Chip manufacturing equipment

Abstract

The utility model relates to chip manufacturing equipment. The chip manufacturing equipment comprises a rack, a mass transfer mechanism and a hot-pressing die bonding mechanism, the mass transfer mechanism is arranged on the rack and is used for realizing mass transfer of chips; the hot-pressing die bonding mechanism comprises a hot-pressing plate and a bonding table arranged on the rack, and the bonding table is used for bearing the chips transferred by the mass transfer mechanism; the chip comprises a substrate, anisotropic conductive adhesive smeared on the surface of the substrate and a plurality of chip crystal grains connected with the substrate through the anisotropic conductive adhesive, the hot pressing plate is used for covering and pressing all the chip crystal grains on the substrate, and the hot pressing plate can conduct heat to the chip. And the anisotropic conductive adhesive is conducted in the thickness direction of the substrate, so that the substrate is electrically connected with the plurality of chip grains. And the problems of pseudo soldering or welding drifting of chip crystal grains in the die bonding process can be obviously reduced.

Description

Technical Field

[0001] The present application relates to the field of chip technology, and in particular to a chip manufacturing device. Background Art

[0002] Mini LED display is an array composed of a large number of LED chip grains arranged in a certain order on a driving circuit substrate, and its packaging requires precise welding technology.

[0003] In the current Mini / Micro-LED mass transfer equipment, after completing the mass transfer of chips, a further high-temperature die bonding process needs to be performed on another device. In the two devices, multiple visual alignment and loading and unloading process steps are required, resulting in a long production operation time and affecting production efficiency. In addition, the die bonding process usually performs eutectic reflow on the transferred chips and substrates to achieve the interconnection of metal electrodes. However, in this process, due to the occurrence of cold solder joints and other phenomena, the cured chip array will fail the electrical test performance during the electrical test.

[0004] BACKGROUND OF THE PRESENT APPLICATION The above information disclosed is only for understanding the background of the concept of the present application and may contain information that does not constitute the prior art. Utility Model Content

[0005] Based on this, in order to solve the above problems, it is necessary to provide a chip manufacturing equipment.

[0006] A chip manufacturing device, comprising:

[0007] frame;

[0008] A mass transfer mechanism, which is disposed on the rack and is used to realize mass transfer of chips;

[0009] A hot pressing and crystal bonding mechanism, the hot pressing and crystal bonding mechanism comprises a hot pressing plate and a bonding platform arranged on the frame, the bonding platform is used to receive the chip transferred by the mass transfer mechanism, the chip comprises a substrate, an anisotropic conductive adhesive applied on the surface of the substrate and a plurality of chip grains connected to the substrate through the anisotropic conductive adhesive, the hot pressing plate is used to cover all the chip grains on the substrate, and the hot pressing plate can conduct heat to the chip, so that the anisotropic conductive adhesive is conductive in the thickness direction of the substrate, so as to realize the electrical connection between the substrate and the plurality of chip grains.

[0010] The above chip manufacturing equipment includes at least the following beneficial effects: the chip manufacturing equipment of the present application combines the mass transfer mechanism and the hot pressing crystal bonding mechanism into one, and the chip substrate after the mass chip transfer and AOI inspection can be directly transferred to the location of the hot pressing crystal bonding mechanism, without the need to perform further high-temperature crystal bonding process on another device after completing the mass transfer of the chip as in the traditional solution, which is conducive to improving production efficiency and yield. In the process of mass chip transfer, the chip can be directly placed on a substrate coated with anisotropic conductive adhesive, the process is simple, no steel mesh alignment is required, and the problem of insufficient alignment accuracy is avoided, which is conducive to improving production efficiency and yield, and reducing costs. It should be emphasized that the hot pressing plate provided in the present application can press the chip onto the bonding table, the hot pressing plate can apply uniform pressure to the chip grains on the chip substrate, and the hot pressing plate can also conduct heat to the substrate to make the anisotropic conductive adhesive conductive in the thickness direction of the substrate, thereby realizing the electrical connection between the substrate and the multiple chip grains. The chip is equivalent to being clamped between the bonding table and the hot pressing plate, which can significantly reduce the problems of cold solder joints or welding drift of the chip grains during the solid crystal bonding process, reduce the risk of unqualified electrical performance of the chip, and improve the yield rate.

[0011] In one embodiment, the chip crystal grain is provided with a first electrode and a second electrode at intervals, the substrate is provided with a first conductive member and a second conductive member, the first electrode is aligned with the first conductive member, the second electrode is aligned with the second conductive member, and the anisotropic conductive adhesive can be conductive in the thickness direction of the substrate and insulated in the direction parallel to the substrate, so as to realize the electrical connection between the first electrode and the first conductive member, the electrical connection between the second electrode and the second conductive member, and the insulation between the first electrode and the second electrode. The anisotropic conductive adhesive is conductive in the direction perpendicular to the coating direction (z direction), i.e., the longitudinal direction, but is electrically insulating in the coating direction (x & y direction), i.e., the transverse direction. Therefore, the anisotropic conductive adhesive can be coated on the front side of the substrate without worrying about the problem of short circuit between multiple electrodes on the chip, which is conducive to simplifying the process steps and improving production efficiency.

[0012] In one embodiment, the hot pressing plate is a hot pressing steel plate.

[0013] In one embodiment, the bonding stage is a heatable bonding stage, that is, the bonding stage can be heated and transfer heat to the substrate.

[0014] In one of the embodiments, a side of the substrate used for connecting with the chip die is fully coated with the anisotropic conductive adhesive.

[0015] In one of the embodiments, the coating thickness of the anisotropic conductive adhesive is 10-50 um.

[0016] In one of the embodiments, the coating thickness of the anisotropic conductive adhesive is 30 um.

[0017] In one embodiment, the anisotropic conductive adhesive includes conductive particles.

[0018] In one embodiment, the conductive particles include at least one of Ni / Au, nanosilver, and nanocopper.

[0019] In one of the embodiments, the chip manufacturing equipment further includes a cleaning device, which is used to provide a cleaning liquid to remove excess anisotropic conductive adhesive on the substrate after the substrate and the chip die are electrically connected. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 A schematic structural diagram of a hot pressing plate, a chip and a bonding station provided in one embodiment of the present application.

[0022] Figure 2 A structural stereogram of a chip manufacturing device provided in one embodiment of the present application.

[0023] Reference numerals:

[0024] 10. Chip manufacturing equipment; 100. Rack; 200. Mass transfer mechanism; 300. Hot pressing and bonding mechanism; 310. Hot pressing plate; 320. Bonding station; 400. Chip; 410. Substrate; 411. First conductive member; 412. Second conductive member; 420. Chip grain; 421. First electrode; 422. Second electrode; 500. Anisotropic conductive adhesive. DETAILED DESCRIPTION

[0025] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0026] See also Figure 1 and Figure 2 In some embodiments, the present application provides a chip manufacturing device 10 , which includes a frame 100 , a mass transfer mechanism 200 , and a hot pressing die bonding mechanism 300 . Among them, the mass transfer mechanism 200 is arranged on the frame 100 and is used to realize the mass transfer of chips 400; the hot pressing and solidifying mechanism 300 includes a hot pressing plate 310 and a bonding platform 320 arranged on the frame 100, and the bonding platform 320 is used to receive the chips 400 transferred by the mass transfer mechanism 200, and the chips 400 include a substrate 410, an anisotropic conductive adhesive 500 applied on the surface of the substrate 410, and a plurality of chip grains 420 connected to the substrate 410 through the anisotropic conductive adhesive 500, and the hot pressing plate 310 is used to cover all the chip grains 420 on the substrate 410, and the hot pressing plate 310 can conduct heat to the chip 400, so that the anisotropic conductive adhesive 500 is conductive in the thickness direction of the substrate 410, so as to realize the electrical connection between the substrate 410 and the plurality of chip grains 420.

[0027] The chip manufacturing equipment 10 mentioned above includes at least the following beneficial effects: the chip manufacturing equipment 10 of the present application combines the mass transfer mechanism 200 and the hot pressing crystal bonding mechanism 300 into one, and the chip 400 substrate 410 after the mass chip 400 transfer and AOI inspection can be directly transferred to the location of the hot pressing crystal bonding mechanism 300, without the need to perform further high-temperature crystal bonding process on another device after completing the mass transfer of the chip 400 as in the traditional solution, which is conducive to improving production efficiency and yield. In the process of mass transfer of the chip 400, the chip 400 can be directly placed on the substrate 410 coated with anisotropic conductive adhesive 500, the process is simple, no steel mesh alignment is required, and the problem of insufficient alignment accuracy is avoided, which is conducive to improving production efficiency and yield, and reducing costs. It should be emphasized that the hot pressing plate 310 provided in the present application can press the chip 400 onto the bonding table 320, and the hot pressing plate 310 can uniformly apply pressure to the chip grains 420 on the substrate 410 of the chip 400. The hot pressing plate 310 can also conduct heat to the substrate 410 to make the anisotropic conductive adhesive 500 conductive in the thickness direction of the substrate 410, thereby realizing the electrical connection between the substrate 410 and the plurality of chip grains 420. The chip 400 is equivalent to being clamped between the bonding table 320 and the hot pressing plate 310, which can significantly reduce the problems of cold solder joints or soldering drift of the chip grains 420 during the solid crystal bonding process, reduce the risk of unqualified electrical performance of the chip 400, and improve the yield rate.

[0028] Specifically, Figure 1As shown, in some embodiments, the chip die 420 is provided with a first electrode 421 and a second electrode 422 at intervals, the substrate 410 is provided with a first conductive member 411 and a second conductive member 412, the first electrode 421 is aligned with the first conductive member 411, the second electrode 422 is aligned with the second conductive member 412, and the anisotropic conductive adhesive 500 can be conductive in the thickness direction of the substrate 410 and insulated in the direction parallel to the substrate 410, so as to realize the electrical connection between the first electrode 421 and the first conductive member 411, the electrical connection between the second electrode 422 and the second conductive member 412, and the insulation between the first electrode 421 and the second electrode 422. The first electrode 421 and the second electrode 422 may refer to bumps, and the first conductive member 411 and the second conductive member 412 may refer to the ITO conductive layer on the substrate 410. The anisotropic conductive adhesive 500 is conductive in a direction perpendicular to the coating direction (z direction), i.e., in the longitudinal direction, but is electrically insulating in the coating direction (x & y directions), i.e., in the lateral direction. Therefore, the anisotropic conductive adhesive 500 can be coated on the front side of the substrate 410 without worrying about short circuits between the multiple electrodes on the chip 400, which is conducive to simplifying the process steps and improving production efficiency.

[0029] Furthermore, in some of the embodiments, the hot pressing plate 310 is a hot pressing steel plate.

[0030] Furthermore, in some embodiments, the bonding stage 320 is a heatable bonding stage 320. In other words, the bonding stage 320 can be heated and conduct heat to the substrate 410.

[0031] Furthermore, in some of the embodiments, the side of the substrate 410 used for connecting with the chip die 420 is fully coated with the anisotropic conductive adhesive 500 .

[0032] Furthermore, in some of the embodiments, the coating thickness of the anisotropic conductive adhesive 500 is 10-50 um.

[0033] Furthermore, in some of the embodiments, the coating thickness of the anisotropic conductive adhesive 500 is 30 um.

[0034] Furthermore, in some embodiments, the anisotropic conductive adhesive 500 includes conductive particles.

[0035] Furthermore, in some embodiments, the conductive particles include at least one of Ni / Au, nanosilver, and nanocopper.

[0036] Furthermore, in some of the embodiments, the chip manufacturing equipment 10 also includes a cleaning device, which is used to provide a cleaning liquid to remove excess anisotropic conductive adhesive 500 on the substrate 410 after the substrate 410 and the chip die 420 are electrically connected.

[0037] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0038] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

[0039] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0040] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0041] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0042] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0043] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0044] In the description of this specification, the description of reference terms "one embodiment", "other implementation methods", etc. means that the specific features, structures, materials or features described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of the present application. The terms used herein in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application.

Claims

1. A chip manufacturing device, characterized in that: include: frame; A mass transfer mechanism, which is disposed on the rack and is used to realize mass transfer of chips; A hot pressing and crystal bonding mechanism, the hot pressing and crystal bonding mechanism comprises a hot pressing plate and a bonding platform arranged on the frame, the bonding platform is used to receive the chip transferred by the mass transfer mechanism, the chip comprises a substrate, an anisotropic conductive adhesive applied on the surface of the substrate and a plurality of chip grains connected to the substrate through the anisotropic conductive adhesive, the hot pressing plate is used to cover all the chip grains on the substrate, and the hot pressing plate can conduct heat to the chip, so that the anisotropic conductive adhesive is conductive in the thickness direction of the substrate, so as to realize the electrical connection between the substrate and the plurality of chip grains.

2. The chip manufacturing equipment according to claim 1, characterized in that: A first electrode and a second electrode are arranged on the chip grain at intervals, a first conductive part and a second conductive part are arranged on the substrate, the first electrode is aligned with the first conductive part, and the second electrode is aligned with the second conductive part. The anisotropic conductive adhesive can conduct in the thickness direction of the substrate and insulate in the direction parallel to the substrate to achieve electrical connection between the first electrode and the first conductive part, electrical connection between the second electrode and the second conductive part, and insulation between the first electrode and the second electrode.

3. The chip manufacturing equipment according to claim 1, characterized in that: The hot pressing plate is a hot pressing steel plate.

4. The chip manufacturing equipment according to claim 1, characterized in that: The bonding station is a heatable bonding station.

5. The chip manufacturing equipment according to claim 1, characterized in that: The side of the substrate used for connecting with the chip crystal grain is fully coated with the anisotropic conductive adhesive.

6. The chip manufacturing equipment according to claim 1, characterized in that: The coating thickness of the anisotropic conductive adhesive is 10-50 um.

7. The chip manufacturing equipment according to claim 6, characterized in that: The coating thickness of the anisotropic conductive adhesive is 30 um.

8. The chip manufacturing equipment according to claim 1, characterized in that: The anisotropic conductive adhesive includes conductive particles.

9. The chip manufacturing equipment according to claim 8, characterized in that: The conductive particles include at least one of Ni / Au, nano-silver and nano-copper.

10. The chip manufacturing equipment according to any one of claims 1 to 9, characterized in that: The chip manufacturing equipment also includes a cleaning device, which is used to provide a cleaning liquid to remove the excess anisotropic conductive adhesive on the substrate after the substrate and the chip crystal grain are electrically connected.

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