Heating element array structure, heating element welding module, welding jig and atomization device

Abstract

The utility model discloses a heating element array structure, a heating element welding module, a welding jig and an atomization device. The heating element array structure comprises a plurality of heating elements, a base material frame material and fixing nodes for connecting the heating elements to the base material frame material, wherein the heating elements are integrally formed; the heating body comprises two side edge belts which are opposite to each other at an interval and a mesh connected between the two side edge belts; the two side edge belts of each heating body are connected to the base material frame material through fixing nodes respectively, and the two fixing nodes of each heating body are located at the same ends of the side edge belts of the heating bodies. According to the heating body array structure, the fixed nodes are arranged at the ends of the heating bodies, so that the pins can be in continuous side connection with the vast majority of the areas of the side edges of the heating bodies and are not interfered by the fixed nodes, the welding mode selection range of the pins is expanded, and the heating body array structure is suitable for spot welding, resistance pressure welding and welding. The device is also suitable for continuous welding and other welding modes, and the production efficiency and the yield are improved.

Description

Technical Field

[0001] The present application relates to the field of heating atomization technology, and in particular to a heating element array structure, a heating element welding module, a welding fixture and an atomization device. Background Art

[0002] At present, the types of heating elements in the atomization unit of the atomization device mainly include spring wire and mesh core structure. The mesh core structure is increasingly widely used due to its large contact area with the atomized liquid and high atomization efficiency. The heating net with a mesh core structure is generally obtained by etching or stamping. However, in the process of preparing the heating net by stamping, mold loss will occur, resulting in changes in the size of the heating net, mold repair costs, and reduced production efficiency. It is not as stable as etching production. The etching process is widely used in the manufacture of heating nets due to its stable dimensional accuracy and high production efficiency.

[0003] In the prior art, the heating nets are prepared on the substrate by etching process, and the heating nets formed after etching are independent of each other. When welding the pins, the pins need to be welded one by one on each heating net, which leads to low welding efficiency. Utility Model Content

[0004] The technical problem to be solved by the present application is to provide a heating element array structure which is applicable to multiple welding methods and has high welding efficiency, a heating element welding module having the heating element array structure, and a welding jig and an atomizing device for the heating element welding module.

[0005] The technical solution adopted by the present application to solve the technical problem is: to provide a heating element array structure, including a plurality of heating elements formed in one piece, a base material frame material, and a fixed node connecting the heating elements to the base material frame material;

[0006] The heating element comprises two side bands spaced opposite to each other and a mesh connected between the two side bands; the two side bands of each heating element are respectively connected to the base frame material through a fixed node, and the two fixed nodes of each heating element are located at the end of the same end of the side band of the heating element.

[0007] In some embodiments, the heating element array structure includes two groups of heating modules arranged along the width direction of the heating element array structure, each group of the heating modules includes a plurality of the heating elements arranged at intervals along the length direction of the heating element array structure; the fixed node is located at one end of the two groups of the heating modules facing each other.

[0008] In some embodiments, the side band has a long side opposite to the mesh and a short side connected to one end of the long side, and the fixed node is connected to the short side of the side band; the base frame material includes at least one transverse frame bar extending along the length direction of the heating element array structure; a plurality of the heating elements are distributed on at least one side of the transverse frame bar, and each of the heating elements is connected to one of the transverse frame bars through two of the fixed nodes.

[0009] In some embodiments, the side band has a long side opposite to the mesh and a short side connected to one end of the long side; the fixing node is connected to a position of the long side close to the short side.

[0010] In some embodiments, the base frame material further includes a plurality of vertical frame bars extending along the width direction of the heating element array structure, a vertical frame bar is arranged between two adjacent heating elements, and a first gap is formed between the vertical frame bar and the side bands of the adjacent heating elements.

[0011] In some embodiments, the substrate frame material includes two positioning ends that are spaced apart from each other; each of the heating elements is located between the two positioning ends, and the side bands of the heating elements located at both ends of the heating element array structure in the length direction are respectively connected to the corresponding positioning ends through fixed nodes.

[0012] The present application also provides a heating element welding module, comprising the above-mentioned heating element array structure, and a plurality of pairs of pins, each pair of the pins being respectively welded to two side bands of a corresponding heating element.

[0013] In some embodiments, a first gap is formed between the outer sides of the two side bands of each heating element and the substrate frame material, and the pins are arranged in the first gap.

[0014] The present application also provides a welding jig for making the above-mentioned heating element welding module, the welding jig includes a positioning plate for positioning the heating element array structure thereon; the positioning plate is provided with a plurality of groups of positioning grooves; each group of the positioning grooves includes two strip grooves for pins to be embedded, and the second interval between the two strip grooves forms a positioning area for limiting a heating element of the heating element array structure therein.

[0015] In some embodiments, at least one positioning protrusion is further provided on the positioning plate, and the positioning protrusion is laterally connected between the two strip grooves of the positioning groove.

[0016] In some embodiments, the positioning plate is a magnetic plate or is provided with a magnetic element.

[0017] The present application also provides an atomization device, comprising at least one of the heating elements on the heating element welding module and the pins welded to the corresponding heating element.

[0018] The beneficial effects of the present application are as follows: in the heating element array structure, the fixed node position is set at the end of the heating element, so that the pin can be continuously connected to most areas of the side band of the heating element without being interfered by the fixed node, thereby expanding the selection range of welding methods for the pin, and is not only suitable for spot welding and resistance pressure welding, but also for other welding methods such as continuous welding, thereby improving production efficiency and yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present application will be further described below with reference to the accompanying drawings and embodiments, in which:

[0020] Figure 1 is a schematic structural diagram of a heating element array structure of some embodiments of the present application;

[0021] Figure 2 yes Figure 1 An enlarged structural schematic diagram of the heating element in the heating element array structure shown;

[0022] Figure 3 yes Figure 1 A schematic diagram of the structure of a heating element welding module formed by connecting a heating element array structure and pins shown;

[0023] Figure 4 yes Figure 3 The schematic diagram of the structure of the heating element welding module on the welding fixture is shown;

[0024] Figure 5 yes Figure 4 Schematic diagram of the structure of the welding fixture;

[0025] Figure 6 is a schematic structural diagram of a heating element array structure of other embodiments of the present application;

[0026] Figure 7 yes Figure 6 An enlarged structural schematic diagram of the heating element in the heating element array structure shown;

[0027] Figure 8 yes Figure 6 A schematic diagram of the structure of a heating element welding module formed by connecting a heating element array structure and pins shown;

[0028] Fig. 9 yes Figure 8 The schematic diagram of the structure of the heating element welding module on the welding fixture is shown;

[0029] Fig.10 yes Fig. 9Schematic diagram of the structure of the welding fixture;

[0030] Fig.11 It is a structural schematic diagram of an atomization device. DETAILED DESCRIPTION

[0031] In order to have a clearer understanding of the technical features, purposes and effects of the present application, the specific implementation methods of the present application are now described in detail with reference to the accompanying drawings.

[0032] The heating element array structure of the present application is a semi-finished heating element, that is, a plurality of heating elements with a predetermined shape arranged in an array are formed at one time on a substrate by stamping, etching or laser, and the heating elements are not detached from the substrate.

[0033] like Figure 1 As shown, the heating element array structure of some embodiments of the present application includes a plurality of heating elements 10 , a base material frame material 20 , and a fixed node 30 connecting the heating elements 10 and the base material frame material 20 .

[0034] The heating element 10 is formed on the substrate by stamping, etching or laser processing. After the heating element 10 is formed on the substrate by stamping, etching or laser processing, the substrate portion other than the heating element 10 forms a substrate frame material 20, and the substrate frame material 20 and the heating element 10 are connected by a fixed node 30 so that the heating element 10 does not separate from the substrate frame material 20, and the multiple heating elements 10 formed are connected as a whole through the substrate frame material 20, which is convenient for the subsequent positioning of the pins of each heating element 10 during batch welding. After the pin welding is completed, the heating element 10 is separated from the substrate frame material 20 to avoid positioning each heating element 10 separately and then welding the pins of each heating element 10 one by one, thereby improving the welding efficiency.

[0035] The substrate is a metal plate suitable for making the heating element 10, such as a nickel plate, a nickel-chromium plate, a titanium plate, a stainless steel plate or an iron-chromium-aluminum plate, etc. The thickness of the substrate corresponds to the thickness of the heating element 10, that is, a substrate with the same thickness is selected according to the thickness of the heating element 10 to be prepared. The length and width of the substrate are not limited, and a plurality of heating elements 10 arranged in one row, one column, or multiple rows and columns can be processed on the substrate in combination with the size of the heating element 10.

[0036] In this embodiment, the fixed node 30 is located at the end of the heating element 10, and can avoid the side portion of the heating element 10 to which the pin is to be connected, so that the pin is not interfered with by the fixed node, and can be docked on the side of the heating element 10 and be on the same horizontal plane with the heating element 10. In addition to being suitable for traditional stack welding methods, it is also further suitable for side welding methods, and can improve welding quality and product consistency.

[0037] like Figure 2As shown, the heating element 10 may further include two side bands 11 spaced opposite to each other and a mesh 12 connected between the two side bands 11. When the heating element 10 is applied to the atomization device, the heating element 10 mainly heats and atomizes the atomized liquid by generating heat after the mesh 12 is energized. The two side bands 11 serve as the connection parts of the heating element 10, which are used to connect to the pins and conduct electricity through the external power supply (such as a battery cell) of the pins. A fixed node 30 is formed at the end of each side band 11, and the fixed node 30 is connected between the end of the side band 11 and the substrate frame material 20. In combination with each heating element 10 having two side bands 11, that is, each heating element 10 has two fixed nodes 30, and the two fixed nodes 30 of each heating element 10 are located at the end of the same end (the end facing the same direction) of the side band 11 of the heating element 10.

[0038] Specifically, the side band 11 has a long side 111 opposite to the mesh 12, a short side 112 connected to one end of the long side 111 and in the same direction as one side of the mesh 12; the other short side 113 of the side band 11 is connected to the other end of the long side 111 and in the same direction as the other side of the mesh 12. Figure 2 In the illustrated embodiment, the fixed node 30 is connected to the short side 112 of the side band 11, so that the heating element 10 is connected to the base frame material 20 through the short side 112 of the side band 11, and the entire long side 111 of the side band 11 is relatively free. Since there is no fixed node between the long side 111 and the base frame material 20, there is a gap, which is the first gap 110, and can be used for the pin to be placed therein and connected to the side band 11 by welding or the like. The width of the first gap 110 is greater than or equal to the cross-sectional width of the pin, wherein the pin can be but not limited to a flat pin, a polygonal pin, a circular or elliptical pin, etc., and the cross-sectional width of the pin is the cross-sectional width of the pin in the width direction of the first gap 110.

[0039] The long side 111 of the side band 11 corresponds to the width of the mesh 12, and also corresponds to the width of the entire heating element 10. The short side 112 of the side band 11 corresponds to the length of the mesh 12, and the sum of the length of the short sides 112 of the two side bands 11 and the length of the mesh 12 forms the length of the entire heating element 10.

[0040] The substrate frame material 20 may include at least one transverse frame bar 22, and the transverse frame bar 22 extends along the length direction of the heating element array structure. A plurality of heating elements 10 are distributed on at least one side of the transverse frame bar 22, and each heating element 10 is connected to a transverse frame bar 22 through two fixed nodes 30. The substrate frame material 20 may also include two positioning ends 21 spaced opposite to each other, and the transverse frame bar 22 is laterally connected between the two positioning ends 21. All the heating elements 10 are located between the two positioning ends 21. Since the heating elements 10 are connected to at least one side of the transverse frame bar 22 through the fixed nodes 30, the heating elements 10 only need to be connected to the transverse frame bar 22 through the fixed nodes 30 and connected to the substrate frame material 20, and there is no connection structure between the heating elements 10 and the positioning ends 21 of the substrate frame material 20. In some embodiments, the substrate frame material 20 may also not require the positioning ends 21.

[0041] When there are two or more heating elements 10 spaced and arranged side by side, the base frame material 20 further includes at least one vertical frame bar 23, which is located between two adjacent heating elements 10 and plays a role in spacing and positioning; the first interval 110 outside the side band 11 of the heating element 10 is between the side band 11 and the adjacent vertical frame bar 23. The two or more heating elements 10 are all connected to the horizontal frame bar 22 with one end having the fixed node 30. Figure 1 As shown, when there are multiple heating elements 10 and they are arranged in two rows, each row of heating elements forms a group of heating modules, and the several heating elements 10 of each group of heating modules are arranged at intervals along the length direction of the heating element array structure; the heating elements 10 of the two groups of heating modules are both oriented with one end having a fixed node 30 toward and connected to the transverse frame bar 22, so that the fixed node 30 is located at the end of the two groups of heating modules facing each other.

[0042] In addition, it can be understood that after the heating element 10 and the substrate frame material 20 are formed on the substrate, the substrate frame material may also have a frame 24 located on the outside of the heating element 10 and connected between the two positioning ends 21. In order not to block the pins from extending into the first gap 110 on the outside of the side band 11 of the heating element 10 and keep the pins and the heating element 10 in the same horizontal plane, the frame 24 is removed before welding the pins.

[0043] When connecting the pins to the heating element 10, the pins 40 are directly matched with the heating element 10 of the heating element array structure, and then welded to connect the pins to the heating element 10, and the pins and the heating element 10 together form a heating unit. The heating unit and the base frame material 20 can be integrated into a heating element welding module.

[0044] like Figure 3 As shown, the heating element welding module includes the heating element array structure and a plurality of pairs of pins 40 ; each pair of pins 40 includes two pins 40 . The number of pairs of pins 40 is set corresponding to the number of heating elements 10 .

[0045] Combination Figures 1 to 3 Each pair of pins 40 is disposed on the outside of the side band 11 of a heating element 10 of the heating element array structure, fitted in the first interval 110 on the outside of the side band 11, and connected to the long side 111 of the side band 11 by welding (such as side welding). The end of the pin 40 is flush with the short side 112 of the side band 11 or close to the short side 112 of the side band 11.

[0046] exist Figure 3 In the illustrated embodiment, the fixing node 30 is connected between the short side 112 of the side band 11 of the heating element 10 and the transverse frame strip 22 of the base frame material 20. When welding the pin 40, the pin 40 is extended to the outside of the long side 111 of the side band 11 of the heating element 10. When the end of the pin 40 abuts against the transverse frame strip 22, it indicates that the pin 40 is in place. Then, spot welding, resistance pressure welding or continuous welding can be selected according to actual needs.

[0047] The welding of the pin 40 is performed on a welding jig. Figure 4 and Figure 5 As shown, the welding jig used for the above welding may include a positioning plate 50 for positioning the heating element array structure thereon. The heating element array structure may be positioned on the surface of the positioning plate 50 by at least one of fastening, magnetic attraction, and the like.

[0048] As for the fastening method, the positioning plate 50 may be provided with a positioning structure 51, which is used to cooperate with the positioning end 21 of the substrate frame material 20 to fix the substrate frame material 20 on the positioning plate 50. The positioning structure 51 includes at least two positioning holes and / or at least two positioning columns. For the positioning hole, the positioning end 21 of the substrate frame material 20 may be provided with a convex column adapted to the positioning hole, and the convex column is inserted into the positioning hole to form positioning; or, the positioning end 21 is provided with a connecting hole that is relatively connected to the positioning hole, and after the connecting hole and the positioning hole are connected, they are locked in the connecting hole and the positioning hole by fasteners such as screws or bolts to form positioning. For the positioning column, the positioning end 21 of the substrate frame material 20 may be provided with a connecting hole that is adapted to the positioning column, and the connecting hole is sleeved on the positioning column to form positioning.

[0049] For the magnetic attraction method, the positioning plate 50 can be a magnetic attraction plate made of a material with magnetic attraction properties, and the magnetic attraction plate can magnetically attract the heating element 10 thereon. Alternatively, a plurality of magnetic attraction components (such as magnets) are built into the positioning area corresponding to the heating element 10 on the positioning plate 50, and the heating element 10 is magnetically attracted to the positioning plate 50 through the magnetic attraction components.

[0050] Furthermore, at least one group of positioning grooves is provided on the positioning plate 50. Each group of positioning grooves includes two relatively spaced strip grooves 52. The two strip grooves 52 correspond to two pins 40 of a pair of pins 40 respectively, and are used for the pins 40 to cooperate therein for limiting.

[0051] The interval between the two strip grooves 52 of each group of positioning grooves forms a positioning area for limiting a heating element 10 therein. That is, when the heating element array structure is positioned on the positioning plate 50, each heating element 10 in the heating element array structure falls between the two strip grooves 52 of a group of positioning grooves.

[0052] Combination Figures 3 to 5 When the welding jig is used, the heating element array structure is placed on the positioning plate 50 and fixed to the positioning plate 50 by magnetic attraction and / or fastening, eliminating the process of placing and positioning the heating elements 10 one by one. The pins 40 are placed on the positioning plate 50 and limited in the strip grooves 52, so that pins 40 are placed on both sides of each heating element 10. Select a welding method such as spot welding, resistance pressure welding or continuous welding for welding, so that the pins 40 are connected to the side band 11 of the heating element 10. Of course, the pins 40 can also be stacked on the side band 11, and the two are connected as a whole by welding.

[0053] like Figure 6 As shown, the heating element array structure of other embodiments of the present application includes a plurality of heating elements 10 , a base material frame material 20 , and fixed nodes 30 connected between the heating elements 10 and the base material frame material 20 .

[0054] The heating element 10 is formed on the substrate by stamping, etching or laser processing. After the heating element 10 is formed on the substrate by stamping, etching or laser processing, the substrate portion other than the heating element 10 forms a substrate frame material 20, and the substrate frame material 20 and the heating element 10 are connected by a fixed node 30 so that the heating element 10 does not separate from the substrate frame material 20, and the multiple heating elements 10 formed are connected as a whole through the substrate frame material 20, which is convenient for the subsequent positioning of the pins of each heating element 10 during batch welding. After the pin welding is completed, the heating element 10 is separated from the substrate frame material 20 to avoid positioning each heating element 10 separately and then welding the pins of each heating element 10 one by one, thereby improving the welding efficiency.

[0055] The substrate is a metal plate suitable for making the heating element 10, such as a nickel plate, a nickel-chromium plate, a titanium plate, a stainless steel plate or an iron-chromium-aluminum plate, etc. The thickness of the substrate corresponds to the thickness of the heating element 10, that is, a substrate with the same thickness is selected according to the thickness of the heating element 10 to be prepared. The length and width of the substrate are not limited, and a plurality of heating elements 10 arranged in one row, one column, or multiple rows and columns can be processed on the substrate in combination with the size of the heating element 10.

[0056] In this embodiment, the fixed node 30 is located at the end of the heating element 10, and can avoid the side portion of the heating element 10 to which the pin is to be connected, so that the pin is not interfered with by the fixed node, can be docked on the side of the heating element 10 and be on the same horizontal plane with the heating element 10, is suitable for various welding methods, and can improve welding quality and product consistency.

[0057] The heating element 10 may further include two side bands 11 spaced opposite to each other and a mesh 12 connected between the two side bands 11. When the heating element 10 is applied to the atomization device, the heating element 10 mainly heats and atomizes the atomized liquid by heating the mesh 12 after being energized. The two side bands 11 serve as the connection parts of the heating element 10, and are used to connect to the pins, and conduct electricity through the pins to an external power source (such as a battery cell). A fixed node 30 is formed at the end of each side band 11, and the fixed node 30 is connected between the end of the side band 11 and the substrate frame material 20.

[0058] Specifically, the side band 11 has a long side 111 opposite to the mesh 12, a short side 112 connected to one end of the long side 111 and in the same direction as one side of the mesh 12; the other short side 113 of the side band 11 is connected to the other end of the long side 111 and in the same direction as the other side of the mesh 12. Figure 6-Figure 7 In the illustrated embodiment, the fixing node 30 is connected to one end of the long side 111 of the side band 11 and close to the short side 112. Most of the long side 111 of the side band 11 (except for the portion at the end where the fixing node 30 is located) is relatively free, and there is a gap between most of the long side 111 in the length direction and the substrate frame material 20. The gap is a first gap 110, which can be used for placing a pin therein and connected to the side band 11 by welding or the like. The width of the first gap 110 is greater than or equal to the cross-sectional width of the pin, wherein the pin may be, but is not limited to, a flat pin, a polygonal pin, a circular or elliptical pin, etc., and the cross-sectional width of the pin is the cross-sectional width of the pin in the width direction of the first gap 110.

[0059] The long side 111 of the side band 11 corresponds to the width of the mesh 12, and also corresponds to the width of the entire heating element 10. The short side 112 of the side band 11 corresponds to the side where the length of the mesh 12 is located, and the sum of the length of the short sides 112 of the two side bands 11 and the length of the mesh 12 forms the length of the entire heating element 10. It can be understood that in some embodiments, the length of the long side 111 of the side band 11 can also be different from the width of the mesh 12.

[0060] The base frame material 20 may further include two spaced-apart positioning ends 21 and at least one vertical frame bar 23; each vertical frame bar 23 extends along the width direction of the heating element array structure. When the heating element array structure has a plurality of heating elements 10 and a plurality of vertical frames 23, the plurality of vertical frames 23 are spaced-apart along the length direction of the heating element array structure, and the plurality of heating elements 10 are distributed between the vertical frames 23 and between the vertical frames 23 and the positioning ends 21; some heating elements 10 are connected between the positioning ends 21 and the vertical frames 23 through fixed nodes 30, and some heating elements 10 are connected between two adjacent vertical frames 23 through fixed nodes 30.

[0061] Specifically, when there are two or more heating elements 10, the heating elements 10 can be arranged side by side at intervals, and the heating element 10 near the positioning end 21 is connected between the positioning end 21 and the vertical frame bar 23 through the fixing nodes 30 of the two side strips 11, and the heating element 10 far from the positioning end 21 is connected between two adjacent vertical frame bars 23 through the fixing nodes 30 of the two side strips 11. The first interval 110 is formed between the vertical frame bar 23 and the side strips 11 of the adjacent heating element 10, and between the positioning end 21 and the side strips 11 of the adjacent heating element 10.

[0062] In some embodiments, the base frame material 20 includes a vertical frame bar 23 without two positioning ends 21 ; a vertical frame bar 23 is provided between two adjacent heating elements 10 . The first interval 110 is formed between the vertical frame bar 23 and the side bands 11 of the adjacent heating elements 10 .

[0063] like Figure 6 As shown, when there are multiple heating elements 10 and they are arranged in two rows, each row of heating elements forms a group of heating modules, and the several heating elements 10 of each group of heating modules are arranged at intervals along the length direction of the heating element array structure; the heating elements 10 of the two groups of heating modules face each other with one end having a fixed node 30, and form a symmetrical distribution on the heating element array structure, so that the two groups of heating modules are arranged along the width direction of the heating element array structure. Among the multiple heating elements 10 of each group of heating modules, some heating elements 10 are connected between the positioning end 21 and the vertical frame bar 23 through the fixed node 30, and some heating elements 10 are connected between two adjacent vertical frame bars 23 through the fixed node 30. For the heating element 10 connected between the positioning end 21 and the vertical frame bar 23, the first interval 110 on one side of the heating element 10 is located between the positioning end 21 and the heating element 10, and the first interval 110 on the other side is located between the heating element 10 and the vertical frame bar 23. For the heating element 10 connected between two vertical frame bars 23 , the first intervals 110 on both sides of the heating element 10 are respectively located between the heating element 10 and the vertical frame bars 23 on the corresponding side.

[0064] In other embodiments, when a heating element 10 or two heating elements 10 that are symmetrical up and down are formed on the substrate, the substrate frame material 20 includes two positioning ends 21 formed on opposite sides of the heating element 10, and there is no need to form vertical frame strips 23. At this time, the heating element 10 is connected between the two positioning ends 21 through the fixed nodes 30 of the two side bands 11.

[0065] It can also be understood that after the heating element 10 and the substrate frame material 20 are formed on the substrate, the substrate frame material may also have a frame 24 located on the outside of the heating element 10 and connected between the two positioning ends 21. In order not to block the pins from extending into the first gap 110 between the heating element 10 and the substrate frame material 20 and to keep the pins and the heating element 10 in the same horizontal plane, the frame 24 is removed before welding the pins.

[0066] When the pin is connected to the heating element 10 by side welding, the pin can be directly placed in the first gap 110 between the heating element 10 and the base frame material 20, and then welded to connect the pin to the heating element 10, and the pin and the heating element 10 together form a heating unit. The heating unit and the base frame material 20 can be integrated into a heating element welding module.

[0067] like Figure 8 As shown, the heating element welding module includes the heating element array structure and a plurality of pairs of pins 40 ; each pair of pins 40 includes two pins 40 . The number of pairs of pins 40 is set corresponding to the number of heating elements 10 .

[0068] Combination Figures 6 to 8 Each pair of pins 40 is disposed outside the side band 11 of a heating element 10 of the heating element array structure and is connected to the long side 111 of the side band 11 by welding. The end of the pin 40 is close to the short side 112 of the side band 11.

[0069] exist Figure 8 In the illustrated embodiment, the fixed node 30 is connected between the end of the long side 111 of the side band 11 of the heating element 10 and the base frame material 20. When welding the pin 40, the pin 40 is extended to the outside of the long side 111 of the side band 11 of the heating element 10. When the end of the pin 40 is close to or abuts against the fixed node 30, it indicates that the pin 40 is in place. Then, spot welding, resistance pressure welding or continuous welding can be selected according to actual needs.

[0070] The welding of the pin 40 is performed on a welding jig. Fig. 9 and Fig.10 As shown, the welding jig used for the above welding may include a positioning plate 50 for positioning the heating element array structure thereon. The heating element array structure may be positioned on the surface of the positioning plate 50 by at least one of fastening, magnetic attraction, and the like.

[0071] As for the fastening method, the positioning plate 50 may be provided with a positioning structure 51, which is used to cooperate with the positioning end 21 of the substrate frame material 20 to fix the substrate frame material 20 on the positioning plate 50. The positioning structure 51 includes at least two positioning holes and / or at least two positioning columns. For the positioning hole, the positioning end 21 of the substrate frame material 20 may be provided with a convex column adapted to the positioning hole, and the convex column is inserted into the positioning hole to form positioning; or, the positioning end 21 is provided with a connecting hole that is relatively connected to the positioning hole, and after the connecting hole and the positioning hole are connected, they are locked in the connecting hole and the positioning hole by fasteners such as screws or bolts to form positioning. For the positioning column, the positioning end 21 of the substrate frame material 20 may be provided with a connecting hole that is adapted to the positioning column, and the connecting hole is sleeved on the positioning column to form positioning.

[0072] For the magnetic attraction method, the positioning plate 50 can be a magnetic attraction plate made of a material with magnetic attraction properties, and the magnetic attraction plate can magnetically attract the heating element 10 thereon. Alternatively, a plurality of magnetic attraction components (such as magnets) are built into the positioning area corresponding to the heating element 10 on the positioning plate 50, and the heating element 10 is magnetically attracted to the positioning plate 50 through the magnetic attraction components.

[0073] Furthermore, at least one group of positioning grooves is provided on the positioning plate 50. Each group of positioning grooves includes two relatively spaced strip grooves 52. The two strip grooves 52 correspond to two pins 40 of a pair of pins 40 respectively, and are used for the pins 40 to cooperate therein for limiting.

[0074] The interval between the two strip grooves 52 of each group of positioning grooves forms a positioning area for limiting a heating element 10 therein. That is, when the heating element array structure is positioned on the positioning plate 50, each heating element 10 in the heating element array structure falls between the two strip grooves 52 of a group of positioning grooves.

[0075] The positioning plate 50 is also provided with at least one positioning protrusion 53; the positioning protrusion 53 is transversely connected between the two strip grooves 52 of the positioning groove. The positioning protrusion 53 is used to align and position the heating element array structure on the positioning plate 50, and also includes the placement and limiting of the pins 40. For example, Figure 8 The heating element array structure shown has two groups of symmetrical heating modules, for example, with a gap between the two groups of heating modules, and the positioning protrusion 53 on the positioning plate 50 is arranged corresponding to the gap. When the heating element array structure is placed on the positioning plate 50, the gap is aligned with and matched with the positioning protrusion 53, so that the positioning protrusion 53 is arranged between the two symmetrical heating elements 10.

[0076] Combination Figures 8 to 10When the welding jig is used, the heating element array structure is placed on the positioning plate 50 and fixed to the positioning plate 50 by magnetic attraction and / or fastening, eliminating the process of placing and positioning the heating elements 10 one by one. The pins 40 are placed on the positioning plate 50 and limited in the strip grooves 52, so that pins 40 are placed on both sides of each heating element 10. Select a welding method such as spot welding, resistance pressure welding or continuous welding for welding, so that the pins 40 are connected to the side band 11 of the heating element 10. Of course, the pins 40 can also be stacked on the side band 11, and the two are connected as a whole by welding.

[0077] In this embodiment, after completing the welding of the pins 40 on the welding jig, the heating element array structure with the pins 40 (i.e., the heating element welding module) can be sent to the disconnection station, and the fixed nodes 30 between the heating element 10 and the substrate frame material 20 can be disconnected by stamping, cutting, etc. The heating element 10 with the pins 40 forms an independent heating unit, and the substrate frame material 20 separated from the heating element 10 forms waste for discharge and collection.

[0078] like Fig.11 As shown, an atomization device 100 is shown. When the heating unit 101 composed of the pin 40 and the heating element 10 is used in the atomization device, the heating element 10 is energized through the pin 40, and the heating element 10 generates heat to heat the atomized liquid, thereby forming an aerosol for the user to inhale. According to application requirements, the heating unit can be further rolled to form a cylindrical structure, and cooperated with liquid guide parts such as liquid guide cotton or porous ceramics to form an atomization unit.

[0079] The two fixed nodes 30 on the heating element 10 are both located at the ends of the heating element 10, and the pins 40 can be connected to the heating element 10 by lap welding or by side welding. In addition, it can be understood that the atomization device 100 can have more than one heating unit 101, and multiple heating units 101 can be connected in parallel or in series to achieve different atomization requirements.

[0080] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A heating element array structure, characterized in that: It includes a plurality of heating elements formed in one piece, a base material frame material, and a fixing node for connecting the heating elements to the base material frame material; The heating element comprises two side bands spaced opposite to each other and a mesh connected between the two side bands; the two side bands of each heating element are respectively connected to the base frame material through a fixed node, and the two fixed nodes of each heating element are located at the end of the same end of the side band of the heating element.

2. The heating element array structure according to claim 1, characterized in that: The heating element array structure comprises two groups of heating modules arranged along the width direction of the heating element array structure, each group of the heating modules comprises a plurality of the heating elements arranged at intervals along the length direction of the heating element array structure; the fixed node is located at one end of the two groups of the heating modules facing each other.

3. The heating element array structure according to claim 1, characterized in that: The side band has a long side opposite to the mesh sheet and a short side connected to one end of the long side, and the fixing node is connected to the short side of the side band; The base material frame includes at least one transverse frame bar extending along the length direction of the heating element array structure; the plurality of heating elements are distributed on at least one side of the transverse frame bar, and each heating element is connected to one transverse frame bar via two fixed nodes.

4. The heating element array structure according to claim 1, characterized in that: The side band has a long side opposite to the mesh sheet and a short side connected to one end of the long side; the fixing node is connected to a position of the long side close to the short side.

5. The heating element array structure according to any one of claims 1 to 4, characterized in that: The base frame material includes a plurality of vertical frame strips extending along the width direction of the heating element array structure, one vertical frame strip is arranged between two adjacent heating elements, and a first interval is formed between the vertical frame strip and the side bands of the adjacent heating elements.

6. The heating element array structure according to claim 5, characterized in that: The base material frame comprises two positioning ends which are spaced apart and opposite to each other; each of the heating elements is located between the two positioning ends.

7. A heating element welding module, characterized in that: It comprises the heating element array structure as claimed in any one of claims 1 to 6 and a plurality of pairs of pins, wherein each pair of the pins is respectively welded to two side bands of a corresponding heating element.

8. The heating element welding module according to claim 7, characterized in that: A first interval is formed between the outer sides of the two side bands of each heating element and the base frame material, and the pins are arranged in the first interval.

9. A welding jig, characterized in that: Used to manufacture the heating element welding module according to claim 8, the welding jig comprises a positioning plate for positioning the heating element array structure thereon; the positioning plate is provided with a plurality of positioning grooves; Each group of the positioning grooves includes two strip grooves for pins to be embedded in, and the second interval between the two strip grooves forms a positioning area for limiting a heating element of the heating element array structure.

10. An atomizing device, characterized in that: It comprises at least one of the heating elements on the heating element welding module as described in claim 7 or 8 and the pins welded to the corresponding heating element.

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