with at least one second protrusion.

10. The electronic device according to claim 9, characterized in that: The second inner surface is also provided with a heat sink, which is located on a side of the fourth heat pipe close to the second heat-conducting structure, and the heat sink and the contour of the structural member on the second surface are matched with each other.

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