Degassing system for removing He gas in TEOS (tetraethyl orthosilicate) liquid and semiconductor process system

Abstract

The utility model relates to a degassing system for removing He gas in TEOS (tetraethyl orthosilicate) liquid and a semiconductor process system. The degassing system comprises a heating component, a communicating component, an oscillating component, a first gas filtering component and a second gas filtering component, the liquid source heating device has the advantages that the liquid source device, the heating liquid source device and the heating component are communicated, so that the liquid source is heated, and gas contained in the liquid source can overflow conveniently; the vibration component is arranged on the communication component, vibration of the vibration component drives vibration of the communication component, bubbles dissolved in the liquid source can float on the surface of the liquid source, and gas overflow is facilitated; the communication component is communicated with the first gas filtering component, and gas overflowing from a liquid source through heating and oscillation is diffused through a filter membrane on a filter plate; the first gas filtering component is communicated with the second gas filtering component, so that free gas and dissolved gas of the liquid source seed are released by the PFA filter membrane, and degassing operation of the liquid source is completed.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a degassing system for removing He gas in TEOS liquid and a semiconductor process system. Background Art

[0002] A degasser, also known as a vacuum degasser, is a device that uses vacuum suction to remove non-condensable gases contained in a liquid. Degassers are often overlooked components in fluid systems, but they play a vital role in reducing dissolved gases. This is because dissolved gases in reagent lines can cause bubbles to form, which can interfere with analytical results and cause errors in the system. Using a degasser, the gas that causes bubbles can be removed to ensure optimal performance of the equipment. Helium dissolved in liquids can have an adverse effect on many processes.

[0003] In the semiconductor industry, delivering liquids with very low dissolved gas content can extend equipment life, reduce maintenance and improve process quality. The vacuum degasser releases free and dissolved gases in water by generating a vacuum. Most of the vacuum degassing devices currently used simply install a vacuum pump. Although it can also achieve the degassing function, the degassing efficiency is low if it only relies on the vacuum pump to achieve degassing.

[0004] Currently, no effective solution has been proposed for the problems of low degassing efficiency and the like in related technologies. Utility Model Content

[0005] The utility model aims to provide a degassing system and a semiconductor process system for removing He gas from TEOS liquid in view of the deficiencies in the prior art, so as to solve the problems of low degassing efficiency existing in the related art.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] In a first aspect, the utility model provides a degassing system for removing He gas from TEOS liquid, comprising:

[0008] A heating component, the heating component is connected to the liquid source device and the heated liquid source device respectively, and is used to heat the liquid source;

[0009] a communicating component, the communicating component being in communication with the heating component and being located downstream of the heating component, and being used for conveying the heated liquid source;

[0010] an oscillating component, the oscillating component being arranged at the communicating component and being located downstream of the heating component, and being used for oscillating the liquid source heated by the heating component;

[0011] a first gas filtering component, which is connected to the connecting component and is located downstream of the connecting component, and is used for filtering gas overflowed from the liquid source through the heating component;

[0012] The second gas filter component is located downstream of the first gas filter component and is used to filter free gas and dissolved gas contained in the liquid source.

[0013] In some of the embodiments, the heating component comprises:

[0014] A heating box, the heating box is connected to the heating liquid source device and is used to contain the heating liquid source;

[0015] The spiral pipe is spirally arranged inside the heating box and is connected to the liquid source device, and is used to heat the liquid source by heating the liquid source.

[0016] In some of the embodiments, the oscillating component includes:

[0017] a first fixing plate, the first fixing plate being connected to the process equipment;

[0018] a second fixing plate, the second fixing plate being connected to the communicating component and corresponding to the first fixing plate;

[0019] A plurality of vibration members are respectively arranged between the first fixing plate and the second fixing plate, and are used for vibrating the connecting member.

[0020] In some embodiments, the first gas filter component includes:

[0021] A plurality of filter plates, wherein the plurality of filter plates are connected in sequence, and the filter plate at the first position is connected to the connecting component, and the filter plate at the last position is connected to the second gas filter component, for filtering the gas overflowed from the liquid source through the heating component;

[0022] A plurality of first filter tubes, which are arranged between two adjacent filter plates and are used to connect the two adjacent filter plates;

[0023] The first filter box is communicated with the filter plate at the last position and is used for buffering the liquid source filtered by the filter plate.

[0024] In some embodiments, the second gas filter component includes:

[0025] A second filter box, wherein the second filter box is used to install components;

[0026] A vacuum pump, the vacuum pump being in communication with the second filter housing and being used for performing vacuum treatment on the second filter housing;

[0027] The second filter tube is spirally arranged inside the second filter box, and the two ends of the second filter tube are respectively connected to the first gas filter component and the semiconductor process equipment, and is used for filtering the free gas and dissolved gas contained in the liquid source.

[0028] In some embodiments, the heating box comprises:

[0029] A first inlet, the first inlet is opened in the heating box, and the first inlet is connected to a heating liquid source device;

[0030] The first outlet is opened in the heating box and is centrally symmetrically arranged with the first inlet, and the first outlet is connected to the heating liquid source equipment.

[0031] In some embodiments, the heating box further comprises:

[0032] A second inlet, the second inlet is opened in the heating box, and the second inlet is used for one end of the spiral pipe to pass through;

[0033] The second outlet is opened in the heating box body and is centrally symmetrically arranged with the second inlet, and the second outlet is used for the other end of the spiral pipe to pass through.

[0034] In some embodiments, the second filter housing comprises:

[0035] A vacuum port, which is provided in the second filter housing and is used for installing the vacuum pump;

[0036] a third inlet, the third inlet being provided in the second filter housing and being used for one end of the second filter tube to pass through;

[0037] The third outlet is opened in the second filter box and is centrally symmetrically arranged with the third inlet, and is used for the other end of the second filter tube to pass through.

[0038] In some of the embodiments, the communication component comprises:

[0039] A first connecting tube, one end of which is connected to the heating component, and the other end of which is connected to the first gas filtering component. The oscillating component is disposed on the outer side of the first connecting tube for conveying the oscillated liquid source.

[0040] In some of the embodiments, the communication component further comprises:

[0041] A second connecting pipe, one end of which is connected to the first connecting pipe, and the other end of which is connected to the first gas filter component, is used to transport the liquid source after the shock.

[0042] In some of the embodiments, the communication component comprises:

[0043] A plurality of first connecting tubes, wherein the plurality of first connecting tubes are connected in sequence, the first connecting tube at the first position is connected to the heating component, and the first connecting tube at the last position is connected to the first gas filtering component, and the oscillating component is disposed on the outer side of each first connecting tube for conveying the liquid source after oscillation;

[0044] A plurality of second connecting tubes are arranged at intervals from a plurality of first connecting tubes, a second connecting tube is arranged between two adjacent first connecting tubes, and the second connecting tube at the last position is respectively connected with the first connecting tube at the last position and the first gas filter component, for conveying the liquid source after shock.

[0045] In some of the embodiments, it also includes:

[0046] A fluid flow rate regulating component is connected to the first gas filter component and the second gas filter component respectively, and is used to accelerate the overflow of gas contained in the liquid source.

[0047] In some of the embodiments, the fluid flow rate regulating component comprises:

[0048] A fluid flow rate regulating member, the fluid flow rate regulating member being in communication with the first gas filtering member and being used for accelerating the overflow of the gas contained in the liquid source;

[0049] An extension pipe is connected to the end of the fluid flow rate regulating component and the second gas filter component respectively, and is used for conveying a liquid source.

[0050] In a second aspect, the utility model further provides a semiconductor process system, comprising:

[0051] A degassing system as described in the first aspect.

[0052] The utility model adopts the above technical solution, and compared with the prior art, has the following technical effects:

[0053] The utility model discloses a degassing system and a semiconductor process system for removing He gas in TEOS liquid. By connecting a liquid source device and a heating liquid source device with a heating component, a heat exchange liquid source with a higher temperature can exchange heat with a liquid source with a lower temperature, thereby heating the liquid source, and then increasing the temperature of the liquid source and reducing the gas solubility under the condition of constant pressure, so as to facilitate the overflow of the gas contained in the liquid source; by arranging an oscillating component on a connecting component, the vibration of the oscillating component drives the vibration of the connecting component, so that bubbles dissolved in the liquid source can float on the surface of the liquid source, so as to facilitate the overflow of the gas; by connecting the connecting component with a first gas filtering component, by diffusing the gas overflowed by the liquid source through the filter membrane on the filter plate through the heating and oscillating liquid source, the gas separated from the liquid source can be prevented from dissolving again in the liquid source; by connecting the first gas filtering component with the second gas filtering component, the liquid source is placed in a vacuum environment, and then the free gas and dissolved gas in the liquid source are released by the PFA filter membrane, so as to complete the degassing operation of the liquid source. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 is a schematic diagram of a degassing system according to an embodiment of the utility model (I);

[0055] Figure 2 is a schematic diagram of a heating component according to an embodiment of the utility model;

[0056] Figure 3 is a schematic diagram of a connecting component according to an embodiment of the utility model (I);

[0057] Figure 4 is a schematic diagram of an oscillating component according to an embodiment of the utility model;

[0058] Figure 5 is a schematic diagram of a first gas filter component according to an embodiment of the utility model (I);

[0059] Figure 6 is a schematic diagram of a second gas filter component according to an embodiment of the utility model;

[0060] Figure 7 is a schematic diagram of a degassing system according to an embodiment of the utility model (II);

[0061] Figure 8 is a schematic diagram of a connecting component according to an embodiment of the utility model (II);

[0062] Fig. 9 is a schematic diagram of a degassing system according to an embodiment of the utility model (III);

[0063] Fig.10is a schematic diagram of a first gas filter component according to an embodiment of the utility model (II);

[0064] Fig.11 It is a schematic diagram of a fluid flow rate regulating component according to an embodiment of the utility model.

[0065] The reference numerals are: 100, heating component; 110, heating box; 111, first inlet; 112, first outlet; 113, second inlet; 114, second outlet; 120, spiral pipe;

[0066] 200, connecting component; 210, first connecting pipe; 220, second connecting pipe;

[0067] 300, oscillating component; 310, first fixing plate; 320, second fixing plate; 330, vibrating member;

[0068] 400, first gas filter component; 410, filter plate; 420, first filter tube; 430, first filter box; 431, open;

[0069] 500, second gas filter component; 510, second filter box; 511, vacuum port; 512, third inlet; 513, third outlet; 520, vacuum pump; 530, second filter tube;

[0070] 600, fluid flow rate regulating component; 610, fluid flow rate regulating member; 620, extension tube. DETAILED DESCRIPTION

[0071] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is described and illustrated below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. Based on the embodiments provided in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0072] Obviously, the drawings described below are only some examples or embodiments of the present application. For ordinary technicians in this field, the present application can also be applied to other similar scenarios based on these drawings without creative work. In addition, it can also be understood that although the efforts made in this development process may be complicated and lengthy, for ordinary technicians in this field related to the content disclosed in this application, some changes in design, manufacturing or production based on the technical content disclosed in this application are just conventional technical means, and should not be understood as insufficient content disclosed in this application.

[0073] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those of ordinary skill in the art that the embodiments described in this application may be combined with other embodiments without conflict.

[0074] Unless otherwise defined, the technical terms or scientific terms involved in this application should be understood by people with ordinary skills in the technical field to which this application belongs. The words "one", "a", "a", "the" and the like involved in this application do not indicate a quantitative limitation, and may represent the singular or plural. The terms "include", "comprise", "have" and any of their variations involved in this application are intended to cover non-exclusive inclusions; for example, a process, method, system, product or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units that are not listed, or may also include other steps or units inherent to these processes, methods, products or devices. The words "connect", "connected", "coupled" and the like involved in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The "multiple" involved in this application refers to two or more. "And / or" describes the association relationship of associated objects, indicating that there may be three relationships, for example, "A and / or B" can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the objects before and after are in an "or" relationship. The terms "first", "second", "third", etc. involved in this application are only used to distinguish similar objects and do not represent a specific ordering of the objects.

[0075] Example 1

[0076] This embodiment relates to a degassing system of the utility model.

[0077] like Figure 1As shown, a degassing system for removing He gas from TEOS liquid includes a heating component 100, a connecting component 200, an oscillating component 300, a first gas filtering component 400 and a second gas filtering component 500. The heating component 100 is connected to a liquid source device and a heated liquid source device respectively, and is used to heat the liquid source; the connecting component 200 is connected to the heating component 100 and is located downstream of the heating component 100, and is used to transport the heated liquid source; the oscillating component 300 is arranged on the connecting component 200 and is located downstream of the heating component 100, and is used to oscillate the liquid source heated by the heating component 100; the first gas filtering component 400 is connected to the connecting component 200 and is located downstream of the connecting component 200, and is used to filter the gas overflowed from the liquid source through the heating component 100; the second gas filtering component 500 is connected to the first gas filtering component 400 and is located downstream of the first gas filtering component 400, and is used to filter the free gas and dissolved gas contained in the liquid source.

[0078] like Figure 2 As shown, the heating component 100 includes a heating box 110 and a spiral pipe 120. The heating box 110 is connected to the heating liquid source device and is used to accommodate the heating liquid source; the spiral pipe 120 is spirally arranged inside the heating box 110 and is connected to the liquid source device and is used to heat the liquid source through the heating liquid source.

[0079] Specifically, the heating box 110 is arranged in a hollow rectangular structure, and the heating box 110 is respectively connected to the liquid outlet pipe and the liquid inlet pipe of the heating liquid source equipment, so that the heat exchange liquid source is accumulated inside the heating box 110 and the heat exchange liquid source is circulated.

[0080] In some of the embodiments, the heating box 110 includes but is not limited to a stainless steel box.

[0081] Furthermore, the heating box 110 includes a first inlet 111 and a first outlet 112. The first inlet 111 is provided in the heating box 110 and is connected to the heating liquid source device; the first outlet 112 is provided in the heating box 110 and is centrally symmetrically arranged with the first inlet 111 and is connected to the heating liquid source device.

[0082] More specifically, the first inlet 111 is integrally formed at a side wall at one end of the heating box 110 in the length direction, and the first inlet 111 is communicated with a liquid outlet pipe of the heating liquid source device.

[0083] More specifically, the first outlet 112 is integrally formed at the side wall of the other end of the heating box 110 in the length direction, and the first outlet 112 is connected to the liquid inlet pipe of the heating liquid source device.

[0084] It should be noted that by connecting the liquid outlet pipe and the liquid inlet pipe of the heating liquid source equipment to the first inlet 111 and the first outlet 112 at both ends of the length direction of the heating box 110 respectively, the heat exchange liquid source can flow in the heating box 110, thereby maintaining the temperature of the heat exchange liquid source inside the heating box 110 and ensuring the heating effect of the liquid source.

[0085] Furthermore, the heating box 110 includes a second inlet 113 and a second outlet 114. The second inlet 113 is provided in the heating box 110, and is used for one end of the spiral tube 120 to pass through; the second outlet 114 is provided in the heating box 110, and is centrally symmetrically arranged with the second inlet 113, and is used for the other end of the spiral tube 120 to pass through.

[0086] More specifically, the second inlet 113 is integrally formed at the top wall at one end of the heating box 110 in the length direction, and the position of the second inlet 113 on the heating box 110 is close to the position of the first inlet 111 on the heating box 110, and the second inlet 113 can be provided for the end of the spiral tube 120 to pass through, so that the spiral tube 120 is connected to the liquid source equipment.

[0087] More specifically, the second outlet 114 is integrally formed at the bottom wall of the other end of the heating box body 110 in the length direction, and the position of the second outlet 114 on the heating box body 110 is close to the position of the first outlet 112 on the heating box body 110, and the second outlet 114 can be provided for the end of the spiral tube 120 to pass through, so that the spiral tube 120 is connected with the connecting component 200.

[0088] It should be noted that by respectively opening the second inlet 113 and the second outlet 114 on the side walls at both ends of the length direction of the heating box 110, the flow path of the liquid source inside the heating box 110 can be increased, thereby increasing the heating effect on the liquid source.

[0089] Specifically, the spiral tube 120 is arranged in an S-shaped bent coil structure, and the first end of the spiral tube 120 passes through the second inlet 113 and is connected to the liquid source equipment, and the second end of the spiral tube 120 passes through the second outlet 114 and is connected to the connecting component 200; it should be noted that the first end and the second end of the spiral tube 120 are respectively the two ends in its length direction.

[0090] In some of the embodiments, the spiral tube 120 includes, but is not limited to, a stainless steel tube.

[0091] like Figure 3As shown, the connecting component 200 includes a first connecting pipe 210. One end of the first connecting pipe 210 is connected to the heating component 100, and the other end of the first connecting pipe 210 is connected to the first gas filtering component 400. The outer side of the first connecting pipe 210 is provided with an oscillating component 300 for conveying the oscillated liquid source.

[0092] Specifically, the first end of the first connecting tube 210 is connected to the second end of the spiral tube 120, and the second end of the first connecting tube 210 is connected to the first gas filter component 400. It should be noted that the first end and the second end of the first connecting tube 210 are the two ends in the length direction thereof.

[0093] In some embodiments, the first connecting pipe 210 includes but is not limited to a stainless steel pipe.

[0094] Furthermore, the communication component 200 further includes a second communication pipe 220. One end of the second communication pipe 220 is communicated with the first communication pipe 210, and the other end of the second communication pipe 220 is communicated with the first gas filter component 400 for conveying the liquid source after the shock.

[0095] Specifically, the first end of the second connecting pipe 220 is connected to the second end of the first connecting pipe 210, and the second end of the second connecting pipe 220 is connected to the first gas filter component 400. It should be noted that the first end and the second end of the second connecting pipe 220 are the two ends in the length direction thereof.

[0096] In some embodiments, the second connecting pipe 220 includes but is not limited to a stainless steel pipe.

[0097] In this embodiment, the connecting component 200 has the following two implementation modes:

[0098] 1) There is one first connecting pipe 210 and one second connecting pipe 220;

[0099] 2) There are a plurality of first connecting pipes 210 and a plurality of second connecting pipes 220 .

[0100] For implementation mode 2), the details are as follows:

[0101] a. A plurality of first connecting tubes 210 are connected in sequence, the first connecting tube 210 at the top is connected to the heating component 100, and an oscillating component 300 is arranged on the outside of each first connecting tube 210 for conveying the heated liquid source; a plurality of second connecting tubes 220 are arranged at intervals and connected to the plurality of first connecting tubes 210, and the second connecting tube 220 at the bottom is connected to the first gas filtering component 400 for conveying the oscillating liquid source;

[0102] b. A plurality of first connecting tubes 210 are connected in sequence, the first connecting tube 210 at the first position is connected to the heating component 100, and the first connecting tube 210 at the last position is connected to the first gas filtering component 400, and an oscillating component 300 is arranged on the outer side of each first connecting tube 210 for conveying the heated liquid source; a plurality of second connecting tubes 220 are arranged at intervals and connected to the plurality of first connecting tubes 210, and a second connecting tube 220 is arranged between two adjacent first connecting tubes 210 for conveying the oscillated liquid source.

[0103] The number of the second connecting tubes 220 matches the number of the first connecting tubes 210. Generally, the number of the second connecting tubes 220 is not greater than the number of the first connecting tubes 210, that is, the number of the second connecting tubes 220 can be equal to the number of the first connecting tubes 210, or can be less than the number of the first connecting tubes 210 (generally the number of the first connecting tubes 210 minus 1).

[0104] like Figure 4 As shown, the oscillating component 300 includes a first fixing plate 310, a second fixing plate 320 and a plurality of vibrating members 330. The first fixing plate 310 is connected to the process equipment; the second fixing plate 320 is connected to the connecting component 200 and corresponds to the first fixing plate 310; and the plurality of vibrating members 330 are respectively arranged between the first fixing plate 310 and the second fixing plate 320 for vibrating the connecting component 200.

[0105] The number of the oscillating components 300 matches the number of the first communicating tubes 210. Generally, the number of the oscillating components 300 is equal to the number of the first communicating tubes 210.

[0106] More specifically, the first fixing plate 310 is provided in a waist-shaped plate structure, and the first fixing plate 310 is connected to the process equipment by welding, riveting or bolting.

[0107] In some of the embodiments, the first fixing plate 310 includes but is not limited to a stainless steel plate.

[0108] More specifically, the second fixing plate 320 is provided in a waist-shaped plate structure, and the second fixing plate 320 is connected to the outer wall of the first connecting pipe 210 by welding, riveting or bolt fixing.

[0109] In some of the embodiments, the second fixing plate 320 includes but is not limited to a stainless steel plate.

[0110] It should be noted that the lengths of the first fixing plate 310 and the second fixing plate 320 can be set according to actual needs, and no excessive restrictions are imposed herein.

[0111] More specifically, the vibration member 330 is located between the first fixing plate 310 and the second fixing plate 320, and the first end of the vibration member 330 is connected to the first fixing plate 310 by welding, riveting or bolting, and the second end of the vibration member 330 is connected to the second fixing plate 320 by welding, riveting or bolting. It should be noted that the first end and the second end of the vibration member 330 are the two ends of the length direction thereof.

[0112] In some embodiments, the vibration member 330 includes but is not limited to an electromagnetic spring.

[0113] It should be noted that the number of the vibration members 330 is eight, and the eight vibration members 330 are arranged at intervals along the length direction of the first fixing plate 310 .

[0114] In some of the embodiments, the number of the vibration elements 330 may be 7, 9, etc., that is, the number of the vibration elements 330 may be set according to actual needs, and no excessive restrictions are imposed herein.

[0115] like Figure 5 As shown, the first gas filter component 400 includes a plurality of filter plates 410, a plurality of first filter tubes 420 and a first filter box 430. The plurality of filter plates 410 are connected in sequence, and the first filter plate 410 is connected to the connecting component 200, and the last filter plate 410 is connected to the second gas filter component 500, for filtering the gas overflowed from the liquid source through the heating component 100; the plurality of first filter tubes 420 are arranged between two adjacent filter plates 410, for connecting the two adjacent filter plates 410; the first filter box 430 is connected to the last first filter tube 420, for buffering the liquid source filtered by the filter plate 410.

[0116] Specifically, the filter plate 410 is arranged in a rectangular plate structure, and the interior of the filter plate 410 has a cavity that can accommodate the liquid source, and the top of the cavity is sealed with a filter membrane, so that the gas overflowed by heating and shaking can diffuse out.

[0117] In some of the embodiments, the filter plate 410 includes, but is not limited to, a stainless steel plate.

[0118] It should be noted that the number of the filter plates 410 is 6, and the 6 filter plates 410 are stacked, and the 6 filter plates 410 away from the first filter box 430 are connected through the first filter tube 420.

[0119] In some of the embodiments, the number of the filter plates 410 may be 5, 7, etc., that is, the number of the filter plates 410 may be set according to actual needs, and no excessive restrictions are made herein.

[0120] Specifically, both ends of the first filter tube 420 in the length direction are respectively connected to two adjacent filter plates 410 , and the two first filter tubes 420 between three adjacent filter plates 410 are centrally symmetrically arranged.

[0121] In some of the embodiments, the first filter tube 420 includes but is not limited to a stainless steel tube.

[0122] It should be noted that the number of the first filter tubes 420 is 6. Among them, 5 first filter tubes 420 are respectively connected to the corresponding two adjacent filter plates 410, and 1 first filter tube 420 is respectively connected to the filter plate 410 and the first filter box 430.

[0123] In some embodiments, the number of the first filter tubes 420 matches the number of the filter plates 410. It should be understood that the number of the first filter tubes 420 is one less than the number of the filter plates 410.

[0124] Specifically, the first filter box 430 is arranged in a cubic structure, and the interior of the first filter box 430 has a hollow cavity, and the cavity is connected to the filter plate 410 to achieve buffering of the liquid source filtered by the plurality of filter plates 410 .

[0125] In some of the embodiments, the first filter housing 430 includes but is not limited to a stainless steel hollow housing.

[0126] like Figure 6 As shown, the second gas filter component 500 includes a second filter box 510, a vacuum pump 520 and a second filter tube 530. The second filter box 510 is used to install components; the vacuum pump 520 is connected to the second filter box 510 and is used to perform vacuum treatment on the second filter box 510; the second filter tube 530 is spirally arranged inside the second filter box 510, and the two ends of the second filter tube 530 are respectively connected to the first gas filter component 400 and the semiconductor process equipment, and is used to filter the free gas and dissolved gas contained in the liquid source.

[0127] Specifically, the second filter box 510 is in a rectangular parallelepiped structure, and the second filter box 510 has a cavity inside, which can be used to install the second filter element tube.

[0128] In some of the embodiments, the second filter housing 510 includes but is not limited to a stainless steel housing.

[0129] Furthermore, the second filter box 510 includes a vacuum port 511, a third inlet 512 and a third outlet 513. The vacuum port 511 is provided in the second filter box 510 for installing the vacuum pump 520; the third inlet 512 is provided in the second filter box 510 for passing one end of the second filter tube 530; the third outlet 513 is provided in the second filter box 510 and is centrally symmetrically arranged with the third inlet 512 for passing the other end of the second filter tube 530.

[0130] More specifically, the vacuum port 511 is opened on the side wall of the second filter box 510 , and the vacuum port 511 allows the vacuum end of the vacuum pump 520 to communicate with the second filter box 510 .

[0131] More specifically, the third inlet 512 is opened at one end of the second filter box 510 in the length direction and is located at the top wall of the second filter box 510 , and the end of the second filter tube 530 can pass through the third inlet 512 .

[0132] More specifically, the third outlet 513 is opened at the other end of the second filter box 510 in the length direction and is located at the side wall of the second filter box 510 , and the end of the second filter tube 530 can pass through the third outlet 513 .

[0133] Specifically, the vacuum pump 520 is installed on the outer wall of the second filter box 510 by welding, riveting or bolting, and the vacuum end of the vacuum pump 520 is connected to the vacuum port 511 on the second filter box 510.

[0134] In some of the embodiments, the vacuum pump 520 includes but is not limited to a reciprocating vacuum pump 520 and a rotary vacuum pump 520 .

[0135] Specifically, the second filter tube 530 is arranged in a spiral shape inside the second filter box 510, and the first end of the second filter tube 530 passes through the third inlet 512 and is connected to the first gas filter component 400, and the second end of the second filter tube 530 passes through the third outlet 513 and is connected to the semiconductor process equipment; it should be noted that the first end and the second end of the second filter tube 530 are respectively the two ends in its length direction.

[0136] In some embodiments, the second filter tube 530 includes but is not limited to a PFA filter membrane spiral tube.

[0137] It should be noted that the vacuum pump 520 draws the second filter box 510 into a vacuum state, so that the liquid source in the second filter tube 530 is placed in a vacuum environment, so that the free gas and dissolved gas in the liquid source are released from the PFA filter membrane.

[0138] The method of using this embodiment is as follows:

[0139] In the actual working process, the heating liquid source device is turned on, so that the heat exchange liquid source flows into the interior of the heating box 110 through the first inlet 111. When the heat exchange liquid source inside the heating box 110 is full, the heat exchange liquid source inside the heating box 110 can flow into the heating liquid source device again through the first outlet 112, so as to realize the circulation of the heat exchange liquid source.

[0140] Turn on the liquid source device so that the liquid source can flow into the spiral pipe 120. Since the spiral pipe 120 is placed inside the heating box 110, the heat exchange liquid source with a higher temperature can exchange heat with the liquid source with a lower temperature, thereby heating the liquid source. In addition, the temperature of the liquid source is increased while the pressure remains unchanged, and the solubility of the gas is reduced, which facilitates the overflow of the gas contained in the liquid source.

[0141] The vibration member 330 is turned on, and the vibration of the vibration member 330 drives the vibration of the first connecting pipe 210, so that the bubbles dissolved in the liquid source can float on the surface of the liquid source, which is convenient for the gas to overflow;

[0142] The liquid source flows to the filter plate 410 through the first connecting pipe 210. The gas overflowed by the liquid source through heating and shaking is diffused through the filter membrane on the filter plate 410, thereby preventing the gas separated from the liquid source from dissolving into the liquid source again.

[0143] The liquid source processed by the filter plate 410 flows to the second filter tube 530, and the vacuum pump 520 is turned on to put the second filter box 510 in a vacuum state, so that the liquid source in the second filter tube 530 is placed in a vacuum environment, and then the free gas and dissolved gas in the liquid source are released from the PFA filter membrane to complete the degassing operation of the liquid source.

[0144] The advantage of this embodiment is that, by connecting the liquid source device and the heating liquid source device with the heating component, the heat exchange liquid source with a higher temperature can exchange heat with the liquid source with a lower temperature, thereby heating the liquid source, and then increasing the temperature of the liquid source and reducing the gas solubility under the condition of constant pressure, so as to facilitate the overflow of the gas contained in the liquid source; by arranging the oscillation component on the connecting component, the vibration of the oscillation component drives the vibration of the connecting component, so that the bubbles dissolved in the liquid source can float on the surface of the liquid source, so as to facilitate the overflow of the gas; by connecting the connecting component and the first gas filter component, by diffusing the gas overflowed from the liquid source through the filter membrane on the filter plate by heating and shaking the liquid source, the gas separated from the liquid source can be prevented from dissolving into the liquid source again; by connecting the first gas filter component with the second gas filter component, the liquid source is placed in a vacuum environment, and the free gas and dissolved gas in the liquid source are released by the PFA filter membrane to complete the degassing operation of the liquid source.

[0145] Example 2

[0146] This embodiment is a variation of Embodiment 1.

[0147] like Figure 7 and Figure 8 As shown, the number of the first connecting pipes 210 is two, and the number of the second connecting pipe 220 is one.

[0148] The first end of a first connecting tube 210 is connected to the second end of the spiral tube 120 , and the second end of the first connecting tube 210 is connected to the first end of the second connecting tube 220 .

[0149] The first end of the other first connecting pipe 210 is connected to the second end of the second connecting pipe 220 , and the second end of the first connecting pipe 210 is connected to the first gas filtering component 400 .

[0150] In addition, in the present embodiment, the number of the oscillating components 300 is two, and the two oscillating components 300 are respectively installed on the corresponding first connecting pipes 210 .

[0151] The usage and advantages of this embodiment are the same as those of Embodiment 1 and will not be described in detail here.

[0152] Example 3

[0153] This embodiment is a variation of Embodiments 1 to 2.

[0154] like Fig. 9 , Fig.10 and Fig.11 As shown, the degassing system further includes a fluid flow rate regulating component 600. The fluid flow rate regulating component 600 is respectively connected to the first gas filter component 400 and the second gas filter component 500 to accelerate the overflow of the gas contained in the liquid source.

[0155] Specifically, the fluid flow rate regulating component 600 includes a fluid flow rate regulating component 610 and an extension tube 620. The fluid flow rate regulating component 610 is connected to the first gas filter component 400 to accelerate the overflow of the gas contained in the liquid source; the extension tube 620 is respectively connected to the end of the fluid flow rate regulating component 610 and the second gas filter component 500 to transport the liquid source.

[0156] Specifically, the fluid flow rate regulating member 610 is arranged in a funnel structure, and the end of the fluid flow rate regulating member 610 with a larger diameter is connected to the first filter box 430 , and the end of the fluid flow rate regulating member 610 with a smaller diameter is connected to the extension pipe 620 .

[0157] In some of the embodiments, the fluid flow rate regulator 610 includes, but is not limited to, a stainless steel tapered tube.

[0158] It should be noted that the liquid source in the first filter box 430 can flow into the interior of the fluid flow rate regulating component 610, and the liquid source can adhere to the inner wall of the fluid flow rate regulating component 610, that is, by increasing the area of ​​the liquid source attached to the inner surface of the fluid flow rate regulating component 610, on the one hand, it can be beneficial to the overflow of the gas contained in the liquid source, and on the other hand, it can facilitate the connection with the second gas filter component 500.

[0159] Specifically, the first end of the extension tube 620 is connected to the end of the fluid flow rate regulator 610 with a smaller diameter, and the second end of the extension tube 620 is connected to the second gas filter component 500. It should be noted that the first end and the second end of the extension tube 620 are the two ends in the length direction thereof.

[0160] In some of these embodiments, the extension tube 620 includes, but is not limited to, a stainless steel tube.

[0161] Furthermore, the first filter box 430 includes an opening 431 . The opening 431 is integrally formed at a side wall of the first filter box 430 , and the first filter box 430 is in communication with the second gas filter component 500 through the opening 431 .

[0162] It should be noted that the size of the opening 431 can be set according to the size of the fluid flow rate adjusting member 610, and no excessive restrictions are imposed herein.

[0163] The method of using this embodiment is as follows:

[0164] In the actual working process, the heating liquid source device is turned on, so that the heat exchange liquid source flows into the interior of the heating box 110 through the first inlet 111. When the heat exchange liquid source inside the heating box 110 is full, the heat exchange liquid source inside the heating box 110 can flow into the heating liquid source device again through the first outlet 112, so as to realize the circulation of the heat exchange liquid source.

[0165] Turn on the liquid source device so that the liquid source can flow into the spiral pipe 120. Since the spiral pipe 120 is placed inside the heating box 110, the heat exchange liquid source with a higher temperature can exchange heat with the liquid source with a lower temperature, thereby heating the liquid source. In addition, the temperature of the liquid source is increased while the pressure remains unchanged, and the solubility of the gas is reduced, which facilitates the overflow of the gas contained in the liquid source.

[0166] The vibration member 330 is turned on, and the vibration of the vibration member 330 drives the vibration of the first connecting pipe 210, so that the bubbles dissolved in the liquid source can float on the surface of the liquid source, which is convenient for the gas to overflow;

[0167] The liquid source flows to the filter plate 410 through the first connecting pipe 210. The gas overflowed by the liquid source through heating and shaking is diffused through the filter membrane on the filter plate 410, thereby preventing the gas separated from the liquid source from dissolving into the liquid source again.

[0168] The liquid source processed by the filter plate 410 flows to the fluid flow rate regulating member 610, and the liquid source can be attached to the inner wall of the fluid flow rate regulating member 610, that is, by increasing the area of ​​the liquid source attached to the inner surface of the fluid flow rate regulating member 610, it is beneficial for the gas contained in the liquid source to overflow;

[0169] The vacuum pump 520 is turned on to put the second filter box 510 in a vacuum state, so that the liquid source in the second filter box 510 is placed in a vacuum environment, and the free gas and dissolved gas in the liquid source are released from the PFA filter membrane to complete the degassing operation of the liquid source.

[0170] The advantage of this embodiment is that by connecting the first gas filter component with the fluid flow rate regulating component, the liquid source can be attached to the inner wall of the fluid flow rate regulating component, that is, by increasing the area of ​​the liquid source attached to the inner surface of the fluid flow rate regulating component, it is beneficial to the overflow of the gas contained in the liquid source.

[0171] Example 4

[0172] This embodiment relates to a semiconductor process system of the utility model.

[0173] A semiconductor process system includes the degassing system as described in embodiments 1 to 3, wherein the degassing system is connected to a liquid source device, a heated liquid source device and a semiconductor process device.

[0174] It should be noted that the liquid source equipment, the heated liquid source equipment and the semiconductor process equipment are existing technologies and will not be described in detail here.

[0175] The usage and advantages of this embodiment are the same as those of Embodiment 1, Embodiment 2 and Embodiment 3, and will not be described in detail here.

[0176] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0177] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A degassing system for removing He gas from TEOS liquid, characterized in that: include: A heating component, the heating component is connected to the liquid source device and the heated liquid source device respectively, and is used to heat the liquid source; a communicating component, the communicating component being in communication with the heating component and being located downstream of the heating component, and being used for conveying the heated liquid source; an oscillating component, the oscillating component being arranged at the communicating component and being located downstream of the heating component, and being used for oscillating the liquid source heated by the heating component; a first gas filtering component, which is connected to the connecting component and is located downstream of the connecting component, and is used for filtering gas overflowed from the liquid source through the heating component; The second gas filter component is located downstream of the first gas filter component and is used to filter free gas and dissolved gas contained in the liquid source.

2. The degassing system according to claim 1, characterized in that The heating component comprises: A heating box, the heating box is connected to the heating liquid source device and is used to contain the heating liquid source; A spiral pipe, wherein the spiral pipe is spirally arranged inside the heating box and is connected to the liquid source device, and is used to heat the liquid source by heating the liquid source; and / or The oscillating component comprises: a first fixing plate, the first fixing plate being connected to the process equipment; a second fixing plate, the second fixing plate being connected to the communicating component and corresponding to the first fixing plate; a plurality of vibration members, each of which is disposed between the first fixing plate and the second fixing plate and is used to vibrate the connecting member; and / or The first gas filter component comprises: A plurality of filter plates, wherein the plurality of filter plates are connected in sequence, and the filter plate at the first position is connected to the connecting component, and the filter plate at the last position is connected to the second gas filter component, for filtering the gas overflowed from the liquid source through the heating component; A plurality of first filter tubes, which are arranged between two adjacent filter plates and are used to connect the two adjacent filter plates; A first filter box, which is connected to the first filter tube at the last position and is used to buffer the liquid source filtered by the filter plate; and / or The second gas filter component comprises: A second filter box, wherein the second filter box is used to install components; A vacuum pump, the vacuum pump being in communication with the second filter housing and being used for performing vacuum treatment on the second filter housing; The second filter tube is spirally arranged inside the second filter box, and the two ends of the second filter tube are respectively connected to the first gas filter component and the semiconductor process equipment, and is used for filtering the free gas and dissolved gas contained in the liquid source.

3. The degassing system according to claim 2, characterized in that: The heating box comprises: A first inlet, the first inlet is opened in the heating box, and the first inlet is connected to a heating liquid source device; A first outlet, wherein the first outlet is disposed in the heating box and is centrally symmetrically arranged with the first inlet, and the first outlet is connected to a heating liquid source device; and / or The heating box comprises: A second inlet, the second inlet is opened in the heating box, and the second inlet is used for one end of the spiral pipe to pass through; The second outlet is opened in the heating box body and is centrally symmetrically arranged with the second inlet, and the second outlet is used for the other end of the spiral pipe to pass through.

4. The degassing system according to claim 2, characterized in that: The second filter housing comprises: A vacuum port, which is provided in the second filter housing and is used for installing the vacuum pump; a third inlet, the third inlet being provided in the second filter housing and being used for one end of the second filter tube to pass through; The third outlet is opened in the second filter box and is centrally symmetrically arranged with the third inlet, and is used for the other end of the second filter tube to pass through.

5. The degassing system according to claim 1, characterized in that: The communication component comprises: A first connecting tube, one end of which is connected to the heating component, and the other end of which is connected to the first gas filtering component. The oscillating component is disposed on the outer side of the first connecting tube for conveying the oscillated liquid source.

6. The degassing system according to claim 5, characterized in that The communication component also includes: A second connecting pipe, one end of which is connected to the first connecting pipe, and the other end of which is connected to the first gas filter component, is used to transport the liquid source after the shock.

7. The degassing system according to claim 1, characterized in that The communication component comprises: A plurality of first connecting tubes, wherein the plurality of first connecting tubes are connected in sequence, the first connecting tube at the first position is connected to the heating component, and the first connecting tube at the last position is connected to the first gas filtering component, and the oscillating component is disposed on the outer side of each first connecting tube for conveying the liquid source after oscillation; A plurality of second connecting tubes are arranged at intervals from a plurality of first connecting tubes, a second connecting tube is arranged between two adjacent first connecting tubes, and the second connecting tube at the last position is respectively connected with the first connecting tube at the last position and the first gas filter component, for conveying the liquid source after shock.

8. The degassing system according to any one of claims 1 to 7, characterized in that: Also includes: A fluid flow rate regulating component is connected to the first gas filter component and the second gas filter component respectively, and is used to accelerate the overflow of gas contained in the liquid source.

9. The degassing system according to claim 8, characterized in that The fluid flow rate regulating component comprises: A fluid flow rate regulating member, the first end of which is in communication with the first gas filter component, and is used to accelerate the overflow of the gas contained in the liquid source; An extension pipe is connected to the end of the fluid flow rate regulating component and the second gas filter component respectively, and is used for conveying a liquid source.

10. A semiconductor process system, characterized in that: include: A degassing system as claimed in any one of claims 1 to 9.

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